电源系统传导干扰仿真 q3d, siwave rlcg parasitics ansys mechanical thermal/stress ansys cfd...

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1 August 3, 2017 ANSYS UGM 2017 © 2017 ANSYS, Inc. 电源系统传导干扰仿真 杨利辉 / 高级工程师 ANSYS CHINA

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Page 1: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

1 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

电源系统传导干扰仿真

杨利辉 / 高级工程师

ANSYS CHINA

Page 2: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

2 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

A. ANSYS用于传导干扰EMI仿真的工具介绍

B. Simplorer用于电力电子开关电源仿真设计

C. Q3D用于电力电子开关电源仿真设计

D.用于噪声计算的动态耦合方法

目录

Page 3: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

3 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

A. 用于传导干扰EMI的工具介绍

Page 4: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

4 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

•传导干扰受到很多因素的干扰,把考虑这些因素的

模型链接到电路仿真工具中,就可以对传导干扰进行

仿真分析;

•为了考虑EMI的多种物理影响,ANSYS有丰富的工具

和模型用于电力电子仿真;

•仿真应用包含中低频率的开关电源SMPS,PWM功率

变换器,逆变器,整流器,传感器,做动器,电机和

电机驱动器等

传导干扰EMI需要考虑的问题

Page 5: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

5 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

ANSYS 机电系统解决方案

ANSYS SimplorerSystem Design

PP := 6

ICA:

A

A

A

GAIN

A

A

A

GAIN

A

JPMSYNCIA

IB

IC

Torque JPMSYNCIA

IB

IC

Torque

D2D

ANSYS Maxwell2D/3D FEA Analysis

HF/SIHFSS, Q3D, SIWave

RLCG Parasitics

ANSYS MechanicalThermal/Stress

ANSYS CFDThermal

Model order Reduction

Co-simulation

Field Solution

FE Model Generation

OptimetricsLS-DSO

SCADE SuiteControl Systems

Embedded Design

Push Back Excitations

PExprtMagnetics

RMxprtMachine Design

Page 6: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

6 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

非线性器件Simplorer

-5.00E-02

0.00E+00

5.00E-02

1.00E-01

0 100 200 300

・Extraction Magnetic Char. via Maxwell

・NL Magnetic Core Model.

0.00 10.00 20.00 30.00 40.00Time [ms]

-25.00

-12.50

0.00

12.50

25.00

Y1

[A

]

Simplorer1_runLine Current ANSOFT

Curve Info

U8.AMa.I

U8.AMb.I

U8.AMc.I

Motor current

・NL Capacitor Model. C(q, V)

-231.0n 618.0n0 200.0n 400.0n

-50.0

700.0

0

166.7

333.3

500.0

-172.0n 750.0n0 200.0n 400.0n 600.0n

-50.0

700.0

0

166.7

333.3

500.0

・Semiconductor Device Model

Page 7: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

7 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

无源器件、线性器件耦合(Parasitics)

・ transmission characteristic of 3D

・ structure :HFSS

・ Impedance of a 2.5D board :SIWave

・ The parasitism ingredient of a cable /3D structure :Q3D Extractor

Simplorer

Coupling with various ANSYS electromagnetic-field analysis tools is possible.

-500.00m

500.00m

0

48.00m 50.00m49.00m

Sheet8.Vcm Sheet8.Vdm

Common mode Voltage (Vcm) Normal mode Voltage (Vdm)

Page 8: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

8 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

磁性器件设计- Inductors/TransformersSIMPLORER

PExprt

Maxwell

Ideal Transformer PExprt Transformer

Page 9: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

9 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

测试器件的频率响应

Port1:1_pos Port1:1_neg

E1

A

AM1

+

V

VM1

0

EQU

FML1

Zz := VM1.V/AM1.I

0

1.00E-005 1.00E-004 1.00E-003 1.00E-002 1.00E-001 1.00E+000 1.00E+001 1.00E+002F [MHz]

-20.00

0.00

20.00

40.00

60.00

80.00

100.00

dB

(Zz)

-100.00

-50.00

0.00

50.00

100.00

an

g_

de

g(Z

z)

[de

g]

Simplorer1Rectangular Plot0

Curve Info

dB(Zz)

ang_deg(Zz)

*.s*p

TouchStoneNetwork Data Explorer

0.00 10.00 20.00 30.00 40.00Time [ms]

-5.00

5.00

15.00

25.00

35.00

VM

1.V

[m

V]

0.00

0.10

0.20

0.25

AM

1.I [A

]

Curve Info

VM1.VTR

AM1.ITR

Import as State Space Model.

Frequency Response

Transient

Using the Network Data Explorer, the TouchStone format file

is importable into Simplorer, for both AC and Transient simulations./同时进行交流和瞬态分析

Page 10: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

10 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

从电磁场到电路的频率响应耦合流程

HFSS・Q3D Extractor・Maxwell(Eddy Current)

Result of Frequency Sweep

Designer(NEXXIM)

Result of LNA

State Space model

(Simplorer

.sml file)

Import to

Simplorer

Observation result by a

measuring machine

S parameter file

(Touchstone .sNp)

SIwave

Result of S/Y/Z parameter

Everything uses fitting method of frequency response to generate a "state space model“.

Page 11: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

11 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

用ANSYS EM 工具提取部件或结构参数

Q3D Extractor

Maxwell

SIwave

Electrical Components・3D branch conductors・2D Cables

Multi layered circuit board (PCB)・Large # of terminals

HFSS

High Frequency Electrical components・Connectors ・3D Cables

Winding impedance.Capacitance between windings.(Loop inductance is solved = Looped conductor are needed.)

Branched conductor impedance.(Partial inductance is solved = any geometry is possible, but detailed L(F) are ignored.)

Well grounded PCB.(Perpendicular electric field is assumed. = Thin layered conductors are needed.)

High frequency transmission.(Transmission-mode matching is performed on a port. = Ground connections are needed.)

ElectroMagnetic Components ・Non-Linear Cores ・Coils

Page 12: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

12 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

• Q3D is a tool streamlined for quickly characterizing electrical parasitics of interconnects, busbars, and cables across frequency.

• Q3D Extractor: 3-D quasi-static lumped RLC parameter extractor.Linear permeability = 1.

• 2D Extractor: 2-D T-line RLGC parameter extractor.Linear permeability.

• SIwave is meant specifically for multi-layer PCBs with a good ground-plane. It can handle many ports.

• HFSS is meant for microwave solution, when the wavelength is close to the geometry size (when electrically large).

• Maxwell is meant for coils and magnetics.

DC ???

Q3D

2D Extractor

HFSS, SIwaveX

10

L

2

L

Maxwell

20

L

不同的应用场合采用不同的仿真工具

Page 13: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

13 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

ANSYS集成设计平台

• One desktop application handles multiple design types• Simplorer, Maxwell, RMxprt, Q3D, HFSS

• Streamlines coupled workflows between systems/circuits and 3D

Page 14: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

14 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

访问 PExprt/PEmag

• PExprt/PEmag are opened from the

Windows > Start menu

• Or, open PEmag from within the

Electronics Desktop

(in the Tools menu, find PEmag)

Page 15: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

15 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

设置和选项

• In the General Options

window, you can find the

Default Units.

• For Low-Frequency

applications, change:

Time: [s]

Frequency: [Hz]

Page 16: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

16 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

B. Simplorer 用于电力电子设计

Page 17: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

17 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

Simplorer用户接口

Equation

s

State

Machine

Analog

Control Circui

t

SubShe

et

LISN output,

frequencies

Motor Speed,

Currents

Project

Manager

Drag &

Drop

Library

Tree

Page 18: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

18 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

• This is a “low-frequency” EMI solution from

DC to ~100MHz.

• The switching frequency may be from 10Hz

to ~100kHz.

• Sometimes we may need several time-steps

per rise/fall, and the transient simulation

requires higher-frequency data (from

measurement or simulation).

• If all components are characterized across

the frequency, then the results will also be

valid across freq.

Simplorer 传导噪声仿真应用

Trap_WavePWIDTH=1e-005TRISE=0.1usTFALL=0.1usTPERIO=5e-005

0 20 40 60 80 100Time [us]

0.00

0.25

0.50

0.75

1.00

Tra

p_W

ave.V

AL

Simplorer1Trapezoidal Waveform

0 10 20 30 40 50Spectrum [MHz]

-140

-115

-90

-65

-40

-15

0

dB

(Tra

p_W

ave.V

AL)

Simplorer1Trapezoidal Frequency Spectrum

fswitch = 20kHz

Page 19: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

19 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

• The time-step used in the transient circuit simulation is dictated by the

dynamics of the circuit/system.

• For results up to 30MHz (CISPR upper limit), then you will want time-step at

<=15ns.

• Whatever time-step (Hmin) is used, you should provide frequency-

dependent component data above 2/(Hmin).

仿真步长设置Time-steps <= 1/2Fmax

Fresults

30MHzFswitching

?DC0Hz

2/Hmin~120MHz

Fcomponent-Max

~120-300MHz

Page 20: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

20 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

• 在Simplorer中进行电力电子仿真时,有非常多的开关动作,所以是非线性的

• 能体现频域特性的模型和数据决定系统的动态响应

• 有多种方法建立和使用这些能体现频域特性的模型和数据

用于瞬态仿真的频域模型

Page 21: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

21 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

• Simplorer中即使是隔离的变换器,也需要参考地

• 可以建立有别于大地的信号地和系统地

• 大地和其它地之间可以用实际的阻抗隔离

Simplorer里的参考地

Page 22: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

22 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

• 定义系统中的关键部件

✓ Characterize these well across operating points

✓ Model all passive components from impedance analyzer

✓ Model active components from datasheet if not measurement

• 对所有电流路径-特别是地电流路径建模

• Q3D抽取寄生参数

• Simplorer中求解瞬态模型

• 与各种标准比较

• 优化设计-同时包含电路和PCB Layout

仿真设置和流程

Page 23: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

23 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

C. Q3D 用于电力电子设计

Page 24: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

24 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

• Main LF applications are:

- Bus bar systems

- Power modules (coming from a MCAD package)

- Power boards (coming from an ECAD package)

- Assembly (board + housing + busbar for instance)

•We specifically cover the following issues:

- Solver setup/求解设置

- State Space model generation to Simplorer/生成状态空间模型到Simplorer

Introduction to Q3D for Power Electronics

Page 25: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

25 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

•Please refer to the Q3D User’s Guide for detailed descriptions

Q3D Extractor Graphical Interface

Page 26: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

26 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

Import Geometry – ECAD and/or MCAD

•Cadence Allegro/APD/SiP

•Mentor Graphics Board Station

•Mentor Graphics Expedition

•Mentor Graphics PADS Layout

•Zuken CR5000

•ODB++

•DXF

•GDSII

SIwave

HFSS

Q3D Extractor

3D CAD Model

•IGES

•STEP

•ACIS

•Parasolid

•Pro-ENGINEER

•AutoCAD

•CATIA

•Siemens PLM NX

Q3D

ECAD MCAD

Page 27: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

27 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

• Conductors / Dielectrics have distinct behavior./导体和电介质有不同的行为特性

• Materials are Passive, Causal, and Linear, but frequency-dependent./频变材料

• Conductors determine capacitance surfaces (“nets”), and solid current paths

where you can assign source/sink terminals.

• Dielectrics affect capacitance (frequency dependence) as well as dielectric loss

(conductance).

• To maintain causality, the frequency-dependence of the dielectric material needs

to satisfy criteria, and are automatically adjusted in some cases.

• To simplify geometry, the Background

material can be set as dielectric so

that dielectric objects can be

excluded from geometry.

材料特性

In LF power-electronic applications, G is very small, and it is suggested to ignore G by setting Loss Tangent = 0.

Page 28: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

28 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

• A net is a collection of touching conductor objects.

• Use Auto-Identify Nets to generate conductor nets for all separate conduction

paths.

• A net must have source & sink terminals for RL analysis

• A net does not need either terminal for CG analysis

• A net cannot have more than one sink terminal

• You can have multiple sources

导电网络

Page 29: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

29 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

• Source/Sink can be assigned to faces of 3D objects or 2D sheet objects touching

a 3D conductor.

• [Source]: The face which becomes an inflow source of an electric current.

• [Sink]: The face which becomes an outflow source of an electric current.

• It's possible to set only 1 sink per conduction net. You can switch around the

direction of Source/Sinks in the Matrix Reduction, but it is not necessary for use

in Circuit simulations.

• Do not select multiple faces and assign them to one source or one sink. Assign

each face separately and combine in Matrix Reduction if necessary.

Source and Sink (Terminals)

Page 30: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

30 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

◦ Inductance can be defined as:

✓ Partial Inductance, or Loop Inductance

✓ Each of these inductances have self and

mutual (in a multi-conductor system) components

◦ Q3D Extractor calculates Partial inductance

◦ Loop inductance is measured in the lab

✓ Typically an inductance measurement requires a complete circuit path (i.e. loop)

and the location of the return path has an effect on this Inductance value. We can

also specify the self inductance and mutual inductance.

◦ Sometimes the return path may be difficult or impossible to specify but it is possible to

integrate over a known current path only and call this partial inductance. Partial inductance

represents the component of inductance that results only from the part of the current loop

that is explicitly being modeled.

Partial vs. Loop Inductance – Overview

Page 31: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

31 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

◦ The total loop inductance is the sum of the partial self and mutual inductances

for each section of the loop. Lloop= L11 + L12 + L21 + L22

◦ In order to correlate the Q3D Extractor results with measurement results, a

return path matrix reduction operation can be performed. This reduction allows

us to specify a net to serve as a return path for current. We can then

approximate the loop inductance of a closed conduction path. Specifying a

return path does not simulate the effect of the full current loop because parts of

the loop may not be explicitly modeled.

Partial vs. Loop Inductance (Continued)

Page 32: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

32 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

• Solution Frequency is at the frequency where you only have surface currents

due to skin-effect. In LF applications, a frequency ~100-500MHz is usually

sufficient.

• This solution frequency should

only correspond to where

skin-effect is dominant, and

not to any intermediate

frequencies. Intermediate

frequencies are extracted in

RLC results only.

Simulation Setup

Page 33: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

33 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

LCR matrix calculation・LCR matrix

Right-click on Analysis>Setup and the C, R, L is displayed in the Matrix tab.

The resistance value in DC, inductance value and the capacitance are displayed.

The resistance value at AC solution frequency and inductance value are also available as a calculation result of ACR/ACL.

DC current distribution. AC current distribution on surfaces.

Page 34: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

34 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

• Matrix Reduction is not necessary for circuit simulation, as the

terminals can be connected in a circuit simulation.

• Reduction allows (reduces/adjusts pins):

• Move/Add Sink (changes Source/Sink locations)

• Join in Series/Parallel (combines R/L for separate paths)

• Float/Ground Net (adjusts C/G)

• Float Terminal (no R/L contribution)

• Float at Infinity (no infinite contribution to C/G)

• Return Path (a specific Join in Series)

• Change Frequency (used automatically in Frequency Sweep)

Matrix Reduction (optional)

Page 35: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

35 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

• RL solution does not solve in transition region

• One RL Solve at DC

• One RL Solve at AC

✓ Surface current (skin depth) is well developed

• Intermediate frequencies are interpolated

in the transition region.

Frequency Solution and Effects

CG solves across frequency sweep only if dielectric permittivity, and loss-tangent produce frequency-dependent effects.

In LF power-electronic applications, G is very small, and it is suggested to ignore G by setting Loss Tangent = 0.

Page 36: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

36 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

• To generate an accurate State Space Model, it is important

to get enough frequency values.

• For that, create an Interpolating Sweep using a log scale with

at least 5 samples per decade. Start at 1Hz (DC).

Frequency Sweep

The max frequency is the highest frequency involved in the upcoming Simplorersimulation.

2*fmax_Simpl_result < fmax_Q3D_sweep

1/(5*rise-time) < fmax_Q3D_sweep

2/Hmin < fmax_Q3D_sweep

Hmin = Simplorer minimum time-step

Page 37: 电源系统传导干扰仿真 Q3D, SIWave RLCG Parasitics ANSYS Mechanical Thermal/Stress ANSYS CFD Thermal Model order Reduction Co-simulation Field Solution FE Model Generation

37 August 3, 2017 ANSYS UGM 2017© 2017 ANSYS, Inc.

D. 用于噪声计算的动态耦合

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Start Electronics Desktop

・Open the ANSYS Electronics Desktop① Open example file “buckboost_pwm_SNP.aedt”② Show design “basic_pcb_1_work_Q3D”

(Start solving if desired.)

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Switch to Simplorer Design

・Switch to Simplorer Design① open design “Simplorer6_dynSS_LISN”

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Import state space model

・Importing state space model①menu [SimplorerCircuit] / [SubCircuit] / [Q3D Dynamic Component] / [Add

State Space] Select Q3D/Desktop file. Select own project filename. Could be another file.

② Select Q3D design data.

First, select 3D, for 3D geometry.A frequency sweep setting name is

specified for the model data.②-1

②-2

③ Next, we go to the Options tab.

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Import state space model(2)

③ Check the Options tab settings.

③-1

③-1 [Pin Description]

The multi-terminal model used in Simplorer can make use of the source/sink names by selecting Pin Description. Interaction with the component is much easier, so this setting is recommended.

③-2 [Static link]

OFF (default): Every time a simulation is begun, Q3D is started so that the data is update.

ON: The model data is embedded in Simplorer after first created. The Simplorer file can be moved to other computers on its own, and it's possible to simulate Simplorer without a Q3D license. If there is a parameter variation/change, then Q3D will be called to extract the data for the new variation.

③-3 [Z(ref)]

This is a reference impedance for the state-space model data. It is suggested that this value match the impedance in your system, possibly 1mOhm-1Ohm.

③-2

③-3

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Place parts

・Connect terminals① Circuit topology is same as prev.

Right-click[Push Down]

Right-click[Pop Up ]

Right click menu [Push Down] to show LISN sub circuit. Go back to upper level, [Push down] in right click menu on free space of sheet.

[Tips] [Add at unconnected pins]/[Page connectors] right-clicks a part, and is convenient.

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Simulation result

1.00E-005 1.00E-004 1.00E-003 1.00E-002 1.00E-001 1.00E+000 1.00E+001 1.00E+002Spectrum [MHz]

-160.00

-110.00

-60.00

-17.28d

B(U

13

.Vcm

)

Simplorer6_dynSSLISNRectangular Plot6Curve Info

dB(U13.Vcm)TR

Common mode voltage Vcm [dB]

1.00E-005 1.00E-004 1.00E-003 1.00E-002 1.00E-001 1.00E+000 1.00E+001 1.00E+002Spectrum [MHz]

-160.00

-110.00

-60.00

-20.00

dB

(U1

3.V

dm

)

Simplorer6_dynSSLISNRectangular Plot6_1Curve Info

dB(U13.Vdm)TR

Normal mode voltage Vdm [dB]

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FFT: Trace setting

Noise thresholdresolution of filter.default = 40[dB]

Time = resolution.# sampling = BW

Hmin is small enough

For non-repeating waveforms, consider choosing a window.

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• time T = StopTime-StartTime

• Sampling N = #Harmonics

FFT Resolution

][1

HzNT

Bw Band width

Bw

][1

HzT

Dwresolution

Dw

Don’t alias your post-processing FFT’s.If there are higher frequencies, make sure you use enough FFT points.

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Switching waveform

12.004 12.006 12.008 12.010 12.012 12.014Time [ms]

0.00

12.50

25.00

37.50

50.00

62.50

Y1

Simplorer5_diffIc

2dyn

3dyn

4dyn

12.004 12.006 12.008 12.010 12.012Time [ms]

0.20

2.50

5.00

7.50

10.00

12.50

15.00

Y1

Simplorer5_diffVce

2dyn

3dyn

4dyn

Turn on/off current IcTurn on/off voltage Vce

blue:no LCRred:DC LCR modelbrown:Sspace model

blue:no LCRred:DC LCR modelbrown:Sspace model

A surge corrugation and the inclination are also affected.⇒ The influence to noise will be confirmed.

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Confirmation of a noise ingredient

Switching loss (Ic×Vce) [dB] frequency component

Common mode voltage Vcm[dB] frequency component

Behavior in the 10kHz where the inductance changes showed conspicuously.It's also necessary to expand a sweep area to see the difference in the high frequency component.

blue:no LCRred:DC LCR modelbrown:Sspace model

red:DC LCR modelbrown:Sspace model

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Frequency Dependent Busbar Model Example

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Frequency Dependent Busbar Model Example

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感谢聆听