核准審核製作 dio sod523fl 80v swi 1ss400 fms test report...

核准審核製作

1 2 3 4 5 判定

Min Type Max Uint

1.20 V

Min Type Max Uint

0.1 μA

Test Result

Major problem

Warning Point

Recommen dation

0.894

0.013 0.013

PASS

綜合判定

Temperature=25℃

IF=100mAOK0.9040.904 0.897 0.897

Temperature=25℃

VR=80VOK0.013

Eddie

零件編號 24100054Component

PackageSOD-523FL

Operation

Temperature

Jarry

—55℃~125℃ Formosa製造商

Forward Voltage

Reverse Current

DIO SOD523FL 80V SWI 1SS400 FMS Test ReportAlei

Items Test ConditionSpecTest Result

0.012 0.012

供應商﹕FMS 核准審核製作

A Jarry Alei Mary

料號﹕24100054

CR MA MI

A V

B V

C V

A V

B V

C V

D V

電

氣A Ｖ

A V

B V

C V

D V

包裝 A V

其他 A V

GP RoHS字樣每批目視

顏色是否與承認書及樣品相符合

電極

不允許

依MIL-STD-105E表LevelⅡ單次抽樣AQL:

MA=0.4MI=1.5

長度 1.10~1.30(mm)

版次﹕型號 :

SOD523FL

樣本數

依MIL-STD-

105E表LevelⅡ

單次抽樣 AQL:

S1-1.0

目視／數顯卡尺0.70~0.90(mm)

加百裕電子科技(昆山)有限公司SQE Standard Inspection Procedure

制訂日期﹕ 2012/6/14品名﹕DIO SOD523FL 80V SWI 1SS400 FMS

標籤紙

內容字

樣確認

0.50~0.70(mm)

寬度

厚度

小於1.20V

尺

寸

外

觀

形狀

毛邊

須平整,不可有破損及參照樣本.

檢查項目品質重點檢查規格缺點區分

檢驗方式/測定器

檢驗是否與承認書及樣品相符合

目視/放大镜

目視

每批目視

每批

每批

3000

Pb字体

SOD-523FL

有效的SGS报告及外箱GP标示每批目視

備註

三用電錶

(HP34401A)

依MIL-STD-

105E表LevelⅡ

單次抽樣 AQL:

S1-1.0

Forward

Voltage

(VF)

每批

目視

目視

Reel

表單編碼﹕QS-2Q-005-04A

環境資料

QTY

TYPE

無鉛

APPROVAL BY ISSUE BY

Customer Name

： :

加百裕工業股份有限公司 Celxpert Energy Corporation

Customer P/N ： 24100054

FMS ERP P/N ： 1SS400-H Description : 100mA/90V Small Signal Switching Diode, SOD523-FL

Date ： 2012/05/11

■ 美麗微半導體(股)公司 FORMOSA MICROSEMI CO., LTD. 新北市土城區中央路 3 段 208 號 5 樓 5F,NO.208,Sec.3,Chung Yang Road, Tucheng District, New Taipei City,Taiwan

TEL：886-2-2269-6661

FAX：886-2-2269-6141

□ 杭州美麗微電子有限公司 HANGZHOU FORMOSA MICRO-ELECTRONIC CO.,LTD.

杭州市濱江區明德路 6 號 1 幢三層

Floor 3, Block 1, No. 6, Mingde Road, Bingjiang District, Hangzhou,China TEL:86-571-8669-8326 FAX:86-571-8669-6991

FQP-AD02-05/REV：C

美麗微半導體股份有限公司

FORMOSA MICROSEMI CO., LTD.

承認書 APPROVAL SHEET

1/20

http://www.formosams.com/TEL:886-2-22696661FAX:886-2-22696141

1

2

4~5

8

10

11~12

6

4

7~8, 13~1415

16~18

19

20

List

.................................................................................................

................................................................................................

...............................................................................

IR Reflow .................................................................................

Soldering ......................................................

Date Code .......................................................................

Marking ...........................................................................

...................................................................................

.......................................................................................

...........................................................................

( )

.................................................................

..........................................................................

.....................................................

Formosa MSRB751S-H

30mA/40V Small Signal Schottky Diode

2/20

SMD Small Signal Switching Diode Formosa MS

1

2

2

2

2

3

4

4

4

5

6

6

7

List

List.................................................................................................

Package outline...............................................................................

Features..........................................................................................

Maximum ratings .............................................................................

Rating and characteristic curves........................................................

Pinning information...........................................................................

Marking...........................................................................................

Suggested solder pad layout.............................................................

Packing information..........................................................................

Reel packing....................................................................................

Suggested thermal profiles for soldering processes.............................

High reliability test capabilities...........................................................

Mechanical data...............................................................................


1SS400

Document ID Issued Date Revised Date Revision Page.

DS-221919 2008/02/10 2010/05/10 C 7

3/20

Package Outline

Page 2

100mA Surface Mount Small Signal Switching Diode-90V

Features

Low current rectification and high speed switching

Extremely small surface mount type.

Up to 100mA current capability.

Low forward voltage drop (V = 1.2V typ. @100mA)FSilicon epitaxial planar chip, metal silicon junction.

Lead-free parts for green partner, exceeds environmental standards of MIL-STD-19500 /228

• Suffix "-H" indicates Halogen-free part, ex. 1SS400-H.

• • • • • •

Formosa MS


PARAMETER

Repetitive peak reverse voltage

DC reverse voltage

Peak Forward Surge Current

Mean rectifying current

Storage temperature

Operating Junction temperature

CONDITIONS Symbol

VRRM

VR

IFSM

IO

TJ

TSTG

MIN.

-55

-65

TYP. MAX.

90

80

500

100

+125

+125

UNIT

V

V

mA

mA

oC

oC

Forward voltage I = 100 mA F

Reverse current

Diode capacitance

Reverse recovery time

V = 80 V R

V = 0.5V, f = 1MHzR

I = 0mA, RL=100ΩFV = 6V, 1R

VF

IR

CT

trr

1.20

0.1

3.0

4.0

V

uA

pF

ns

1SS400

SMD Small Signal Switching Diode


Dimensions in inches and (millimeters)

0.028(0.70)

0.020(0.50)

0.051(1.30)

0.043(1.10)0.0

35(0

.90)

0.02

8(0.

70)

0.01

4(0.

35)

0.00

9(0.

25)

SOD-523FL

0.067(1.70)

0.059(1.50)

0.00

7(0.

20)

0.00

2(0.

05)

Mechanical data

•

• Case : Molded plastic, SOD-523FL

• Terminals :Plated terminals, solderable per MIL-STD-750, Method 2026

• Polarity : Indicated by cathode band

• Mounting Position : Any

• Weight : Approximated 0.002 gram

Epoxy : UL94-V0 rated flame retardant

Peak Forward Current IFM 225 mA

t=1s

DS-221919 2008/02/10 2010/05/10 C 7

Pd Power dissipation mW200

Maximum ratings and Electrical Characteristics (AT T =25A oC unless otherwise noted)

4/20


Rating and characteristic curves (1SS400)

FIG.2 - TYPICAL REVERSE CURVE

RE

VE

RS

E C

UR

RE

NT,

(µA

)

REVERSE VOLTAGE

0.01

0.1

1.0

FIG.1-TYPICAL FORWARD CURVE

INS

TA

NTA

NE

OU

S F

OR

WA

RD

CU

RR

EN

T,

IF(m

A)

FORWARD VOLTAGE,VF(V)

0 0.2 0.4 0.6 0.8 1.0 1.2 1.4


10

100

1000

TA=

-25

°C

TA=

25

°C

TA=

75

°C

TA=

125°C

0 20 40 60 80 100 120

0.01

0.1

1.0

10

100

1000

0.001

TA=25°C

TA=75°C

TA=125°C

10

5

2

1

0.5

0.2

0.1

0 2 .4 .6 .8 10 1.2 1.4

CA

PA

CIT

AN

CE

BE

TW

EE

N T

ER

MIN

AL

S,

CT(p

F)

FIG.4-RVERSE RECOVERY TIME CURVE

REVERSE VOLTAGE, VR(VOLTS) FORWARD CURRENT, IF(mA)

FIG.3-TYPICAL CAPACITANCE CURVE

FIG.5-SURGE CURRENT CURVE

SU

RG

E C

UR

RE

NT,

IFS

M(A

)

PULSE WIDTH, TW(ms)

PULSE GENERATOR

OUTPUT 50Ω

SAMPLING

OSCILLOSCOPE

5kΩ

50Ω

FIG.6-REVERSE RECOVERY TIME MEASUREMENT CIRCUIT

D.U.T.0.01μF

PULSE

DS-221919 2008/02/10 2010/05/10 C 7

VR=6VI =1/10Irr R

R E

VE

R S

E R

E C

OV

E R

Y T

IME

: t

rr (

ns

)

5/20

Pinning information

21Pin1 cathodePin2 anode

Pin Simplified outline Symbol

Marking

Type number Marking code

1SS400 A, 4

Page 4

1 2

Formosa MS

Suggested solder pad layout

Dimensions in inches and (millimeters)


1SS400



A

C

B

DS-221919 2008/02/10 2010/05/10 C 7

B

0.024 (0.60)

A

0.032 (0.80)

C

0.044 (1.10)

PACKAGE

SOD-523FL

6/20

Formosa MS


1SS400



DS-221919 2008/02/10 2010/05/10 C 7

Packing information

Item Tolerance SOD-523FL

Carrier width

Carrier length

Carrier depth

Sprocket hole

7" Reel outside diameter

7" Reel inner diameter

Feed hole diameter

Sprocket hole position

Punch hole position

Punch hole pitch

Sprocket hole pitch

Embossment center

Reel width

Overall tape thickness

Tape width

P0

P1

E

B

C

d

F

T

W

P

A

D

D1

D2

W1

Symbol

0.1

0.1

0.1

min

0.2

0.1

0.3

1.0

0.1

0.1

0.1

0.1

0.1

0.1

2.0

unit:mm

178.00

50.00

13.00

1.75

3.50

2.00

4.00

2.00

0.23

8.00

9.50

P0

P1

E

B

d

FW

PA

D

D1D2

W1

C

T

Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.

0.90

1.94

0.76

1.50

7/20

Formosa MSReel packing


1SS400



COMPONENT INNER REEL CARTON APPROX.PACKAGE REEL SIZE REEL SPACING BOX BOX DIA, SIZE CARTON GROSS WEIGHT (pcs) (m/m) (pcs) (m/m) (m/m) (m/m) (pcs) (kg)

SOD-523FL 7" 3,000 4.0 30,000 183*183*123 178 240,000382*262*387 9.5

DS-221919 2008/02/10 2010/05/10 C 7

Profile Feature Soldering Condition

Average ramp-up rate(TL to TP)

Formosa MS1SS400

1. Solder Resistance

2. Solderability

3. High Temperature Reverse Bias

4. Forward Operation Life

5. Intermittent Operation Life

6. Pressure Cooker

7. Temperature Cycling

8. Thermal Shock

9. Forward Surge

10. Humidity

11. High Temperature Storage Life

at 260 5 for 10 2sec.immerse body into solder 1/16"±1/32"

Oat 245±5 C for 5 sec.

OV =80% rate at T =125 C for 168 hrs.R J

ORated average rectifier current at T =25 C for 500hrs.A

OT = 25 C, I = IA F OOn state: power on for 5 min.off state: power off for 5 min. on and off for 500 cycles.

O15P at T =121 C for 4 hrs.SIG A

O O-55 C to +125 C dwelled for 30 min.and transferred for 5min. total 10 cycles.

O O0 C for 5 min. rise to 100 C for 5 min. total 10 cycles.

Peak Forward Surge Current at t=1s

Oat T =85 C, RH=85% for 1000hrs.A

Oat 175 C for 1000 hrs.

O± C ± MIL-STD-750DMETHOD-2031

MIL-STD-202FMETHOD-208

MIL-STD-750DMETHOD-1026



JESD22-A102



MIL-STD-750DMETHOD-4066-2



Item Test Conditions Reference

High reliability test capabilities




DS-221919 2008/02/10 2010/05/10 C 7

9/20

美麗微半導體股份有限公司台北縣土城市中央路三段號樓 208 5 FORMOSA MICROSEMI CO.,LTD 5F, No. 208, Sec. 3, Chung Yong Rd. http://www.formosams.com Tuchen City, Taipei Hsien, Taiwan TEL: 886-2-22696661 FAX: 886-2-22696141 Quality Service & Satisfaction

____________________________________________________________________________

第 1 頁；共 1 頁

Hand Soldering Guide

Background

Hand soldering with a hand solder iron is an individual process, unlike reflow or wave soldering

where the soldering conditions are controlled. During hand soldering, each soldering operation can

see different temperatures, stresses and amount of solder.

The most important part of hand soldering is the operator. The operator must fully understand the

operation he or she is performing. Care should be taken not only in soldering, but also in correct

component handling.

1. Soldering by Soldering Iron:

Solder iron should be with adjustable temperature controller, the diameter of the soldering iron tip

should be less than1mm and set the temperature not to exceed 350℃。

2. It is not suggested to contact the end terminals of the component by the soldering iron tip, place the

soldering iron tip adjacent to the termination-land interface ( see the figure following).

3. The soldering iron tip temperature should be controlled not to exceed 350℃. When the solder

starts to follow, slowly move the tip of the soldering iron towards the component. Add any additional

solder needed to generate a solder fillet. As the solder flows onto the component termination,

remove the soldering iron.

4. Suggest to have the soldering iron tip adjacent to the termination-land interface not exceed 3

seconds at 350℃ or not exceed 7 seconds at 300℃ to minimize the possibility of thermal shock.

Hand Soldering Expression Diagram

Diode θ1mm

Solder Iron

PCB Substrate

Solder

Terminals

10/20

LOT NUMBER ( ) / DATE CODE( ) :

LOT NUMBER :6 ,

DATE CODE: 2 , X1X2

X1 X2 X1: X2: 1 :1 2 :2 .10 :O 11 :N 12 :D

X

X :

X X X X X

X X X X X , A(5 ) :

11/20


製表人:陳政安

加百裕包裝規範 1. 使用一般的標籤，加百裕共兩種標籤，捲盤、內盒、外箱都要四項標籤，外箱標籤為加百裕

的格式。

2. 圖示: 四項標籤外箱標籤

3. 標籤內容說明四項標籤 :

P/N : 我們的料號，依 INVOICE 上的資料鍵入

CUST : 客戶料號，依 INVOICE 上的資料鍵入

LOT : 依該貨批號鍵入

Q’TY : 數量，依該貨數量鍵入

DATE code : 當日出貨日期的年週

外箱標籤 :

廠商 : 美麗微，不須更動

加百裕訂單號碼 : 依 INVOICE 上的”P/O NO.”資料鍵入

加百裕料號 : 依 INVOICE 上的”CUSTOMER P/N”資料鍵入

品名 : 依 INVOICE 上的”FMS P/N”資料，不須更動

規格 : 該貨的封裝型態，不須更動

數量 : 該貨的數量

製造日期 : 空白，不需填寫

交貨日期 : 出貨當天的日期

4. 注意事項: 加百裕出口有分元崧、基眾兩個地方，包貨時和填寫麥頭時要注意。

KYET JI_JONQ

12/20


製表人:陳政安

13/20

FORMOSA MICROSEMI CO.,LTD

Storage Circumstance

(1) Avoid storage locations where devices will be exposed to moisture or direct sunlight.

(Be especially careful during periods of rain or snow.)

(2) Do not place device cartons upside sown. Stack cartons on top of one another in an

upright position only; do not place cartons on their sides.

(3) The storage area temperature should be kept within a temperature range of 5℃

to 35℃,and relative humidity should be maintained below 75%.

(4) Do not store devices in the presence of harmful (especially corrosive) gases, or in

dusty conditions.

(5) Use storage areas where there is minimal temperature fluctuation. Rapid temperature

changes can cause moisture to form on stored devices, resulting in lead oxidation or

corrosion. As a result, the solder ability of the leads will be degraded.

(6) When repacking devices, use anti static containers.

(7) Do not allow external forces or loads to be applied to devices while they are in storage.

Storage Shelf Life

(1) Below 1 years – OK (should be kept within a temperature range of 5℃

to 35℃, and relative humidity should be maintained below 75%)

(2) More than 2 years – Each Date Code must pass solder ability testing per

MIL-STD-202F METHOD 208F, solder ability condition 245C±5℃(473±9F) at LTPD

10 (C=0 ) and must pass a sample electrical test to an AQL of 0.04. If the devices fail

solder ability, scrap. If the devices pass solder ability and fail the AQL of 0.04 sample

electrical test, 100% electrical test then return to stock.

14/20

Per

cen

tage

%p

pm

Per

cen

tage

%p

pm

Lead

Fra

me

Iro

n (

Fe)

7439

-89-

60.

2445

2800

042

.16

42

16

00

.00

13

.97

30

28

57

13

97

30

.28

57

1

Nic

kel (

Ni)

7440

-02-

00.

1772

4800

030

.56

30

56

00

.00

10

.12

84

57

14

10

12

84

.57

14

3

Silv

er (

Ag

)74

40-2

2-4

0.10

2312

000

17.6

41

76

40

0.0

05

.84

64

00

00

58

46

4.0

00

00

Co

pp

er

(Cu

)74

40-5

0-8

0.05

5912

000

9.64

96

40

0.0

03

.19

49

71

42

93

19

49

.71

42

9

Sub

-To

tal

0.58

0000

000

100

33

.14

28

57

14

33

14

28

.57

14

3

Ch

ipSi

lico

n (

Si )

7440

-21-

30.

0186

4200

093

.21

93

21

00

.00

1.0

65

25

71

43

10

65

2.5

71

43

Go

ld (

Au

)74

40-5

7-5

0.00

1338

000

6.69

66

90

0.0

00

.07

64

57

14

37

64

.57

14

3

Alu

min

um

(Al)

7429

-90-

50.

0000

2000

00.

11

00

0.0

00

.00

11

42

85

71

1.4

28

57

Sub

-To

tal

0.02

0000

000

100

1

.14

28

57

14

31

14

28

.57

14

3

Wir

eG

old

( A

u )

7440

-57-

50.

0400

0000

010

01

00

00

00

.00

2.2

85

71

42

86

22

85

7.1

42

86

Sub

-To

tal

0.04

0000

000

100

2.2

85

71

42

86

22

85

7.1

42

86

Mo

ldin

g C

om

po

un

dFu

sed

Sili

ca (

SiO

2)

6067

6-86

-00.

6810

4800

063

.06

63

06

00

.00

38

.91

70

28

57

38

91

70

.28

57

1

Met

al H

ydro

xid

e13

09-4

2-8

0.27

4212

000

25.3

92

53

90

0.0

01

5.6

69

25

71

41

56

69

2.5

71

43

Solid

Ep

oxy

Res

in25

928-

94-3

0.05

1408

000

4.76

47

60

0.0

02

.93

76

00

00

29

37

6.0

00

00

Ph

en

olic

Res

in90

03-3

5-4

0.03

4128

000

3.16

31

60

0.0

01

.95

01

71

43

19

50

1.7

14

29

Cry

stal

line

Sili

ca14

808-

60-7

0.02

8836

000

2.67

26

70

0.0

01

.64

77

71

43

16

47

7.7

14

29

Car

bo

n B

lack

1333

-86-

40.

0103

6800

00.

969

60

0.0

00

.59

24

57

14

59

24

.57

14

3

Sub

-To

tal

1.08

0000

000

100

61

.71

42

85

71

61

71

42

.85

71

4

Lead

Fre

e P

lati

ng

Tin

(Sn

)74

40-3

1-5

0.03

0000

000

100

10

00

00

0.0

01

.71

42

85

71

41

71

42

.85

71

4

Sub

-To

tal

0.03

0000

000

100

1.7

14

28

57

14

17

14

2.8

57

14

Tota

l1.

7500

0000

01

00

10

00

00

0

Co

mp

on

ent

Info

rmat

ion

Co

mp

on

ent

Sub

stan

ce

CA

S N

um

ber

Am

ou

nt

(mg)

Ho

mo

gen

eou

s M

ater

ial L

evel

Co

mp

on

ent

Leve

l

Ro

HS

& H

igh

-Tem

p C

om

plia

nt

Yes

Ro

HS

Exem

pti

on

Yes

Hal

oge

n-f

ree

Co

nve

rsio

n D

ate

2012

/5/1

1To

tal D

evic

e M

ass

(mg)

1.7

50

00

00

00

Envi

ron

men

tal R

atin

gs In

form

atio

n (

For

EE c

om

po

ne

nt

use

)

Ref

low

max

tem

p.

260℃

Rem

ark

Co

lor

Bla

ckP

acka

ge T

ype

/ P

ins

SOD

52

3-F

L/2

Pin

s

Ro

HS

& H

alo

gen

-fre

e C

om

plia

nt

Yes

Pac

kage

Bo

dy

Size

(W

xLxH

) m

m1

.2x0

.8x0

.6

Co

mp

any

nam

e: F

orm

osa

Mic

rose

mi C

o.,

Ltd

.d

ated

: 2

012/

5/11

Cu

rren

t P

rod

uct

ion

Info

rmat

ion

Typ

e n

um

ber

1SS4

00-H

Ass

emb

ly S

ite

add

ress

27

Wes

t P

eop

le R

oad

, Les

han

, Sic

hu

an, C

hin

a

Ce

lxp

ert

Par

t N

um

ber

. : 2

4100

054

15/20

產品料號 : (P/N)

產品名稱 :(Product Name)

廠商名稱 :(Suppliers Name)

限制濃度Threshold concentration

ppm(mg/kg)

是否含有(請以V 標

記) Use in part or

not？

use in where

and purpose

75

塑膠(包含橡膠)、油墨、包材：5

800

paint, ink: 90

800

Heavy Metal ：N.D.

表單編碼：QS-3R-012-01I

Polychlonnated Terphenyls

(10).溴化阻燃劑 BFRs1000 Yes No

Brominated Flame Retardant

Yes No

Yes No

1000 Yes No Hexabromocyclododecane

(9). 六溴環十二烷 HBCDD

(8).四溴雙酚-A-雙-二溴丙醚1000 Yes No

TBBP-A-bis

(7). 多溴聯苯醚PBDE800 Yes No

IEC 62321

Polybrominated diphenyl ethers ND

(6).多溴聯苯PBB800 Yes No

IEC 62321

Polybrominated biphenyls ND

5. RoHS (item 1, 2, 3, 4, 6, 7) & Halogen free (item 17, 18) must be detected. The date of test report shall be within

one year.

Remark:

要求內容Requirement

具體內容請參照環境有害物質管理準則文件之環保規定 For futhter details, please refer to Celxpert Environment Protect Policy

Yes No

Hexavalent chromium compounds

Lead and lead compounds

(3). 汞及汞化合物

Mercury and mercury compounds

(4). 六價鉻化合物

(5). 包裝材料中重金屬(汞、鎘、六價鉻、鉛)之總量

Heavy metals (mercury, cadmium, lead, and hexavalent

chromium)in packing materials

800

< 100

實測值measured

value

(11). 多氯聯苯 (PCB)

禁限物質Banned substances

(1). 鎘及鎘化合物

Cadmium and cadmium compounds

(2). 鉛及鉛化合物

ND Yes No

Yes No

禁用物質管制調查表

基本資料(Basic Data)

蓋章處:(Company's Seal)

提供日期: 2012/5/11Date:

請各廠商依據實際情況填寫下表(Please fill in following items on the basis of fact.)

24100054

100mA/90V Small Signal Switching Diode, SOD523-FL

Formosa Microsemi Co., Ltd.

Investigation for the environment-related substances to be controlled

24

ND

Yes No

Polychlorinated biphenyl

(12).多氯化萘 (PCN)

Polychlorinated naphthalene

N.D.

N.D.

Yes No

Yes No

Impurity, Tin-

Plated Layer of

Terminals

IEC 62321

IEC 62321

IEC 62321

IEC 62321

ND

4. Please provide homogeneous material test reports to prove the part is compliant with RoHS and Halogen free.

1. If the environment-related substances to be controlled is not uesd in your products and manufacturing

process,please choose or mark on NO.

3. Nickel: the use of products that are in direct contact with the skin or that are touched for a long period of time .

2. Please present measurement data according to the test report, and composition charts or MSDS (Material safety

data sheet) in detail to Celxpert purchase department.

(13).聚氯三聯苯(PCT)N.D.

16/20





ppm(mg/kg)

是否含有(請以V 標記)

Use in part or not？Please choose and

mark “ V ”

use in where

and purpose

短鏈氯化石蠟 (C10-C13)： ND

中鏈氯化石蠟 (C14-C17)： 1000

人體可碰觸：N.D.

人體不碰觸：30

木製棧板：75

其他：ND

人體碰觸：N.D.

人體不碰觸：1000 或

釋放率< 0.5 ug-Ni/cm2/week


Ozone depleting substances, ODS

(29).鎳

Yes NoNickel

(28). 銻1000 Yes No

Antimony, Sb

(27).砷100 Yes No

Arsenic, As

Azo compounds

Asbestos

(21).臭氧危害物質N.D.

Yes No

Yes No

Chloride ND

(18).氯

900 Yes No

BS EN 14582:2007/

IEC61189-2

Formaldehyde

Pentachlorophenol, PCP

(20).偶氮化合物 Yes No

(19).五氯笨酚

Polyvinyl chloride (PVC) and PVC blends

(16).氯化阻燃劑 CFRs1000 Yes No

Chlorinated Flame Retardants

BS EN 14582:2007/

IEC61189-2

ND

Organic Tin and its compounds

(Tributyltin (TBT) compounds; Triphenyltin (TPT)

compounds);Bis(tributyltin)oxide(TBTO);Dibutyltin

(DBT) compounds；Dioctyltin (DOT) compounds)

(24).石棉

(17).溴

Bromine

900

(22).甲醛 Yes No

1000


Remark:


(23).有机锡化合物（三丁基錫 (TBT)、三苯基錫

(TPT)、氧化雙三丁基锡(TBTO)、二丁基锡化合物

(DBT)、二辛基锡化合物(DOT))

(14). 短鏈和中鏈氯化石蠟 (SCCP & MCCP)

Short and Medium Chained Chlorinated Paraffins

Yes No

Yes No

(15).聚氯乙烯(PVC)以及聚氯乙烯混合物Negative Yes No

Yes No


(25).鹵化戴奧辛/呋喃

Halogenated dioxins and furans

Yes No

TBT&TPT&TBTO：N.D.

DBT &DOT：1000




提供日期: 2012/5/11Date:


24100054



5. RoHS (item 1, 2, 3, 4, 6, 7) & Halogen free (item 17, 18) must be detected. The date of test report shall be within one

year.


N.D.

N.D.

1000


2. Please present measurement data according to the test report, and composition charts or MSDS (Material safety

data sheet) in detail to Celxpert purchase department.

Selenium/Selenium Compounds(Se)

(26).硒/硒化合物 Yes No




實測值measured value

Yes No

17/20





ppm(mg/kg)

是否含有(請以V 標記)

Use in part or not？Please choose and

mark “ V ”

use in where

and purpose

PFOS：物質或配製品：50

成品：1000

PFOA：50 ppm (紡織品及有塗層的

材料需小於1 μg/m2)

塑料，經常性和皮膚接觸的部件，

接觸時間超過30秒：

BaP < 1,總量 < 10

塑料，偶爾性接觸的部件，與皮膚

接觸時間少於30秒，或與皮膚沒有

接觸的部件：

BaP < 20,總量 < 200


(33).全氟辛烷磺酸鹽/全氟辛酸

(32).鄰苯二甲酸

1000

Yes No

(36).三氧化二銻

(37).富馬酸二甲酯 Yes No

N.D.

Beryllium, Be



Yes No Bismuth/Bismuth Compounds，Bi

(30).鈹1000

Expandable polystyrene

Phthalates (including DEHP, DBP, BBP, DINP,

DIDP, DNOP and DNHP)

(34).多環芳香族化合物

Yes No

Polycyclic aromatic hydrocarbons (PAHs)

1000 Yes No

Yes No

0.1




提供日期:2012/5/11Date:


24100054


Sb2O3


實測值measured value


(31).鉍/鉍化合物

Radioactive Substances (U, Pu, Rn, Am,Th, Cs, Sr

and other)

Yes No

PFOS/PFOA


(35).放射性物質

Yes No

Dimethylfumarate，DMF

所有無鹵產品與無鹵零組件:1000

(38).發泡聚苯乙烯(EPS)

Remark:

2. Please present measurement data according to the test report, and composition charts or MSDS (Material

safety data sheet) in detail to Celxpert purchase department.




5. RoHS (item 1, 2, 3, 4, 6, 7) & Halogen free (item 17, 18) must be detected. The date of test report shall be within

one year.


銷往南韓的所有包裝材料：ND Yes No

18/20

美麗微半導體股份有限公司

FORMOSA MICROSEMI CO.,LTD

加百裕料件承認需要資料測試報告

一、測試項目：1SS400-H -55 度 +25 度 +125 度 VF 及 IR 各 5pcs

二、測試內容：

1SS400-H -55 度 +25 度 +125 度測試結果

Temp. -55℃ +25℃ +125℃

項目 VF(V) IF=100mA

IR(uA) VR@80V

VF(V) IF=100mA

IR(uA) VR@80V

VF(V) IF=100mA

IR(uA) VR@80V

NO.1 1.08 0.001 0.959 0.004 0.846 3.29

NO.2 1.03 0.001 0.957 0.005 0.845 3.19

NO.3 1.03 0.001 0.956 0.005 0.842 3.37

NO.4 1.04 0.001 0.958 0.004 0.843 3.34

NO.5 1.06 0.001 0.956 0.003 0.845 3.42 Approved by : C.Z Chen Prepared by：Kai chen Date : 5/15/2012

20/20

1-封面-1SS400-H.pdf2-Content-1SS400-H.pdf�¶�± 1

3-1SS400_REV_C.pdf頁面 1頁面 2頁面 3頁面 4頁面 5頁面 6頁面 7

4-Hand Solding Guide.pdf5.1-Formosa Label.pdf5.2-客製標籤-加百裕.pdf5.3-儲存條件(英文).pdf6-物質成份表-2010 01 20-1SS400-H.pdf8.1-QS-3R-012-01禁用物質管制調查表REV I-1SS400-H.pdf8.2-附件五(環境物質保證書).pdf9-加百裕料件承認需要資料測試報告-1SS400-H.pdf

核准 審核 製作 dio sod523fl 80v swi 1ss400 fms test report...

Documents

核准審核製作 dio sod523fl 80v swi 1ss400 fms test report...