C O N F I D E N T I A L

櫃買市場業績發表會-群聯電子(8299)

台北花園大酒店

2016/5/12

C O N F I D E N T I A L

損益表 2016Q1

2015 Q1~Q4 2016Q1

營業收入 Operating Revenues(K)

37,178,103 9,906,386

本期營業淨利 Operating Income(K)

4,275,558 984,649

稅前淨利 Profit Before Income Tax(K)

4,531,832 1,058,692

本期淨利 Net Profit Attributed(K)

3,957,529 926,974

本期綜合利益總額 Total Comprehensive Income

Attributed(K) 3,832,119 964,855

基本每股盈餘(稅後) Earnings Per Share Basic

(After Income Tax) (NTD)

20.41 4.71

C O N F I D E N T I A L

資產負債表 2016Q1

2015 2016Q1

流動資產 Current Assets(K)

24,206,141 26,635,699

現金 Cash(K)

11,868,334 9,269,733

存貨 Inventory(K)

5,251,376 9,243,308

不動產、廠房及設備 PPEs(K)

1,637,395 1,980,529

非流動資產 Non-Current Assets(K)

3,546,282 4,120,136

總資產 Total Assets(K)

27,752,423 30,755,835

總負債 Total Liabilities(K)

7,395,758 9,434,315

總權益 Net Assets (K)

20,356,665 21,321,520

C O N F I D E N T I A L

Patent Portfolio

* Updated Apr 2016

Country Pending Granted

Taiwan 102 434

China 225 280

USA 137 322

Others 2 30

Total 466 1066

NAND Application Performance &

Lifetime

NAND Error Handling Techniques

High Speed Interfaces

Mobile Security

Main Areas of Coverage

* Source: China IC Industry Intellectual Property Annual Report (2015)

Patents Worldwide Ranked 14th in China (Memory-Related Patents, 2001-2014)

Patent Owner Rank Publication # # of Granted

Samsung 1 1110 682

IBM 2 814 618 SK Hynix 3 739 371 Panasonic 4 716 467 Intel 5 614 420

Macronix 6 592 446 Sony 7 520 370

Huawei 8 509 195

Toshiba 9 471 349 Fujitsu 10 376 202 TSMC 11 281 167

Micron 12 265 116 Infineon 13 239 174

Phison 14 235 102 NEC 15 224 196

Renesas 16 219 129 Hua Hong 17 212 26 Qualcomm 18 211 80 Philips 19 207 59 Hitachi 20 195 147

C O N F I D E N T I A L

USB Flash Drive Controller

Controller Q2 ‘16 Q3 ‘16 Q4 ‘16 Q1 ‘17

PS2251-68 (USB 2.0, 1 CH)

PS2251-69 (USB 2.0, 1 CH) 15nm & 3D TLC

PS2251-06 (USB 3.0, 1 CH, LDPC) 20nm, 15nm & 3D TLC

PS2251-07 (USB 3.0, 1 CH) MLC Max R/W 250/80MB/s TLC Max R/W 200/40MB/s

PS2251-08 (USB 3.0, 2 CH, High Speed) MLC Max R/W 400/300MB/s TLC Max R/W 320/100MB/s

PS2251-09 (USB 3.0, 1 CH) Cost Down of PS2251-07

PS2251-12 (USB 3.0, WTG 2.0) 2-CH eMMC Reader (HS-200), Max R/W 280/85MB/s

ES MP

C O N F I D E N T I A L

microSD Roadmap

Segment Q4 2015 Q1 2016 Q2 2016 Q3 2016 Q4 2016

Professional UHS-II

Professional UHS-I

Consumer Mainstream

Consumer Value

PS8039 15nm MLC Up to 8GB R70/W10, CL10

PS8039 15nm TLC Up to 8GB R45, CL4

In Development Mass Production

PS8039 15nm TLC 32~128GB R80/W20, CL10

PS8039 15nm MLC 16~64GB R90/W45 U3, CL10

PS8210 15nm MLC 8~64GB R95/W90 U3, CL10

PS8036 15nm pSLC 16~64GB R280/W245, V90, CL10

PS8036 15nm MLC 32~128GB R280/W90, V60, CL10

PS8130 3D TLC, 32~64GB R70, CL10

PS8210 15nm TLC 16~64GB, R70 CL10, High IOPs IOPs: R2000/W400

16GB CS May/E

32/64GB CS June/E

• Phison will prepare customer samples starting with 16GB, end of May

MaxIOPS microSD

C O N F I D E N T I A L

microSD with the Wide Application

UHS-II microSD

256GB microSD

VideoMate microSD

MaxIOPs microSD

• UHS-II microSD • The fastest read/write speed microSD card in the market

• 256GB microSD • The Largest capacity microSD card in the market

• VideoMate microSD card • For IP cam or monitoring cameras application, small host cache and require stable writing

speed • TotalFrame technology for sustained recording and flash endurance enhancement

• MaxIOPs microSD card • Better mobile phone or tablet user experience, more applications start to demand random

performance level

Fastest Speed / Interface microSD

Largest Capacity microSD

IP camera or sustained recording

smartphone/tablet user experience

C O N F I D E N T I A L

New OS Requires More microSD Performance

• Google released Android Marshmallow (M) in Oct., 2015 and added uSD support as “Adaptable Storage Devices”, where microSD is allowed to be formatted as internal storage

• Many smartphones will be updated with Android M

• Therefore, SDA considers introducing a new Logo to assure card’s mobile performance level

* Source: SDA m

Brand Model

HTC

A9

M8

M9

M10

LG V10

G4

Google Android ONE

Nexus ONE

MOTOROLA XPURE

XPLAY

Phones currently supporting “Adaptable Storage”

C O N F I D E N T I A L

MaxIOPS microSD: The High IOPS Solution

MaxIOPS microSD (16/32/64GB)

New FW Architecture

for High Random IOPs

15nm 128Gb TLC

PS8210 SD/eMMC Controller

• One-of-a-kind microSD solution to address fast random access

• New FW architecture built on top of existing, highly-matured PS8210 SD/eMMC controller

• eMMC-compatible performance optimized for 4K small file R/W IOPS and multi-app access

• Goal: Enhanced smartphone user experience acting at speeds similar to internal storage

We believe a significant share of microSD will move to higher performance, in order to meet the increasing requirements from the smartphone & OS

C O N F I D E N T I A L

eMMC & UFS Controller

Controller Q2 ‘16 Q3 ‘16 Q4 ‘16 Q1 ‘17

PS8225 (eMMC 5.1, 1 CH, HS-400) eMMC/eMCP 5.1 15nm MLC & TLC

PS8226 (eMMC 5.2, 1 CH, HS-533, SECC) High Performance/Capacity eMMC/eMCP 5.2 3D MLC & TLC

PS8227 (eMMC 5.1, 1 CH, HS-400) Low/Mid Density eMMC/eMCP 5.1 15nm MLC & TLC

PS8228 (eMMC 5.2, 1 CH, HS-400, SECC) Low Cost eMMC/eMCP 5.2 3D MLC & TLC

PS8311 (UFS 2.1, 1 CH, G3 1-Lane, SECC) Mid End UFS Embedded & UFS Card UniPro 1.6x, M-PHY 3.x, 15nm & 3D TLC

PS8313 (UFS 2.1, 2 CH, G3 2-Lane, LDPC) High Performance UFS Embedded 28nm, UniPro 1.6x, M-PHY 3.x, 3D TLC

ES MP

C O N F I D E N T I A L

PS3111 CTRL Specs/Schedule

Controller Features

Interface SATA Gen III

Process UMC 40nm

DRAM Support SDRAM

Max. Channel 2

ECC LDPC

CE No. 16

Available Capacity MLC : Up to 1TB TLC : 128GB/256GB/512GB/1TB

Flash Support TSB 15nm MLC/TLC, 3D-NAND, HY 14, M L06/BOKB

Additional Features Data Compression, End to End Data Path Protection

C O N F I D E N T I A L

PS3111 Product Lines

S11 M.2 2242 M.2 2280 2.5”SSD Half Slim

Form Factor

Capacity MLC 32GB – 512GB MLC 8GB – 1TB MLC 8GB – 1TB TLC 128GB – 1TB

MLC 8GB – 1TB

NAND Placement Max. 2PCS Flash Max. 4PCS Flash Max. 4PCS Flash Max. 4PCS Flash

Remark Double-side Single-side

S11 mSATA CFast uSSD

Form Factor

Capacity MLC 8GB – 1TB MLC 32GB – 1TB MLC 8GB – 128GB

NAND Placement Max. 4PCS Flash Max. 2PCS Flash Max. 8-Layer Stack

Remark 90ball & 156ball

C O N F I D E N T I A L

2016 SATA SSD Models

SSD Phison Phison Mxxxxxl Sxx Sxxxxxg

Controller S10 S11 9188 2246XT MEX

DDR DDR3 N/A DDR3 N/A DDR3

Channel 8/4 2 4 4 4

ECC BCH LDPC BCH BCH LDPC

PS3110-S10

High IOPS with the support of external DRAM and 3D NAND; perfect for mainstream and enterprise applications. S10 + S11 as the making of

Phison SATA SSD landscape PS3111- S11

Med throughput with the support of 3D NAND and DRAM-less design; perfect for cost-sensitive consumer applications.

S11 2CH/Dram-less/High CP Value

Full Density Support

C O N F I D E N T I A L

2016 SSD Landscape

Segment Samsung SanDisk Micron Intel

Enterprise Value

Consumer Enthusiast

Consumer Mainstream

Consumer Value

850 PRO

PM863 S10 + MLC H1

S10 + MLC H1

S10 + 3D TLC H2

S10 + TLC H1

S11 + 3D TLC H2

S10 + TLC H1

S11 + TLC H2

X300DC M500DC DC S3500

Extreme PRO M600 730

850 EVO Ultra II MX200 535

750 EVO SSD Plus BX200

S10 + 3D TLC H2

C O N F I D E N T I A L

PS5008/5008T CTRL Specifications

PHISON PS5008-E8 PS5008-E8T

Interface Gen3x2 NVMe Gen3x2 NVMe

Process UMC 40nm UMC 40nm

Status CS in Q3 ‘16 CS in Q3 ‘16

DRAM DDR3/DDR3L N/A

Channel 4 4

ECC StrongECC StrongECC

CE No. 32 32

Flash 15 16 3D NAND

15 16 3D NAND

AES Support Support

C O N F I D E N T I A L

PCIe Product Lines

E8T M.2 2280 M.2 2280 M.2 2242 uSSD

Form Factor

Capacity TSOP: 64 – 256GB BGA: 128 – 512GB

128 – 512GB BGA: 128 – 256GB TBD

NAND Placement Max. 4PCS Flash Max. 4PCS Flash Max. 2PCS Flash TBD

Remark Single-side Double-side 16*20*1.65 (mm)

E8 M.2 2280 M.2 2280 U.2

Form Factor

Capacity BGA: 256 – 512GB BGA: 256 – 1TB TBD

NAND Placement Max. 2PCS Flash Max. 4PCS Flash TBD

Remark Single-side Double-side TBD

C O N F I D E N T I A L

Thank you