led silicone cure oven 오븐사양서enex21.com/led_cure_oven.pdf · 2010. 8. 10. · 8....

오 븐 사 양 서

CV-230AD LED SILICONE CURE OVEN

4 CHAMBER

Document no ZK11427

Rev.09

May 25, 2010

LED SILICONE CURE OVEN

CV-230AD / 4-CHAMBER

FEATURE

1. FEATURE

• DIMENSION

(IN) 450(W) X 450(D) X 520(H)mm

(OUT) 1840(W) X 1077(D) X 1770(H)mm approx.

• FAN AND MOTORSIROCCO FAN and 1/4HP Motor

• HEATING SYSTEMElectric heating system

• Nitrogen Auto-in/out

• Recorder 1 set (SDR100)

• Air Cooling system

• Low Velocity condition (0.4m/sec)

• 3 Color LED LAMP (installed beside the door)

FEATURE

• Double Inner Chamber Type

for low-velocity condition (for Dispensing cure process)

* PATENTED

WIND Velocity = 0.4m/sec

Normal Oven = 2.5~3.8m/sec

• Double insulation door (by Air)

FEATURE

• Chamber Cooling system

• Motor

• Outlet Duct Damper

FEATURE

PERFORMANCE

2. PERFORMANCE

Process Model Requirement Performance Remark

Epoxy Cure

Dispensing Cure

CV-230AD

Maximum temperature Max. 250℃

Working Temperature Room temp ~ 180’CExtremely low air velocity inside the chamber

Temperature uniformity 150±2.5℃ @Unload condition

Cured material strengthDST min. 5kgf

HST min. 5kgf-For Epoxy Cure

Programmable controller Yes Max. 100 Pattern

Temperature Heat-up rate Within 30min. Room temp to 150℃

Cooling performance Within 0.5 hour * 170’C => 75’C

Air Velocity 0.4 m/sec

APPLICATIONS

Using cure process ;

LED Silicone Cure for Top/Power LED Package

Process flow:

3. APPLICATIONS

Die attach Wire bonding Dispensing

Oven cure

Trim

SPECIFICATIONS

No Items Equip. spec. Remark

1 Utility / power 220Volt 60Hz 3 phase 16.5KW

2 Maximum temperature Maximum 250℃

3 Working temperature Room temperature to 180℃

4 Temperature uniformity ± 2.5℃ @ 150℃ unload condition

5 Chamber size 450mm(W) X 450mm(D) X 520mm(H)

6 Out dimension 1840(W) X 1077(D) X 1770(H)mm

7 Motor for Air circulator Moter-1/4HP

8 Fan for Air circulator Sirocco type FAN Φ180mm x 75mm x 4

9 Insulation Glass wool / Thickness- 110mm

10 Temperature controller Touch Screen 5.7” Program Controller

11 Heater 3.9Kw X 4 ea

12 Temp RecorderDigital 4channel paperless recorder

SDR100

13 Heater control PID Control / SSR

14 N2 flow unit L / min (Max. 50L) x 4

15 Lamp 3 Color LED – Near to Door

4. SPECIFICATIONS

SPECIFICATIONS

No Items Equip. spec. Remark

16 Interior SUS

17 Exterior SS41 Painted coating

18 Thermo Couple CA 'K‘ type, 4 ea

19 Vent Outlet valve Φ100 mm (outlet)

20 Air Cooling System Auto Air cooling (42W Fan/motor)

21 Door Lock system Installed Door lock system (Air cylinder)

22 ShelvesSUS Punching type

4 X 2ea

23 Door Air Insulation & silicon Rubber door

24 Safety Device Double Over-Heat Protector

Over-Current Protector

Fan & Motor Over-load protector

Alarm buzzer

4. SPECIFICATIONS

UTILITY

5. UTILITIES

No Items Requirements Remark

1 Elec. Power 220Volt 60Hz 3 phase 16.5KW x 1

2 N2 gas 80~120PSI Φ8mm x 1

3 Vent out (Duct) Φ100mm x 1 (capacity : 4~7m/sec)

4 Air 80~120PSI (for Door lock system)

5 Water N/A

6 Dimension 1840(W) X 1077(D) X 1770(H)mm

6. TEMPERATURE UNIFORMITY DATA

TEMPERATURE DATA

1

2

3

4

5

6

LEAD FRAME

MAGAZINE

Inner Chamber

Temp. check points : 6 point / chamber @150C

N2 flow : 30L /min

Temp. sensor location

SERIAL no JK2010056-4Chamber

Setting Point 150’C

Chamber # A B C D

1 150.4 150.1 150.1 150.3

2 150.7 150.2 150.6 150.8

3 150.2 150.3 149.8 149.6

4 150.4 150.5 150.9 149.9

5 150.0 150.4 150.7 150.4

6 150.1 150.0 150.5 150.3

Max. 150.7 150.5 150.9 150.8

Min. 150.0 150.0 149.8 149.6

Avg 150.2 150.2 150.4 150.2

Max-Min 0.7 0.5 1.1 1.2

7. TEMP PROFILE DATA

TEMPERATURE DATA

Serial no : JK2010054 – A Chamber

Temp. check points : 6 point

N2 flow : 30L /min

Temp. sensor location

1

2

3

4

5

6

LEAD FRAME

MAGAZINE

Inner Chamber

0.0

’C ~

25

0’C

30 min.

25’C

170’C

120’C

80’C

Cure Time

8. COMPARISON DATA (with OLD Oven)Visual inspection after dispensing cure

PERFORMANCE DATA

Package Type SMD TOP view packages LED

OVEN ENEX OVEN(CV-230AD) Competitor’s OVEN

Velocity 0.4m/sec 3.8m/sec

Sample 2,000 2,000

Defect 0 2

Remark

- No defect - Silicon surface defect

PERFORMANCE DATA

7. COMPARISON DATA (with OLD Oven)Test results (‘a’ Customer-RANK DATA of ‘X’ axis)

• 1st lot

• 3rd lot • 4th lot

• 2nd lot

PERFORMANCE DATA

7. COMPARISON DATA (with OLD Oven)Test results (‘a’ Customer-RANK DATA of ‘X’ axis)

• 5th lot

• 7th lot

• 6th lot

PERFORMANCE DATA

7. COMPARISON DATA (with OLD Oven)Test results (‘w’ Customer-RANK DATA of ‘X’ axis)

* Sample : from same Lot

ENEX Oven

ENEX Oven

Major CUSTOMERS

CUSTOMER OVEN TYPE REMARK

Lumi-Micro 4 Chamber system ‘2008–2009 10 set

IST 2 Chamber system ‘2008 – 5 set

Apro Systems 2 Chamber system ‘2010 – 4 set

FC Semiconductor 2 Chamber system ‘2008 – 2 set

Entec 4 Chamber system ‘2008~2009 – 11 set

Lumens 4 Chamber system

6 Chamber special model

‘2009 – 2set

‘2009 – 8set

Seoul Semiconductor 4 Chamber System ‘2009 ~2010 48set

LG Innotek 4 Chamber system ‘2009 – 72 set

Itswell 4 Chamber system ‘2009 – 7 set

Nepes LED 4 Chamber system ‘2009 – 2 set

CTL 4 Chamber system

6 Chamber special model

‘2009 – 1set

‘2009 – 3set

Raytron 4 Chamber system ‘2009 – 2 set

Heesung Electronics 4 Chamber system ‘2010 – 21 set

DS LCD 4 Chamber system ‘2009 – 16 set

Lusem 4 Chamber system

6 Chamber special model

‘2009 ~2010 21set

KEC Corporation 4 Chamber system ‘2009 – 12 set