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PUBLIC

SENIOR DIRECTOR

TECHNOLOGY DEVELOPMENT

JON CHEEK

FUTURE OF EMBEDDED PROCESSING WITH FD SOI

OCTOBER 2018

1 COMPANY CONFIDENTIAL

Technology made large populations possible; large

populations now make technology indispensable.

Joseph Krutch

2 COMPANY CONFIDENTIAL

3 COMPANY CONFIDENTIAL

4 COMPANY CONFIDENTIAL

5 COMPANY CONFIDENTIAL

6 COMPANY CONFIDENTIAL

7 COMPANY CONFIDENTIAL

WILL EXCEED

3XEARTH’S POPULATION

BY 2020 IoT DEVICES

8 COMPANY CONFIDENTIAL

SCALABILITY OF EMBEDDED PROCESSING

BROADEST APPLICATION PROCESSOR DYNAMIC RANGE28 FD SOI PLATFORM

PUBLIC

GPU

7000 NU 1 Shader

ARM v7

A7 CPU Cluster

7ULP

Display

MIPI / Alpha

Blending

Parallel I/F

LP IO/ LP Conn

Cortex-M4

ARM DSP EXT GPU 7000L

4 Shader

VPU H.265 /

H.264

ARM v8

A35 CPU Cluster

Display

Controller

IMG Capture

Audio DSP

HSIO / LSIO / Conn

8QXP

GPU

7000UL2 Shader

VPU H.265 /

H.264

ARM v8

A35 CPU Cluster

8DX

Cortex-M4

Display

Controller

IMG Capture

Audio DSP

HSIO / LSIO / Conn

Cortex-M4GPU

7000XS/VX

8 Shader

GPU

7000XS/VX

8 Shader

VPU H.265 VPU H.264

ARM v8 A53

CPU Cluster

ARM v8 A72

CPU Cluster

Display

Controller

Display

Controller

Imaging Capture Imaging Capture

Audio DSP HSIO / LSIO / Conn

8QuadMax

Cortex-M4 Cortex-M4

1

3

2

Power Efficiency

High Performance

Power-Performance

>>RBB

ARVt

TOx

<< Iq

>>FBB

LVt

LPower IP

Lext

LVt

RVtLPower IP

Lext

HPerf IP

>Vdd

>Vdd

DVFS

i.MX 8

i.MX 8X

i.MX 7

HPerf IPRBB

RVt Lext

<<Vmin

9 COMPANY CONFIDENTIAL

SCALABILITY OF EMBEDDED PROCESSING

CROSSING OVER TO MICROCONTROLLERS28 FD SOI PLATFORM

PUBLIC

Ultra-low Power

Dynamic & Static

Common IP with i.MX

ARM Cortex M7 + 2D

Large OCRAM

i.MX 8

i.MX 8X

i.MX RT

i.MX 7

PUBLIC 10 10

PUBLIC 11 11

• ARM Cortex-A class

and Cortex-M cores

• 600 MHz to 2 GHz performance

• Thousands of applications

• Full open-source OS platforms

APPLICATIONS PROCESSORS

i.MX

MCUs

KINETIS & LPC

• ARM Cortex-M cores

• Performance

up to 300 MHz

• Embedded memory

• Easy to use tools

• RTOS support

Best OfBoth Worlds

PUBLIC 12 12

CROSSOVER PROCESSORS

i.MX RT

• ARM Cortex-M cores

• Over 600 MHz performance

• Deterministic instructions

• Short latency

• Easy to use tools

• RTOS support

PUBLIC 13

i.MX RT Crossover ProcessorsLeveraging FD SOI for Edge Computing

Larger Internal SRAM

ARM Cortex® - M7Instruction & Data Cache, L2 Cache,

Tightly Coupled Memory (TCM)

Connectivity(UART, I2C, USB, SPI, GPIO,

10/100 Ethernet, USB 2.0, etc.)

Timers

Securitywith on-the-fly decryption

Multi-media with 2D Graphics

Display Interface Camera Interface

External Memory SupportExternal SDRAM, NOR,

NAND

System Control Power Management with Integrated DCDC

i.MX RT

PUBLIC 13

• > 3x higher compute

performance vs today’s

MCUs

• 2x faster instruction

pipeline vs. M4

• 2x faster DSP vs. M4

• 10-100x improved

inference time

• NXP optimized memory

architecture

PUBLIC 14

Industry’s Lowest Leakage Memories

Conventional

FD-SOI SRAM

NXP Ultra-Low

Leakage SRAM

MRAM –

Non-Volatile

SRAM

>10X improvement

10X improvement

• 28nm FD-SOI

• Arm Cortex-M4

• 512kB NXP Ultra

Low Leakage SRAM

• 2MB of STT-eMRAM

• Proprietary dynamic application-

dependent power-performance tunability

• Ultra-low voltage operation plus high

reliability at elevated temperatures

• Industry-leading non-volatile e-MRAM

• 1,000X faster wake-up than e-flash

• 400X lower write power than e-flash

• 1,000-10,000x faster write time than

e-flash

• Higher endurance than e-flash

PUBLIC 14

PUBLIC 15

Body Biasing – Leveraging for Market Leadership

PUBLIC 15

Quad Core Subsystem

• Vdd Overdrive Only

• SOG Global Body Biasing

• Independent Domain Body Biasing

• On Chip Memory Array Body Biasing

• Assymetric Device Body Biasing

• Mixed Vt Common Well Body Biasing

PUBLIC 16

Static Power Leadership

PUBLIC 16

Sub Pico Amp Per Bit Memories

0.35V Vmin Capability

Supporting -40C to 125C

PUBLIC 17

Dynamic Power Leadership

PUBLIC 17

High Granularity Bias Techniques

Mixed Vt Common Well Capability

<0.6V Vmin Capability

Supporting -40C to 125C

PUBLIC 18

Machine Learning – Edge Computing Enabled by FD SOI

18

Voice Processing

Gesture Control

Active Object

Recognition

Personal / Property

Home Environment

Multi-camera

Observation

Augmented Reality

Smart Sense & Control

i.MX 6 & 71-2x Cortex-AARM

i.MX RTCortex-MARM

Scalable & optimized inference engines across the entire MCU & Apps Processors

8

8

i.MX 8Dual GPUs – 128 GFLOPS

OpenCL 1.2 + VX Extensions GPU assembly

High-end Edge Compute & AI

4

i.MX 8XSingle GPU – 32 GFLOPS

OpenCL 1.2 FP

Mid-end Edge ComputeLow-end Edge Compute

MCU Edge Compute

Trained ModelsInference Engines

Training & Classification in the Cloud

PUBLIC

PUBLIC 19PUBLIC 19

i.MX 8

- Food Segmentation & ID

- Bottle counting

i.MX 8

- Food ID (20 classifier)

- 6mS Inference

- 99% accuracy

i.MX RT

- Food ID (5 classifier)

- 66mS Inference

- 99% accuracy

Smart Microwave

Smart Fridge

Smart Appliance

Proof of Concept

CES 2018

Utilizes Simple

CNN Neural Net

To Identify Food

(aka FoodNet)

20 COMPANY CONFIDENTIALPUBLIC

Scalable Solutions

Lowest Leakage Memories

Real Time & General Compute

Leadership Thru Body Biasing

Best Dynamic & Static Power

Enabling Edge Compute

21 COMPANY CONFIDENTIALPUBLIC

The Future of Embedded Processing Enabled by FD SOI

NXP and the NXP logo are trademarks of NXP B.V. All other product or service names are the property of their respective owners. © 2018 NXP B.V.

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