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©2017 by System Plus Consulting | Bosch BMP380 Pressure Sensor 1

Bosch BMP380Pressure SensorMEMS report by Audrey LAHRACHNovember 2017

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Table of Contents

Overview / Introduction 3

o Executive Summary

o Reverse Costing Methodology

Company Profile 6

o Bosch Sensortec

o BMP380

Physical Analysis 11

o Synthesis of the Physical Analysis 12

o Package 14

View & Dimensions

Opening

Wire Bonding Process

Cross-Section

o ASIC Die 24

ASIC Die View & Dimensions

ASIC Delayering & Main Blocs

ASIC Die Process

ASIC Die Cross-Section

ASIC Die Process Characteristic

o MEMS Pressure Die 40

MEMS Die View & Dimensions

MEMS Die Cross-Section

MEMS Pressure & Temperature Process

MEMS Pressure & Temperature Characteristics

o Physical Comparison 57

Bosch Environmental Sensor Evolution

Comparison with STMicroelectronics LPS22HB

Sensor Manufacturing Process 66

o ASIC Die Front-End Process & Fabrication Unit

o MEMS Process & Fabrication Unit

o Final Test & Packaging Fabrication unit

Cost Analysis 80

o Synthesis of the cost analysis 81

o Yields Explanation & Hypotheses 83

o ASIC Component 85

Die Front-End Cost/Probe Test, Thinning & Dicing

ASIC Component Cost

o MEMS Pressure Die 89

Die Front-End Cost/Probe Test, Thinning & Dicing

Sensor Die Cost

o LGA Packaged Component 95

LGA Packaging Cost

Back End: Final Test

Component Cost

Selling Price 100

Company services 105


Overview / Introductiono Executive Summaryo Reverse Costing

Methodologyo Glossary

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Executive Summary

This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling priceof the Bosch BMP380 Pressure Sensor.

With its wide 300hPa - 1250hPa measurement-covering range and a low power consumption of only 2.0µA, Bosch’s BMP380pressure sensor is more accurate than the previous BMP280 pressure sensor.

Assembled in a 10-pin, metal-lid 2.0mm x 2.0mm x 0.75mm land-grid array package, the BMP380 integrates a digital pressuresensor and a temperature sensor. It is equipped with only one MEMS die and an amplification application-specific integratedcircuit - the same number of dies as the BMP280, but with smaller dimensions.

The pressure sensor is manufactured with Bosch’s “Advanced Porous Silicon Membrane” process, integrating a flexiblepressure membrane and temperature diodes on a silicon substrate.

This System-in-Package consists of two sensors in one small package, mixing wire bonding and flip-chip connections. Athorough package analysis is included in this report, which also describes and compares MEMS and ASIC technologyevolutions.

This report also offers deep technological and cost analyses of the BMP380, along with a technical and price comparison withBosch’s BMP280 pressure sensor, a competing pressure sensor from STMicroelectronics (the LPS22HB), and Bosch’s twoenvironmental sensors, the BME280 and the BME680.





Physical Analysis


Cost Analysis


The reverse costing analysis is conducted in 3 phases:

Teardown analysis

• Package is analyzed and measured• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking• Setup of the manufacturing process.

Costing analysis

• Setup of the manufacturing environment• Cost simulation of the process steps

Selling price analysis

• Supply chain analysis• Analysis of the selling price

Reverse Costing Methodology





Physical Analysis


Cost Analysis


Executive Summary

This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling priceof the Bosch BMP380 Pressure Sensor.

With its wide 300hPa - 1250hPa measurement-covering range and a low power consumption of only 2.0µA, Bosch’s BMP380pressure sensor is more accurate than the previous BMP280 pressure sensor.

Assembled in a 10-pin, metal-lid 2.0mm x 2.0mm x 0.75mm land-grid array package, the BMP380 integrates a digital pressuresensor and a temperature sensor. It is equipped with only one MEMS die and an amplification application-specific integratedcircuit - the same number of dies as the BMP280, but with smaller dimensions.

The pressure sensor is manufactured with Bosch’s “Advanced Porous Silicon Membrane” process, integrating a flexiblepressure membrane and temperature diodes on a silicon substrate.

This System-in-Package consists of two sensors in one small package, mixing wire bonding and flip-chip connections. Athorough package analysis is included in this report, which also describes and compares MEMS and ASIC technologyevolutions.

This report also offers deep technological and cost analyses of the BMP380, along with a technical and price comparison withBosch’s BMP280 pressure sensor, a competing pressure sensor from STMicroelectronics (the LPS22HB), and Bosch’s twoenvironmental sensors, the BME280 and the BME680.


Overview / Introduction


Physical Analysis

o Synthesiso Packageo Package Cross-Sectiono ASICo MEMS Pressure/

Temperatureo Bosch Evolutiono STMicroelectronics

LPS22HB Comparison


Cost Analysis


Package Cross-Section - Overview

Cross-Section Plane

Package Cross-Section Overview – SEM View©2017 by System Plus Consulting

Package total thickness: xxx mm

o ASIC thickness: xxx mm

o MEMS Pressure thickness: xxx mm

o Metal Lid thickness: xxx mm




Physical Analysis



LPS22HB Comparison


Cost Analysis


ASIC Cross-Section – Metal Layers

Metal Layers Cross-Section - SEM View©2017 by System Plus Consulting




Physical Analysis



LPS22HB Comparison


Cost Analysis


MEMS Pressure Overview

MEMS Die Overview – SEM View©2017 by System Plus Consulting

ASIC

HUMIDITY & PRESSURE SENSOR




Physical Analysis



LPS22HB Comparison


Cost Analysis


Mfr. Ref. Die Size Die Marking Year Marking

Metal Layer Epitaxy Thickness

Number of Temperature Diode

Bosch

BMP280 Xx x xxmm xx xx xx xxµm x

BME280 xx x xxmm xx xx xx xxµm x

BME680 Xx x xxmm xx xx xx xxµm x

BMP380 Xx x xxmm xx xx xx xxµm x

BMxxxx Pressure Sensor Die©2015 by System Plus Consulting


BMxxxx Pressure xxx Sensor Die©2017 by System Plus Consulting


Bosch Environmental Sensor Evolution - Pressure Sensor Die




Physical Analysis



LPS22HB Comparison


Cost Analysis


Package Comparison

BMP380 Pressure Sensor©2017 by System Plus Consulting

STMicroelectronics – LPS22HB©2017 by System Plus Consulting

Mfr. Ref. Package Type Package size (mm)

Pin Number

Pitch Dies Number Wire Bonding Number

Bosch BMP380 Metal Lid LGA 2x2x0.75 10 0.5 xx xx

STMicroelectronics LPS22HB HLGA 2x2x0.76 10 0.4 xx xx




Physical Analysis


Cost Analysiso Summaryo Supply Chaino Yieldso ASIC Die Costo MEMS Pressure/

Temperature Die Costo Packaging Costo Back-end Costo Component Cost


ASIC Front-End Cost

• The unprobed wafer cost is estimated at $xxx for mediumyield hypothesis.

• The main part of the wafer cost is due to the xxxxxx with xx%.




Physical Analysis





ASIC Die Cost

Cost Breakdown Cost Breakdown Cost Breakdown

Low Yield Medium Yield High Yield

• The number of good dies per wafer is estimated toranges from xxx to xxx according to yield variations,which results in a die cost of $xxxx for medium yield.




Physical Analysis





BMP380 Component Cost

The component cost ranges from $xxx to $xxx according to yieldvariations.

The ASIC die manufacturing represents xx% of the module cost.

The MEMS Temp./Pressure die represents xx% of the module cost.

The package assembly represent xx% of the module cost.

Final test and yield losses account for xx% of the module cost.




Physical Analysis


Cost Analysis

Selling Price Analysiso Definitions of Priceo Manufacturer Financial

Ratioso Manufacturer Price

BMP380 Estimated Selling Price Evolution

• We estimate that xxxxx realizes a grossmargin of xx% on the component,which results in a final componentprice ranging from $xxx to $xxx.

• This corresponds to the selling price forlarge volume to OEMs.

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