- 39 -

3 /

PD

KEIT PD ISSUE VOL 11-4

- 41 -

3. /

, ,

IT , ,

,

,

Breakthrough

,

- 3D 20 D

,

3

- 42 -

.

1.

, , ,

, , ,

* : (09.9)

[ 1 : ]

, ,

, , 5

- 43 -

[ 1 : ]

( : )

PC 640 487 TV 125 13 84

264 177 LCD 103 40 29

342 226 1 75 18

34 Gray 22 e- 5 31 25

24 LAN 52 STB 41 15 40

SSD 16 37 DSC 66 11 58

23 26 PMP/MP3 68 2 28

* : KSIA 2010

, (,

) //

* : 2011

[ 2 : ]

- 44 -

2.

/

Application

, , ,

, ,

, /

Needs

// 20nm

IT ,

,

- 45 -

.

1.

3,045(09)

50% 14.6%

3

[ 2 : 2010 ]( : , %)

410.3 13.5 1,467.1 48.2 632.5 20.8 280.2 9.2 3,040.8

336.0 50.0 128.6 19.1 140.4 20.9 6.6 1.0 673.4

45.2 2.9 1,198.7 64.0 290.5 15.5 188.7 10.1 1,874.4

19.1 3.9 139.8 28.3 201.5 40.9 84.8 17.2 493.0

18.3 5.5 65.8 19.7 190.2 57.0 8.3 2.5 333.8

* : 2011 (iSuppli '11)

2.

D-TV,

IT

, 2013 ,

IT 10%

- 46 -

[ 3 : ]( : US$, )

2009 2010 2011 2012 2013 CAGR

Total Market 3,045 3,573 3,853 4,136 4,264 8.8%

447 535 562 574 507 3.2%

1,575 1,790 1,879 2,000 2,059 6.9%

IT 448 519 573 639 691 11.5%

167 294 364 404 446 27.0%

409 435 475 519 561 8.3%

* : 2011 (isuppli 2010.3, Gartner 2010.3)

.

1.

Auska II , Mirai

- , 50

NSF 18.2M , IBM, TI,

AMD, Freescale, Micron

EU 10 3 ()

IMEC() ()

- 47 -

4G LTE ST-

, Freescale, MediaTek

VDEC ,

, ,

- , NEC, Fujitsu LTE SoC

LTE 3G ST- Huawei

WiFi, Bluetooth, GPS Wireless connectivity

, CSR, , TI

- WiFi

Infineon, ST Micro, Fairchild

, , ,

LED IC

IT

2030 02

3 , , LiS

- HEV 85% , PHVEV

Alcatel-Lucent, Cisco, Fujitsu Finisar,

Opnext, Emcore, JDSU

TI, ST Micro, Fairchild TSMC,

UMC, X-Fab

- 48 -

//

ArF ArF immersion double patterning

EUV IMEC

, High-k/Metal Gate

300mm Fab 450mm Fab

/ , , TSMC

2.

, 40 D

20 , 30

, P

3

PCRAM, ReRAM , STT-M

KIST

2G, 3G /

DMB, WiBro

- 49 -

B3G 4G ETRI

LTE (08) LG LTE

(AP) 62.6%

,

* DDI(Display Driver IC, 3 / 21.5%), CIS(CMOS Image Sensor, 4 / 12%)

* 09 : 34, 8.6, PC CPU 7

3DLED TV (Scaler, MPEG decoder), DTV , 3D

,

CPU,

IT

RFID/USN, ,

,

- 99 LG, 00 SDI

(09 24.5)

- 20%

PON WDM-PON

//

- 50 -

//

7

- , 20 , High-k gate/metal

ALD , PECVD ,

* 7 : , , LED, , , ,

* (09) : 11.1%, 41.4%, EU

( 7)

TSV

3D

. /

, ( )

,

() Ge,

() ArF

(EUV)

- EUV(Extreme UltraViolet) :

() DPT, SPT, Cell Shrink, TSV

- 51 -

- DPT(Double Patterning Tech.) : 2

design rule 1/2

- SPT(Spacer Patterning Tech.) :

- Cell Shrink : 4

- TSV(Through Silicon Via) :

- Wafer Immersion Lithography :

ArF

1. /

2 2 Moore

40

,

14

,

Gate

, Al

Cu

- 52 -

* : Semiconductor & FPD Monthly 201105

[ 3 : MOS FET ]

lithography ()

13.5nm X

EUV

* EUV : (Extreme Ultra Violet)

(Stepper)

* : Semiconductor & FPD Monthly 201105

[ 4 : ]

- 53 -

(Optical Proximity Correction)

2. /

Gate

Leak

Hf (HfO2) (Hf-SiO), Hf-Si-ON,

(Hf-Al-O)

Si SiGe Epitaxi Si

Si MOS FET

-

SourceDrain

, eV

(RTA; Rapid Thermal Annealing)

Annealing

- 54 -

(Low-k)

Cu Dry Etching Duel Damasecene

* : Semiconductor & FPD Monthly 201105

[ 5 : Dual Damascene process]

[ 4 : Low-k ]

Si

SOG HSQ MSQ BCB Teflon Porous MSQ Xerogels

2.74.0 2.93.2 2.62.8 2.62.7 2.1 1.72.2 1.12.2

* : Semiconductor & FPD Monthly 201105

- 55 -

3.

1 () 3D Transistor

5 4, 22nm (Ivy Bridge) 3D Transistor

-(Tri-Gate)

CPU ,

3D Tr.

* ('03-'09) : 62 120B$ 1/3 58B$

3D Tr. 10

* 3D Tr. : 1 3D Tr.('02) 3D Tr.('03) 3D Tr. S ('06)

* 3D Tr Gate 37%, 50%, 2-3%

< 2D 3D (FinFET) >

22

AP

PC SoC

PC 3D Tr.

+

- 56 -

* 40W ( ) 15W ()

2 (IDF 2011 )

* , 3D Tr. PC

, ARM SoC

GPU( )

2 () 25nm D

4 25, 25nm 7

* 30nm 20nm 30% 20%

'80 (D) 80%

('99 ) D 16.2% 3

, '11.1Q 4

, '10 16% 13.5%

* ()/(%) : (08) 36.0/15.2 (09) 39.5/17.4 (10) 64.5/16.2

(11.1A) 11.2/13.6

* ()/(%) : (08) 9.0/8.4 (09) 4.2/9.0 (10) 7.4/6.7 (11)

4.6/5.3

* D (%) : () 17.9, () 12.0, () 8.0, () 5.7

,

, 6 (30nm )

* ( ) : 40nm('09.10 /'09 '10 1 ),

30nm(10.09 /'10.12 '11.05 )

30nm 5 , 20nm 7

, 6

- 57 -

< (iSuppli) >

2009 2010 2011

1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q

7xnm 22% 11% 3% 1% 1% 0% 0% 0% 0% 0% 0% 0%

6xnm 78% 89% 97% 99% 88% 70% 51% 34% 25% 8% 3% 0%

5xnm 0% 0% 0% 0% 9% 23% 34% 36% 35% 26% 21% 11%

4xnm 0% 0% 0% 0% 2% 7% 15% 30% 41% 66% 70% 75%

3xnm 0% 0% 0% 0% 0% 0% 0% 0% 0% 2% 7% 13%

< D (11.1Q) >

70 0% 0% 1% 0% 0% 71% 0% 0%

60 0% 1% 7% 25% 0% 29% 0% 89%

50 21% 34% 72% 35% 70% 0% 87% 0%

40 75% 65% 20% 41% 30% 0% 13% 11%

30 4% 0% 0% 0% 0% 0% 0% 0%

20 0% 0% 0% 0% 0% 0% 0% 0%

< D (11.1Q) >

/

()

()

()

600%

07 3

1%

07 2

25%

08 3

5021%

08 4

34%

08 235%

4075%

09 7

65%

09 4

41%

10 1

304%

10 7

0%

11 1

0%

11 5

200%

11

0%

12

0%

11 7

3 () AP TSMC

AP A5

TSMC

- 58 -

AP

* AP '10 ,

AP

(: A4A5)

4Q A5 , A6

* 2010 (%) : (TSMC) 38.5, (UMC) 11.6, GF 11.3, () 2.5

4 () 3 14

6 1, PC 2011

3 14

3 32 22 14

22 3D

12

5 () ATIC

ATIC AMD

219% 2 UMC

2% , , TSMC

- 59 -

.

- , SW+ 3F

- 3F(Fusion + Future + Frontier) : + +

TV, PC

SW SoC

( )

-

- (: 3D )

, ,

,

3

- 60 -

< >

2009 2010 2011 2012 2013 2014CAGR

('10-'14)

404,206 443,505 471,269 500,883 518,501 532,786 4.7% 5,676 6,508 7,216 7,960 8,668 9,347 9.5% 86,088 117,711 119,498 120,719 120,404 125,451 1.6%

PC136,188 152,741 169,336 191,754 207,568 220,664 9.6%

308 354 411 477 526 558 12.0%47,512 64,038 62,015 67,521 62,978 65,374 0.5%

11,306 10,495 10,015 9,581 9,083 8,247 -5.8%

33 34 35 36 37 36 1.4%2,902 3,357 3,093 2,902 2,734 2,737 -5.0%

- 6,237 13,572 21,856 30,058 38,232 57.3%- 19 55 103 154 208 81.9%- 2,367 5,819 10,273 14,069 17,791 65.6%

218,196 251,057 302,718 338,164 379,709 413,271 13.3%3,051 3,358 3,729 3,938 4,208 4,404 7.0%47,454 59,072 72,621 75,025 83,844 95,842 12.9%

176,442 207,193 238,163 258,524 282,533 300,752 9.8%1,340 1,604 1,801 1,974 2,120 2,226 8.5%39,547 48,727 55,376 58,822 63,023 67,138 8.3%

57,418 85,254 119,755 146,399 178,796 202,955 24.2%

180 280 432 581 745 898 33.8%11,268 17,693 25,475 31,105 37,218 43,166 25.0%

Gray8,134 11,856 12,750 10,011 8,640 7,515 -10.8%145 228 255 213 192 167 -7.5%

1,416 2,228 2,203 1,498 1,229 1,083 -16.5%

321,706 338,383 353,025 372,958 383,147 385,945 3.3%14,997 15,584 16,006 16,611 17,227 17,715 3.3%44,611 57,706 59,219 59,362 60,997 63,558 2.4%

TV99,217 109,055 121,403 136,081 139,568 136,148 5.7%

213 232 241 263 280 292 5.9%8,296 12,542 13,745 14,839 15,772 16,563 7.2%

E-Book811 1,526 2,137 2,319 2,421 2,387 11.8%5 10 17 21 24 25 25.7%

236 533 747 824 853 827 11.6%

()81,215 92,421 97,502 102,732 107,913 113,265 5.2%15,299 21,587 21,910 23,204 24,758 26,572 5.3%

Power Train23,555 27,418 29,200 30,952 32,655 34,418 5.8%5,141 7,498 7,813 8,227 8,789 9,563 6.3%

Safety10,275 11,991 12,914 13,844 14,799 15,806 7.1%2,097 3,076 3,160 3,358 3,597 3,902 6.1%

298,994 332,042 351,847 367,781 387,072 408,786 5.3%21,227 28,258 28,514 29,121 30,918 31,977 3.1%

73,617 79,175 84,014 89,327 95,902 102,442 6.7%6,639 8,424 8,383 8,565 9,166 9,529 3.1%

1,410,367 1,554,775 1,679,815 1,791,040 1,890,993 1,973,230 6.1%

10,701 11,991 13,147 14,206 15,282 16,253 7.9%229,506 304,006 320,549 326,017 339,826 364,232 4.6%

: ISuppli/Gartner '10, /