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초저가 유기 면광원 조명 핵심기술 연구초저가 유기 면광원 조명 핵심기술 연구
조 성 민
성균관대학교 화학공학부
2009. 12. 18.
Add-Vision, Inc. (U.S.A.)
Printed P-OLED 제조 공정
Add-Vision Patents1. Screen Printing Light-Emitting Polymer Patterned Devices, US 6,605,483 filed April 2000. 2. Printable Electrode for Light Emitting Polymer Device, US 2003/0153141 A1 filed Dec 2001. 3 S P i t bl El t l i t P l I k US 7 115 216 fil d D 20013. Screen Printable Electroluminescent Polymer Ink, US 7,115,216 filed Dec 2001. 4. Method for Encapsulation of Light Emitting Polymer Devices and Apparatus made by Same,
US 2004/0187999 filed Dec 2002.
Add-Vision, Inc. (U.S.A.)
Low-cost PLED Signage
BarixTM coated barrier flexible substrateBarixTM thin-film encapsulationScreen-printed polymer light emitting inksScreen-printed air-stable cathode metal ink (Ag)
Mitsubishi 155 inch modular OLED TV
SRI International, U.S.A.
Table of contents
(1) OLED lighting : Key issues
(2) Fabrication cost of OLED lightings
(3) Alternative TCO (Transparent Conducting Oxides) technology
(4) How to achieve all solution-processed OLEDs?(4) How to achieve all solution processed OLEDs?
(5) Large-area OLED lighting panels
(6) White PLEDs for OLED lighting
(7) Summary
Recent OLED lighting R&D projects
Light In-Line : Lowering the cost of OLED manufacturing: a German funded research and development project : 3 years from 2009. 7. 1. ( 7 million euro )
Combined OLED technology for large area and low costlightings applications (CombOLED)
: Applied Materials GmbH, Merck KGaA
lightings applications (CombOLED): a European funded research and development project within the 7th Framework Programme
: 3 years from 2008. 1. 1. ( 7 million euro )
OLED100. eu funded under 7th Framework ProgrammePower efficiency : 100 lm/WLifetime : 100,000 hour Size : 100cmⅹ100cmCosts : 100 euro/m2
: 3 years from 2008. 9. 1. ( 12.5 million euro )
Fast2Light : cost-effective, high-throughput, roll-to-roll, large areadeposition processes for fabricating light-emitting polymer-OLED for lighting applications: a European funded research and development project within the 7th Framework Programme : 3 years from 2008. 1. 1.
OLED lighting : KEY issues
(1) Efficiency
“V i t t f l ill i ti ”“Very important for general illumination”
(2) Cost
“Low-cost can create new applications of OLED lightings.”
(3) Lifetime(3) Lifetime
“Enough for general illumination when exceeds 10,000 hours”
※ Cost reduction should be the first goal for OLED technology※ Cost reduction should be the first goal for OLED technology
to create or enter new solid-state lightings (SSL) markets.
SMOLED versus PLED
n type ETL (n)
Cathode
Cathode
SMOLED PLED
n-type ETL (n)
Hole BL
Emissive Layer (i) Interlayer
Cathode
Emissive Layer
p type HTL (p)
Electron BL
Emissive Layer (i)
Anode
HIL
Interlayer
Anode
p-type HTL (p) Anode
(1) Highest efficiency : 102 lm/W @ 1,000
cd/m2 (Universal Display Corporation)
(1) Highest efficiency : 20-30 lm/W
@ 1,000 cd/m2 (GE, CDT)
(2) High-cost fabrication process
(3) Complex structure (more than 10 layers)
(4) Long lifetime
(2) Low-cost fabrication process
(3) Simple structure (less than 4 layers)
(4) Short lifetime(4) Long lifetime (4) Short lifetime
Areas of impact on OLED lightings
The biggest impact on OLED lightings : Low cost substrate selectionScalable manufacturing processLow cost manufacturing process
Voltage
g p
EfficiencyScalability
fil LifetimeLow cost film deposition
Critical problems for OLED lightings
Metric 2008 2010 2012 2015
Efficacy – Lab (lm/W) 58 99 150 150
Efficacy – Commercial (lm/W)
N/A 44 76 150
D i P i ($/kl ) N/A 72 27 10Device Price ($/klm) N/A 72 27 10
Device Price ($/m2) N/A 216 80 30
Device Life –
Critical Problem
Device Life Commercial Product
(1,000 hours)N/A 11 25 50
Source : OLED Technical Committee, Fall 2008Source : OLED Technical Committee, Fall 2008
Fluorescent tube : 60 lm/W ; < 1 $/klm ; < 6 $/m2 ; 10,000 hours
Incandescent bulb : 17 lm/W ; < 1 $/klm ; < 6 $/m2 ; 750 hours
Substrate Cost (current) : AMOLED glass : ~ $50/m2
PDP glass : ~ $30/m2
PMLCD : $10/m2PMLCD : ~ $10/m2
Window glass : ~ $ 4/m2
Cost estimation of OLED lightings
Key assumptions GEN 4 730ⅹ920 GEN6 1500ⅹ1800 WET (R to R)
Organic deposition utilization (%) 50 70 70
TACT time (min) 3 2 < 2TACT time (min) 3 2 < 2
Yielded output per month (m2) 5,667 55,891
Equipment costs ($) $40M $100M $10M
Cost ($/m2)
Substrate 10 8
Anode/Cathode 10 5(BOM : 30%)
Organics 28 16
Encapsulation 10 8
Labor 41 5
Equipment 100 27 2
Yield 35 8
Outcoupling 11 9
(30%)(1/10)
Total Yielded Cost ($) 245 86
$Total Yielded Cost per klm ($/klm) 40 13 4
(1/3)
UDC G.E.
Issues on anode/cathode for OLED lightings
Anode Cathode
● Usually transparent ● Usually opaque- ITO - Ba- AZO (ZnO:Al) - Ca
Very thin metal Mg/Ag- Very thin metal - Mg/Ag- CNT or Graphene - Al/LiF
● High work function ● Low work function~ 5 eV ~ 3 eV
● Low refractive index ● Reactive< 2 0 - Easily oxidized< 2.0 - Easily oxidized
● Low sheet resistance ● Must be deposited onto organics< 1 Ω/square !! - Careful vapor deposition- Probably need metal grid - Direct printing of inks
- Lamination● Low cost - Transfer
< $5/m2< $5/m
Solution-processed alternative for ITO - AZO
mist
substrateN2Heated substrate holder
Ultrasonic generator
Moving stage
LME price ($/ton)
1. Scalable process to large area
2 L t
p ($/ )Zn 1,895Al 1,830In 610,000
2. Low-cost non-vacuum process
3. Roll-to-roll process capabilitySn 14,900Mg 3,000Ag 570,000Au 35,350,000
(2009.9.11)
AZO (ZnO:Al) growth – Arrhenius plot
4.0 Activation energy for the growth reaction : 34 kJ/mol·K
3.5
min
))
3.0e (n
m/m
Slope = -4,200
2.5
owth
Rat
2.0
Film
Gro
0.0016 0.0018 0.0020 0.00221.5
ln(F
1/T (K-1)
Properties of AZO (ZnO:Al) thin films
100 1021 20
Hexagonal Wurtzite
10-1 15-3)
Hexagonal Wurtzite crystal structure
(A.U
.)
10
1020
15
hm-c
m)
atio
n (c
m-
2 /Vse
c)
350oC
nten
sity
10-2
1019
10
sist
ivity
(O
Con
cent
ra
bilit
y (c
m2
300oC
I
10-3 5Res
Car
rier C
Mob
250oC
200oC
20 30 40 50 60 70 800 2 4 6 8 10 12
10-4 1018 0
Al concentration (wt %) 2 th t
200oC
Al concentration (wt.%) 2 theta
Properties of AZO (ZnO:Al) thin films
80
100
80
100
60
tanc
e (%
)
60
80
Al-doped ZnO (2.5 % doping)Growth Temperatureta
nce
(%)
20
40Al doping concentrations(Growth Temp. : 300oC) 0% 2.5% 5%
Tran
smitt
20
40 Growth Temperature 200oC 250oC 300oC 350oC
Tran
smitt
300 400 500 600 700 8000
7.5% bare ITO
Wavelength (nm)300 400 500 600 700 8000
Bare ITO
Wavelength (nm)
Properties of AZO (ZnO:Al) thin films
CharacteristicsCommercial Asahi U-type
Ultrasonic-mistdeposited AZOCharacteristics
ITO FTO (SnO2:F)deposited AZO
(ZnO:Al)
Average 82% 79 5% 80%
transmittance82% 79.5% 80%
Optical bandgap 3.5 eV 3.9-4.2 eV 3.3 eV
L thi k 200 900 1 200Layer thickness 200 nm 900 nm 1,200 nm
Sheet resistance 5 Ω/square 13 Ω/square 10 Ω/square
Resistivity 0 25 mΩcm 1 2 mΩcm 0 9 mΩcmResistivity 0.25 mΩcm 1.2 mΩcm 0.9 mΩcm
Roughness 1.0 nm 34.7±5.2 nm 25.6 nm
Hall mobility 55 cm2/Vsec 38 cm2/Vsec 18 cm2/Vsec
Deposition temp. 170oC 350oC 300oC
Growth Technique Vacuum sputtering APCVD (gas) UMD (solution)
Structure for Solution-Processed OLEDs
For “All solution-processed OLEDs”, - Polymer OLEDs
- Removal of an electron-injection layer such as LiF
- Solution process for the formation of metal electrodes
Conventional Single-Layer OLED Salt-doped P-i-N Single-Layer OLED
Metal Cathode
Bu4N+1 nm LiF
Metal Cathode
PVK-based emitting layer
BF -
PVK-based emitting layer
ITO Glass
PEDOT:PSS
BF4
ITO Glass
PEDOT:PSS
Electrical Annealing
Salt-doped P-i-N PolymerOLED4
1.0x104
1.2x104
1.4x104/m
2 )
0.3 wt.% Bu4NBF4 salt doping No salt doping with 1nm LiF Salt doping with 1nm LiF Salt doping without LiF 1.2x104
1.4x104
1.6x104
/m2 )
0.3 wt.% Bu4NBF4 salt doping doped but not treated 30 seconds at 7 V 30 seconds at 10 V30 seconds at 11 V
6.0x103
8.0x103
umin
ance
(C
d/
(A) (B) (C) 6.0x103
8.0x103
1.0x104
Lum
inan
ce (
Cd undoped with 1nm LiF
0 2 4 6 8 10 12 14 16 18 20 220.0
2.0x103
4.0x103Lu
0 2 4 6 8 10 12 14 16 18 20 220.0
2.0x103
4.0x103
L
0 2 4 6 8 10 12 14 16 18 20 22
Voltage (V)
700
800
0.3 wt.% Bu4NBF4 salt doping No salt doping with 1nm LiF
0 2 4 6 8 10 12 14 16 18 20 22
Voltage (V)
1.8x104
2.1x104
Bu4NBF4 salt doping wt.%annealed for 60 seconds at 10 V
400
500
600
p g Salt doping with 1nm LiF Salt doping without LiF
nsity(m
A/c
m2 )
(A) (B) (C)
1.2x104
1.5x104
ance
(C
d/m
2 )
annealed for 60 seconds at 10 V 0.6 wt.% 0.9 wt.% 1.2 wt.% 1.5 wt.% undoped with 1nm LiF
100
200
300
Cur
rent
den
Inflection point
3.0x103
6.0x103
9.0x103
Lum
ina
0 2 4 6 8 10 12 14 16 18 20 220
Voltage (V)0 3 6 9 12 15 18
0.0
Voltage(V)
Salt-doped P-i-N Polymer OLED60000
60000
40000
50000
60000
Salt activation time at 13V 0 sec. 10 sec. 30 sec.
50 sec.d/m
2 )
40000
50000
60000
d/m
2 )
Salt activation 13 V - 30 sec. 15 V - 30 sec. 17 V - 30 sec.18 V 30 sec
20000
30000
50 sec. 70 sec. 90 sec. 110 sec. 130 sec.
Lum
inan
ce (c
d
20000
30000
Lum
inan
ce (c
d 18 V - 30 sec. 19 V - 30 sec.
10 15 20 25 300
10000
5 10 15 20 25 300
10000
500
600
after salt annealingft 1 h
6 8 10 12 14 16 18
10450000
60000
Salt activation time at 13 V0 sec. with LiF
10 15 20 25 30
Voltage (V)5 10 15 20 25 30
Voltage (V)
300
400
500
nce
(cd/
m2 )
sity
(mA
/cm
2 ) after 1 hr after 24 hr
103
10
30000
40000
nanc
e (c
d/m
2 )
0 sec. with LiF 30 sec. with LiF 60 sec. with LiF 90 sec. with LiF 90 sec. without LiF
100
200 Lum
inan
Cur
rent
den
s
10210000
20000
Lum
in
6 8 10 12 14 16 180
Voltage (V)5 10 15 20 25 30
0
Voltage (V)
Salt-doped P-i-N Polymer OLED
25000
30000
35000
400
500
2 ) /cm
2 )
Salt doping concentrationSalt activation voltage Salt activation time
: 0.6 wt.%: 13 V: 10 sec.
12000
16000
100
120
2 )
Conventional device with LiF layerNo salt doping
/cm
2 )
10000
15000
20000
200
300
min
ance
(cd
/m2
nt d
ensi
ty (
mA
/
8000
40
60
80
min
ance
(cd/
m2
nt D
ensi
ty (m
A/
10 15 20 25 300
5000
10000
0
100
Lum
Cur
ren
10 15 20 250
4000
0
20
40
Lum
Cur
ren
Voltage (V)
50000
60000
400
Salt doping concentrationSalt activation voltage S lt ti ti ti
: 0.6 wt.%: 13 V110
Voltage (V)
60000
75000
500
600
Salt-doped device with LiF layerSalt doping concentration : 0 6 wt %
30000
40000
200
300
nce (c
d/m
2 )
nsity
(m
A/c
m2 )Salt activation time : 110 sec.
45000
60000
300
400
nce
(cd/
m2 )
Salt doping concentration : 0.6 wt.%Salt activation voltage : 13 VSalt activation time : 90 sec.
nsity
(mA
/cm
2 )
10000
20000
100
200
Lum
inan
Cur
rent
den
15000
30000
100
200Lu
min
an
Cur
rent
Den
10 15 20 250 0
Voltage (V)10 15 20 25 30
0 0
Voltage (V)
Salt-doped P-i-N Polymer OLED
60000
70000
10 cd/A
15 cd/A
0 sec. 10 sec. 30 sec.
50 sec
20 cd/A50000
60000
Salt activation time at 13 V 60 sec. with LiF 90 sec. without LiF
N lt d i ith LiF
10 cd/A
30000
40000
50000
nce (c
d/m
2 )
50 sec. 70 sec. 90 sec. 110 sec.
30000
40000
nce (c
d/m
2 )
No salt doping with LiF
10000
20000
300005 cd/A
Lum
inan
Salt activation at 13 V10000
20000
Lum
inan
0 1000 2000 3000 4000 5000 6000 70000
Current density (A/m2)
0 1000 2000 3000 4000 5000 60000
Current density (A/m2)
With the doping of an organic salt (Bu4NBF4) into polymer OLEDs, - balance of electrons and holes in OLEDs
- comparable performance with conventional OLEDs with LiF
- stable OLEDs up to much higher luminance
- similar lifetime to conventional OLEDs
Salt-doped P-i-N Polymer OLED - Fabrication
For “vacuum-free fabrication of polymer OLEDs”, - Transfer process of metal electrode
- Scalable to large area
Emission Layer(PVK PBD TPD Ir(ppy) salt)
Emission Layer(PVK PBD TPD Ir(ppy) salt)
Al
PEDOT:PSS
(PVK, PBD, TPD, Ir(ppy)3,salt)
PEDOT:PSS
(PVK, PBD, TPD, Ir(ppy)3,salt)
ITO ITO
Salt-doped P-i-N Polymer OLED - Fabrication
Salt-doped P-i-N Polymer OLED - Fabrication
500
100C, 5min150C 5min
20000
100C, 5min150C 5 i
300
400150C, 5min 170C, 5min 200C, 5min
mA
/cm
2 ) 15000
150C, 5min 170C, 5min 200C, 5min
d/m
2 )
mA
/m2 )
Cd/m
2 )
Evaporated Evaporated C th d
200
rren
t den
sity
(m
5000
10000
Lum
inan
ce(c
d
ent
den
sity
(
um
inan
ce (
CpCathode Cathode Transferred
Cathode
0 5 10 15 20 250
100Cu
0 5 10 15 20 250
5000
Curr
e LTransferred Cathode
※ Delayed turn-on voltage & limited luminance of cathode-transferred
0 5 10 15 20 25
Voltage(V) Voltage(V)Voltage (V) Voltage (V)
y gdevices seem to be responsible to the native oxide of aluminum cathode.
Salt-doped P-i-N Polymer OLED - Fabrication
For “vacuum-free fabrication of multi-layer polymer OLEDs”, - Transfer process of metal electrode with ETL
Scalable to large area- Scalable to large area
Al
Emission Layer(PVK PBD TPD Ir(ppy) salt)
Emission Layer(PVK PBD TPD Ir(ppy) salt)
Al
ETL + electron injection promoter
PEDOT:PSS
(PVK, PBD, TPD, Ir(ppy)3,salt)
PEDOT:PSS
(PVK, PBD, TPD, Ir(ppy)3,salt)
ITO ITO
Inverted Salt-doped P-i-N Polymer OLED
For “full solution-processed polymer OLEDs”, - Direct printing of metal electrode from metal pastep g p
- Scalable to large area
Al or Ag
paste printing of metals
Emission Layer(PVK, PBD, TPD, Ir(ppy)3,salt)
PEDOT:PSSEmission Layer
(PVK, PBD, TPD, Ir(ppy)3,salt)
PEDOT:PSS
ITO
Mist deposited ZnO
ITO
Mist deposited ZnO
ITO ITO
Inverted Salt-doped P-i-N Polymer OLED
2.2
2.5
3.0
2.3PVK
--
+++
ITO (4.7)
ITO (4.7)
5 8
ITO (4.7)
Z O
4.4PEDOT(5.0)
Al (4.3)
6.05.6 5.5
--------
+++++++
PEDOT(5.0)
Al (4.3)
PEDOT(5.0)
Al (4.3)
5.8ZnO
7.6
Ir(ppy)3PBD TPD
V- +
V- +
ITO (4 7)
VV
ITO
------
++++++++
PEDOT(5 0)
Al (4.3)
(4.7)
ZnO
4.4
PEDOTAl (4.3)
(4.7)
ZnO
4.4
---
++
(5.0)
7.6
(5.0)
7.6
V- +V- +
Inverted Salt-doped P-i-N Polymer OLED
PEDOT:PSS
900 ZnO layer ; salt doping No ZnO layer ; salt doping ZnO layer ; No salt doping
3 6 9 12 15 18 21 24 27
10000
ITO
ZnO
Emitting layerPEDOT:PSS
600
nce
(cd/
/m2 )
esity
(mA
/cm
2 )
1000
3 6 9 12 15 18
Glass300
Lum
inan
Cur
rent
de
100
900
)
Conventional device with LiF (Fig.1 (b)) Salt-doped device (Fig.1 (c)) Inverted salt-doped device with ZnO (Fig.1 (a))
3 6 9 12 15 18
100003 6 9 12 15 18 21 24 27
0
Voltage (V)
600
ce (c
d/m
2 )
esity
(mA
/cm
2 )1000
300
Lum
inan
c
Cur
rent
de
100
3 6 9 12 15 180
Voltage (V)RMS 6.7 nm
Screen printing : Equipment
Pressure GuageGuage
Mask Align
S lift
Controller
Screen-lift
Controller
Vision CameraSqueeze & Scraper
Mask Holder
Screen printing : pixels
1x2 mm2 pixels
1 mm
23.5 m
23 5
mm
23.5 mm
Large-Area OLED panel : Uniformity
Organic Curing(min) Thickness(nm) α-step images
Screen printing : Uniformity higher than 90% over 10 cm ⅹ 10cm area
g g p g
1 30 77
2 30 711
3 30 662 5 3
4 30 764
5 30 775 30 77
Large-Area OLED panel ( Structure I )
Al PVPPVP E i i l E i i l
PVP
150×150 100×100
PVP Bank
PVPBank Emissive layer Emissive layer
ITO
PEDOT:PSS
Gl
PEDOT:PSSCu Cu
Bank
Cu
Glass
Electrolessly depositedScreen printing of
Large area OLED panelElectrolessly-deposited Cu grids
p gPEDOT:PSS, PVP, and
emissive layer
Large-area OLED panel
Large-Area OLED panel ( Structure I )
screen printed PMMA pattern
Sn, Pd seeds for Cu plating
glass
ITO screen-printed PMMA pattern
screen-printed PMMA over-layer
electroless-plated Cu lines
Large-Area OLED panel ( Structure I )
Large-Area OLED panel ( Structure I )
Large-Area OLED panel ( Structure II )
(1) ITO wet etching using screen printed PMMA mask
(2) Screen printing of PEDOT:PSS and emissive layer( ) p g y
(3) Evaporation or transfer of aluminum metal cathode
(1) (2) (3)(1) (2) (3)
ITOPEDOT:PSS and
AlITO emissive layers Al
Large-Area OLED panel ( Structure II )
White OLEDs (single layer)
Metal Cathode (Al)
LiF
PVK-based white emitting layer
PVK ; OXD-7
Firpic (B) ; Ir(mppy)3 (G) ; Ir(piq)2 (R)
ITO Glass
PEDOT:PSS + polysilics acid (PSA)
ITO Glass
White OLEDs (single layer) : Efficiency
D i C iti CIE 1931 coordinates Max. brightness Max. current ffi i CCT
Table 1. Device performance of the white PLEDs doped with red, green and blue phosphorescent dyes.
Device Composition CIE 1931 coordinates at 1000 cd/m2
Max. brightness [cd/m2] efficiency
[cd/A]
CCT[K]
A[a] 100:1[c] 0.232 0.398 1,780 1.93 9,500A 00 0 3 0 398 , 80 93 9,500
B[a] 100:2[c] 0.304 0.379 1,860 1.21 7,100
C[a] 100:3[c] 0.374 0.375 1,300 1.7 4,100
D[b] 50:0.1:1.2[d] 0.357 0.360 3,500 4.3 4,500
E[b] 50:0.1:1.5[d] 0.405 0.341 4,800 4.7 3,200
F[b] 50:1 :1[d] 0.301 0.468 12,200 13.7 5,550
[a] Doubly-doped devices. [b] Triply-doped devices. [c] FIrpic:Ir(piq)2 ratio; FIrpic is fixed at 10 wt% of the active layer blend. [d] FIrpic:Ir(ppy)3:Ir(piq)2 ratio; FIrpic is fixed at 10 wt % of the active layer blend.
White OLEDs : PSA incorporation
Table 2. Effects of PSA nanodots with different concentrations in hole injection layer on the EL performance of the white PLEDs
DevicePSA concentration (wt%
Turn on voltage CIE 1931 coordinates
1000 d/ 2
Max. brightness
Max. current efficiency
Current density at
1000Device tration (wt% of PEDOT)
voltage [V] at 1000 cd/m2 brightness
[cd/m2]efficiency [cd/A], [V]
1000 cd/m2
[mA/cm2]
1 0 6.3 0.332 0.468 12230 13.7, 13.1 10.41 0 6 3 0 33 0 68 30 3 , 3 0
2 0.75% 6 0.325 0.479 11600 15.2, 10.8 8.0
3 1 50% 5 2 0 327 0 496 15000 22 9 10 3 6 13 1.50% 5.2 0.327 0.496 15000 22.9, 10.3 6.1
4 3% 4.8 0.362 0.51 15300 21.3, 9.6 5.7
5 5% 5 3 0 373 0 461 7450 20 4 11 6 5 45 5% 5.3 0.373 0.461 7450 20.4, 11.6 5.4
6 10% 5.3 0.325 0.507 3700 30.3, 11.8 4.7
White OLEDs with interlayer
Metal Cathode (Al)
LiF
PVK-based white emitting layer
PVK ; OXD-7 ; TCTA
Firpic (B) ; Ir(mppy)3 (G) ; Ir(piq)2 (R)
PEDOT:PSS
Interlayer (TCTA)
ITO Glass
White OLEDs with interlayer
2.2
2.82.82.72.6
3.12.42.42.62.6
Interlayer Emissive layer Triplet energy (eV)
2.7FIrpic
2 4
5 05.2
PED
OT
TCTA
TCTA
TPD
α-N
PD
FIrp
ic
Ir(m
ppy)
3
Ir(p
iq) 2
LiF/
Al
OXD
-7
2.8TCTA
2.34
2.4Ir(mppy)3
5.8
6.5
5.05.1
5.75.45.4
5.95.9PVK
TPD2.29
α-NPD
2.0Ir(piq)3
350
400 No TCTA, α-NPD, TPD 5% TCTA 5% α-NPD5% TCTA + 5% NPD
0 5 10 15 20 25
104
20
25
No TCTA, α-NPD, TPD 5% TCTA 5% α-NPD5% TCTA + 5% α NPD
1,700 cd/m2
200
250
3005% TCTA + 5% α-NPD 5% TPD 5% TCTA + 5% TPD
nsity
(mA
/cm
2 )
102
103
ance
(cd/
m2 )
15
5% TCTA + 5% α-NPD 5% TPD 5% TCTA + 5% TPD
ffici
ency
(cd/
A) 19.7 cd/A
50
100
150
Cur
rent
de
101
Lum
ina
5
10
Cur
rent
Ef
13 V
0 5 10 15 20 250
Voltage (V)
100
5 10 15 20 250
Voltage (V)
White OLEDs with interlayer
300
2 )
0% TCTA 3% TCTA 5% TCTA
7% TCTA
5 10 15 20 25
104 20
24
A) 19.8 cd/A
1,600 cd/m2
200
min
ance
(cd/
m2 )
dens
ity (m
A/c
m2 7% TCTA
10% TCTA
103 12
16
t effi
cien
cy (c
d/A
0
100
Lu
Cur
rent
102
0
4
8
Cur
ren 0% TCTA
3% TCTA 5% TCTA 7% TCTA 10% TCTA12.3 V
5 10 15 20 250
Voltage (V)6 8 10 12 14 16 18 20 22
0
Voltage (V)
400 Undoped emissive layer Undoped emissive layer with interlayerDoped emissive layer
5 10 15 20 2525
1,800 cd/m2
200
300
sity
(mA
/cm
2 )
e (c
d/m
2 )
Doped emissive layer Doped emissive layer with interlayer
104
15
20
ncy
(cd/
A) 20.5 cd/A
100
200
Cur
rent
den
s
Lum
inan
ce
103
5
10
Undoped emissive layerUndoped emissive layer with interlayer
Cur
rent
Effi
cien
5 10 15 20 250
Voltage (V)
102
6 8 10 12 14 16 18 200
Undoped emissive layer with interlayer Doped emissive layer Doped emissive layer with interlayer
Voltage (V)
11.5 V
Summary
(1) For low-cost OLED lightings, low-cost TCO substrates is necessary.
(2) Full vacuum-free fabrication of white OLEDs is possible by metal(2) Full vacuum free fabrication of white OLEDs is possible by metal
transfer technique.
(3) Full solution-processed OLED lightings could be realized by utilizing
the inverted structure of OLEDs.
(4) Large-area OLED lighting panel can be realized using solution
processes such as screen or gravure printings.
(5) Power efficiency of white polymer OLEDs needs to be improved.
( World highest : 25 lm/W @ 1,000 cd/m2 )
( O l b t hi h t 15 l /W @ 1 000 d/ 2 )( Our laboratory highest : 15 lm/W @ 1,000 cd/m2 )