スタンダード製品独立による梱包ラベル変更のご案内. packaging packing boxes...

株式会社ＰＡＬＴＥＫ

〒222-0033 神奈川県横浜市港北区新横浜2-3-12 Tel:045-477-2014 Fax:045-477-2010 http://www.paltek.co.jp

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文書管理番号：RC304-16-NT320 平成28年12月7日

お客様各位株式会社ＰＡＬＴＥＫＱＲＡグループ塩脇由華

スタンダード製品独立による梱包ラベル変更のご案内

拝啓平素は格別のお引立てを賜り厚く御礼申し上げます。さて、NXP Semiconductors社よりスタンダー

ド製品独立による梱包ラベル変更について案内文が届きましたので下記に要点をご報告いたします。ご査

収の上何卒宜しくお取り計らい下さるようお願い申し上げます。敬具

記対象製品

こちらのURLをご参照ください。

http://www.paltek.co.jp/qra/NXP/201611038I/NXP_CIN_201611038I_Part_Number_List.xlsx

変更内容

2017年Q1より、NXP社のスタンダード製品を取り扱うビジネスユニットがNexperia社として独立いたします。この変

更により、梱包箱のロゴとラベルがNXPからNexperiaに変更になります。現在庫分はそのまま出荷されますので、施

行日以降一定期間はNXP、Nexperiaの両方梱包で出荷されます。

詳細はNXP Semiconductors社発行「Customer Information Notification (201611038I)」を、梱包箱、ラベル情報の詳

細は「Nexperia Company Name for BU Standard Products Affects Packing and Labels」をご参照ください。

実施日

変更予定日：2017年1月9日

添付資料

NXP Semiconductors社発行「Customer Information Notification (201611038I)」

NXP Semiconductors社発行「Nexperia Company Name for BU Standard Products Affects Packing and Labels」

連絡先

この件につき、ご質問がございましたら弊社営業担当までご連絡くださいますよう、お願い申し上げます。

以上

注意：NXP Semiconductors社発行の英文報告書が正式報告書となっております。本和文報告書とNXP Semiconductors社発行の

英文報告書との間に差違が生じた場合はNXP Semiconductors社発行の英文報告書を優先願います。

Customer Information Notification 201611038IIssue Date: 30Nov2016Effective Date: 09Jan2017

Dear PALTEK PCN,

Here's your personalized quality information concerningproducts PALTEK CORPORATION purchased from NXP.For detailed information we invite you to view thisnotification online

Change Category Wafer Fab

Process Assembly

Process Product Marking Test

Location Design

Wafer FabMaterials

AssemblyMaterials

MechanicalSpecification

TestProcess

Errata

Wafer FabLocation

AssemblyLocation Packing/Shipping/Labeling

TestEquipment

Electrical spec./Testcoverage

Nexperia Company Name for BU Standard Products Affects Packing and Labels

Information NotificationIn Q1 2017 NXP Business Units Standard Products will continue as a standalone company, Nexperia. Asa result of this change the packing and labelling on the product portfolio will change from NXP to Nexperia.

The NXP logo or words 'NXP Semiconductors' will be replaced by the Nexperia Logo or wording'Nexperia' respectively.

From the implementation date onwards the new company name will be phased in, both the new and theold labeling will be shipped in parallel for a certain transition period. The details about the appearance ofthe new labels and logo are attached.

The affected product types can be found in the attached type list.

Why do we issue this Information NotificationTo inform customers on the visible changes in packing and labels reflecting the new company name.

Identification of Affected ProductsPacking labelsLabels and packing material will reflect the Nexperia branding.

Impactno impact to the product's functionality anticipated.There is no impact to the final product, label and packing updated to Nexperia branding

Data Sheet RevisionNo impact to existing datasheet

Disposition of Old ProductsExisting inventory will be shipped until depleted

https://extranet.nxp.com/requestdispatcher?app=pcn&pcnId=bd6fa564976719713e22b0551b3ead5a

Additional informationAdditional documents: view online

Contact and SupportFor all inquiries regarding the ePCN tool application or access issues, please contact NXP "Global QualitySupport Team".

For all Quality Notification content inquiries, please contact your local NXP Sales Support team.

For specific questions on this notice or the products affected please contact our specialist directly:email address [email protected]

At NXP Semiconductors we are constantly striving to improve our product and processes to ensure theyreach the highest possible Quality Standards.Customer Focus, Passion to Win.

NXP Quality Management Team.

About NXP Semiconductors

NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and StandardProduct solutions that leverage its leading RF, Analog, Power Management, Interface, Security and DigitalProcessing expertise. These innovations are used in a wide range of automotive, identification, wirelessinfrastructure, lighting, industrial, mobile, consumer and computing applications.

NXP SemiconductorsHigh Tech Campus, 5656 AG Eindhoven, The Netherlands© 20062010 NXP Semiconductors. All rights reserved.

https://extranet.nxp.com/requestdispatcher?app=pcn&pcnId=bd6fa564976719713e22b0551b3ead5a

https://extranet.nxp.com/group/distinet/faq

mailto:[email protected]?subject=Support

CIN 201611038I Nexperia Company Name for BU Standard Products Affects Packing and Labels Revision: 01

Product Information NXP Product NXP 12 NC Code Customer Customer Part

Number

Document information

Info Content

Author Richard Aspin

Supplier NXP Semiconductors

Reference CIN 201611038I

Revision History Revision Description

01 Initial submission to support CIN approval

Purpose and Background

The purpose of this report is to provide the documentation supporting the packing and labelling changes for Nexperia.

Table of Contents

Requirement Description 1 Packaging 1.1 Example of Nexperia Reel Box 2

Barcode Identification Labels

2.1 PQ Label

2.2 Reel Label

2.3 Standard Outer Box Label

2.4 Customer Outer Box Label

2.5 Standard Packing List

All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.

Customer Information Notice Revision: 01

NXP Semiconductors CIN 201611038I

Nexperia Company Name for BU Standard Products Affects Packing

and Labels

Page 2 of 6

1. Packaging Packing boxes currently have the NXP logo, these logos will be updated with the ‘Nexperia’. Example of the change is shown below. 1.1 Example of Nexperia Reel Box





and Labels

Page 3 of 6

2. Barcode Identification Labels The printed barcode identification labels used for final products, assembled product and wafer shipments will be updated to reflect the new company name. The data fields for final products will not change with the exception of the ‘Company’ field name at the top of the label. Examples of the changes are included below. 2.1 PQ Labels

Current Proposed

Figure 1: Example PQ Label

2.2 Reel Label

Current Proposed

Figure 2: Example Reel Label

Update Company Name

Update Company Name





and Labels

Page 4 of 6

2.3 Standard Outer Box Label

Current Proposed

Figure 3: Example Standard Outer Box Label

2.4 Customer Outer Box Label

Current Proposed

Figure 4: Example Customer Outer Box Label

2.5 Standard Packing List

Current Proposed

Note: Headings apply to optional appendices Figure 5: Example Standard Packing List

Label Format Unchanged

Update Company Name

Update Supplier Address

Update Supplier Number

Update Company Name

Update Ship from Address

Update Company Logo





and Labels

Page 5 of 6

Legal information

Disclaimers Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

Unless otherwise recorded in a written agreement, all sales transactions

relating to the products described herein by NXP Semiconductors are subject

to NXP’s general terms and conditions of commercial sale. These are

published at www.nxp.com/profile/terms/index.html

Right to make changes — NXP Semiconductors does have the right to make

changes. However, any changes need to be released and announced

following applicable automotive standards: e.g. AEC-Q100 (Integrated

Circuits) or AEC-Q101 (discretes) for releases, JESD46D for changes or

applicable agreed customer specific requirements.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of customer’s

third party customer(s). Customers should provide appropriate design and

operating safeguards to minimize the risks associated with their applications

and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary testing

for the customer’s applications and products using NXP Semiconductors

products in order to avoid a default of the applications and the products or of

the application or use by customer’s third party customer(s). NXP does not

accept any liability in this respect.

Export control — This document as well as the item(s) described herein may

be subject to export control regulations. Export might require a prior

authorization from competent authorities.





and Labels

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