1. sedra/smith 1.64 e eg / 2 gezphysics.nchu.edu.tw/prophys/electron/2013spring/hw4.pdf ·...

1
應用電子學(I) 作業四 Due date 2013/4/22 1. Sedra/Smith 1.64 利用 B=7.3×10 15 cm -3 K -3/2 E g =1.12eV 2. Sedra/Smith 1.65 3. Sedra/Smith 1.66 4. Sedra/Smith 1.67 5. Sedra/Smith 1.68 6. Sedra/Smith 1.69 7. 解釋在半導體材料中下列名詞的意義。假如是一個物理量,則寫出對於室溫 矽晶圓材料此物理量的大小(數量級即可),包括單位。 (a)摻雜的補償(compensation) (b)移動率(mobility) (c)載體的擴散係數(diffusion constant) (d)Einstein relationship (e)質量作用定律(mass action law) (f)能隙(帶溝)(band gap) 8. kT E g e BT T n 2 / /2 3 i ) (

Upload: truongnhu

Post on 21-Jul-2018

219 views

Category:

Documents


1 download

TRANSCRIPT

  • I

    Due date 2013/4/22 1. Sedra/Smith 1.64 B=7.31015 cm-3K-3/2 Eg=1.12eV 2. Sedra/Smith 1.65 3. Sedra/Smith 1.66 4. Sedra/Smith 1.67 5. Sedra/Smith 1.68 6. Sedra/Smith 1.69 7.

    (a)(compensation) (b)(mobility) (c)(diffusion constant) (d)Einstein relationship (e)(mass action law) (f)()(band gap) 8.

    kTEgeBTTn 2//23i )(