extremely critical control environment for next generation ......chairman & ceo gudeng, co ltd....

Extremely Critical Control Environment for Next Generation

Fabrication Processes: FOUP and Loadport Unit

Mr. Bill Chiu / 邱銘乾先生Chairman & CEO Gudeng, Co Ltd

Agenda

•Technical Roadmap

• 300mm wafer carrierWINdowTM FOUP

• 450mm wafer carrierDiffuser FOUP

•Critical scenario of FOUP door opening Clean dry air curtain control in the sub-20 nm

semiconductor processes.

•Summary

100mm

1975

150mm

1982

200mm

1991

300mm

1999

450mm

2018

Technical Roadmap

2001-

300mm200mm150mm100mm

1991-1982-1975-

2001-

300mm200mm150mm100mm

1991-1982-1975-

2001-

300mm200mm150mm100mm

1991-1982-1975-

2001-

300mm200mm150mm100mm

1991-1982-1975-

Wafer yield

300mm wafer carrier WINdowTM FOUP

Unibody Shell & Intergrated Diffusor Low Humidity & ESD

Optimized carrier & material design

FM Approval

a. Integrated Design b. Specific Material

c. Excellent Performance d. Special Certification

300mm Wafer Carrier

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Hu

mid

ity

LCP

Liquid Crystal Plastic

300mm wafer carrier WINdowTM FOUP

uniform flow

non-uniform flow

Before

After

300mm wafer carrier WINdowTM FOUP

We integrate the diffuser into FOUP shell by flat window type. We also

use insert-molding technology to produce the FOUP. This unique design

will not influence the original SEMI spec and allows FOUP to be cleaned

easily and brings a better purge performance at next generation.

Purge Gas Inlet

It can prevent the

influence of robot.

Purge Gas Inlet

Slot_1 Slot_13 Slot_25

300mm wafer carrier WINdowTM FOUP

450mm Wafer carrier

450mm wafer carrier Diffuser type

Side view Top view

wafer

2 inlets

Purge Flow

wafer

2 inlets

Purge Flow

FOUP

Wafer

CDA Purge gas

Purge Flow

FOUP

WaferCDA Purge gas

Diffuser

Purge

Purge Flow

450mm wafer carrier Diffuser type

Oxygen concentration curve when only

diffuser purge with different flow rateWafer Carrier CDA purge w & w/o diffuser

different flow rate at slot 1 front

1. The FOUP’s relative humidity will increase when the flow rate is QP =

200(L/min) without diffuser purging. After importing diffuser into FOUP, the

relative humidity will increase when the flow rate is QP = 240(L/min). This result

shows the atmosphere’s moisture will roll into the FOUP as the purge flow rate

increase, the moisture barrier effect will decrease.

2. Because of the best flow rate of diffuser is QP =200 (L/min), we set 200, 210,

240 (L/min) as diffuser flow rate. From the result of diffuser flow rate, QP =210

(L/min) has the best oxygen barrier effect when the FOUP door opening.

Air Curtain

Warm Air

Cold AirCold Air

Warm Air

Fly Insects

Dirt / Dust

Inside

Out

side

Air Flow

Patent :103219919 ( Taipei Tech )

Air Curtain

Annular grooves

Filling holes

UPE Ventilation plate

Air Curtain

Air Curtain

• Air Curtain width 50 mm 360

(L/min)

• V = 0.29 (m/s)

332

355

288

860

805

40

432

1600

532

Unit: mm

• CFD Software : Ansys Fluent

• Turbulence modeling: Large Eddy Simulation(LES)

• Mesh size：0.01m

Mesh separately

Max X：0.0065m Max Y：0.0065m

Max Z：0.00335m

Summary

1. The WINdowTM FOUP only needs 35~40 LPM will make it

maintain at low relative humidity when the door opening. It also can

prevent the influence of robot , effectively.

2. The FOUP with diffuser has much better purging effect than

normal FOUP. It cause the uniform gas current distribution in FOUP.

3. With the different width of air curtain, the moisture barrier effect

will be different. From the result, it shows that 50mm width of air

curtain with 300(L/min) flow rate have the best barrier effect. It

makes FOUP’s inner relative humidity maintaining at 0%.