PCB . PCB 1.1 PCB PCB PCB PCB1.1 1.2 PCB 1.1903Mr. Albert Hanson""(Circuit) PCB 2. 1936Dr Paul EisnerPCB print-etch(photoimage transfer) 1.3 PCB PCB 1.3.1 PCB A. a. /PolyimideBT/Epoxy b. Copper-invar-copperceramic B. a. Rigid PCB b. Flexible PCB 1.3 c. Rigid-Flex PCB 1.4 C. a. 1.5 b. 1.6 c. 1.7 D. /////,1.8 BGA. PCB 1.3.2 A. 1.9 B. 1.10 1.11 C. IC PCB

.2.1. PCBBare Board

PCB Shop(Assembly)Turn-Key Drawing, Artwork, Specification PCB:123 4 ( 5 ) 6 Micro-Modifier CAM(Computer Aided Manufacturing) DFM(Design For Manufacturing) output 2.2. A Gerber file PCB CAD1960Gerber Scientific Gerber System CADOutput DataDrawingFilm Gerber Format B. RS-274D Gerber Format EIA STANDARD RS-274D(Electronic Industries Association) 1.Function Code G codes, D codes, M codes 2.Coordinate data imaging C. RS-274X RS-274DRS-274DCode RS-274X Parametersextended Gerber format D. IPC-350 IPC-350IPCneutral format,PCB CAD/CAM,,PCB SHOP NC Drill Program,Netlist,Laser Plotter. E. Laser Plotter Gerber format IPC 350 format Artwork F. Aperture List and D-Codes 2.3. 2.3.1 PCB SHOPBare Board -. , 2.3.2 . A. . B.BOM-Bill of Material BOM LaminatePrepregCopper foilSolder Mask LegendFinish,, OSP C. , .,CheckECO(Engineering

Change Order) ,. D. . 30~60% Layout PCB Layout PANEL a. b.PANEL c.piece__________ d.. e. , 2.3.3 A. (Flow Chart) :. B. CAD/CAM a. Gerber Data CAMaperturesshapes PCB CAMIPC-350CAMNC Routing PCB Layout NC Router, . Shapes ,thermal padAperture codeshapes b. Check list check list c. Working Panel PCB Layout . 30~60% Layout PCB

Layout PANEL 1. 2.PANEL 3.piece 4.. 5 , working Panel d. Artwork CAMD-CodeLaser Plotter PCB . 1. 2. 3. 4. ,RoutingNC Routing e. DFMDesign for manufacturing .Pcb lay-out PCB Lay-out PCB PAD PAD PCB PCBLay-out . C. Tooling AOINetlist ..AOICAD referenceAOINet list Fixture 2.4 ,, ,PCB,, ,, ,, Lay-out , PCB ,.,,, .

.

Copper-clad Laminate CCL ,:, ,, ,.3.1 . Resin Glass fiber ( Copper foil ) Composite material . 3.1 3.1.1 Resin 3.1.1.1 , Phenolic Epoxy Polyimide PolytetrafluorethylenePTFE TEFLONB Bismaleimide Triazine BT Thermosetted Plastic Resin 3.1.1.2 Phenolic Resin phenol Formaldehyde Formalin Crosslinkage 3.1 1910 Bakelite Bakelite (NEMA-Nationl Electrical Manufacturers Association) , NEMA "X" "X" "X" "P" Punchable "C" cold punchable "FR" (Flame Retardent) (Flame resistance) XXXPC FR-225 ,.062in : A a. XPC Grade UL94XPC Grade HB__________ b. FR-1 GradeXPC GradeXPC Grade VTRUL94FR-1 V-0V-1V-2 V-0 c. FR-2 GradeFR-1 FR-1FR-1FR-2,FR-2 FR-1 B. a.

FR-4PCB . b. FR-4 (Silver Paste) FR-4 b-1 1) XY()Z() 2) FR-4FR-1XPC FR-1XPC . b.-2 1) 2) __________ 3) (Silver Migration) c. (Carbon Through Hole). PCB . Carbon Paste Key Pad XPC 0.81.01.2mm d. 40Pitch1.78mmIC e. (Anti-Track) 2.1.2 Epoxy Resin Varnish) A-stage B-stage prepreg ,__________ C-stage 2.1.2.1 Bisphenol A Epichlorohydrin dicy (Flammability test),

Tetrabromo-Bisphenol A FR-4 : --Bisphenol A, Epichlorohydrin () - DicyandiamideDicy (Accelerator)--Benzyl-Dimethylamine ( BDMA ) 2- Methylimidazole ( 2-MI ) --Ethylene glycol monomethyl ether( EGMME ) Dimethyl formamide (DMF) Acetone ,MEK (Additive) -- Tg. A. ( Difunctional Epoxy Resin),3.2. 3.3. NEMA FR-4( NEMA G-10) B. () Dicy, (latent) , 160 B-stage Dicy (Hygroscopicity) dicy , ,. C. epoxy dicy BDMA 2-MI D. Tg , FR4 Tg 115-120, , ,, Tg , Tg Tg , a. X Y b. Z c. Tg . , Tg E. FR4 3.1.2.2(Multifunctional Epoxy)

FR4 __________ A. Novolac Novolac , Novolac Epoxy Novolacs3.4. FR4 , Tg , (Smear) PTH B. Tetrafunctional Epoxy FR4 " " (Tetrafunctional Epoxy Resin ). " " ,3.5Tg Novolac Polyclad Novolac 160 2-4 , ,, . ,FR4. 3.1.2.3 Polyimide(PI) A. Bismaleimide Methylene Dianiline ,3.6. B. FR4 Tg 120 FR4 180-190 260 .PI, FR4 FR4 X Y Z C. : a. UL94 V-0 b. c. (Hygroscopic), d.(Varnish,,) , e. FR4 2-3 Rigid- Flex MIL-P-13949H, GI. 3.1.2.4 (PTFE) Polyterafluoroethylene ,3.7. PTFE Teflon , (Impedance) (microwave) "GT""GX" "GY" ,type3M : A. PTFE

MILP-55110E 4.8.4.4 (Wicking) B. . C. Tg 19 c, . 3.1.2.5 BT/EPOXY BT(Mitsubishi Gas Chemical Co.)1980 Bismaleimide Trigzine Resin monomer3.8 BT A. a. Tg180BT(peel Strength) (Smear) b. UL94V-0 c. d. e. B. a. COB wire bonding BT/EPOXY b. BGA ,PGA, MCM-Ls CAF(Conductive Anodic Filament),( ) BT/EPOXY 3.1.2.6 Cyanate Ester Resin 1970PCBCiba Geigy3.9 A. a. Tg250 b. (2.5~3.1) B. a. . b. . 3.1.2 3.1.2.1 (Fiberglass)PCB Kelvar(Polyamide)(Quartz) (Glass) 17Owen-IllinoisCorning Glass Works Owens-Corning Fiberglas Corporation1939 3.1.2.2 (Continuous)(discontinuous)

(Fabric)(Mat)FR4 CEM3 A. ()A CESE a./ b. c. d. e. f. PCBE 3.2 (copper foil) ,,3,4mil,( 1 mil),.,Profile. . 3.2.1 3.2.1.1 (Rolled-or Wrought Method) (3 *4) ,, (Heat treatment or Annealing), A. . a. Ductility,FPC,. b. Low-profile Surface,Microwave. B. . a. . b. . c. ,. 3.2.1.2 (Electrodeposited Method) ED. , 600 ASF (Columnar) (passivated) (Drum) ,

(Drum side ), (Matte side) .: A. a. . b. . B. . a. , b. . 3.2.1.3 , 1.0 Ounce (oz)1 oz (28.35g). 35 (micron)1.35 mil. 1 oz 1/2 oz 1/4 oz,. 3.2.2 3.2.2.1 0.5 oz (17.5 micron ) 3/8 oz (Carrier) ( copper foil), ED ,2.1 mil. ,3 mil.. " " " "(Porosity), .,. ,5 mil, . 3.2.2.2 XY (Stress)ED . ,Grade 2,E-Type high-ductilityGrade 2,E-Type HTE . ED. 3.2.2.3 A EDDrum a. Bonding Stage(Matte Side) """Nodulization" 2000~4000A b. Thermal barrier treatments-(BrassGould JTC)(Zinc YatesTW) Dicy 500~1000A c. Stabilization""(Chromation) ""(passivation)" "(antioxidant) B a. (Double treatment) 20 COST

/ Polyclad DST b. (Low profile) Tooth Profile () () ( just etch,over-etch) Polyclad DST ""Organic Silane Treatment 3.3.3 IPC-CF-150 TYPE E TYPE W , class 1 class 4 class 5 class 8 . 3.4 PP( Prepreg) "Prepreg""preimpregnated" B-stagePrepreg"Bonding sheet" 3.4.1 3.4.2 Gel time, Resin flow, Resin Content Volatile Dicy 3.4.3 EPOXY53~6 3.3.2prepregData sheet 3.4.4Cruing 3.4 (Driving Force)(Miniaturization)( ) 3.4.1 PDAPC Chip Package -(a)(b) 3.4.2 CPU PCB, DkDf PCB

.4.1 , (FCC) 198410 "",pcb lay-out """" ,

.. 4.2 A. Print and Etch B. Post-etch Punch C. Drill and Panel-plate ,(buried hole),20. ( Post-etch Punch). 4.2.0 BOM A. - B. - C. - D. - 4.2.1 step A. a. b. c. d. e. f. g. (__________) h. a. c. f. g. ( ) B. a. (Brush) b. (Pumice) c. (Microetch) C. ,4.1. 4.1 a. ,

b. a. b. a. b. c. D/F d. D. (pumice) a. b. c. a. Pumice b. E. () . F. 4.2.2 4.2.2.1 A. ,(Silk Screen Printing) "" (Thick Film)(Hybrid Circuit)(Chip Resist )(Surface Mounting) ,,,, .cover: a. , ( ,) b. c., d. e. f. g.(Peelable ink) ,,__________.. B. (Screen Printing) :,,,,,,,, .

a. (1) (silk),(nylon),(Polyester,),,. . (2) : Plain Weave. (3) (mesh),(thickness),(diameter),(opening) :4.2 :inchcm : :,Slight(S),Medium(M),Thick(T),Half heavy duty(H),Heavy duty(HD),Super heavy duty(SHD) 4.2. b.(Stencil) (1).(Direct Stencil) , .,, ., . (2).(Indirect Stencil) ,, ,. c. (1).. (2).(UV) (3).,,,,,. , , . d. :. , ,. . loading/unloading,, .3/4, loading, Rack. loading/unloading, . , pinningccd. : (1) : ,, .,. (2) Squeege (Polyure-thanePU) Shore A6080. 7080; ,6070

3/41 (3). pin,(Off Contact Distance)( 2m/m5m/m ), .. , pinningccd., . (4). , ,follow data sheet, modify. ,UV,IR . (5). . ,. check list . 4.2.2.2 .. A. (Laminator)0.1mm, B. C. D. Break point 50~70% ,30+_2, auto dosing. 4.2.3 (CaCl2) & Resist D/FD/F B C. Etchant PVC (Poly Vinyl chloride)PP (Poly Propylene) (Ti) ,( etching factor4.3) Cu+

, . a. CuCl2 Cu, Cu++ Cu+__________1 Cu+Cu++2 Cu+ ------------- (1) Cu+Cu++, b. Cu++ Cu+CuCl2 CuCl HCl Cu + H2CuCl4 + 2HCl 2H2CuCl3 ------------- (2) H2CuCl4 CuCl2 + 2HCl 2H2CuCl3 CuCl + 2HCl (2)HCl(2) Cu+ H2CuCl4 2H2CuCl3 + CuCl () ---------- (3) CuCl + 2HCl 2H2CuCl3 () ---------- (4) CuClHCl CuCl HCl HCl 1. (undercut ) etching factor 2. 3. (H2O2)H2O2 c.. CuCl2,Auto dosing, ,: 1. 2. HCl 3. H2O2 4. 5. 4.2.4 pcbstepD/F D/F()D/F NaOHKOH 1~3% A. . B. , BCS

C. K() 4.2.5 4.2.5.1 A. 2.3,(), , 4.4 B. (6)(), M/L 4.2.5.2(post Etch Punch) A. Pin Lam 4Slot 4.5 prepreq 4SLOT SLOT PIN B. Mass Lam System Multiline""PPS 1.CAM""(Optical Target) pads 4.6 2. 3.Optiline PECCD 4Slot 4.7 4. 4.2.5.2 A. a. check b. Shift B. a.4.8 b.4mil, c.Resin Curepattern 4.3 AOI() () , (integrity),,,, ,, , ,,., (AOI), ,, AOI,(Leakage), AOI,. , .__

.5.1. : (Copper Foil),(Prepreg)(Oxidation),. ,,. 5.2. ,5.1: 5.3. 5.3.1 (Black/Brown Oxide Treatment) 5.3.1.1 A. ,(Adhesion). B. , C. (Passivation)(Amine) 5.3.1.2. ( pink ring ) 5.3.1.3. : ,, ,2Cu+[O] Cu2O, CuO,,"", "" 5.3.1.4. ( ), 5.3.1.5 A. Cu2O, ,, , ,,, B. ,PTH(Pink ring), PTH . ,,5.2. C. , , (Peel Strength). (Self-Limiting) (Sealer), 5.4,,, 5.3.1.6 ,,, ,,,,: A. - .,,scum B. -PH,,.

C. - (grain structure), 50-70 , D. - , , - , E. -,, , ,, ,, F. . G. ,,. H. -, ,, 5.3.1.7 , ,,CPVCPP ,,RACK. (Spray)(Flood),,, ,,(Accelerator). . 5.3.1.8 A. a.(o/w)0.30.07mg/cm2 (1) 9cm10cm 1oz (2) 13010min. w1(g) (3) 20%H2SO410minw2(g) (4) O/W = W1-W291021000 weight gain,In-processQC b.( Peel Strength ) 4~8 lb/in (1) 1oz-( lay up ) (2) 1cm( ). c.(Etch Amount) 7030u in (1) 9cm10cm 1oz13010min w1(g) (2) 2'18"() w2(g) (3) d. 5.3.2 ,,(Lay-up)., (Prepreg),(Copper foil),:

5.3.2.1 P/P(Prepreg) P/P: P/P(Resin Flow)(Gel time)(Resin Content) : A. (Resin Flow) 1,Flow test-4 ,1702.820025PSI10, , 3.192,, : ,16m2,(3.196 2)2 3.142=16.045m2, "" 2,Scaled flow test-, 7in5.5in7in,(104,106,108) 18-20,(12.113.116)10,11615020 ,31PSI840 5%8101, , ,: ho=[Wo/n(5.5410-2)-Wg]21.210-2 ho-,Wo-,Wg-(g/in2),n- B. (Gel time or Tack Time) B-Stage ,, , C-Stage ,, , (air bubble) C. (Resin Content) c-1 (Burn Out) c-2 (Treated Weight) D. (Polarizing Filter) dicy , , dicy E. , 54015 , 20X F. (Volatile), 4 4 4 , 1mg, 163 2.815 1, ,

5.3.2.2. P/P ,5.3 ,Prepreg 5.3.2.3 '' 5.3.2.4 :Cap-lamination,Foil-lamination __________Foil-lamination. A. ,,,, : (a) , 3.5 mil(), , (b) ,Z, ,5 mil (c) ,,, ,C-Stage ,, (d) (Impedance),(Low Profile),(Matte side) 6,12 ,(Wrinkle) ,, (e) ,6shift. (,),(). C. 202,50% 5%, , (),, 30, , 24 1 , ,Tg D. (a) -, , : ,,, ,, ,,,

2, , , , , X . (b) -, __________ (c)-,, , ,, ,,, , 150-200PSI, 5.3.3 5.3.3.1 : A.(Autoclave): 5.4 : : B.Hydraulic 5.5 :a. b. : C. ADARA SYSTEM Cedal Cedal ,,Prepreg 5.6 : a. __________ b. c. d. Cycle time4Omin. e. . f. : C-1. Cedal AdaraStack5.7 5.3.3.2. : A.:

: : a. b. B. : : a., b. C. : : D.: Prepreg : a.(35/min.) b. : a. b. 5.3.3.3. (Opening): A.: 5.8. A-1 a. ,(Press plate): , ,. b. (Separator plate): , . c.: , , d.: e. (Release sheet) (Press pad) Conformal press, coverlayer. B. CEDAL ADARA :5.9 CEDAL5.9,Stack65Panel,, 5.10 5.3.3.4. Profile 5.11 A.: a.: b.:

c.:(Internal stress)(WarpTwist) B.: a.( Kiss pressure):(Book), b.: c.:C-stage d.: B-1 ,, , , : = 40PSIA(__________)() = 560PSIA :1/2 =14.22PSI(pound/in2) 1PSI = 0.07/2 ,1/2 = 1ATM 5.3.3.5. : a. b. c. ,pits & dents d. e. f. 5.3.4 5.3.4.1. A. B. IPQC (In Process Quality Control) 5.3.4.2.: A.(post cure, post lamination)-150,4. curing ,,( Tg ).Tg,curing . : a.. b.,. c.. B. ,-(Relief), a.: ,, , b.X-Ray: ,,. C. (CNC)-, ,1, , , CNC ,.__

6.1 , ,:,, (Via),(Blind hole),(Buried hole)(via hole).'.... .',,,,, .,20. 6.2 PIN 6.3PIN ,,,, stack.1.2.3.4.. . ,pin,pin(pinning maching) . ,,pin., PIN. 6.4. 6.4.1 List A. B. C. D. (Spindle) E. F. G. XYZXY H. I. Step Drill J. K. RUN OUT 6.4.1.1 A. B. C. D. E. 6.4.2 (Drill Bit),(Back-up board),(Entry board). :6.1. 6.4.2.1 (Drill Bit), , , A. ___________ :

a. (Tungsten Carbide ,WC) b. (Cobalt) c.. , (Sinter) . 94% , 6% .1 micron. B. ,6.2, (drill point) ( Flute ) (handle,shank) : a. (Drill Point)- 6.3 (1) (Point Angle) (2) (Primary Face) (3) (Secondary face) (4) (Chisel edge) (5) (Margin) , , (Chisel edge), , stack, (Margin), ,. (Corner) ,, , (Point angle), , 90 ~ 110 , FR4 115 ~ 135 , 130 15 (Primary Face Angle), 30 , (cheisel Edge Angle) b. (Flute) , (Flute) (Helix or Flute Angle), '_'(_'(_'_, ,, , , (smear) , c. (Shank) Spindle , 4: (1) Straight Shank, (2) Common Shank (3) (4)

C. a. 20~40,6.4 b. (Re-Sharpping) , (High) , 5000-6000 (Hit), () 6.4.2.2. Entry Board() A. : a. b. c. d. e. B. : a. - , . b. . c. 5~30mil,, ,.. :, ,,,. 6.4.2.3 Backup board A. a. b.(Exit Burr c. d. B. . - . b. phenolic . c. VBUVented Back Up .: ,,,,. 6.4.3 6.4.3.1 CNC CAD/CAM .. Loading/Unloading. 6.4.3.2 "Feeds and Speeds" A. (Feeds): (IPM)""(Chip Load) (in/R)

B. (Speeds) (Revolution Per Minute RPM) RPM 120in/minRPM : 1. 2. 3. 4. 6.4.4 A. B. ,Run out . C. over100% D. Spindle E. Run out 0.0005" F. 6.5 6.5.1 : 0.6 mm,0.3 mm(micro hole) 6.5.2 , 0.3mm (Surface Mount Techology) PC 1. 2. (Aspect) 3. PC() 4. 5. () 6. A 1. 10~15m 2. () 3. PC10m 4.

: STACK PCB PC 1. PC 2. PC 3. 0.15~0.2mm0.3~0.4mm 4. 6.6 6.6.1 1. 2. 3. (check) 4. 5. () 6. (burr) 6.6.2coupon(6.5) coupon: 1. 2. 3. 1000,2000,3000 hit . ,.

7.1 (Plated Through Hole , PTH) ( metalization ), , 1986Hunt PTH, "Black hole"base, . PTH, (direct plating). 7.2 PTHa 7.2.1. (deburr) ,,1.2.,burr. ,,,,de-burr.de-burr Desmear.de-burr,. 4.1. 7.2.2. (Desmear) A.: a. Desmear

b. Create Micro-roughadhesion B. Smear: ResinTg P.I.(Poor lnterconnection) C. Desmear: (Sulferic Acid) (Plasma)(Cromic Acid) (Permanganate). a. b. c. d. 7.2.2.1 (KMnO4 Process): A.(Sweller): a. :Epoxy Polymer KMnO4 Micro-rough Concentration b. : 7.1 c. :KMnO4 d. : (1) 7.2 KMnO4PTH (2) Surface Tension: Wetting Surface Tension Drag out Wetting Smear B. (KMnO4 ): a. KMnO4:KMnO4NaMnO4KMnO4, b. : 4MnO4- + C + 4OH- MnO4= + CO2 + 2H2O () 2MnO4- + 2OH- 2MnO4= + 1/2 O2 + H2O (PH) MnO4- + H2O MnO2 + 2OH- + 1/2 O2 (Mn+4) c. : d. Mn+7, Mn+6,Mn+4

e. : 7.3 f. : (1). (2).By-product7.4: g. KMnO4Micro-rough: Sweller Micro-rough h. i. C. (Neutralizer): a. NaHSO3NeutralizerMn+7 or Mm+6 or Mn+4(Neutralizer)->Mn+2 (Soluable) b. Pink RingAcid base HCl H2SO4 Cl Oxide LayerH2SO4Base c .H2SO4NeutralizerAuto-dosing 7.2.2.2 .: A.Cycle timeRack(Basket)() B.: (Working hours / Cycle time)*( FIight Bar / Hoist)*(Racks/Flight Bar)*(SF/Rack)= SF/Mon C.Pre-baking:7.5 a.2.Cure1,3 CureBaking b.ResinBonding2~31,2,3 c.StressVoid. 7.2.2.3. : A: a . 4MnO4- + 4OH- + Epoxy 4MnO4= + CO2 + 2H2O b. 2MnO4- + 2OH- 2MnO4= + 1/2O2 + H2O (Side reaction) MnO4= + H2O (CI-/SO4= /Catalize Rx.) MnO2 + 2OH- + 1/2 O2 (Precipitation formation) 2MnO4= + NaOCI + H2O 2MnO4- + 2OH- + NaCI 4MnO4= + NaS2O8 + H2SO4 4MnO4- + 2OH- + 2Na2SO4 4MnO4= + K2S2O8 + H2SO4 4MnO4- + 2OH- + 2K2SO4 (For Chemical regeneration type process reaction) 2MnO4= + 1/2 O2 + H2O 2MnO4- + 2 OH(Electrolytic reaction: Need replenish air for Oxgen consumption) B. MnO4- Permanganate NaS2O8 Sodium Persulfate MnO4= Manganate S2O4- Sulfate

OH- Hydroxide(Caustic) CO2 Carbon Dioxide NaOCI Sodium Hydrochloride MnO2 Manganese Dioxide 7.2.2.4.Desmear Process: 7.2.2.5. Pocket Void: A.:SwellerGlass fiberThermal cycle B.: 7.6 aStress bResin StressZCuring Stress aB Resin recession cPocket void CPull away 7.2.3 (PTH) PTH 7.2.3.1 A. Conditioner Microetch Catalpretreatment Cataldeposit Accelerator Electroless Deposit B. a. Conditioner 1. DesmearBipolarCuGlass fiberEpoxy 2. Conditioner (1)Cleaner (2)Conditioner Pd/Sn Colloid 3. Colloid 4. ConditionerDrag In ActivatorPd+ b. Microetch 1. MicroetchingConditionerFilm 2. c. Catalpretreatment 1. MicroetchPd/Sn 2. Surface Tension d. Cataldeposit 1. Pd 7.7 2. Pd2+Sn2+Cl- = 1612 3. 7.8 Cl Roughness 4. e. Accelerator 1. PdSnPd2+

2. Pd+2/Sn+2 (HF)Pd+2(ad) + Sn+2 (aq) Pd+2(ad) (HCHO)Pd(s) 3. SnPdPdSn Sn+2a Sn+4 + 6F- SnF6-2 or Sn+2 + 4F- SnF4-2 Pd PH>=4 Pd+2 + 2(OH)- Pd(OH)2 PHmtsL)IR IR=0 EIR=(J.L2/2Kd)-----------------------------------(5) J L d EIR>>0mth>mtsL (2)cth>ctsCharge transfer potential Charge transfer potential(Aspect ratio )

C-2 ctcharge transfer overpotential 9.2 9.2ct () a. J(Limit) b. Range J/J(Limit)=0.35~0.45 c. J/J (Limit) d. 1* e. (ct>2*) cts=cth9.2Jcts>Jcth(Throwing Power T.P.