About Siotech CorporationRely on the trustworthy quality and excellent technology. “Silicone base LED (Optical) Encapsulant” with high refractive index rate and excellent protection to strengthen key production link of LED Chip package for holding technical life necessary and closely follow up the pace of prosperity society to step into new century together.

product lines

제품종류 계열명칭 모델 특성 굴절율 점도 경도 투과율 400nm/2nm(%)

실리콘봉지제

SioMax

Sio-5588 고굴절율 실리콘 봉지제 1.54 4500 A70 ＞ 90%

Sio-5533 고굴절율 , 중경도 실리콘 봉지제 1.54 3000 D40 ＞ 90%

Sio-5599 고경도 , 저점도 실리콘 봉지제 1.54 500-1000 D70 ＞ 90%

SioPlus

Sio-6688

특수응용 : 입자가 큰 형광체 대응실리콘 봉지제

1.54 2500 A70 ＞ 90%

Sio-6633 1.54 4500 A70 ＞ 90%

Sio-6699 1.54 500-1000 D70 ＞ 90%

Sio-6622 1.54 2500 D30 ＞ 90%

SioLite Sio-4411 저굴절율 및 저원가 실리콘 봉지제 1.41 3000 A60추가로 필요한 자료는 당사 문의 바람

SioLense

Sio-1155 고굴절율 , 고경도 실리콘 봉지제 1.54 3000 D75 88%

Sio-1166 고굴절율 , 고경도 , 고점도 실리콘 봉지제

1.5412000-15000

D75 88%

SioPoxy 추가로 필요한 자료는 당사 문의 바람 .

Test items

• Transmittance

• Pot Life

• Substrate adhesion

• Heat / Humidity test (Level 3)

• Thermal shock test

• Sulfur Exposure test

• Lighting test

• Color after UV / Heat

Transmittance of 5588

SiO-5588

0

20

40

60

80

100

200 300 400 500 600 700 800

Wavelength (nm)

Tra

nsm

ittan

ce (%

)Thickness 2mm

92% (450nm)

Pot LifeStored at 25℃

Substrate adhesion

www.siotech.com.tw

0

0.2

0.4

0.6

0.8

1

1.2

1.4

Ag PPA

Bon

din

g S

tren

gth

(M

Pa) SiO-5588 S 社 D 社

Heat / Humidity test (Level 3)Chip ： 3528 、 5050PLCC / Blue light

Method ： 60 /60%RH/40hr → IR-Reflow(260 )*3cycles℃ ℃ → Soak into the red ink 4 hours 。

5588 5588S 社D 社

PS ： Follow-up to do lighting testing, are all pass.

S 社D 社

Thermal shock testChip ： 3528 、 5050PLCC / Blue light

Method ： -40 /15min ℃ ↔ 120 /15mins*500cycles℃ → Soak into the red ink 4 hours 。

5588 5588

PS ： Follow-up to do lighting testing, are all pass.

www.siotech.com.tw

S 社D 社 S 社D 社

Sulfur Exposure test

Sulfur

Sulfur vapor

keep at 80℃

Chip attached to the cap inside.

5588 S社 D 社

0hr

12hr

24hrReactive expression of sulfur.

4Ag+2H2S+O2→2H2O+ 2Ag2S(Black)

Method, as shown below.Method, as shown below.Chip ： 5050PLCC

Lighting test Chip ： 3528PLCC(Blue) / 3%Phosphor / 60mA

25℃ 85 / 85%RH℃

90

95

100

105

110

0 250 500 750 1000 1250 1500

Time (hr)

Rela

tive Inte

nsi

ty (

%)

SiO-5588 S 社 D 社

90

95

100

105

110

0 250 500 750 1000 1250 1500

Time (hr)

Rela

tive Inte

nsi

ty (

%)

SiO-5588 S 社 D 社

Color after UV / Heat

5588S社D社

initial

QUV(313)*24hr

200℃*24hr

SummaryCode D社 S社 5588

Substrate adhesion X △ ○

Heat / Humidity test (Level 3) X △ ○

Thermal shock test X △ ○

Sulfur exposure test X X △

Lighting test ○ ○ ○

Color after

(UV / Heat) ○ X ○