2

[1,2]. [3]. . [3-6]. [7] [8] [9]. 100 . Ni-Cr-B-Si . [7] [10]. - HVOF [8]. . . [11]. .

2-1 2-1-1 [12]. . . . : . . . ( ) . . [footnoteRef:1] (1). . . [13]. . (4.5 ) Ni-Al [13]. . . . . . . []. [1: Stiffness]

2-1. [14].2-2 :[footnoteRef:2] . : ( ) (mm3.g-1) [footnoteRef:3]. ( 3) (material loss) ( 4) [15]. [2: Erosion Value] [3: Reference]

2-2. [15] 2-3 . [16].

4. [17].

[footnoteRef:4] . . . [18]. [19]. [4: Solid Particle Erosion]

[footnoteRef:5] . . 15 30 ( 56). . (7). 4560 [20]). . [5: Ductile]

[footnoteRef:6] [footnoteRef:7] . [footnoteRef:8] [footnoteRef:9] [footnoteRef:10] [footnoteRef:11] . [6: Lip] [7: Platelet] [8: Sapling] [9: Lateral] [10: Chunk] [11: Remove]

2-5. [21] . 2-6. [21]

2-2-1 : 60 (8). . . [footnoteRef:12] ( 9) [22]. [12: SEM]

2-7. [20].

2-8. [22].

2-9. : ) 60 ) 45 ) 90 [22].

2-2-2 . [footnoteRef:13] . . . . ([20]) . . [footnoteRef:14] [12]. [13: Bulk] [14: Chipping]

() 30 . . . [footnoteRef:15] . [13 ]. 100% . 30 . . . / ( 10) [23]. [15: Splat]

2-10. Cr3C2-NiCr [23]. . . (SiO2) . (SiC) . . " " [footnoteRef:16] [footnoteRef:17] . . (11). [5]. [16: Weight Gain] [17: Shielding]

2-11. Cr3C2-NiCr [23].

SiO2 SiC ( ) . . . 1 [footnoteRef:18] . 1 [footnoteRef:19] . . [footnoteRef:20] [5]. [18: Indentation] [19: Microchipping] [20: Pore]

SiO2. SiO2 SiC . [21]. . [5].

2-12. [13].

2-3 . . . [footnoteRef:21] . [footnoteRef:22] 5 25Kw/m2 ( ) 75 . [24]. [21: Stiffness] [22: Flexural]

2-4 2-4-1 / . Al-O-C . Mg Cr Si Cu . . M-O-C M-C M . . Cu-O-C [25].

2-4-2 - -- . TiO2- [footnoteRef:23] - [footnoteRef:24] TiO2 . . -- . [footnoteRef:25] [footnoteRef:26] [21]. [23: Magnetron Sputtering] [24: Laser Ablation] [25: Adhesion] [26: Cohesion]

2-4-3 . . . (150650 ) . . . 80 . . . [26]. [footnoteRef:27] [footnoteRef:28] [footnoteRef:29] . [footnoteRef:30] ( 13) [footnoteRef:31] [26]. [27: Poly ether ether keton] [28: Poly Carbonat] [29: Poly amide] [30: Pulsed Laser Deposition ] [31: Sputtering]

2-13. [26].

. [footnoteRef:32] [footnoteRef:33] [footnoteRef:34] . [footnoteRef:35] . . 500 [footnoteRef:36] ( 14) [26]. [32: Vapor Deposition] [33: Bond Coat] [34: Adhesion Strengths] [35: Physical Vapor Deposition] [36: Delamination]

2-14. (PMMA) [26].

( 15) [27].

2-15. TiN [footnoteRef:37] [27]. [37: Vacume Arc Deposition]

[25]. ( 16). [28-31].

2-16. [32].

2-5 70 [footnoteRef:38] . . .... . .[footnoteRef:39] . ( 800 - ). . . [33-40]. [38: Metallising] [39: Shielded]

2-6 2-6-1 " " () ( ) 50 1000 . [footnoteRef:40] [footnoteRef:41] . ( 17) . (120) ( K/s 106) . [41]. [40: Droplet] [41: Splat]

2- 17. [42].

010 . 5 . ( 18) . . . [footnoteRef:42] [footnoteRef:43] . . 19 80Ni-20Cr HVOF . [footnoteRef:44] [41 42]. [42: Rod] [43: Drag] [44: Lamellar]

2-18 . [42] . 2-19. 80Ni-20Cr HVOF. [41].

19 . . . . . . . [footnoteRef:45] 10 60 . . 60% . . . [footnoteRef:46] [41]. [45: As Sprayed] [46: Accumulated]

2-6-2 2-6-2-1 . - ( 20).

2-20. [42]. . . ( 10%) [footnoteRef:47] [43]. [47: 1 - Substrate]

2-6-2-2 [footnoteRef:48] . . 21 . . . . ( 10%) . [43]. [48: 2 - Cored]

2-21. [41].

2-6-2-3 . C20000 . . 22 . [44]. . . : ( 5 ) . . .

2-22. [42].

2-6-2-4 [footnoteRef:49]HVOF [49: 3 - High Velocity Oxy-Fuel]

HVOF ( ) ( ) . ( 23). ( 2%). [footnoteRef:50] 23 [45]. [50: 1 - Shock Diamonds]

2-23. HVOF[42].

: ( 60 ). - . [42].2-6-3 2-6-3-1 . .

2-24. [42].

2-6-4 . HVOF APS . [46].

2-6-4-1 . 25 . ( 1/0 1 10 ) . C200 . [46].

2-25 . [42].

2-6-5 2-6-5-1 . C 500 . . HVOF . [44].

2-6-5-2 . . [42].

2-6-5-3 . [47].

2-6-5-4 [footnoteRef:51] . . [44]. [51: 1 - Thermal Barrier Coatings]

2-6-5-5 . . [44].

2-6-5-6 ... [44].

2-6-6 2-6-6-1 . 6 26 . : . ( ) [48].

2-26. [48].

- . 27 .

2-27. [48].

2-6-6-2 . . . : (): . . . [footnoteRef:52] [footnoteRef:53] . [footnoteRef:54] . [52: 2 - Self-Fluxing Coatings] [53: 3 - Fusing] [54: 4 - Bond Coats]

(): ( ) . [48].

2-6-6-3 . . . [footnoteRef:55] . . . [15]. APS HVOF [15]. [55: 1 - Lubrication]

2-6-6-4 . . HVOF . 1% 2% . [47].

2-6-7 2-6-7-1 10 60 . [footnoteRef:56] [49]. [footnoteRef:57] [footnoteRef:58] . . ( ) . [56: 1 - Atomizing] [57: 2 - SHS: Self-Propagating High Temperature Synthesis] [58: 3 - Sintering]

2-6-7-2 3 5 . [43].

2-6-8 2-6-8-1 [footnoteRef:59] [59: Bond Coat]

. 370 . . . ( 28). / [5051]. . [50].

2- 28. [51].

80 100 300 . . ( 29) [51].

2-29. [52].

. 5% . . - ( WC-Co ) [footnoteRef:60] -[footnoteRef:61] WC-Co. ( 30)[13]. [60: Functionally Graded Material(FGM)] [61: WC-Co]

2-30. (I FGM II WC-Co/Zn/polymer)[ 13].

. . . - 5% [51]. . / . . [footnoteRef:62] WC-Co . . [footnoteRef:63] . [51]. [62: Top Coat] [63: Cohesive failure]

Huang [53]. . . YSZ[footnoteRef:64] YSZ . [footnoteRef:65] 810 4 . 400 / ( 31) [53]. [64: Yitria Stabilized zirconia(YSZ)] [65: Thermal Ablation]

2-31. [53]. Ni-Cr-B-Si . [ ]. . . . . ( 32) [54].

2-32. [54].

( 32) 0.1 . [54].

2-33. .(Ni-Cr-B-Si) [54].

Alonso [55]. . 1040 . ( 33)[55].

2-33. [55].

/ - / . [55]. WC-Co . . / . . . . . [footnoteRef:66] . [55]. [66: Chipping]

. . . . . .