10372 marcas varias dvd con procesador zoran manual de servicio
Post on 14-Oct-2014
148 Views
Preview:
TRANSCRIPT
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
completion of any service or repairs thisproduct,Ask the service thechnician to performsafety check to determinw that product is inproper operatin condition
Unauthorized substitution may result infire,electric shock or other hazardsupon
by the manufactruer or have the samecharacteristics,as the originalparts
DC:140mA-93mA
DC:140mA-93mA
technician has used replacement parts specified
AC:200mA-1.4mA
AC:200mA-1.4mA
to qualifled service presonal whenreplacement parts are required surethe service
0.8A-1.3A
Note:Damage rquring service,unplug this producefrom the wall oulet and refer servicing
15.7mA-19mA
specitied in the circuit for safety reasonscomponent shall be replaced only by thecomponent
Ajacent to relevant component demoting specific
EMC PART
Checked:
AC TO DC
SHEET:
SHEN ZHEN MTC MULTIMEDIA CO.,LTD
Design:
1 OF VER: A
DWG NO.:DV5312-YL01-03
TITLE:
Apprd: 5
PART NO.:
MODEL: DV5312
11mA-19mA
USB/DIGI AUDIO/RGBCVBS/IR
P+5V
F-
MIC12V
F+
STB12V
+12V
STB12V
A+5V
-12V P-12VSTB-25V
STB12V
+5V
+5V5V
5V
STB-25V
STBYSTANDBY
P+5V
MIC12V
P+5V
F+
F-
P-12V
STBY
GND
GND
GND
C98
100UF/35V
C106
0.1UF
BC6
0.1UF
R20
1K
Q65401
1
23
FB7 FB
12
L28
FB0805
L1
FB0805
C104
0.1UF
R23
10K
R163
100K/0.5W
R11
1K/0805
R420
D16
RS1K_SMD
R79
4.7K
Q38550
1
2 3
Q5
5551
1
2 3
R150100
R149
4.7K
R10
10K
R3
100R/0805
Z1
12V/1W_SMD
C99
222/1KV
C1101
U12 PC8174
23
14
23
1
R710K
Q23904
1
23
F2T2AL/250V
12
C101
100UF/50V
L5
10UH/1A_SMD
12
IC1
TL431
23
1
R19
10K
C102
100UF/50V
D14
RS1K_SMD
R152
2K
L36 1206+EC3
10uF/400V
R22510R/0805
L8NC/FB0805
L34.7U/1A_0805
12
+
EC410uF/25V
R6
100K
L7 NC/FB0805
R21
10K
D12
RS1K_SMD
CON1
~AC100-240V INPUT VOLTAGE
12
12
CON2ON/OFF Button(SW)
12
T2
EEL19
1
4
2
3
5
11
12
10
9
8
7
6
C96
100UF/25V
Z2
7.5V/1W_SMD
+ EC110uF/400V
U10
TNY-275PN
1 2
5
3467
EN BP
S
DSSS
L35
10U/1A_SMD
12
R5
680R
BR1GB206
1 3 2 4
1 3 2 4
R18100K
C94
100UF/25V
BC11
0.1UF
Q48050/DIP
1
23
Q7
BT8550
1
23
R91K/0805
C109
0.1UF
D15
SR360
R153
1K
R8
4K7
L4 NC/FB0805
C95
100UF/25V
L21mH/0.05A/6X8
L30
10UH/2A
12
R154
0R/0.5W/1206
R13
10K
C87
1000UF/16V
R151
1K
L6 NC/FB0805
C39
470UF/16V
D13
RS1K_SMD
Y1
222/400V
C97
100UF/35V
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
FS1: H=RGB L=CVBS
FS2 FS3000110
4:3SCART CFG
TV16:9
SCART config circuit
Close to Q22
5 OF
JACK+VIDEO+SCART
Checked:
VER: A
MODEL: DV5312
SHEET:
DWG NO.:DV5312-YL01-03
Design: TITLE:
SHEN ZHEN MTC MULTIMEDIA CO.,LTD
Apprd:
PART NO.:
5
CVBS
CVBS_G_Y
RGB/CVBS
COAX_SPDIF
YUV-YCr/YC-Y_OUT
RMAIN-OUT
RGB/CVBS
16:9/TV
COAX_SPDIF
CVBS_C
P+5V
S/PDIF_OUT
STB
CVBS
P+12V
16:9/TV
CVBS
YUV-Y
YUV-Y
Cr/YC-Y_OUT
Cb/YC-C_OUT
Cb/YC-C_OUT
C_B_U
LMAIN-OUT
D5VOPTICAL_SPDIF
-25VF+F-
P+5VDATACLK
IRRCV
Cr/YC-YY_R_V
Cr/YC-Y
Cb/YC-C
Cb/YC-C
Cb/YC-C_OUT LMAIN-OUT
Cr/YC-Y_OUT CVBS
C_B_U
FPC_DOUT
CVBS_C
FS1
FPC_CLKFPC_STBIRRCV
Y_R_V
CVBS_G_Y
Y_C_CVBS
FS3
FS2LMAIN-OUTRMAIN-OUT
LMAIN-OUT
RMAIN-OUT
SL-OUT
SR-OUT
CEN-OUT
LFE-OUT
S/PDIF_OUT
-25VF-F+
P+5V
P+12V
P+5V
D5V
P+5V
J1AUDIO 6CH
1
7
2
4
3
8
5
9
6
Q24BT3904
1
23
Q23BT3904
1
23
CON12
9PIN/2.0
123456789
R210
56R
TP10
R2392.2K
TP78
R247
0R
C148150pF
R2021K5
TP7
C193101
R217
2R/0805
TP17
TP77
TP20
R14
22R
R249
0R
TP8
TP67
C143150pF
TP76
C174150pF
TP9
TP82
TP48
C153
0.1uF
TP75
TP22
R192 75R TP3
R250
NC
C194101
TP49
TP80
Q1BT3904
1
23
Q22
BT39041
23
TP81
R201 75R
R248
NC
R234
4K7
R122
TP4
TP13
TP50
TP23
J3 AV4
1
2
3
6
4
5
TP14
TP47
C138150pF
C195101
CON3
9PIN/2.0
123456789
R21427R
R205 75R
C152
22pF
J2
SVIDEO&CVBS
12346
75
8 9
TP83
TP5
TP19
CON13
3PIN/2.0
123
C1210.1uF
TP72
TP6
TP73
R2071K2
R22910K
C132150pF
R23010K
R155
56R
R17675R
TP12
C158101
R164 33R
R20410K
TP79
TP11
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
AMUTE or MUTE_CTL:Hi: Mute.
4 OF
AUDIO+KARAOKE
Checked:
VER: A
MODEL: DV5312
SHEET:
DWG NO.:DV5312-YL01-03
Design: TITLE:
SHEN ZHEN MTC MULTIMEDIA CO.,LTD
Apprd:
PART NO.:
5
MUTE
MUTE
RMAIN-OUT
MUTE
MUTE+12VA
MUTE
MUTE
-12VA
+12VA
+12VA
-12VA
-12VA
P-12V
LMAIN-OUT
MUTE_CTL
AMCLKAINABCLK ALRCLK
MUTE
P-12V
MIC1
MIC_VOCAL
DSPVCC33
ADCVCC33DSPVCC33 ADCVCC33
ADCVCC33
-12VA
+12VA
+12VA
-12VA
+12VA
+12VA
-12VA
-12VA
LRIN P+12V
MIC12V
MIC1
MIC2
MIC2
LRIN
APWM_R-
APWM_R+
LMAIN-OUT
RMAIN-OUT
APWM_L-
APWM_L+
APWM_CEN-
APWM_CEN+
APWM_LFE-
APWM_LFE+
CEN-OUT
LFE-OUT
APWM_SL+
SR-OUT
SL-OUT
APWM_SR+
APWM_SL-
APWM_SR-
MUTE_CTL
AMCLKALRCLKABCLK
AIN
MIC_VOCAL
MIC12V
P-12V
P+12V
P-12V
D5V+12V
DSPVCC33
CON10
5P/2.0
12345
D2NC/4148
12
R253 4.7K
FB6 FB
R30347K
Q27BT3904
1
23
R29110K
R2592K
C2241.5nF
R273NC/1K
+C20147uF/16V
R12NC/0R
C128 160pF
Q29BT8550
1
2 3
R295
2K2
R279 2K2
D23 LL41481 2
R231 1K
C222 160pF
+ C211
100U/16V
R186
2K2
R2622K7
TP1
C228
0.1uF
R271
NC/1K
D1
NC/4148
12
R25547K
C227
0.1uF
R28847K
R274
1K/NC
R299 43K
R269NC/10K
R286 43K
C1241nF
TP2
C212
104
R300 43K
+ C209
10U/16V
R254 47K
R282 2K2
R311 0R
R296 1K
R242 2.2K
R260 33R
D22LL4148
12 C223
1nF
R200 10K
+
-
U9ALM4558
3
21
84
TP71
R309
NC/0RU11
CE2632
1234567 8
91011121314DVDD
SDOUTBCLKFMTCAPVREFRIN LIN
AVDDAGNDNOHP
LRCLKMCLKDGND
R294 2.2K
C2781.5nF
R25247K
+
-
U8BLM4558
5
67
84
R257 47K
R284 43K
R29210K
R221 43K
C2211nF
R280 1k
Q25BT3904
1
23
C1311nF
R281 2.2K
R301 43K
TP70
C214 160pF
R25847K
R30810K
R25110K
R3100R
R43 3.3K
+
-
U7ALM4558
3
21
84
R199 1K
R256100K
C1921.5nF
R306 47K
R30710K
C198
0.1uF
R198
2K2
C220 160pF
C2251.5nF
C2151nF
R182 100K
R218 2.2K
R285 43K
R219 43K
C226
0.1uF
TP18
R305 47K
C123 160pF
R28747K
R159100K
+ C208
10u/16V
C19647uF/25V
R289 47K
Q34BT3904
1
23
+
-
U8ALM4558
3
21
84
R30447K
C184
0.1uF
R302 43K
+
-
U7BLM4558
5
67
84
+C20047uF/16V
R220 43K
R272
0R/NC
Q28BT3904
1
23
C1631.5nF
R243 43K
C2171nF
C231100uF/16V
C2191.5nF
R2931K
C206
104
Q32BT3904
1
23
R278
2.2K
Q33BT3904
1
23
Q31BT3904
1
23R283 43K
C229
0.1uF
C216 160pF
R277 1k
R297 2.2K
+C197
10uF/16V
R261 33R
R23210K
R298
2K2
Q20 BT8550
1
2 3
R290 47K
+
- U9BLM4558
5
67
84
R2632K7
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
LOAD+
GND
LOAD-
INSW
OUTSW
1.25V 1.25V
BEMF
HOMESWGND
SL-
SP-SP+
SL+
Current Type(Default)
Close to motor driver.
Checked:
Design:
Apprd:
R161=300R, for HOP1200W onlyinclude arima , R161=0R
PDIC Control:DVD=LOWCD=HIGH
OPU HD65PS OthersR175: 3.3R 4.7R R189: 3.3R 4.7R
2.1V
PDIC Control:DVD=LOWCD=HIGH
R202=300R, for HOP1200W only
2.1V
CN201 is used for Sanyo/Samsung/Sony OPUs
OPU HD65PS OthersR221: 3.3R 4.7R R224: 3.3R 4.7R
VR_CD
CD_DVD
3V3_DRV
3V3_FB
OPU5VVC1
TACT-
FACT+
CDLD
FACT-
OPU_HFM
VR_DVD
FOCUS_SSLED_STRACK_SSPDL_S
SP_M-
INSW
SP_MOT-
TACT+
1V8_FB
3V3_DRV
1V8_DRV
LOAD+
SLED_S
CLOSE
FACT+
TACT-
OPEN
3V3_FB
VC2
SL_MOT+
SL_MOT-
SP_M-
SPDL_S
SL_MOT+
FOCUS_S
TRACK_S
SP_MOT+
1V8_DRV
1V8_FB
HOMESWVR_CD
LOAD-
FACT-
SPDL_SENS-
SPDL_SENS+
SL_MOT-
SP_MOT+SP_MOT-
LOAD+LOAD-
TACT+
MD_DVD
VR_DVD
DVDLD
MD_CD
HOMESWIN_OUT_SW
RFRF_CRF_BRF_ARF_DRF_FRF_E
OPU_HFM
VR_DVD
OPU5V
DVDLD
VC1
VR_CD
CDLD
CD_DVD
VR_DVD
TACT+TACT-
CDLD
FACT+
DVDLD
OPU5V
OPU_HFM
FACT-
VR_CD
VC1
RF_BRF_C
RF_D
RF
RF_FRF_E
CD_DVD
MD_CD
MD_DVD
IN_OUT_SWHOMESW
FOCUS_SSLED_S
TRACK_SSPDL_S
CLOSE
OPEN
SPDL_SENS+
SPDL_SENS-
INSW
DRVSB
RF_A
LD_DVD
LD_CD
VC
RF_A
RF_FRF_B
RF_E
RF_CRF_D
CD_DVDRF
DSPVCC18DSPVCC33
P+5V
DSPVCC33
P+5V
P+5V
DSPVCC33
DSPVCC33
DSPVCC33
DSPVCC33
P+5V
RFA5V
(value) is for AM5888s
U5AM5888S
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
29 30
VINFC
CFCERR1(TRB_1)
CFCERR2(REGO2)
VINSL+
VINSL-(REGO1)
VOSL(FWD)
VNFFC(REV)
VCC
PVCC1(LOAD-)
PGND(LOAD+)
VOSL-(VOSL+)
VOSL+(VOSL-)
VOFC-
VOFC+
STBY
BIAS
VINTK
CTKERR1(TRB_2)
CTKERR2(NC)
VINLD
PREGND
PVCC2
VNFTK(NC)
PGND(VCC2)
VOLD-
VOLD+
VOTK-
VOTK+
GN
DG
ND
1
CON7
6P 2.0: SLED & SPINDLE Con
654321
R168
2K
D19
1N4002
1 2C1660.1uF
TP63
C136470P
TP87 R16533K
R15 33R
CON9
24P/0.5
2322212019181716151413121110987654321
24TR+FO-FO+
MD(DVD)VCC/NC
VR(DVD)GND(DVD)
LD(DVD)LD(CD)VR(CD)
GND(CD)MD(CD)NC/SEL
V-RFV-CV-BV-AV-DV-FV-EVccVs
GND
TR-
C1461nF
TP52
TP68
R244 100R
TP58
C1560.1uF
R235100R
Q378550
1
23
C1411nF
C1341nF
R17 0R
TP64
D21 4148
1 2
R22810K
Q268550
1
23
TP86
+C175220uF/16V
+ C179100uF/16V
TP69
R2401K 1%
TP53
R1601K 1%
C1470.1uF
R2260R
TP57
TP27
R187100R
R22512K 1%
TP84
TP56
CON1424Pin OPU connector
242322212019181716151413121110987654321
2526
GND-LDDVD-LD
NCHFM
MDCD-LD
VR-DVDVR-CD
NCE
VCCVC(VREF)
GND/PDFBA
RFCD/DVD_SW
DCT-T+F+F-
GN
D
GN
D
CON8
5p 2.0: TRAY_Con
54321
TP40
R1974.7K
R3173.3K
TP61
TP85
TP41
Q218550
1
23
R185NC
C1290.1uF
R1624.7K
+ C18847uF/16V
Q358550
1
23
R1894.7R
R1754.7R
TP39
TP55
TP42
TP54
+ C178100uF/16V
R2221R
TP44
R22420K 1%
TP60
R236NC
Q388550
1
23
R245 100R
Q368550
1
23
R2230R
TP46
D181N4002
12
D24 4148
1 2R161
0R
TP65 R1724.7K
TP88
R216 2R/0805
R2274K3 1%
R177
2K
+ C230220uF/16V
TP62
TP59
R167 220R
C130470P
R181 220R
TP51
TP66
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
Vaddis 9
Close to Pin37 of U15
R195 R194Flash selectIntel NC 0RAMD/SST 0R NC
A19
NCNCRY/BY#
BYTE#
Use it to connect the shell of the crystal with ground.
Close to Vaddis!
Close to Vaddis!
Close to Vaddis!
Important power supply!
MUX GPIOs
500mA for device
EEPROM
Crystal
Close to Vaddis
Close to pin 105
UART:For customer model, please just keep test point close to Vaddis.
Close to Vaddis
SDRAM configuration:1X16Mbit: CS0# = Low;1X64Mbit: CS1# = Low; CS0#=BA1SDRAM speed <=7nsTras <=44.4nsTrp <=22.2ns
Flash speed <= 70 nS.If plan to use 90ns Flash, it needs to be verified by s/w.
Note: While using different OPU,use the same parameter forAM5888S
While using AM5888SR211
R213R206
R209
51K51K
51K22K
JP1BOOTSELPlay OPENDownload CLOSE
2 OF
DSP+SDRAM+FLASH
Checked:
VER: A
MODEL: DV5312
SHEET:
DWG NO.:DV5312-YL01-03
Design: TITLE:
SHEN ZHEN MTC MULTIMEDIA CO.,LTD
Apprd:
PART NO.:
5
ADD FOR STB REALLY
ADD FOR (D)
RA
MC
AS
-
RA
MD
AT5
RA
MD
AT4
RA
MA
DD
8
RA
MD
AT1
5
RA
MD
AT9
RA
MA
DD
7
RA
MD
QM
RA
MA
DD
4
RA
MW
E-
RA
MA
DD
9
RA
MA
DD
0
RA
MD
AT7
RA
MA
DD
10
RA
MA
DD
1R
AM
AD
D2
RA
MD
AT1
1
RA
MD
AT6
RA
MD
AT0
RA
MC
S0-
RA
MD
QM
RA
MA
DD
5R
AM
AD
D6
RA
MD
AT1
0
RA
MR
AS
-
RA
MB
A
RA
MD
AT1
RA
MD
AT1
3R
AM
DA
T2
RA
MD
AT1
2
RA
MA
DD
11
PC
LK
RA
MA
DD
3
RA
MC
S1-
RA
MD
AT8
RA
MD
AT1
4
RA
MD
AT3
RA
MB
A
RA
MD
QM
RA
MA
DD
6R
AM
AD
D5
PC
LK RA
MD
AT1
1
RA
MR
AS
-
RA
MD
AT0
RA
MC
S0-
RA
MA
DD
3
RA
MD
AT1
RA
MD
AT1
2R
AM
DA
T13
RA
MD
AT1
0
RA
MD
AT2
RA
MD
AT4
RA
MC
AS
-
RA
MD
AT1
4
RA
MA
DD
1
RA
MD
AT3
RA
MD
AT8
RA
MD
AT1
5
RA
MD
AT9
RA
MA
DD
7
RA
MA
DD
9
RA
MD
AT7
RA
MW
E-
RA
MA
DD
10
RA
MD
AT5
RA
MA
DD
4
RA
MA
DD
0
RA
MD
QM
RA
MA
DD
2
RA
MD
AT6
SDRAM3.3V
SDRAM3.3V
MEMADD16
MEMDAT15MEMDAT7MEMDAT14MEMDAT6MEMDAT13MEMDAT5MEMDAT12MEMDAT4
MEMDAT11MEMDAT3MEMDAT10MEMDAT2MEMDAT9MEMDAT1MEMDAT8MEMDAT0
MEMADD0
MEMWR#
MEMRD#
VDDPLL
VDD1AFE
OSCIN
OSCOUT
FOCUS_STRACK_S
SPDL_S
RF
DUPRD0DUPTD0
FS2FS1
AMCLK
I2C
_CLK
I2C
_DA
T
AP
WM
_LFE
+
DUPTD1
VDDPLL
RA
MD
AT8
RF_
F
RAMADD5 APWM_SL-
APWM_L-
IRRCV
DUPRD1
VDDDAC
RA
MD
AT3
RAMADD2
MIC
_VO
CA
L
RF_
B
APWM_CEN-
FPC_CLK
RA
MD
AT1
5
MEMDAT10
ME
MR
D#
CVBS_G_Y
CVBS_C
RA
MD
AT0
RA
MD
AT5
RA
MD
QM
MEMADD7
C_B_U
S/PDIF_OUT
RA
MD
AT1
1
IPC
LK
MEMDAT13
VD
D1A
FE
MEMCS0#
Y_C_CVBS
Y_R_V
OSCOUT
RA
MD
AT1
2
SP
DL_
SE
NS
-
RF_
C
VDDAFE
APWM_SR+
FPC_DOUT
RA
MD
AT1
MEMADD10
MD
_CD
SLE
D_P
WM
ME
MD
AT0
DRVSB
RA
MD
AT1
0
RA
MW
E-
MEMADD9
ME
MA
DD
0
MEMDAT15
MEMDAT5
USB_DPUSB_DN
RA
MA
DD
0
RF_
D
SP
DL_
SE
NS
+
SP
DL_
PW
M
RAMADD4
APWM_SR-
DUPTD0
OSCIN
RA
MD
AT6
RA
MR
AS
-
USB_DP
RE
SO
UT
MD
_DV
D
ME
MC
S0#
ME
MD
AT8
RA
MC
AS
-
USB_DN
ABCLK
AINHOMESWOPEN
RA
MD
AT4
RA
MA
DD
10
RAMADD1
VC
AP
WM
_LFE
-
MEMDAT3
VD
DA
FE
RF_
E
ME
MD
AT9
VDDDAC
APWM_SL+
APWM_L+
DUPRD0
RA
MD
AT1
4
RA
MD
AT1
3
RF_
A
LD_D
VD
ME
MD
AT1
APWM_CEN+
ALRCLK
IN_OUT_SW
FPC_STB
VDDDAC
MEMADD15
RFN
VD
DA
FE
VD
DP
WM
VDDPWM
APWM_R+
CLOSE
RA
MA
DD
8
MEMADD6
MEMDAT14
MEMDAT4MEMDAT11
RFP
LD_C
D
VR
EF
APWM_R-
I2C_CLKI2C_DAT
DUPTD1 FS3
INSW
DUPRD1
TRA
CK
_PW
M
VDDAPWM
RESET#
MEMADD17
MEMADD19MEMADD1MEMADD2
MEMADD3MEMADD4MEMADD5
MEMADD18MEMWR#MEMADD8
MEMADD11MEMADD12MEMADD13MEMADD14
MEMADD16
MEMDAT7
MEMDAT6
MEMDAT12
MEMDAT2
FCU
_SC
LK
FCU
_RS
T
FCU
_IO
RD
#
FCU
_WA
IT#
FCU
_CS
2#
FCU
_IO
WR
#
FCU
_CS
3#
MEMADD15MEMADD14MEMADD13MEMADD12MEMADD11MEMADD10MEMADD9MEMADD8
MEMADD18MEMADD17MEMADD7MEMADD6MEMADD5MEMADD4MEMADD3MEMADD2MEMADD1
MEMADD19
MEMADD1
PCLK
IPC
LK
RAMADD7
RAMADD6
RAMADD3R
AM
AD
D9
RA
MD
AT2
RA
MD
AT7
RA
MD
AT9
FOC
US
_PW
M
RESET#
MEMDAT13
FCU_WAIT#
FCU_SCLKDSPVCC33MEMDAT12
FCU_RSTFCU_CS2#FCU_CS3#
RA
MB
A
RA
MA
DD
11R
AM
CS
0-
RA
MC
S1-
MUTE_CTL
RESET#
SLED_S
FCU
_IR
Q
FCU_IRQ
FCU_IORD#
FCU_IOWR#
FLASHVCCFLASHVCC
P+5V
DSPVCC33 FLASHVCC
P+5V
DUPRD0DUPTD0
P+5V
DSPVCC33
STB
Y
RAMCKE
RA
MA
DD
8
RA
MC
KE
RESET#
DSPVCC33
OK
_DE
T
CD_DVDCD_DVD''
FPC_DOUTFPC_CLKFPC_STB
C_B_U
Y_R_VCVBS_C
CVBS_G_Y
Y_C_CVBS
ABCLKALRCLK
AMCLK
AP
WM
_LFE
+A
PW
M_L
FE-
FOCUS_STRACK_S
SPDL_SSLED_S
MD
_DV
DM
D_C
D
RF_
FS
PD
L_S
EN
S+
RF_
ES
PD
L_S
EN
S-
RF_
BR
F_A
RF_
DR
F_C
VC
LD_C
DLD
_DV
D
RF
MIC
_VO
CA
L
FS3FS2FS1
IRRCV
AIN
APWM_R+
APWM_L-
APWM_SL-
APWM_L+
APWM_SL+
APWM_R-
APWM_CEN-APWM_CEN+
APWM_SR-APWM_SR+
S/PDIF_OUT
MUTE_CTL
DRVSB
OPENCLOSE
HOMESW
IN_OUT_SW
INSW
STB
Y
CD_DVD
DSPVCC33
DSPVCC33
DSPVCC18
DSPVCC33
DSPVCC33
DSPVCC33
DSPVCC18
DSPVCC33
DSPVCC18
DSPVCC33
P+5V
DSPVCC33
FLASHVCC
DSPVCC33
DSPVCC33
TP29
+ C19110uF/16V
R206 51K
FB8MBW2012-221
CON5
2PIN/2.0
12
R191 10K
U2
SST39VF800
[39VF400/800/160]
123456789
101112131415161718192021222324
484746454443424140393837363534333231302928272625
A15A14A13A12A11A10A9A8NCA20WE#RP#VPPWP#A19A18A17A7A6A5A4A3A2A1
A16VCCQ
GNDDQ15
DQ7DQ14
DQ6DQ13
DQ5DQ12
DQ4VCC
DQ11DQ3
DQ10DQ2DQ9DQ1DQ8DQ0OE#GNDCE#
A0
C171104
TP35
C137 33pF
R180 180R
+C186
100uF/16V
R18
410
0R
TP30
R169 NC/0R
D204148
12
R27033R
R209 22K
+ C185100uF/16V
C164
1nF
TP33
R157 0R
+ C177100uF/16V
C144104
Y427.000MHz
C125104
C154104
C165104
R246 4R7
R170 10K
PH1 1.
TP181
1.
Q8BT3904
1
23
C133104
R2610K
+ C173220uF/16V
D20LL4148
12
TP26
R17
375
R 1
%
R156 0R
FB3
FB
R1782K
R195 0R
C2791nF
C199104
TP28
R16390 Ohm 1%
C127104
+C191
10uF/16V
R2121K
TP43
C18
20.
1uF
C2
0.1UF
R2414k7
R21
575
R 1
%
CON4
2.0X4USB1234
C159
1nF
R23
315
.4K
1%
C202104
TP34
TP45
+ C187100uF/16V
R18356R
R20
875
R 1
%
C181 1nF
R1581M
R2415K
C169104
TP25
FB4
FB
U1A
ZR36962
208
207
206
205
204
203
202
201
200
199
198
197
196
195
194
193
192
191
190
189
188
187
186
185
184
183
182
178
176
179
177
174
175
173
180
181
161
172
163
170
171
167
168
165
166
162
159
160
169
164
158
157
123456789
101112131415161718192021222324252627282930313233343536373839404142
4948
5051
53
52
54 55 5756 58 59 6160 62 63 6564 66 67 69 70 71 7268 73 74 7675 77 78 8079 81 82 8483 85 86 8987 90 91 92
156155154153152151150149148147146145144143142141140139138137136135134133132131130129128127126125124123122121120119118117116115114113112111110109108107106105
44454647
88 93 94 95 96 97 98 99 100
101
102
103
104
43
VD
DP
GP
IO[9
]/ME
MD
AT[
9]M
EM
DA
T[1]
GP
IO[8
]/ME
MD
AT[
8]M
EM
DA
T[0]
ME
MR
D#
ME
MC
S0#
ME
MA
DD
[0]
GP
IO[6
3]/M
EM
CS
2#G
PIO
[62]
/FC
U_I
OR
D#
GP
IO[6
1]/F
CU
_IO
WR
#G
PIO
[60]
/FC
U_S
CLK
GP
IO[5
9]/F
CU
_CS
2#G
PIO
[58]
/FC
U_C
S3#
GP
IO[5
7]/F
CU
_WA
IT#
GP
IO[5
6]/F
CU
_RS
TIG
PIO
[55]
/FC
U_I
RQ
GN
DC
VD
DC
IGP
IO[5
4]/P
WM
CO
[5]
GP
IO[5
3]/P
WM
CO
[4]
GP
IO[5
2]/P
WM
CO
[3]
GP
IO[5
1]/P
WM
CO
[2]
GN
DP
WM
GP
IO[5
0]/P
WM
CO
[1]
VD
DP
WM
GP
IO[4
9]/P
WM
CO
[0]
CD
_MD
GN
DR
EF
DV
D_M
D
VD
DS
AFE
VR
EF
RE
SO
UT
VC
CD
_LD
DV
D_L
D B
GN
D1A
FE CGH KF JE
VD
DA
FE
VD
D1A
FEA
GN
DA
FE D
RFN
RFP
MEMDAT[2]MEMDAT[10]/GPIO[0]MEMDAT[3]MEMDAT[11]/GPIO[1]MEMDAT[4]MEMDAT[12]/GPIO[2]MEMDAT[5]MEMDAT[13]/GPIO[3]MEMDAT[6]MEMDAT[14]/GPIO[4]GNDCMEMDAT[7]MEMDAT[15]VDDCVDDPMEMADD[16]MEMCS1#/GPIO[5]MEMADD[15]MEMADD[14]MEMADD[13]MEMADD[12]MEMADD[11]MEMADD[10]MEMADD[9]MEMADD[8]MEMWR#MEMADD[18]/GPIO[6]MEMADD[17]MEMADD[7]MEMADD[6]GNDCMEMADD[5]MEMADD[4]MEMADD[3]VDDPMEMADD[2]MEMADD[1]MEMADD[19]/IGPIO[7]USBVDDUSBDP/GPO[67]USBDN/GPO[68]USBGND
RAMADD[6]RAMADD[2]
RAMADD[1]RAMADD[7]
RA
MA
DD
[0]
VDDC
RA
MA
DD
[8]
RA
MA
DD
[10]
GN
DC
VD
DP
RA
MA
DD
[9]
RA
MA
DD
[11]
/GP
O[6
4]
RA
MB
AR
AM
CS
0#
RA
MC
S1#
/GP
O[6
5]R
AM
RA
S#
VD
DP
RA
MC
AS
#
GN
DC
RA
MW
E#
GN
DP
CLK
PC
LKV
DD
PC
LKR
AM
DA
T[8]
RA
MD
QM
RA
MD
AT[
7]R
AM
DA
T[9]
VD
DP
RA
MD
AT[
6]
GN
DC
RA
MD
AT[
10]
RA
MD
AT[
11]
RA
MD
AT[
5]
RA
MD
AT[
4]R
AM
DA
T[12
]
VD
DP
RA
MD
AT[
3]
GN
DC
RA
MD
AT[
13]
RA
MD
AT[
14]
RA
MD
AT[
2]
RA
MD
AT[
1]R
AM
DA
T[15
]R
AM
DA
T[0]
GNDDACBS2RSETDAC1
VDDDACDAC2DAC3
VDDDACDAC4
GNDDAC_DDAC5
XINXO
VDDPLLGNDPLLRESET#
GNDCVDDC
GPIO[48]/DUPRD1GPIO[47]/DUPTD1GPIO[46]/DUPRD0
GPIO[45]/PWMCO[5]/DUPTD0VDDP
IGPIO[44]GPIO[43]/TDOGPIO[42]/TCK
GPIO[41]/TDI/NMIGPIO[40]GPIO[39]GPIO[38]
IGPIO[37]/TMS/NMIGPIO[36]GPIO[35]
GPIO[34]/RAMCKE/SPDIFINGPIO[33]/AIN/SPDIFIN
GPIO[32]/SPDIFOGPIO[31]/ABCLK
GPIO[30]/ALRCLKVDDP
GPIO[29]/AMCLKGNDC
GPIO[28]/AOUT[0]/APWM0-GPIO[27]/APWM0+
GPIO[26]/AOUT[1]/APWM1-GPIO[25]/APWM1+
GPIO[24]/AOUT[2]/APWM2-IGPIO[23]/APWM2+
GNDAPWMGPIO[22]/AOUT[3]/APWM3-
GPIO[21]/APWM3+GPIO[20]/APWM4-
GPIO[19]/PWMCO[5]/APWM4+VDDAPWM
RAMADD[3]RAMADD[5]VDDIPGNDC
VD
DC
VD
DP
RA
MD
QM
2/R
AM
CK
E/G
PO
[66]
GN
DC
RA
MC
KE
/SD
I_P
SC
/GP
IO[1
0]G
PA
IO/IG
PIO
[11]
AP
WM
7+/G
PIO
[12]
AP
WM
7-/G
PIO
[13]
AP
WM
6+/G
PIO
[14]
AP
WM
6-/G
PIO
[15]
AP
WM
5+/G
PIO
[16]
AP
WM
5-/G
PIO
[17]
AIN
/SP
DIF
IN/IO
[18]
RAMADD[4]
C150104
C161
27nF
FB5
FB
U6
NC/24C02
1234
8765
A0A1A2
GND
VCCWPSCLSDA
C162104
C14233pF
C167104
R17
475
R 1
%
C139NC/5PF
TP24
TP32
U4
16Mbit: K4S161622C-TC/L70
12345678910111213141516171819202122232425
50494847464544434241403938373635343332313029282726
VD
DD
Q0
DQ
1V
SS
QD
Q2
DQ
3V
DD
QD
Q4
DQ
5V
SS
QD
Q6
DQ
7V
DD
QLD
QM
WE
CA
SR
AS
CS
BA
A10
/AP
A0
A1
A2
A3
VD
D
VS
SD
Q15
DQ
14V
SS
QD
Q13
DQ
12V
DD
QD
Q11
DQ
10V
SS
QD
Q9
DQ
8V
DD
QNC
UD
QM
CLK
CK
EN
CA9
A8
A7
A6
A5
A4
VS
S
JP1NC
1 2
C168 1nF
TP182
1.
R2 1K5
C183104
R23715K
R213 51K
TP38
C157104
C1260.1uF
R19
375
R 1
%
R194 NC
C135 33pF
C160
27nF
R25
4k7
C170104
CON6
SD/MMC/MS
12345678910111213141516
12345678910
111213141516
CON11
4PIN/2.0
1234
TP36
FB1
FB
R23815K
+ C189220uF/16V
R203 10K
C15510nF
FB2 FB
TP31
C145104
R179
2K
C151104
U3
NM[64Mbit:K4S641632H-UC70]
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27282930313233343536373839404142434445464748495051525354
VD
DD
Q0
VD
DQ
DQ
1D
Q2
VS
SQ
DQ
3D
Q4
VD
DQ
DQ
5D
Q6
VS
SQ
DQ
7V
DD
DQ
ML
WE
#C
AS
#R
AS
#C
S#
BA
0B
A1
A10
A0
A1
A2
A3
VD
DV
SSA4
A5
A6
A7
A8
A9
A11NC
CK
EC
LKD
QM
HN
CV
SS
DQ
8V
DD
QD
Q9
DQ
10V
SS
QD
Q11
DQ
12V
DD
QD
Q13
DQ
14V
SS
QD
Q15
VS
S
C122104
R19
010
0R
R188 0R
TP37
R211 51K
+ C180100uF/16V
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
线路图
表格编号:QR-RD-016A
原理框图
U5
TNY275PN
+5V
OPERATIONAL AMPLIFIER
SDRAM
U1
AC IN
5.1CH AUDIO OUTPUT
+3.3V
MOTOR-DRIVER
NJM4558
+1.8V
D5888S
1*16M/4*16M
CD
VFD DRIVER
L
T2
EEL19
ZR36962
FLASH16M
R
PH681
ARIMA
PWM POWER
U7/U8/U9
+12V
VFD DISPLAY
IC1
DSP
100-240V
AUDIO PORT
VIDEO PORT
USB1.1 INPUT
VIDEO PORT
COAXIAL PORT
YUV OUTPUT
DIGTAL COAXIAL OUTPUT
USB PORT
S-VIDEO/CVBS OUTPUT
+5V
-21V
1 OF
Design:
DWG NO.:DV5312-YL01-03
SHEET:
MODEL: DV5312
VER: A
Checked:
1
PART NO.:
DSP+SDRAM+FLASH
Apprd:
SHEN ZHEN MTC MULTIMEDIA CO.,LTD
TITLE:
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
SHEET: 6 pages
PART NO.:
Apprd:
TITLE: Cover page
表格编号:QR-RD-016A
SHEN ZHEN MTC MULTIMEDIA CO.,LTD
Checked:
MODEL: DV5312(ZORAN)Design:
DWG NO.:DV5312-YL01-03
VER: A
TNY274-280TinySwitch-III FamilyEnergy Efficient, Off-Line Switcher with Enhanced Flexibility and Extended Power Range
Figure 1. Typical Standby Application.
Product HighlightsLowest System Cost with Enhanced Flexibility • Simple ON/OFF control, no loop compensation needed• Selectable current limit through BP/M capacitor value - Higher current limit extends peak power or, in open
frame applications, maximum continuous power - Lower current limit improves efficiency in enclosed
adapters/chargers - Allows optimum TinySwitch-III choice by swapping
devices with no other circuit redesign • Tight I2f parameter tolerance reduces system cost - Maximizes MOSFET and magnetics power delivery - Minimizes max overload power, reducing cost of
transformer, primary clamp & secondary components • ON-time extension – extends low line regulation range/
hold-up time to reduce input bulk capacitance• Self-biased: no bias winding or bias components• Frequency jittering reduces EMI filter costs• Pin-out simplifies heatsinking to the PCB • SOURCE pins are electrically quiet for low EMI
Enhanced Safety and Reliability Features• Accurate hysteretic thermal shutdown protection with
automatic recovery eliminates need for manual reset • Improved auto-restart delivers <3% of maximum power
in short circuit and open loop fault conditions• Output overvoltage shutdown with optional Zener • Line under-voltage detect threshold set using a single
optional resistor • Very low component count enhances reliability and
enables single-sided printed circuit board layout• High bandwidth provides fast turn on with no overshoot
and excellent transient load response• Extended creepage between DRAIN and all other pins
improves field reliability
EcoSmart®– Extremely Energy Efficient • Easily meets all global energy efficiency regulations • No-load <150 mW at 265 VAC without bias winding,
<50 mW with bias winding• ON/OFF control provides constant efficiency down to
very light loads – ideal for mandatory CEC regulations and 1 W PC standby requirements
Applications• Chargers/adapters for cell/cordless phones, PDAs, digital
cameras, MP3/portable audio, shavers, etc.
®
February 2006
Table 1. Notes: 1. Minimum continuous power in a typical non-ventilated enclosed adapter measured at 50 °C ambient. Use of an external heatsink will increase power capability 2. Minimum peak power capability in any design or minimum continuous power in an open frame design (see Key Application Considerations). 3. Packages: P: DIP-8C, G: SMD-8C. See Part Ordering Information.
• PC Standby and other auxiliary supplies• DVD/PVR and other low power set top decoders• Supplies for appliances, industrial systems, metering, etc.
DescriptionTinySwitch-III incorporates a 700 V power MOSFET, oscillator, high voltage switched current source, current limit (user selectable) and thermal shutdown circuitry. The IC family uses an ON/OFF control scheme and offers a design flexible solution with a low system cost and extended power capability.
OUTPUT POWER TABLE
PRODUCT3
230 VAC ±15% 85-265 VAC
Adapter1Peak or Open
Frame2Adapter1
Peak or Open
Frame2
TNY274 P or G 6 W 11 W 5 W 8.5 WTNY275 P or G 8.5 W 15 W 6 W 11.5 WTNY276 P or G 10 W 19 W 7 W 15 WTNY277 P or G 13 W 23.5 W 8 W 18 WTNY278 P or G 16 W 28 W 10 W 21.5 WTNY279 P or G 18 W 32 W 12 W 25 WTNY280 P or G 20 W 36.5 W 14 W 28.5 W
PI-4095-082205
Wide-RangeHV DC Input
D
S
EN/UV
BP/M
+
-
+
-
DCOutput
TinySwitch-III
2 E2/06
TNY274-280
Figure 2. Functional Block Diagram.
Figure 3. Pin Configuration.
Pin Functional DescriptionDRAIN (D) Pin:This pin is the power MOSFET drain connection. It provides internal operating current for both start-up and steady-state operation.
BYPASS/MULTI-FUNCTION (BP/M) Pin:This pin has multiple functions:
1. It is the connection point for an external bypass capacitor for the internally generated 5.85 V supply.
2. It is a mode selector for the current limit value, depending on the value of the capacitance added. Use of a 0.1 µF capacitor results in the standard current limit value. Use of a 1 µF capacitor results in the current limit being reduced to that of the next smaller device size. Use of a 10 µF capacitor results in the current limit being increased to that of the next larger device size for TNY275-280.
3. It provides a shutdown function. When the current into the bypass pin exceeds 5.5 mA, the device latches off until the BP/M voltage drops below 4.9 V, during a power down. This can be used to provide an output overvoltage function
with a Zener connected from the BP/M pin to a bias winding supply.
ENABLE/UNDER-VOLTAGE (EN/UV) Pin:This pin has dual functions: enable input and line under-voltage sense. During normal operation, switching of the power
PI-4077-013106
CLOCK
OSCILLATOR
5.85 V4.9 V
SOURCE(S)
S
R
Q
DCMAX
BYPASS/MULTI-FUNCTION
(BP/M)
+
-
VILIMIT
FAULTPRESENT
CURRENT LIMITCOMPARATOR
ENABLE
LEADINGEDGE
BLANKING
THERMALSHUTDOWN
+
-
DRAIN(D)
REGULATOR5.85 V
BYPASS PINUNDER-VOLTAGE
1.0 V + VT
ENABLE/UNDER-
VOLTAGE(EN/UV)
Q
115 µA 25 µALINE UNDER-VOLTAGE
RESET
AUTO-RESTARTCOUNTER
JITTER
1.0 V
6.4 V
CURRENTLIMIT STATE
MACHINE
PI-4078-080905
D S
BP/M S
SEN/UV
P Package (DIP-8C)G Package (SMD-8C)
8
5
7
1
4
2
S6
3
TNY274-280
E2/06
Figure 4. Frequency Jitter.
MOSFET is controlled by this pin. MOSFET switching is terminated when a current greater than a threshold current is drawn from this pin. Switching resumes when the current being pulled from the pin drops to less than a threshold current. A modulation of the threshold current reduces group pulsing. The threshold current is between 60 µA and 115 µA.
The EN/UV pin also senses line under-voltage conditions through an external resistor connected to the DC line voltage. If there is no external resistor connected to this pin, TinySwitch-III detects its absence and disables the line under-voltage function.
SOURCE (S) Pin:This pin is internally connected to the output MOSFET source for high voltage power return and control circuit common.
TinySwitch-III Functional DescriptionTinySwitch-III combines a high voltage power MOSFET switch with a power supply controller in one device. Unlike conventional PWM (pulse width modulator) controllers, it uses a simple ON/OFF control to regulate the output voltage.
The controller consists of an oscillator, enable circuit (sense and logic), current limit state machine, 5.85 V regulator, BYPASS/MULTI-FUNCTION pin under-voltage, overvoltage circuit, and current limit selection circuitry, over- temperature protection, current limit circuit, leading edge blanking, and a 700 V power MOSFET. TinySwitch-III incorporates additional circuitry for line under-voltage sense, auto-restart, adaptive switching cycle on-time extension, and frequency jitter. Figure 2 shows the functional block diagram with the most important features.
OscillatorThe typical oscillator frequency is internally set to an average of 132 kHz. Two signals are generated from the oscillator: the
maximum duty cycle signal (DCMAX) and the clock signal that indicates the beginning of each cycle.
The oscillator incorporates circuitry that introduces a small amount of frequency jitter, typically 8 kHz peak-to-peak, to minimize EMI emission. The modulation rate of the frequency jitter is set to 1 kHz to optimize EMI reduction for both average and quasi-peak emissions. The frequency jitter should be measured with the oscilloscope triggered at the falling edge of the DRAIN waveform. The waveform in Figure 4 illustrates the frequency jitter.
Enable Input and Current Limit State MachineThe enable input circuit at the EN/UV pin consists of a low impedance source follower output set at 1.2 V. The current through the source follower is limited to 115 µA. When the current out of this pin exceeds the threshold current, a low logic level (disable) is generated at the output of the enable circuit, until the current out of this pin is reduced to less than the threshold current. This enable circuit output is sampled at the beginning of each cycle on the rising edge of the clock signal. If high, the power MOSFET is turned on for that cycle (enabled). If low, the power MOSFET remains off (disabled). Since the sampling is done only at the beginning of each cycle, subsequent changes in the EN/UV pin voltage or current during the remainder of the cycle are ignored.
The current limit state machine reduces the current limit by discrete amounts at light loads when TinySwitch-III is likely to switch in the audible frequency range. The lower current limit raises the effective switching frequency above the audio range and reduces the transformer flux density, including the associated audible noise. The state machine monitors the sequence of enable events to determine the load condition and adjusts the current limit level accordingly in discrete amounts.
Under most operating conditions (except when close to no-load), the low impedance of the source follower keeps the voltage on the EN/UV pin from going much below 1.2 V in the disabled state. This improves the response time of the optocoupler that is usually connected to this pin.
5.85 V Regulator and 6.4 V Shunt Voltage ClampThe 5.85 V regulator charges the bypass capacitor connected to the BYPASS pin to 5.85 V by drawing a current from the voltage on the DRAIN pin whenever the MOSFET is off. The BYPASS/MULTI-FUNCTION pin is the internal supply voltage node. When the MOSFET is on, the device operates from the energy stored in the bypass capacitor. Extremely low power consumption of the internal circuitry allows TinySwitch-III to operate continuously from current it takes from the DRAIN pin. A bypass capacitor value of 0.1 µF is sufficient for both high frequency decoupling and energy storage.
600
0 5 10
136 kHz128 kHz
VDRAIN
Time (µs)
PI-
2741
-041
901
500
400
300
200
100
0
4 E2/06
TNY274-280
Figure 5. Auto-Restart Operation.
PI-
4098
-082
305
0 2500 5000
Time (ms)
0
5
0
10
100
200
300 VDRAIN
VDC-OUTPUT
In addition, there is a 6.4 V shunt regulator clamping the BYPASS/MULTI-FUNCTION pin at 6.4 V when current is provided to the BYPASS/MULTI-FUNCTION pin through an external resistor. This facilitates powering of TinySwitch-III externally through a bias winding to decrease the no-load consumption to well below 50 mW.
BYPASS/MULTI-FUNCTION Pin Under-VoltageThe BYPASS/MULTI-FUNCTION pin under-voltage circuitry disables the power MOSFET when the BYPASS/MULTI-FUNCTION pin voltage drops below 4.9 V in steady state operation. Once the BYPASS/MULTI-FUNCTION pin voltage drops below 4.9 V in steady state operation, it must rise back to 5.85 V to enable (turn-on) the power MOSFET.
Over Temperature ProtectionThe thermal shutdown circuitry senses the die temperature. The threshold is typically set at 142 °C with 75 °C hysteresis. When the die temperature rises above this threshold the power MOSFET is disabled and remains disabled until the die temperature falls by 75 °C, at which point it is re-enabled. A large hysteresis of 75 °C (typical) is provided to prevent overheating of the PC board due to a continuous fault condition.
Current LimitThe current limit circuit senses the current in the power MOSFET. When this current exceeds the internal threshold (ILIMIT), the power MOSFET is turned off for the remainder of that cycle. The current limit state machine reduces the current limit threshold by discrete amounts under medium and light loads.
The leading edge blanking circuit inhibits the current limit comparator for a short time (tLEB) after the power MOSFET is turned on. This leading edge blanking time has been set so that current spikes caused by capacitance and secondary-side rectifier reverse recovery time will not cause premature termination of the switching pulse.
Auto-RestartIn the event of a fault condition such as output overload, output short circuit, or an open loop condition, TinySwitch-III enters into auto-restart operation. An internal counter clocked by the oscillator is reset every time the EN/UV pin is pulled low. If the EN/UV pin is not pulled low for 64 ms, the power MOSFET switching is normally disabled for 2.5 seconds (except in the case of line under-voltage condition, in which case it is disabled until the condition is removed). The auto-restart alternately enables and disables the switching of the power MOSFET until the fault condition is removed. Figure 5 illustrates auto-restart circuit operation in the presence of an output short circuit.
In the event of a line under-voltage condition, the switching of the power MOSFET is disabled beyond its normal 2.5 seconds until the line under-voltage condition ends.
Adaptive Switching Cycle On-Time ExtensionAdaptive switching cycle on-time extension keeps the cycle on until current limit is reached, instead of prematurely terminating after the DCMAX signal goes low. This feature reduces the minimum input voltage required to maintain regulation, extending hold-up time and minimizing the size of bulk capacitor required. The on-time extension is disabled during the startup of the power supply, until the power supply output reaches regulation.
Line Under-Voltage Sense CircuitThe DC line voltage can be monitored by connecting an external resistor from the DC line to the EN/UV pin. During power-up or when the switching of the power MOSFET is disabled in auto-restart, the current into the EN/UV pin must exceed 25 µA to initiate switching of the power MOSFET. During power-up, this is accomplished by holding the BYPASS/MULTI-FUNCTION pin to 4.9 V while the line under-voltage condition exists. The BYPASS/MULTI-FUNCTION pin then rises from 4.9 V to 5.85 V when the line under-voltage condition goes away. When the switching of the power MOSFET is disabled in auto-restart mode and a line under-voltage condition exists, the auto-restart counter is stopped. This stretches the disable time beyond its normal 2.5 seconds until the line under-voltage condition ends.
The line under-voltage circuit also detects when there is no external resistor connected to the EN/UV pin (less than ~1 µA into the pin). In this case the line under-voltage function is disabled.
TinySwitch-III Operation
TinySwitch-III devices operate in the current limit mode. When enabled, the oscillator turns the power MOSFET on at the beginning of each cycle. The MOSFET is turned off when the current ramps up to the current limit or when the DCMAX limit is reached. Since the highest current limit level and frequency of a TinySwitch-III design are constant, the power delivered to the
5
TNY274-280
E2/06
V
DRAINV
EN
CLOCK
DC
DRAINI
MAX
PI-2749-082305
Figure 6. Operation at Near Maximum Loading.
V
DRAINV
EN
CLOCK
DC
DRAINI
MAX
PI-2667-082305
Figure 8. Operation at Medium Loading.Figure 7. Operation at Moderately Heavy Loading.
load is proportional to the primary inductance of the transformer and peak primary current squared. Hence, designing the supply involves calculating the primary inductance of the transformer for the maximum output power required. If the TinySwitch-III is appropriately chosen for the power level, the current in the calculated inductance will ramp up to current limit before the DCMAX limit is reached.
Enable FunctionTinySwitch-III senses the EN/UV pin to determine whether or
not to proceed with the next switching cycle. The sequence of cycles is used to determine the current limit. Once a cycle is started, it always completes the cycle (even when the EN/UV pin changes state half way through the cycle). This operation results in a power supply in which the output voltage ripple is determined by the output capacitor, amount of energy per switch cycle and the delay of the feedback.
The EN/UV pin signal is generated on the secondary by comparing the power supply output voltage with a reference voltage. The EN/UV pin signal is high when the power supply output voltage is less than the reference voltage.
In a typical implementation, the EN/UV pin is driven by an optocoupler. The collector of the optocoupler transistor is connected to the EN/UV pin and the emitter is connected to the SOURCE pin. The optocoupler LED is connected in series with a Zener diode across the DC output voltage to be regulated. When the output voltage exceeds the target regulation voltage level (optocoupler LED voltage drop plus Zener voltage), the optocoupler LED will start to conduct, pulling the EN/UV pin low. The Zener diode can be replaced by a TL431 reference circuit for improved accuracy.
ON/OFF Operation with Current Limit State MachineThe internal clock of the TinySwitch-III runs all the time. At the beginning of each clock cycle, it samples the EN/UV pin to decide whether or not to implement a switch cycle, and based on the sequence of samples over multiple cycles, it determines the appropriate current limit. At high loads, the state machine sets the current limit to its highest value. At lighter loads, the state machine sets the current limit to reduced values.
PI-2377-082305
V
DRAINV
EN
CLOCK
DC
DRAINI
MAX
6 E2/06
TNY274-280
Figure 12. Normal Power-Down Timing (without UV).
Figure 13. Slow Power-Down Timing with Optional External (4 MΩ) UV Resistor Connected to EN/UV Pin.
Figure 10. Power-Up with Optional External UV Resistor (4 MΩ) Connected to EN/UV Pin.
Figure 11. Power-Up Without Optional External UV Resistor Connected to EN/UV Pin.
PI-2661-082305
V
DRAINV
EN
CLOCK
DC
DRAINI
MAX
Figure 9. Operation at Very Light Load.
At near maximum load, TinySwitch-III will conduct during nearly all of its clock cycles (Figure 6). At slightly lower load, it will “skip” additional cycles in order to maintain voltage regulation at the power supply output (Figure 7). At medium loads, cycles will be skipped and the current limit will be reduced (Figure 8). At very light loads, the current limit will be reduced even further (Figure 9). Only a small percentage of cycles will occur to satisfy the power consumption of the power supply.
The response time of the ON/OFF control scheme is very fast compared to PWM control. This provides tight regulation and excellent transient response.
PI-
2395
-030
801
0 2.5 5
Time (s)
0
100
200
400
300
0
100
200
VDC-INPUT
VDRAIN
0 1 2
Time (ms)
0
200
400
5
0
10
0
100
200
PI-
2383
-030
801
VDC-INPUT
VBYPASS
VDRAIN
PI-
2381
-103
0801
0 1 2
Time (ms)
0
200
400
5
0
10
0
100
200
VDC-INPUT
VBYPASS
VDRAIN
PI-
2348
-030
801
0 .5 1
Time (s)
0
100
200
300
0
100
200
400
VDC-INPUT
VDRAIN
7
TNY274-280
E2/06
Power Up/DownThe TinySwitch-III requires only a 0.1 µF capacitor on the BYPASS/MULTI-FUNCTION pin to operate with standard current limit. Because of its small size, the time to charge this capacitor is kept to an absolute minimum, typically 0.6 ms. The time to charge will vary in proportion to the BYPASS/MULTI-FUNCTION pin capacitor value when selecting different current limits. Due to the high bandwidth of the ON/OFF feedback, there is no overshoot at the power supply output. When an external resistor (4 MΩ) is connected from the positive DC input to the EN/UV pin, the power MOSFET switching will be delayed during power-up until the DC line voltage exceeds the threshold (100 V). Figures 10 and 11 show the power-up timing waveform in applications with and without an external resistor (4 MΩ) connected to the EN/UV pin.
Under startup and overload conditions, when the conduction time is less than 400 ns, the device reduces the switching frequency to maintain control of the peak drain current.
During power-down, when an external resistor is used, the power MOSFET will switch for 64 ms after the output loses regulation. The power MOSFET will then remain off without any glitches since the under-voltage function prohibits restart when the line voltage is low.
Figure 12 illustrates a typical power-down timing waveform. Figure 13 illustrates a very slow power-down timing waveform as in standby applications. The external resistor (4 MΩ) is connected to the EN/UV pin in this case to prevent unwanted restarts.
No bias winding is needed to provide power to the chip because it draws the power directly from the DRAIN pin (see
Functional Description above). This has two main benefits. First, for a nominal application, this eliminates the cost of a bias winding and associated components. Secondly, for battery charger applications, the current-voltage characteristic often allows the output voltage to fall close to zero volts while still delivering power. TinySwitch-III accomplishes this without a forward bias winding and its many associated components. For applications that require very low no-load power consumption (50 mW), a resistor from a bias winding to the BYPASS/MULTI-FUNCTION pin can provide the power to the chip. The minimum recommended current supplied is 1 mA. The BYPASS/MULTI-FUNCTION pin in this case will be clamped at 6.4 V. This method will eliminate the power draw from the DRAIN pin, thereby reducing the no-load power consumption and improving full-load efficiency.
Current Limit OperationEach switching cycle is terminated when the DRAIN current reaches the current limit of the device. Current limit operation provides good line ripple rejection and relatively constant power delivery independent of input voltage.
BYPASS/MULTI-FUNCTION Pin CapacitorThe BYPASS/MULTI-FUNCTION pin can use a ceramic capacitor as small as 0.1 µF for decoupling the internal power supply of the device. A larger capacitor size can be used to adjust the current limit. For TNY275-280, a 1 µF BP/M pin capacitor will select a lower current limit equal to the standard current limit of the next smaller device and a 10 µF BP/M pin capacitor will select a higher current limit equal to the standard current limit of the next larger device. The higher current limit level of the TNY280 is set to 850 mA typical. The TNY274 MOSFET does not have the capability for increased current limit so this feature is not available in this device.
8 E2/06
TNY274-280
Applications ExampleThe circuit shown in Figure 14 is a low cost, high efficiency, flyback power supply designed for 12 V, 1 A output from universal input using the TNY278.
The supply features under-voltage lockout, primary sensed output overvoltage latching shutdown protection, high efficiency (>80%), and very low no-load consumption (<50 mW at 265 VAC). Output regulation is accomplished using a simple zener reference and optocoupler feedback.
The rectified and filtered input voltage is applied to the primary winding of T1. The other side of the transformer primary is driven by the integrated MOSFET in U1. Diode D5, C2, R1, R2, and VR1 comprise the clamp circuit, limiting the leakage inductance turn-off voltage spike on the DRAIN pin to a safe value. The use of a combination a Zener clamp and parallel RC optimizes both EMI and energy efficiency. Resistor R2 allows the use of a slow recovery, low cost, rectifier diode by limiting the reverse current through D5. The selection of a slow diode also improves efficiency and conducted EMI but should be a glass passivated type, with a specified recovery time of ≤2 µs.
The output voltage is regulated by the Zener diode VR3. When the output voltage exceeds the sum of the Zener and optocoupler
LED forward drop, current will flow in the optocoupler LED. This will cause the transistor of the optocoupler to sink current.When this current exceeds the ENABLE pin threshold current the next switching cycle is inhibited. When the output voltage falls below the feedback threshold, a conduction cycle is allowed to occur and, by adjusting the number of enabled cycles, output regulation is maintained. As the load reduces, the number of enabled cycles decreases, lowering the effective switching frequency and scaling switching losses with load. This provides almost constant efficiency down to very light loads, ideal for meeting energy efficiency requirements.
As the TinySwitch-III devices are completely self-powered, there is no requirement for an auxiliary or bias winding on the transformer. However by adding a bias winding, the output overvoltage protection feature can be configured, protecting the load against open feedback loop faults.
When an overvoltage condition occurs, such that bias voltage exceeds the sum of VR2 and the BYPASS/MULTIFUNCTION (BP/M) pin voltage (28 V+5.85 V), current begins to flow into the BP/M pin. When this current exceeds 5 mA the internal latching shutdown circuit in TinySwitch-III is activated. This condition is reset when the BP/M pin voltage drops below 2.6 V after removal of the AC input. In the example shown, on opening the loop, the OVP trips at an output of 17 V.
D
S
S BP/M
EN/UV
L11 mH
D11N4007
RV1275 VAC
F13.15 A
D21N4007
C16.8 µF400 V
C61 µF60 V
C222 µF400 V
C101000 µF
25 V
C52.2 nF
250 VAC
C11100 µF25 V
+12 V, 1 A
85-265VAC
RTN
J4
J3
J1
J2
C7100 nF50 V
U1TNY278P
C410 nF1 kV
VR1P6KE150A NC 8
6
4
T1
2
5
1
3
D51N4007GP D6
UF4003
D7BYV28-200
U2PC817A
VR21N5255B
28 VVR3
BZX79-C1111 V
C7 is configurable to adjustU1 current limit, see circuitdescription
*R5 and R8 are optional components
R5*3.6 MΩ
R347 Ω1/8 W
R42 kΩ1/8 W
R6390 Ω1/8 W
R720 Ω
R8*21 kΩ
1%
R11 kΩ
R2100 Ω
D31N4007
D41N4007
L2Ferrite Bead3.5 × 7.6 mm
PI-4244-021406
†
†TinySwitch-III
Figure 14. TNY278P, 12 V, 1 A Universal Input Power Supply.
9
TNY274-280
E2/06
For lower no-load input power consumption, the bias winding may also be used to supply the TinySwitch-III device. Resistor R8 feeds current into the BP/M pin, inhibiting the internal high voltage current source that normally maintains the BP/M pin capacitor voltage (C7) during the internal MOSFET off time. This reduces the no-load consumption of this design from 140 mW to 40 mW at 265 VAC.
Under-voltage lockout is configured by R5 connected between the DC bus and EN/UV pin of U1. When present, switching is inhibited until the current in the EN/UV pin exceeds 25 µA. This allows the startup voltage to be programmed within the normal operating input voltage range, preventing glitching of the output under abnormal low voltage conditions and also on removal of the AC input.
In addition to the simple input pi filter (C1, L1, C2) for differential mode EMI, this design makes use of E-Shield™ shielding techniques in the transformer to reduce common mode EMI displacement currents, and R2 and C4 as a damping network to reduce high frequency transformer ringing. These techniques, combined with the frequency jitter of TNY278, give excellent conducted and radiated EMI performance with this design achieving >12 dBµV of margin to EN55022 Class B conducted EMI limits.
For design flexibility the value of C7 can be selected to pick one of the 3 current limits options in U1. This allows the designer to select the current limit appropriate for the application.
• Standard current limit (ILIMIT) is selected with a 0.1 µF BP/M pin capacitor and is the normal choice for typical enclosed adapter applications.
• When a 1 µF BP/M pin capacitor is used, the current limit is reduced (ILIMITred or ILIMIT-1) offering reduced RMS device currents and therefore improved efficiency, but at the expense of maximum power capability. This is ideal for thermally challenging designs where dissipation must be minimized.
• When a 10 µF BP/M pin capacitor is used, the current limit is increased (ILIMITinc or ILIMIT+1), extending the power capability for applications requiring higher peak power or continuous power where the thermal conditions allow.
Further flexibility comes from the current limits between adjacent TinySwitch-III family members being compatible. The reduced current limit of a given device is equal to the standard current limit of the next smaller device and the increased current limit is equal to the standard current limit of the next larger device.
Key Application ConsiderationsTinySwitch-lll Design Considerations
Output Power TableThe data sheet output power table (Table 1) represents the minimum practical continuous output power level that can be obtained under the following assumed conditions:
1. The minimum DC input voltage is 100 V or higher for 85 VAC input, or 220 V or higher for 230 VAC input or 115 VAC with a voltage doubler. The value of the input capacitance should be sized to meet these criteria for AC input designs.
2. Efficiency of 75%.3. Minimum data sheet value of I2f.4. Transformer primary inductance tolerance of ±10%.5. Reflected output voltage (VOR) of 135 V.6. Voltage only output of 12 V with a fast PN rectifier diode.7. Continuous conduction mode operation with transient KP*
value of 0.25.8. Increased current limit is selected for peak and open frame
power columns and standard current limit for adapter columns.
9. The part is board mounted with SOURCE pins soldered to a sufficient area of copper and/or a heatsink is used to keep the SOURCE pin temperature at or below 110 °C.
10. Ambient temperature of 50 °C for open frame designs and 40 °C for sealed adapters.
*Below a value of 1, KP is the ratio of ripple to peak primary current. To prevent reduced power capability due to premature termination of switching cycles a transient KP limit of ≥0.25 is recommended. This prevents the initial current limit (IINIT) from being exceeded at MOSFET turn on.
For reference, Table 2 provides the minimum practical power delivered from each family member at the three selectable current limit values. This assumes open frame operation (not thermally limited) and otherwise the same conditions as listed above. These numbers are useful to identify the correct current limit to select for a given device and output power requirement.
Overvoltage ProtectionThe output overvoltage protection provided by TinySwitch-III uses an internal latch that is triggered by a threshold current of approximately 5.5 mA into the BP/M pin. In addition to an internal filter, the BP/M pin capacitor forms an external filter providing noise immunity from inadvertent triggering. For the bypass capacitor to be effective as a high frequency filter, the capacitor should be located as close as possible to the SOURCE and BP/M pins of the device.
10 E2/06
TNY274-280
For best performance of the OVP function, it is recommended that a relatively high bias winding voltage is used, in the range of 15 V-30 V. This minimizes the error voltage on the bias winding due to leakage inductance and also ensures adequate voltage during no-load operation from which to supply the BP/M pin for reduced no-load consumption.
Selecting the Zener diode voltage to be approximately 6 V above the bias winding voltage (28 V for 22 V bias winding) gives good OVP performance for most designs, but can be adjusted to compensate for variations in leakage inductance. Adding additional filtering can be achieved by inserting a low value (10 Ω to 47 Ω) resistor in series with the bias winding diode and/or the OVP Zener as shown by R7 and R3 in Figure 14. The resistor in series with the OVP Zener also limits the maximum current into the BP/M pin.
Reducing No-load ConsumptionAs TinySwitch-III is self-powered from the BP/M pin capacitor, there is no need for an auxillary or bias winding to be provided on the transformer for this purpose. Typical no-load consumption when self-powered is <150 mW at 265 VAC input. The addition of a bias winding can reduce this down to <50 mW by supplying the TinySwitch-III from the lower bias voltage and inhibiting the internal high voltage current source. To achieve this, select the value of the resistor (R8 in Figure 14) to provide the data sheet DRAIN supply current. In practice, due to the reduction of the bias voltage at low load, start with a value equal to 40% greater than the data sheet maximum current, and then increase the value of the resistor to give the lowest no-load consumption.
Audible NoiseThe cycle skipping mode of operation used in TinySwitch-III can generate audio frequency components in the transformer. To limit this audible noise generation the transformer should be designed such that the peak core flux density is below 3000 Gauss (300 mT). Following this guideline and using the standard transformer production technique of dip varnishing
practically eliminates audible noise. Vacuum impregnation of the transformer should not be used due to the high primary capacitance and increased losses that result. Higher flux densities are possible, however careful evaluation of the audible noise performance should be made using production transformer samples before approving the design.
Ceramic capacitors that use dielectrics such as Z5U, when used in clamp circuits, may also generate audio noise. If this is the case, try replacing them with a capacitor having a different dielectric or construction, for example a film type.
TinySwitch-lll Layout Considerations
LayoutSee Figure 15 for a recommended circuit board layout for TinySwitch-III.
Single Point GroundingUse a single point ground connection from the input filter capacitor to the area of copper connected to the SOURCE pins.
Bypass Capacitor (CBP)The BP/M pin capacitor should be located as near as possible to the BP/M and SOURCE pins.
Primary Loop AreaThe area of the primary loop that connects the input filter capacitor, transformer primary and TinySwitch-III together should be kept as small as possible.
Primary Clamp CircuitA clamp is used to limit peak voltage on the DRAIN pin at turn off. This can be achieved by using an RCD clamp or a Zener (~200 V) and diode clamp across the primary winding. In all cases, to minimize EMI, care should be taken to minimize the circuit path from the clamp components to the transformer and TinySwitch-III.
OUTPUT POWER TABLE
PRODUCT230 VAC ±15% 85-265 VAC
ILIMIT-1 ILIMIT ILIMIT+1 ILIMIT-1 ILIMIT ILIMIT+1
TNY274 P or G 9 10.9 9.1 7.1 8.5 7.1TNY275 P or G 10.8 12 15.1 8.4 9.3 11.8TNY276 P or G 11.8 15.3 19.4 9.2 11.9 15.1TNY277 P or G 15.1 19.6 23.7 11.8 15.3 18.5TNY278 P or G 19.4 24 28 15.1 18.6 21.8TNY279 P or G 23.7 28.4 32.2 18.5 22 25.2TNY280 P or G 28 32.7 36.6 21.8 25.4 28.5
Table 2. Minimum Practical Power at Three Selectable Current Limit Levels.
11
TNY274-280
E2/06
Thermal ConsiderationsThe four SOURCE pins are internally connected to the IC lead frame and provide the main path to remove heat from the device. Therefore all the SOURCE pins should be connected to a copper area underneath the TinySwitch-III to act not only as a single point ground, but also as a heatsink. As this area is connected to the quiet source node, this area should be maximized for good heatsinking. Similarly for axial output diodes, maximize the PCB area connected to the cathode.
Y-CapacitorThe placement of the Y-capacitor should be directly from the primary input filter capacitor positive terminal to the common/return terminal of the transformer secondary. Such a placement will route high magnitude common mode surge currents away from the TinySwitch-III device. Note – if an input π (C, L, C) EMI filter is used then the inductor in the filter should be placed between the negative terminals of the input filter capacitors.
OptocouplerPlace the optocoupler physically close to the TinySwitch-III to minimizing the primary-side trace lengths. Keep the high current, high voltage drain and clamp traces away from the optocoupler to prevent noise pick up.
Output DiodeFor best performance, the area of the loop connecting the secondary winding, the output diode and the output filter capacitor, should be minimized. In addition, sufficient copper area should be provided at the anode and cathode terminals of the diode for heatsinking. A larger area is preferred at the quiet cathode terminal. A large anode area can increase high frequency radiated EMI.
Figure 15. Recommended Circuit Board Layout for TinySwitch-III with Under-Voltage Lock Out Resistor.
+DCOUT
-
+
-
HV DCINPUT
Input FilterCapacitor
Output FilterCapacitor
PI-4278-013006
TOP VIEW
Maximize hatched copper areas ( ) for optimum heatsinking
DBP/MEN/UV
S S S S
Y1-Capacitor
Opto-coupler
CBP
TransformerTinySwitch-III
12 E2/06
TNY274-280
Quick Design Checklist
As with any power supply design, all TinySwitch-III designs should be verified on the bench to make sure that component specifications are not exceeded under worst case conditions. The following minimum set of tests is strongly recommended:
1. Maximum drain voltage – Verify that VDS does not exceed 650 V at highest input voltage and peak (overload) output power. The 50 V margin to the 700 V BVDSS specification gives margin for design variation.
2. Maximum drain current – At maximum ambient temperature, maximum input voltage and peak output (overload) power, verify drain current waveforms for any signs of transformer saturation and excessive leading edge current spikes at
startup. Repeat under steady state conditions and verify that the leading edge current spike event is below ILIMIT(Min) at the end of the tLEB(Min). Under all conditions, the maximum drain current should be below the specified absolute maximum ratings.
3. Thermal Check – At specified maximum output power, minimum input voltage and maximum ambient temperature, verify that the temperature specifications are not exceeded for TinySwitch-III, transformer, output diode, and output capacitors. Enough thermal margin should be allowed for part-to-part variation of the RDS(ON) of TinySwitch-III as specified in the data sheet. Under low line, maximum power, a maximum TinySwitch-III SOURCE pin temperature of 110 °C is recommended to allow for these variations.
13
TNY274-280
E2/06
Parameter SymbolConditions
SOURCE = 0 V; TJ = -40 to 125 °C See Figure 16
(Unless Otherwise Specified)
Min Typ Max Units
CONTROL FUNCTIONSOutput Frequency in Standard Mode fOSC
TJ = 25 °C See Figure 4
Average 124 132 140kHz
Peak-Peak Jitter 8
Maximum Duty Cycle DCMAX S1 Open 62 65 %
EN/UV Pin Upper Turnoff Threshold Current
IDIS -150 -115 -90 µA
EN/UV Pin Voltage VEN
IEN/UV = 25 µA 1.8 2.2 2.6V
IEN/UV = -25 µA 0.8 1.2 1.6
DRAIN Supply Current
IS1EN/UV Current > IDIS (MOSFET Not
Switching) See Note A 290 µA
IS2
EN/UV Open (MOSFET
Switching at fOSC) See Note B
TNY274 275 360
µA
TNY275 295 400TNY276 310 430TNY277 365 460TNY278 445 540TNY279 510 640TNY280 630 760
ABSOLUTE MAXIMUM RATINGS(1,5)
DRAIN Voltage .................................. ..............-0.3 V to 700 V DRAIN Peak Current: TNY274.......................400 (750) mA(2) TNY275.....................560 (1050) mA(2) TNY276.....................720 (1350) mA(2) TNY277.....................880 (1650) mA(2) TNY278...................1040 (1950) mA(2)
TNY279 ................. 1200 (2250) mA(2)
TNY280 ................. 1360 (2550) mA(2) EN/UV Voltage ................................................... -0.3 V to 9 V EN/UV Current ........................................................... 100 mA BP/M Voltage .................................................. ....-0.3 V to 9 V Storage Temperature ......................................-65 °C to 150 °C Operating Junction Temperature(3) .................-40 °C to 150 °C
Lead Temperature(4) ....................................................... 260 °C Notes: 1. All voltages referenced to SOURCE, TA = 25 °C. 2. The higher peak DRAIN current is allowed while the DRAIN voltage is simultaneously less than 400 V. 3. Normally limited by internal circuitry. 4. 1/16 in. from case for 5 seconds. 5. Maximum ratings specified may be applied one at a time, without causing permanent damage to the product. Exposure to Absolute Maximum Rating conditions for extended periods of time may affect product reliability.
THERMAL IMPEDANCE
Thermal Impedance: P or G Package: (θJA) ........................... 70 °C/W(2); 60 °C/W(3)
(θJC)(1) ............................................... 11 °C/W
Notes: 1. Measured on the SOURCE pin close to plastic interface. 2. Soldered to 0.36 sq. in. (232 mm2), 2 oz. (610 g/m2) copper clad. 3. Soldered to 1 sq. in. (645 mm2), 2 oz. (610 g/m2) copper clad.
14 E2/06
TNY274-280
Parameter SymbolConditions
SOURCE = 0 V; TJ = -40 to 125 °C See Figure 16
(Unless Otherwise Specified)
Min Typ Max Units
CONTROL FUNCTIONS (cont.)
BP/M Pin Charge Current
ICH1
VBP/M = 0 V, TJ = 25 °C
See Note C, D
TNY274 -6 -3.8 -1.8
mA
TNY275-279 -8.3 -5.4 -2.5
TNY280 -9.7 -6.8 -3.9
ICH2
VBP/M = 4 V, TJ = 25 °C
See Note C, D
TNY274 -4.1 -2.3 -1
TNY275-279 -5 -3.5 -1.5
TNY280 -6.6 -4.6 -2.1
BP/M Pin Voltage VBP/M See Note C 5.6 5.85 6.15 V
BP/M Pin Voltage Hysteresis VBP/MH 0.80 0.95 1.20 V
BP/M Pin Shunt Voltage VSHUNT IBP = 2 mA 6.0 6.4 6.7 V
EN/UV Pin Line Under-Voltage Threshold
ILUV TJ = 25 °C 22.5 25 27.5 µA
CIRCUIT PROTECTION
Standard Current Limit (BP/M Capacitor = 0.1 µF) See Note D
ILIMIT
TNY274 TJ = 25 °C
di/dt = 50 mA/µs See Note E 233 250 267
mA
TNY275 TJ = 25 °C
di/dt = 55 mA/µs See Note E 256 275 294
TNY276 TJ = 25 °C
di/dt = 70 mA/µs See Note E 326 350 374
TNY277 TJ = 25 °C
di/dt = 90 mA/µs See Note E 419 450 481
TNY278 TJ = 25 °C
di/dt = 110 mA/µs See Note E 512 550 588
TNY279 TJ = 25 °C
di/dt = 130 mA/µs See Note E 605 650 695
TNY280 TJ = 25 °C
di/dt = 150 mA/µs See Note E 698 750 802
Reduced Current Limit (BP/M Capacitor = 1 µF)
ILIMITred
TNY274 TJ = 25 °C
di/dt = 50 mA/µs See Note E 196 210 233
mATNY275
TJ = 25 °Cdi/dt = 55 mA/µs
See Note E 233 250 277
15
TNY274-280
E2/06
Parameter SymbolConditions
SOURCE = 0 V; TJ = -40 to 125 °C See Figure 16
(Unless Otherwise Specified)
Min Typ Max Units
CIRCUIT PROTECTION (cont.)
Reduced Current Limit (BP/M Capacitor = 1 µF) See Note D
ILIMITred
TNY276 TJ = 25 °C
di/dt = 70 mA/µs See Note E 256 275 305
mA
TNY277 TJ = 25 °C
di/dt = 90 mA/µs See Note E 326 350 388
TNY278 TJ = 25 °C
di/dt = 110 mA/µs See Note E 419 450 499
TNY279 TJ = 25 °C
di/dt = 130 mA/µs See Note E 512 550 610
TNY280 TJ = 25 °C
di/dt = 150 mA/µs See Note E 605 650 721
Increased Current Limit (BP/M Capacitor = 10 µF) See Note D
ILIMITinc
TNY274 TJ = 25 °C
di/dt = 50 mA/µs See Note E, F 196 210 233
mA
TNY275 TJ = 25 °C
di/dt = 55 mA/µs See Note E 326 350 388
TNY276 TJ = 25 °C
di/dt = 70 mA/µs See Note E 419 450 499
TNY277 TJ = 25 °C
di/dt = 90 mA/µs See Note E 512 550 610
TNY278 TJ = 25 °C
di/dt = 110 mA/µs See Note E 605 650 721
TNY279 TJ = 25 °C
di/dt = 130 mA/µs See Note E 698 750 833
TNY280 TJ = 25 °C
di/dt = 150 mA/µs See Note E 791 850 943
Power Coefficient I2f I2f = ILIMIT(TYP)2 ×
fOSC(TYP)
Standard Current Limit
0.9 × I2f I2f 1.12 ×
I2fA2HzReduced or
Increased Current Limit
0.9 × I2f I2f 1.16 ×
I2f
Initial Current Limit IINITSee Figure 19
TJ = 25 °C, See Note G0.75 × ILIMIT(MIN)
mA
Leading Edge Blanking Time tLEB
TJ = 25 °C See Note G 170 215 ns
Current Limit Delay tILD
TJ = 25 °C See Note G, H 150 ns
Thermal Shutdown Temperature TSD 135 142 150 °C
16 E2/06
TNY274-280
Parameter SymbolConditions
SOURCE = 0 V; TJ = -40 to 125 °C See Figure 16
(Unless Otherwise Specified)
Min Typ Max Units
CIRCUIT PROTECTION (cont.)Thermal Shut-down Hysteresis TSDH 75 °C
BP/M Pin Shut-down Threshold Current
ISD 4 5.5 7.5 mA
BP/M Pin Power-Up Reset Thresh-old Voltage
VBP/M(RESET) 1.6 2.6 3.6 V
OUTPUT
ON-State Resistance RDS(ON)
TNY274 ID = 25 mA
TJ = 25 °C 28 32
Ω
TJ = 100 °C 42 48
TNY275 ID = 28 mA
TJ = 25 °C 19 22
TJ = 100 °C 29 33
TNY276 ID = 35 mA
TJ = 25 °C 14 16
TJ = 100 °C 21 24
TNY277 ID = 45 mA
TJ = 25 °C 7.8 9.0
TJ = 100 °C 11.7 13.5
TNY278 ID = 55 mA
TJ = 25 °C 5.2 6.0
TJ = 100 °C 7.8 9.0
TNY279 ID = 65 mA
TJ = 25 °C 3.9 4.5
TJ = 100 °C 5.8 6.7
TNY280 ID = 75 mA
TJ = 25 °C 2.6 3.0
TJ = 100 °C 3.9 4.5
OFF-State Drain Leakage Current
IDSS1
VBP/M = 6.2 V VEN/UV = 0 V VDS = 560 V TJ = 125 °C See Note I
TNY274-276 50
µA
TNY277-278 100
TNY279-280 200
IDSS2VBP/M = 6.2 V VEN/UV = 0 V
VDS = 375 V, TJ = 50 °C
See Note G, I15
Breakdown Voltage BVDSS
VBP = 6.2 V, VEN/UV = 0 V, See Note J, TJ = 25 °C 700 V
DRAIN Supply Voltage 50 V
17
TNY274-280
E2/06
NOTES:A. IS1 is an accurate estimate of device controller current consumption at no-load, since operating frequency is so
low under these conditions. Total device consumption at no-load is the sum of IS1 and IDSS2.
B Since the output MOSFET is switching, it is difficult to isolate the switching current from the supply current at the DRAIN. An alternative is to measure the BP/M pin current at 6.1 V.
C. BP/M pin is not intended for sourcing supply current to external circuitry.
D. To ensure correct current limit it is recommended that nominal 0.1 µF / 1 µF / 10 µF capacitors are used. In addition, the BP/M capacitor value tolerance should be equal or better than indicated below across the ambient temperature range of the target application. The minimum and maximum capacitor values are guaranteed by characterization.
E. For current limit at other di/dt values, refer to Figure 23.
F. TNY274 does not set an increased current limit value, but with a 10 µF BP/M pin capacitor the current limit is the same as with a 1 µF BP/M pin capacitor (reduced current limit value).
G. This parameter is derived from characterization.
H. This parameter is derived from the change in current limit measured at 1X and 4X of the di/dt shown in the ILIMIT specification.
I. IDSS1 is the worst case OFF state leakage specification at 80% of BVDSS and maximum operating junction temperature. IDSS2 is a typical specification under worst case application conditions (rectified 265 VAC) for no-load consumption calculations.
J. Breakdown voltage may be checked against minimum BVDSS specification by ramping the DRAIN pin voltage up to but not exceeding minimum BVDSS.
K. Auto-restart on time has the same temperature characteristics as the oscillator (inversely proportional to frequency).
Parameter SymbolConditions
SOURCE = 0 V; TJ = -40 to 125 °C See Figure 16
(Unless Otherwise Specified)
Min Typ Max Units
OUTPUT (cont.)
Auto-Restart ON-Time at fOSC
tARTJ = 25 °C
See Note K 64 ms
Auto-Restart Duty Cycle DCAR TJ = 25 °C 3 %
Nominal BP/M Pin Cap Value
Tolerance Relative to Nominal Capacitor Value
Min MAX0.1 µF -60% +100%1 µF -50% +100%
10 µF -50% NA
18 E2/06
TNY274-280
Figure 17. Duty Cycle Measurement. Figure 18. Output Enable Timing.
Figure 16. General Test Circuit.
PI-4079-080905
0.1 µF
10 V50 V
470 Ω5 W S2
470 Ω
NOTE: This test circuit is not applicable for current limit or output characteristic measurements.
S D
EN/UVS
S BP/M
S
150 V
S12 MΩ
PI-2364-012699
EN/UV
tP
tEN/UV
DCMAX
tP =
1
fOSC
VDRAIN
(internal signal)
0.8
PI-
4279
-013
006
Figure 19. Current Limit Envelope.
19
TNY274-280
E2/06
Typical Performance Characteristics
Figure 20. Breakdown vs. Temperature.
1.1
1.0
0.9-50 -25 0 25 50 75 100 125 150
Junction Temperature (°C)
Bre
akd
ow
n V
olt
age
(No
rmal
ized
to
25
°C) PI-
2213
-012
301
DRAIN Voltage (V)
Dra
in C
urr
ent
(mA
)
300
250
200
100
50
150
00 2 4 6 8 10
TCASE=25 °CTCASE=100 °C
PI-
4082
-082
305
TNY274 1.0TNY275 1.5TNY276 2.0TNY277 3.5TNY278 5.5TNY279 7.3TNY280 11
Scaling Factors:
Figure 21. Frequency vs. Temperature.
Figure 22. Standard Current Limit vs. Temperature.
Figure 23. Current Limit vs. di/dt.
Figure 24. Output Characteristic.
Figure 25. COSS vs. Drain Voltage.
1.4
1.2
1.0
0.8
0.6
0.4
0.2
01 2 3 4
Normalized di/dt
PI-
4081
-082
305
No
rmal
ized
Cu
rren
t L
imit
TNY274 50 mA/µs TNY275 55 mA/µs TNY276 70 mA/µs TNY277 90 mA/µs TNY278 110 mA/µs TNY279 130 mA/µs TNY280 150 mA/µs
Normalizeddi/dt = 1
Note: For the normalized current limit value, use thetypical current limitspecified for theappropriate BP/Mcapacitor.
Drain Voltage (V)
Dra
in C
apac
itan
ce (
pF
)
PI-
4083
-082
305
0 100 200 300 400 500 600
1
10
100
1000
TNY274 1.0TNY275 1.5TNY276 2.0TNY277 3.5TNY278 5.5TNY279 7.3TNY280 11
Scaling Factors:
1
0.8
0.6
0.4
0.2
0-50 0 50 100 150
Temperature (°C)
PI-
4102
-010
9061.2
Sta
nd
ard
Cu
rren
t L
imit
(No
rmal
ized
to
25
°C)
1.2
1.0
0.8
0.6
0.4
0.2
0-50 -25 0 25 50 75 100 125
Junction Temperature (°C)
PI-
4280
-012
306
Ou
tpu
t F
req
uen
cy(N
orm
aliz
ed t
o 2
5 °C
)
20 E2/06
TNY274-280
Typical Performance Characteristics (cont.) 50
30
40
10
20
00 200 400 600
DRAIN Voltage (V)
Po
wer
(m
W)
PI-
4084
-082
305
TNY274 1.0TNY275 1.5TNY276 2.0TNY277 3.5TNY278 5.5TNY279 7.3TNY280 11
Scaling Factors:1.2
1.0
0.8
0.6
0.4
0.2
0-50 -25 0 25 50 75 100 125
Junction Temperature (°C)
PI-
4281
-012
306
Un
der
-Vo
ltag
e T
hre
sho
ld(N
orm
aliz
ed t
o 2
5 °C
)
Figure 27. Under-Voltage Threshold vs. Temperature.
Figure 26. Drain Capacitance Power.
21
TNY274-280
E2/06
Notes:1. Package dimensions conform to JEDEC specification MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP) package with .300 inch row spacing.2. Controlling dimensions are inches. Millimeter sizes are shown in parentheses.3. Dimensions shown do not include mold flash or other protrusions. Mold flash or protrusions shall not exceed .006 (.15) on any side.4. Pin locations start with Pin 1, and continue counter-clock- wise to Pin 8 when viewed from the top. The notch and/or dimple are aids in locating Pin 1. Pin 3 is omitted.5. Minimum metal to metal spacing at the package body for the omitted lead location is .137 inch (3.48 mm).6. Lead width measured at package body. 7. Lead spacing measured with the leads constrained to be perpendicular to plane T.
.008 (.20)
.015 (.38)
.300 (7.62) BSC(NOTE 7)
.300 (7.62)
.390 (9.91)
.367 (9.32)
.387 (9.83)
.240 (6.10)
.260 (6.60)
.125 (3.18)
.145 (3.68)
.057 (1.45)
.068 (1.73)
.120 (3.05)
.140 (3.56)
.015 (.38)MINIMUM
.048 (1.22)
.053 (1.35).100 (2.54) BSC
.014 (.36)
.022 (.56)
-E-
Pin 1
SEATINGPLANE
-D-
-T-
P08C
DIP-8C
PI-3933-100504
D S .004 (.10)⊕
T E D S .010 (.25) M⊕
(NOTE 6)
.137 (3.48)MINIMUM
PART ORDERING INFORMATIONTinySwitch Product FamilySeries NumberPackage Identifier
G Plastic Surface Mount SMD-8CP Plastic DIP-8C
Lead FinishN Pure Matte Tin (Pb-Free)
Tape & Reel and Other OptionsBlank Standard Configurations
TL Tape & Reel, 1000 pcs min./mult., G Package onlyTNY 278 G N - TL
22 E2/06
TNY274-280
SMD-8C
PI-4015-013106
.004 (.10)
.012 (.30).036 (0.91).044 (1.12)
.004 (.10)
0 - ° 8°
.367 (9.32)
.387 (9.83)
.048 (1.22).009 (.23)
.053 (1.35).032 (.81).037 (.94)
.125 (3.18)
.145 (3.68)
-D-
Notes:1. Controlling dimensions are inches. Millimeter sizes are shown in parentheses.2. Dimensions shown do not include mold flash or other protrusions. Mold flash or protrusions shall not exceed .006 (.15) on any side.3. Pin locations start with Pin 1, and continue counter-clock- wise to Pin 8 when viewed from the top. Pin 3 is omitted.4. Minimum metal to metal spacing at the package body for the omitted lead location is .137 inch (3.48 mm).5. Lead width measured at package body. 6. D and E are referenced datums on the package body.
.057 (1.45)
.068 (1.73)(NOTE 5)
E S
.100 (2.54) (BSC)
.372 (9.45).240 (6.10)
.388 (9.86).260 (6.60)
.010 (.25)
-E-
Pin 1
D S .004 (.10)⊕
⊕
G08C
.420
.046 .060 .060 .046
.080
Pin 1
.086
.186
.286
Solder Pad Dimensions.137 (3.48) MINIMUM
23
TNY274-280
E2/06
24 E2/06
TNY274-280
Revision Notes DateD Release final data sheet. 1/06
E Corrected figure numbers and references. 2/06
For the latest updates, visit our website: www.powerint.comPower Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability. Power Integrations does not assume any liability arising from the use of any device or circuit described herein. POWER INTEGRATIONS MAKES NO WARRANTY HEREIN AND SPECIFICALLY DISCLAIMS ALL WARRANTIES INCLUDING, WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS.
PATENT INFORMATION
The products and applications illustrated herein (including transformer construction and circuits external to the products) may be covered by one or more U.S. and foreign patents, or potentially by pending U.S. and foreign patent applications assigned to Power Integrations. A complete list of Power Integrations patents may be found at www.powerint.com. Power Integrations grants its customers a license under certain patent rights as set forth at http://www.powerint.com/ip.htm.
LIFE SUPPORT POLICY
POWER INTEGRATIONS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF POWER INTEGRATIONS. As used herein:
1. A Life support device or system is one which, (i) is intended for surgical implant into the body, or (ii) supports or sustains life, and (iii) whose failure to perform, when properly used in accordance with instructions for use, can be reasonably expected to result in significant injury or death to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
The PI logo, TOPSwitch, TinySwitch, LinkSwitch, DPA-Switch, EcoSmart, Clampless, E-Shield, Filterfuse, PI Expert and PI FACTS are trademarks of Power Integrations, Inc. Other trademarks are property of their respective companies. ©Copyright 2006, Power Integrations, Inc.
Power Integrations Worldwide Sales Support LocationsWORLD HEADQUARTERS5245 Hellyer AvenueSan Jose, CA 95138, USA.Main: +1-408-414-9200Customer Service: Phone: +1-408-414-9665Fax: +1-408-414-9765e-mail: usasales@powerint.com
CHINA (SHANGHAI)Rm 807-808A Pacheer Commercial Centre,555 Nanjing Rd. West Shanghai, P.R.C. 200041Phone: +86-21-6215-5548Fax: +86-21-6215-2468e-mail: chinasales@powerint.com
CHINA (SHENZHEN)Rm 2206-2207, Block A,Electronics Science & Technology Bldg.2070 Shennan Zhong Rd. Shenzhen, Guangdong,China, 518031Phone: +86-755-8379-3243Fax: +86-755-8379-5828e-mail: chinasales@powerint.com
GERMANY Rueckertstrasse 3D-80336, Munich GermanyPhone: +49-89-5527-3910Fax: +49-89-5527-3920e-mail: eurosales@powerint.com
INDIA261/A, Ground Floor7th Main, 17th Cross,SadashivanagarBangalore, India 560080 Phone: +91-80-5113-8020Fax: +91-80-5113-8023e-mail: indiasales@powerint.com
ITALYVia Vittorio Veneto 12 20091 Bresso MIItalyPhone: +39-028-928-6000Fax: +39-028-928-6009e-mail: eurosales@powerint.com
JAPANKeihin Tatemono 1st Bldg 2-12-20 Shin-Yokohama, Kohoku-ku, Yokohama-shi, Kanagawa ken, Japan 222-0033Phone: +81-45-471-1021Fax: +81-45-471-3717e-mail: japansales@powerint.com
KOREARM 602, 6FLKorea City Air Terminal B/D, 159-6Samsung-Dong, Kangnam-Gu,Seoul, 135-728, KoreaPhone: +82-2-2016-6610Fax: +82-2-2016-6630e-mail: koreasales@powerint.com
SINGAPORE 51 Newton Road#15-08/10 Goldhill PlazaSingapore, 308900Phone: +65-6358-2160Fax: +65-6358-2015e-mail: singaporesales@powerint.com
TAIWAN5F, No. 318, Nei Hu Rd., Sec. 1 Nei Hu Dist.Taipei, Taiwan 114, R.O.C.Phone: +886-2-2659-4570Fax: +886-2-2659-4550e-mail: taiwansales@powerint.com
EUROPE HQ1st Floor, St. Jamesʼs HouseEast Street, FarnhamSurrey GU9 7TJUnited KingdomPhone: +44 (0) 1252-730-140Fax: +44 (0) 1252-727-689 e-mail: eurosales@powerint.com
APPLICATIONS HOTLINE World Wide +1-408-414-9660
APPLICATIONS FAX World Wide +1-408-414-9760
製品名:
Product name:
Parts name:
Parts number:
APPROVED BY (CHOP MARK AND SIGNATURE)
Please approve after understanding clause 4.-(11) on sheet 14.It is considered that it was approved when there is an order before returning this specifications.
内容説明Contents explanation
仕様内容は改善の為変更になる可能性が有ります。
仕様を満足する範囲内において、改善の為部品の一部を変更する場合が有ります。
Yasuda Bldg.No.4, 2-26-2, Tsuruyacho, Kanagawa-ku, Yokohama 221-0835, JAPAN
DSF-P0027 Ver. 0.1
'07.02.14
Arima Devices Japan Inc.Design & Development Division
Specifications 仕 様 書
仕様書番号Specifications number
作成日Creation day
RoHS
There is a possibility for change of parts within a range of specification for the improvement.
Gold-plated connector is used.
OPA-681PH-NH
OPA-681PH-NH-2
There is a possibility for change of specification for the improvement.
SUPPLIERGeneralManager
R&D QA
KachiHaneda Terajima
Arima Devices Japan Inc.
DWN. CHKD. APPD.Haneda Kachi Terajima'07.02.14 '07.02.14 '07.02.14
1.0 制定 Haneda Kachi Terajima
1-1. 適用範囲 Scope and field of Application
1-2. 評価条件 Test Conditions
2-1. 性能 Characteristics
2-2. 信頼性 Reliability
2-3. 信頼性試験条件 Reliability test conditions
2-4. 機械的仕様 Mechanical specifications
2-5. 主要部品安全規格 Safety Standerd of Main Parts
3-1. 外形図 Dimensions
3-2. 結線図 Schematic diagram
3-3. APC回路図 APC circuit diagram
3-4. 光路図 Optical path diagram
4. 取り扱い上の注意 Precautions for handling
製品名: Product name: Sheet
仕様書 Specifications
REVD CHKDVer. Description of Revision Date
改 訂 履 歴 Record of Revision
APPD
仕様書番号: Specifications number:
目 次 CONTENTS
0OPA-681PH-NH DSF-P0027
Arima Devices Japan Inc.
1-1. 適用範囲 Scope and field of Application本仕様書はDVD用光 ピックアップに適用する。This specification apply to the optical pickup for DVD.
1-2. 評価条件 Test Conditions(1) 標準評価条件 Standard test environment
温度 Temperature 23±3湿度 Humidity 60±5%RH
ただし、判定に疑義が生じない場合には下記条件で測定してもかまわない。In case that doubt does not happen to determination measurement does not matter eventhe following condition.
温度 Temperature 25±10湿度 Humidity 65±25%RH
(2) 評価姿勢 Test posture対物レンズ光軸は重力方向とする。The object lens axis makes gravity direction.
(3) 試験用装置、回路 Mechanical installation, circuit判定に疑義を生じない水準であること。It shall not ensure suspicion from the evaluation of the test results.
(4) 評価用ディスク Test discCD: A-BEX TCD-782を使用する。 For test, use A-BEX TCD-782.DVD: A-BEX TDV-520Cを使用する。 For test, use A-BEX TDV-520C
(5) 標準試験条件 Standard test conditions特に指定しない限り、以下の条件で行う。Except specified, test under the following conditions.[a] 機械的条件 Mechanical condition
傾角 Skew ラジアル方向0度、タンジェンシャル方向0度。 Radial skew 0 deg, Tangential skew 0 deg.取付高さ Height ガイドシャフト中心とディスクの下面までの距離が9.5mm The distance to a guide shaft center and the undersurface of a disc is 9.5mm.
[b] 回路条件 Electric offsetVcc電圧 Vcc Voltage
5.0VVc電圧 Vc Voltage
2.5Vフォーカスオフセット電圧 Focusing offset
ベストフォーカスに調整する。Adjusted to the best focusing point.
ラジアルオフセット電圧 Radial offsetD.C. 0V
APC回路 APC circuit3-3項 APC回路図によるSee section 3-3. Fig..3 APC circuit diagram
(6) 評価回転速度 Evaluation Disc speed標準速(1倍速)で測定する。 Nomal speed
製品名: Product name: Sheet
1OPA-681PH-NH DSF-P0027仕様書番号: Specifications number:
Arima Devices Japan Inc.
2-1. 性能 Characteristics
2-1-(1) 基本仕様 Basic specifications 種類 Type 光ピックアップ Optical pickup
用途 Application DVD , CD-DA(Compact Disc Digital Audio) , VCD(Video CD)
方式 Method DVD 光源 半導体レーザー Laser diodeDVD Light source 波長 Wavelength: 650Min.~655Typ.~660Max. nm
型番 Type: ADL-65075GRメーカー: 華上光電公司Manufacturer: Arima Optoelectronics Corporation
CD 光源 半導体レーザー Laser diodeCD Light source 波長 Wavelength: 770Min.~790Typ.~805Max. nm
型番 Type: ADL-78031FRメーカー: 華上光電公司Manufacturer: Arima Optoelectronics Corporation
光検出器 6分割PDIC 6 Divided PDICPhoto detector 型番 Type: PH9119A4NF1
メーカー: NEC化合物デバイス株式会社Manufacturer: NEC corporation
アクチュエータ Actuator 4本ワイヤータイプ 4-wire type
フォーカスエラー Focus error 非点収差方式 Astigmatic method
トラッキングエラー Tracking error DVD: 位相差検出法 DPD method
CD: 3ビーム方式 3-beam method
光学系 Optical 対物レンズ Objective lens DVD: f=3.05mm NA=0.60 WD=1.67mm
CD: f=3.07mm NA=0.47 WD=1.30mm
対物レンズ出射光量 DVD : 0.6 mW max 連続 ContinuousEmitting light output at objective lens CD : 0.5 mW max 連続 Continuous
動作温度 10~80 %RH -10~60 Operating environment 保存温度 -30~70 Non-operating 但し急激な温度変化を与えて結露を生じさせないこと。
environment Avoid dew caused by rapid thermal change.
寸法 Dimensions 3-1項による 外形 Appearance See section 3-1 Fig.1 重量 Weight 15g(Nom.)
使用姿勢 Use attitude トラッキング方向が重力方向となす角度は45°以上を推奨。The angle that tracking direction does with gravity directionrecommends 45 or more degree.
製品名: Product name: Sheet仕様書番号: Specifications number:
2DSF-P0027OPA-681PH-NH
Arima Devices Japan Inc.
2-1-(2) 電気性能 Electrical performance条 件 Condition
レーザーダイオード (DVD)Laser diode 最大定格 Tc=25 Maximum ratings 光出力 Po CW 10 mW ADL-65075GR Light output power
逆電圧 Vrl,Vrd - 2 V Laser diode Reverse voltage 30 V Monitor pin photo diode
電気特性 Tc=25 Electrical characteristics 動作電流 Iop Po=7mW 35 mA max 25 mA typ ADL-65075GR Operating current
動作電圧 Vop Po=7mW 2.5 V max 2.2 V typ ADL-65075GR Operating voltage
レーザーダイオード (CD)Laser diode 最大定格 Tc=25 Maximum ratings 光出力 Po CW 5 mW Light output power
逆電圧 Vrl,Vrd - 2 V Laser diode Reverse voltage 30 V Monitor pin photo diode
電気特性 Tc=25 Electrical characteristics 動作電流 Iop Po=3mW 55 mA max 45 mA typ ADL-78031FR Operating current
動作電圧 Vop Po=3mW 2.3 V max 1.8 V typ ADL-78031FR Operating voltage
アクチュエータActuator
フォーカスコイル駆動電流 連続 150 mA rms max 但しトラッキングは0mA Focusing coil current Continuous 0mA for tracking
トラッキングコイル駆動電流 連続 150 mA rms max 但しフォーカスは0mA Tracking coil current Continuous 0mA for focusing
製品名: Product name: Sheet
仕 様 Specifications
3DSF-P0027
項 目 Items
仕様書番号: Specifications number:
OPA-681PH-NH
Arima Devices Japan Inc.
条 件 Conditionフォトディテクター (PDIC)Photo detector 最大定格 Tc=25 Maximum ratings 電源電圧 Vcc - 6 V Power supply voltage
許容損失 PD 240 mW Allowable dissipation
推奨電源電圧範囲 Vcc :+4.5 ~+5.5 V Recommended power Vc :+1.5 ~Vcc-2.0 V
supply voltage range
電気特性 Tc=25 Electrical characteristics Vcc=5.0V, Vc=2.5V
RL=3kΩ, CL=10pF(NEC)
最大出力電圧 VoM Pi=10μW A~D :195 mV min 260 mV typ 325 mV max Maximum output voltage λ=780nm E~F :350 mV min 470 mV typ 590 mV max
RF :330 mV min 440 mV typ 550 mV max
Pi=10μW A~D :205 mV min 275 mV typ 345 mV maxλ=650nm E~F :370 mV min 495 mV typ 620 mV max
RF :345 mV min 460 mV typ 575 mV max
遮断周波数 fc from 100kHz, -3dB A~D :65 MHz min 100 MHz typ - max Cut off frequency λ=650nm, 780nm E~F :0.5 MHz min 2 MHz typ - max
RF :60 MHz min 90 MHz typ - max
製品名: Product name: Sheet
仕 様 Specifications
OPA-681PH-NH DSF-P0027 4仕様書番号: Specifications number:
項 目 Items
Arima Devices Japan Inc.
2-1-(3) アクチュエータ規格 Actuator characteristics
フォーカス Focusing 対物レンズ可動量 フォーカス基準位置より ±0.7 mm以上 or more Movable distance From focus center position
コイル直流抵抗 D.C. 5.5~7.5 ohm B±30% Coil resistance at 25
位相遅れ量 at 1~5 KHz max 25 deg C±10deg Phase delay 共振周波数 振幅ピーク値の周波数 50~60 Hz +5Hz Resonance freq. (fo) Frequency of amplitude peak -8Hz 共振ピーク量 共振周波数での振幅値 max 14 dB C±5dB Resonance peak value (Q) Amplitude value in
resonance frequencyQ = Gain(fo) - Gain(5Hz)
高次共振周波数 振幅ピーク値の周波数 18 KHz以上 or more A 18 KHz以上 Higher-order Frequency of amplitude peak or more
resonance frequency ピーク交点周波数 共振ピークと中域ゲインの交点 10 KHz以上 or more A 10 KHz以上 Peak intersection The intersection of a higher-order or more
frequency resonance peak and a middle range gain
5Hz感度 0.81~1.09 mm/V B±30% Sensitivity(5Hz) 200Hz感度 44~60 μm/V B±30% Sensitivity(200Hz)
*Measurements in terminal of ACT PCB*The above-mentioned data is without FPC and FFC
製品名: Product name: Sheet
Items Condition
信頼性規格
Specifications
5
項 目 条 件 仕 様Reliability
spec.
仕様書番号: Specifications number:
OPA-681PH-NH DSF-P0027
C
Arima Devices Japan Inc.
トラッキング Tracking 対物レンズ可動量 自由中立点からの可動量 ±0.4 mm以上 or more Movable distance From free position
コイル直流抵抗 D.C. 4.0~5.4 ohm B±30% Coil resistance at 25
位相遅れ量 at 1~5 KHz max 15 deg C±10deg Phase delay 共振周波数 振幅ピーク値の周波数 50~60 Hz +5Hz Resonance freq. (fo) Frequency of amplitude peak -8Hz 共振ピーク量 共振周波数での振幅値 max 14 dB C±5dB Resonance peak value (Q) Amplitude value in
resonance frequencyQ = Gain(fo) - Gain(5Hz)
高次共振周波数 振幅ピーク値の周波数 18 KHz以上 or more A 18 KHz以上 Higher-order Frequency of amplitude peak or more
resonance frequency ピーク交点周波数 共振ピークと中域ゲインの交点 10 KHz以上 or more A 10 KHz以上 Peak intersection The intersection of a higher-order or more
frequency resonance peak and a middle range gain
5Hz感度 0.57~0.93 mm/V B±30% Sensitivity(5Hz) 200Hz感度 34~46 μm/V B±30% Sensitivity(200Hz)
チルト精度 Tilt accuracy タンジェンシャル方向 Focus: ±0.5 ±0.3 deg A±0.3deg Tangential direction DVDフォーカス基準位置より
From focus center position for DVD ラジアル方向 Tracking: ±0.3 ±0.3 deg A±0.3deg Radial direction 自由中立点より
From free position
*Measurements in terminal of ACT PCB*The above-mentioned data is without FPC and FFC
対物レンズの動作 Direction of objective lens movement
フォーカス方向 Focusing directionコネクタのFo+ピンにプラス電圧が印可された場合、対物レンズはディスクに近づく方向に動く。When positive voltage applied to Fo+ pin, the objective lens moves toward the disc.
トラッキング方向 Tracking directionコネクタのTR+ピンにプラス電圧が印可された場合、対物レンズはディスクの内周方向に動く。When positive voltage applied toTR+ pin, the objective lens moves toward the inner of disc.
製品名: Product name: Sheet
Condition
DSF-P0027
Items
項 目 条 件
6仕様書番号: Specifications number:
spec.Specifications
信頼性規格仕 様
Reliability
OPA-681PH-NH
CC
Arima Devices Japan Inc.
2-1-(4) 信号再生規格 Electrical characteristics
RF信号 RF signal 信号振幅 DVD:14Tの振幅値(p-p) DVD: 1.08±0.22 Vp-p B±40% B±25% Signal level DVD:p-p level of 14T signal.
CD:11Tの振幅値(p-p) CD: 0.65±0.15 Vp-p B±25% B±25%CD:p-p level of 11T signal.Gain 1X(A+B+C+D) output
ジッター量 DVD:クロックジッター DVD: 10.5 % max. A 14% max. A 14% max. Jitter DVD:Data to the standard clock
CD:3Tジッター標準偏差 CD: 26 nsec max. A 32nsec max. A 32nsec max.CD:Standard deviation of 3T jitter
フォーカスエラー信号 Focusing error signal FE=(A+C)-(B+D) 信号振幅 Sカーブの振幅値(p-p) DVD: 1.25±0.35 Vp-p B±30% Signal level p-p level of S-curve CD: 0.79±0.26 Vp-p B±30%
信号バランス エラー信号のセンターずれ量 ±17 % 以下 C±20% Signal balance Deviation of signal Less than
信号検出範囲 Sカーブの(p-p)に対する範囲 DVD: 6.0 μm 設計値 Design value Detecting range S-curve p-p range CD: 6.0 μm 設計値 Design value
合焦ずれ ジッター最良点と動作基準 DVD: ±20 % C±20% Defocus 位置との距離 CD: ±17 % C±17%
Distance of best jitter position and standard position
極性 (A+C)-(B+D)<0 の時は合焦点よりディスクが近い状態 Polarity If (A+C)-(B+D)<0,disc closer than focalpoint.
CD: トラッキングエラー信号 Tracking error signal TE=E-F 信号振幅 エラー信号の振幅値(p-p) 0.12±0.06 Vp-p B±30% Signal level Signal p-p level
信号バランス エラー信号のセンターずれ量 ±30 % C±20% Signal balance Deviation of signal
回折格子調整精度 Subtract 180 from phase ±45 deg C±15deg Grating adjustment shift between E and F signal
Position: approx. 37.5mm from center of disc
極性 E-F>0は内周方向へスポットがずれた時 Polarity If E-F>0,the spots are slipped off the track to the inside.
製品名: Product name: Sheet
Specifications
仕様書番号: Specifications number:
spec.Items
項 目
項 目
Items
条 件
信頼性規格Reliability spec.
仕 様
OPA-681PH-NH DSF-P0027 7
Reliability
Operating
仕 様
Specifications
信頼性規格
Non-operating
Condition
Condition
条 件
Arima Devices Japan Inc.
2-2. 信頼性 Reliability
2-2-(1) 環境試験 Environment test
放置試験 Non-operating test 高温保存 Temperature: 70 各条件雰囲気中に非動作にて放置し、常温・常湿中に High temperature Time: 24H 取り出し、72時間放置後再生性能を測定する。
温度試験に関しては疑義を生じない限り、16時間 低温保存 Temperature: -30 放置後の測定を可とする。 Low temperature Time: 24H Leave the non-operating pickup under each condition
and leave under standard environment for 72 hours 高湿保存 Temperature: 40 and measure. High humidity Humidity: 90% If there are no suspicion, it may be measured after
Time: 48H 16 hours regarding to the temperature test.
温度サイクル Temperature: -20,60 .4h 1h 1h 1h .6h Temperature cycle Cycle: 5 cycles +60
+25-20
4 hours
温度特性試験 Operating test 高温動作 Temperature: 60 条件雰囲気中にて4時間以上放置後、同条件中で High temperature 10分以上動作させ、下記項目を測定する。
試験項目: ジッター量、RF信号振幅 低温動作 Temperature: -10 Before applying the following test, leave the pickup Low temperature under the condition mentioned in the left for more
than 4 hours and operate the unit for 10 minutes under the same condition. Test items: jitter, RF signal level
2-2-(2) 輸送試験 Transit test
振動試験 加速度 Acceleration: 2.4G constantVibration test 周波数 Frequency: 10~50Hz
Sweep time: 5 minutes(往復 up & down)方向 direction: 3 directions(X, Y, Z)時間 Time: 0.5 hour X 3 directions, total 1.5 hours振動試験機を使用する。 Use vibration test machine.
衝撃試験 加速度 Acceleration: 80G, 6 msecondShock test 方向 Direction: 3 directions 6 faces(±X, ±Y, ±Z)
3 times X 6 faces, total 18 times.衝撃試験機を使用する。 Use shock test machine.
製品名: Product name: Sheet
条 件
Condition
項 目
Items
項 目 方 法
8仕様書番号: Specifications number:
DSF-P0027
Test method
OPA-681PH-NH
方 法条 件
Condition
Test methodItems
Arima Devices Japan Inc.
2-3. 信頼性試験条件 Reliability test conditions
(1)試験条件、姿勢 Test condition, posture標準試験条件と同一条件で測定することを原則とする。The reliability test shall be conducted at the same conditions as the standard test.
(2)試験用測定器、ディスク Measuring instrument, disc標準試験と同一の測定器または、同等品を用いる。但し、測定器、ディスクはやむを得ない場合を除き特殊環境中に入れてはならない。The same measuring instrument and disc of equvalent as used in the standard test shall be used.But the instrument and disc shall not be entered into a specific environment exept in case of inevitable.
(3)測定 Measurements電気系の設定、及び機械的設定は、標準試験条件の初期設定のままで行う。The electric and mechanical measurements of this test shall take place as they were initially measured at the standard test conditions.
(4)適用規格 Specifications各試験による性能は、適用規格欄の分類に基づき規格一覧表により判定する。See the column of reliability specifications and classification (A, B, C).
A: 絶対値 Absolute valueB: 対初期比 Ratio to initial valueC: 対初期差 Difference from initial value
(5)結露 Dew condensation試験中は結露することのないようにする。The dew condensation under test implementation is strict prohibition.
(6)対物レンズ Objective lens対物レンズが汚れた場合は清掃後に測定する。Clean and measure it when object lens is dirty.
2-4. 機械的仕様 Mechanical specifications
(1)外形寸法、送り部品取付部: 3-1 外形図 Dimension, feed parts attachment part: 3-1 Fig.1 Dimensions
(2)コネクター結線: 3-2 結線図 Connector wiring: 3-2 Fig.2 Schematic diagram
(3)送りガイド用軸受け Feed guide bearing.① 基準軸受け Master bearing: 2-φ3(+0.015, -0.000) mm② 従動軸受け Sub bearing: 3(+0.020, +0.005) mm③ 治具(シャフト径 φ2.998 X 2本使用)に取付、自重で落下すること。
Set the pickup to jig and the pickup shall fall free.
製品名: Product name: Sheet
OPA-681PH-NH 9DSF-P0027仕様書番号: Specifications number:
Arima Devices Japan Inc.
2-5. 主要部品安全規格 Safety Standerd of Main Parts
2-5-1. Connector
Material Manufacture Material UL File Type No
Material Manufacture Material UL File Type No
2-5-2. Printed circuit boards
製品名: Product name: Sheet
PCB-ACTELEMENT DENSHI CO LTD E36 94V-0
E160353
GT10T
FPC1020 94V-0
UL File No.
1, CM 94V-0
94V-0
94V-01140-A1
E226898
Parts Material Manufacture Type UL Flame Class
FPC0.5H-SMT-24P G : Manufactured by SHANGHAI YUESHEN ELECTRONIC CO LTD
E109088PPS
Name ClassParts
Socket Housing
Name
Slider Housing POLYPLASTICS CO., LTD.
Parts Material GenericClass
TS250F4D 94V-0DSM JAPAN ENGINEERINGPLASTIC K.K
PA4/6
94V-0PA4/6DSM JAPAN ENGINEERINGPLASTIC K.K
10仕様書番号: Specifications number:
Material Generic UL Flame
E172082TS250F6D
LD03T2-24ND-01 : Manufactured by SUMIKO TEC CO LTD
1140-A6HF2000
94V-0 E109088
E172082
UL Flame
Socket Housing
OPA-681PH-NH DSF-P0027
E69115
E220250
Slider Housing POLYPLASTICS CO., LTD. PPS
FPC-OPTShenzhen Flexcircuits Co., Ltd.
Towa Devices Corp.
Ya Hsin Industrial Co., Ltd.
Arima Devices Japan Inc.
3-1. Fig.1外形図 Dimensions
製品名: Product name: Sheet仕様書番号: Specifications number:
11DSF-P0027OPA-681PH-NH
Arima Devices Japan Inc.
3-2. Fig..2 結線図 Schematic diagram
コネクタピン配列について *先行スポット(Lead spot): FConnector pin layout *FPC Connection: pitch=0.5mm 図示方向:対物レンズ側より見る *Vcc=5V , Vc=2.5V View from the objective lens side *FPC/FFC Connection: pitch=0.5mm
コネクタ仕様 Connector Spec.
メッキ厚 Plating thickness [μm]
Min Typ Max Min Typ MaxLD03T2-24ND-01 Au 0.056 0.0864 0.105 1.795 2.0764 2.320 *1
YUESHEN FPC0.5H-SMT-24P G Au 0.076 0.1016 0.127 1.270 2.1590 3.048*1 The plating thickness is a measurement value by the connector manufacturer. (n=100)
製品名: Product name: Sheet
SUMIKO TEC
メーカー Manufacturer
型番 処理 Type Plating 下地 priming Ni
OPA-681PH-NH仕様書番号: Specifications number:
Au
12DSF-P0027
contact side connector
Arima Devices Japan Inc.
3-3. Fig..3 APC回路図 APC circuit diagram
3-4. Fig..4 光路図 Optical path diagram
製品名: Product name: Sheet仕様書番号: Specifications number:
13
SW2 OFF → SW1 OFF
OPA-681PH-NH DSF-P0027
DVD-LD power supply OFF procedure
DVD-LD power supply ON procedureSW2 OFF → SW1 DVD ON → SW2 DVD-LD ON
DVD Vref=0.18V
CD Vref=0.18V
Arima Devices Japan Inc.
4. 取り扱い上の注意 Precautions for handling
(1) 対物レンズからはレーザ光が放射されます。動作中のLDを直視したり、あるいは他のレンズやミラーを介して光束を監視すると危険ですから、絶対に行わないで下さい。 もし観察するときは、赤外線ビューアーかITVカメラ等を使用して下さい。Laser light is emitted from an object lens. Never look directly into the LD or observe the laser beam through another lens or mirror. If you need to view the beam, use an infrared viewer or an ITV camera.
(2) 半導体レーザは静電気によって破壊されやすいので、ピックアップの取り扱いに際しては静電気の発生を防止するようにご注意下さい。 作業を行う床と机上には静電防止マットを敷き、高抵抗(1MΩ程度)を介してアースと接続して下さい。作業を行う人は手首にリストストラップを着用し、高抵抗(1MΩ程度)を介してアースと接続して下さい。Take precaution against static electricity for handling the pickup, because laser diode may be destroyed by static electricity. Spread conductive rubber sheet to floor and desk and connect to ground through high impedance resistor (about 1MΩ). Use wrist band and connect to ground through high impedance resistor (about 1MΩ).
(3) LDの端子は、出荷時に輸送による静電気破壊防止のため、半田ショートされています。 ショート部の開放は、コネクタ差し込み後半田鏝で行って下さい。 使用する半田鏝は、金属部分が接地されたもの或いは通電5分後の絶縁抵抗が10MΩ以上(D.C. 500V)のもので、半田鏝先が330以下(30W)のものを使用し、速やかに行って下さい。The terminal of laser diode is shorted with solder for protecting laser diode. Open the terminal by solder iron quickly after connecting circuit. Use solder iron that metal part of iron is earth connected or insulations resistance is over 10MΩ(500V D.C.) at working and temperature of heater chip is less than 320 degree(30W).
(4) 半導体レーザは過電流に非常に弱いので、電源のon-offに際してはスパイク電流を流さないような電源回路を使用して下さい。 定格を越す光出力を発生させる電流を流さないようご注意下さい。When tuning on or off the APC circuit, use power source which generate no spike current, because laser diode may be broken by over current. Take precautions not to operate laser diode over rated output level by over current.
(5) 対物レンズに付着したゴミや埃はレンズ用ブロワーを使用して丁寧に吹き飛ばして下さい。 対物レンズに指紋等の汚れを付けないように特にその取り扱いにご注意下さい。 万一、汚れが付着した場合にはレンズペーパーにクリーニング液(日本綿棒Tel03-3573-1884 CDレンズクリーナ液B4)を少量付けて軽く拭き取って下さい。Use lens-blower carefully to blow dust on the objective lens. Please pay attention so as not to attach the dirt of fingerprint etc. to the object lens, especially to the handling. If the objective lens got dirty, wipe slightly with lens cleaning paper moistened with cleaning liquid (B4) made by JCB INDUSTRY Ltd.
(6) ピックアップの保管や輸送については、対物レンズが下向き、または基準シャフトが下向きになるようにして下さい。高温高湿下・低温下・埃・砂塵などの多い場所での保存は避けてください。The storage and transport of the pickup about, the object lens please do as downward, or master bearing becomes downward. Do not store under high temperature and high humidity, low temperature and dusty environment.
(7) LDのチップは、GaAs+GaAlAsで毒物として良く知られているAsを含んでいます。 毒性は、他の化合物、例えばAs2O3、AsCl3等に比較し、はるかに弱い毒性で素子1ヶ当たりは少量ですが、チップを取り出し酸やアルカリへ入れたり、200゜C以上に加熱したり、口に入れたりすることは絶対行わないで下さい。 ライン不良、サービスパーツの不良品は、廃棄物入れにまとめて入れ、御社指定の方法で廃棄処理をして下さい。The LD chip is manufactured from GaAs and GaAlAs, which contains toxic As(Arsenic). The toxicity of As in this form is far lower than other As compounds such as As2O3 and AsCl3,and the As content of one chip is very small. However, avoid putting the chip in an acid or alkali solution, heating it over 200゜C, or putting it your mouth. Defective LDs from the production line and parts removed in servicing should be disposed of with due care.
(8) 本製品は精密調整されています。 分解、調整は行わないでください。 不用意な取り扱いによる衝撃や落下など無いようにしてください。 対物レンズ、アクチュエータ、VR、レーザモジュール部は手を触れたり力を加えないでください。This pickup is already adjusted precisely. Do not decompose or readjust. Pay attention not to drop or not to shock due to rough handling. Do not touch and do not give force to following parts of the unit: a. The objective lens b. The actuator c. The variable resistor d.The laser module
(9) アクチュエータ:強力な磁気回路を有していますので、鉄片などの磁性体が近づきますと特性が変化しますのでご注意ください。 また、カバーの隙間から異物の入ることの無いようにして下さい。Due to strong magnetic circuit, pay attention not to close magnetic materials like iron. Take care of not entering small pieces of substance into the opening of the cover.
(10) レーザーへの戻り光によるノイズ低減のため、DVD-LDに高周波を重畳しています。 輻射レベル低減のための対策はしていますが、お客様の製品からの放射ノイズを規定内に抑える事を保証するものではありません。予測できない症状・事態を確認するためにも、お客様の製品で必要とされる評価・試験を必ず行ってください。The high frequency is superimposed to DVD-LD for the noise decrease to the laser by the return light.It is not the one to guarantee to suppress the radiation noise from customer's product in regulations though measures for the radiation level decrease are done. Do the evaluation and the examination needed in customer's product to check the symptom and the situation not predictable.
(11) FPC・FFC用コネクタが金めっき仕様の場合はFPC・FFC接触部の表面処理は金めっきとしてください。異種金属の組み合わせは接点が腐食し接触不良の原因になるため避けてください。Make the surface treatment in the FPC・FFC contact part a gold plating when the connector for FPC・FFC is a gold-plated specification.Avoid the combination of dissimilar. Otherwise, the point of contact corrodes and it causes the loose connection.
製品名: Product name: Sheet
14DSF-P0027OPA-681PH-NH仕様書番号: Specifications number:
Arima Devices Japan Inc.
Na
me
Mod
el
Num
ber
View
08
control button
1
Item
Scale
Sheet
01
DV
3110-JG01-01
DV
3 110
Explod
ed V
iew
Qty
Unit
A
Ma
terial
Version
02 03 04 05 06 07
USB cover
Ap
proval
Part N
umer
Authorize
Prepare
Date
Descrip
tion
Date
Date
front panel
front panel m
irror
1
Qty 1 1 1 1 1 1
1009 11 12 13 14
pow
er button
cd door mirror
cd door
SCA
RT board
loader
top cover
1 1 1 1 1 1
1
2
3
4
5
bottom
decod
ing board
ba
ck panel
control PCBA
Shenzhen MTC
Co., Ltd
R
QR-RD
-014B
PDF 文件使用 "pdfFactory Pro" 试用版本创建 www.fineprint.com.cn
Procedimiento para cambio de región
All of the DVDs we default all region in firmware ,If need change pls following below way
1, Current region display:Open the loader , press 9735 on remote and press 9
2, Change region Open the loader, press 9735 and" Region code " Such as 1 ,or 2,or 3.... It can change region which you want .
file:///I|/Manuales%20de%20Service/Electronica/A%20LLENAR/OEM/DVZ308(Nisato)/Free%20Zone%20setting.txt22/07/2009 02:40:25 p.m.
top related