cac_phuong_phap_che_tao_mang_hoa_hoc

8/6/2019 Cac_phuong_phap_che_tao_mang_hoa_hoc

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CC PHNG PHP CH TOMNG HA HC

HV: Trn Th Thanh ThyCHK18


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CC LOI MNG HA Mng nhy kh/lng:

Al2O3,Ta2O5, Si3N4-> mng nhy pHZnO:Ga, SnO2:Sb -> nhy hi cn..

Mng chng n mn:

Tb-Fe-Co hay Tb/Fe-CoAl-SiO2,Al2O3:Mg

Mng ngn khuch tn:Ta-Si-N, ZnO,Ni (Al/Si trong bn dn loi n)

ZnAl3 (Al/Au)TiN, TiO2 dng tinh th hay v nh hnh(PbTiO3/Si)


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CM BIN KH/LNG LP NGNKHUCH

TN

LP CHNGOXI HA HOC

N MN

SolgelSolgel

Phn xPhn xCVD,MOCVD(metalorganic CVD),PECVD,LPE

LPCVD,EPD, spraypyrolysis

Phn xPhn x

ALD(atomicALD(atomiclayerlayerdeposition),deposition),PEPE--ALD,ALD,CCVDCCVD(combustio(combustion CVD)n CVD)

Phn xPhn x

TVA (thermionicTVA (thermionicvacuum arc)vacuum arc)

PEPE--ALD, PLDALD, PLD(pulselaser(pulselaser

deposotion)deposotion)


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PHPHNG PHP SOLGELNG PHP SOLGEL

Sol (solution), Gel(gelation) y l phng php ha hc t tng hp cc

phn t huyn ph dng keo rn

(precursor:SnCl4.5H2O, SbCl3.2H2O) trongcht lng sau d to thnh nguyn liu lngpha ca b khung cht rn,c cha y dungmi cho n khi xy ra qu trnh chuyn tipSol-gel.

Cc alkoxide M(RO) l la chn ban u tora dung dch solgel vi cc xc tc thch hp.


5/28

C CH TO DUNG DCH

SOLGEL T ALKOXIDE M(OR)+H2O-> M(OH) + R(OH) (thy phn)

M(OH)+M(OH)->MOM + H20 (ngng t)

M(OH)+M(OR)->MOM +ROH (ngng t)V D: to mng SiO2Thy phn:(C2H5O)3-Si-OC2H5 + H2O-> (C2H5O)3-Si-OH

+ C2H5OHNgng t:(C2H5O)3-Si-OH + OH-Si- (OC2H5)3 ->(C2H5O)3-Si-O-Si-(OC2H5)3

alkoxidealkoxide

solsol


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CC K THUT TO MNG T

DUNG DCH SOLGEL

K thut ph nhng (dip coating)

K thut ph quay (spin coating) K thut ph dng chy (flow coating)

K thut phun (spray coating)..

Capillary coating


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DIP COATING

Ph nhng vt liu cmt cong nh mtknh, thu knh.

C th ph nhng vt

liu c dy t 20nmn 50micromet bngcch chn nht cacht lng sao cho phhp.


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Deposition system:

Deposition speed 0.1 to 85 mm/min

Speed adjustment 0.1 mm/min (ly lm n v)

Arm stroke 145 mm

Deposition cycles Unlimited

Delay times Adjustable from 1 to 9999 seconds

Dipper motor Servo controlled DC motor

Maximum size of substrate 100x100x10 mm (100 % immersion)

Drive Belt system:

Linear range of movement of

dipperunit

0 to 600 mm

Speed oflinear movement 0.01 to 400 mm/min

Barrier motor High pr ecision micro Stepp drivenstepper motor

CC THNG S K THUT CA MY


9/28

00.8U

h

g

L

V

!

h

L

0U

V

g

: dy lp chtlng

: nht cht

lng

:vn tc rt

:khi lng ringcht lng

: gia tc trngtrng


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FLOW COATING

- dy ca mng phthuc: nghing ca , nht cht lng,tc bay hi dung dch

-S dng i vi khng bng phng vph trn din tch ln

- C th thc hin quay

mu sau khi ph tng dng u ca dymng mng.


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K THUT PH QUAY MU

Phng php ny s dng lc quay li tm ph mng, mng c ng u cao nhlc li tm cn bng vi lc o nht cadung dch

Cc bc tin hnh:


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0 20

3

(1 / ). 2A AA

m

h

L

V V V [

!

DY LP PH KHNG DY LP PH KHNG

PH THUC LNGPH THUC LNGDUNG DCH CHO LN DUNG DCH CHO LN

0AV

AV

Lm

:khi lng ring ban u cacht lng

: khi lng ring

: vn tc gc ca

: nht ca cht lng

: tc bay hi ca cht lng


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X L NHIT CHO MNG

-Trong qu trnh to mng khu x l nhit rtquan trng v n nh hng trc tip n vicu trc ca mng. Giai on ny c tcdng lm bay hi ht dung mi cn li trong

mng, vt cht kt ni vi nhau chc chhn hnh thnh nn bin ht lm nh hngn vi cu trc ca mng. i vi mng nhykh cu trc xp ca mng rt c quan

tm-Sau khi x l nhit ta c th tin hnh phin cc d dng cho vic phn tch mu.


15/28

K THUT PH C IN

PHNG PHP NHC IMChemical VaporDeposition (CVD)

+i hi nhit v p sut thp

+ chu nhit cao

+kh ph mng c nhiu thnh phn

Physical VaporDeposition (PVD)

+Kh ph mng c nhiu thnh phn.

+Bung chn khng phi c p sut cao.

+ phi tng thch.

+Kh to b mt phng

Sol-gel +Kh duy tr tinh khit+Gm nhiu bc tin hnh phc tp (hiusut thp), tn thi gian.

+Ch c duy nht c nhit cao


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PHNG PHP CCVD( Combustion Chemical Vapor Deposition)


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HNH NH THC T

Left: One of nGimat's small pilot facilities for production of nanopowdersRight: nanopowder-producing CCVC flame.


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U IM C kh nng sn xut vt liu a thnh phn

mt cch n gin v nhanh chng nh iuchnh dung dch ha hc-> m rng phm ving dng

iu chnh c kch thc, hnh dng v

hnh thi hc ca cc ht nano. My hot ng mi trng khng kh bnh

thngNHC IM Tin cht phi ha tan c v d bt la Dng c t tin


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K THUT PLD

(pulse laser deposition)Phng php PLD c ch trong vi nm va qua vphng php ny ph c thnh cng nhng hp cht

phc tp. K thut PLD ln u tin s dng ph mngsiu dn YBa2Cu3O7. K t nhiu vt liu kh ph bngnhng phng php bnh thng , c bit l nhng hpcht gm nhiuloi oxit khc nhau c ph thnh cngbi phng php ny. Phng php ny dng ph

nhng mng nhy PH nhAl2O3, Ta2O5, cc loi mngchng oxi ha hoc n mn


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Loi Sensor pH pH pH

Mng Sensor Al2O3 Si3N4 Ta2O5

Khong o(pH)

2-12 2-12 2-12

Cng(mV/pH) 54-56 53-55 56-58

Thi gianhng

ng(pht)

1 1 1

bn 3 nm 6 thng 1 nm


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LCH S PHT TRIN CA PLD

1916 Albert Einstein gi nh qu trnh pht x kchthch.

1960 Theodore H. Maiman xy dng my maser

(microwave amplification by stimulated emissionradiation)-my khuch i vi sng bng bc x cm ngs dng thanh ruby nh l mi trng tc dng laser.

1962

Breech v Cross s dng laser ruby lm bay hiv kch thch nguyn t t b mt cht rn

1965 Smith v Turner s dng laser ruby ph mng. Dnh du s khi u ca k thut PLD


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u thp nin 80- nh du s to ra thit b ph mngbng laser v k thut epitaxy . Mt vi nhm nghin cu t c nhng kt qu ng ch trong vic sn xut

ra nhng mng mng bng cch s dng k thut ny

1987 PLD thnh cng trong vic ch to nhng mngmng siu dn nhit

Cui thp nin 80 PLD l mt k thut kh ni tingtrong vic ch to mng mng v c ch n rtnhiu.1990s s pht trin nhanh chng ca laser ko theo

s pht trin ca k thut PLD.

2000s- Drs. Koinuma and Kawasaki nghin cu ci tin hthng PLD to ra nhng mu c cht lng cao vgim thi gian ph mng


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Nguyn tc hot ng


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Metals Ceramics Others

Ag,Au, Cu, Ir,Ni,Rh, Pt,Ru,Zn

Al2O3,Al2O3MgO,3Al2O32SiO2, BaCeO3,BaCO3, BaTiO3, BST, doped-CeO2, Cr2O3, CuxO,[La.95Ca.05]CrO3,Fe2O3, In2O3, ITO, LaAlO3,

LaPO4, LSC, LSM, MgO, Mn2O3, MoO3,Nb2O5,NiO,NSM, PbSO4, PbTiO3, PdO, PLZT, PMN,PMT, PNZT, PZT,RbOx,RhOx,RuO2, SiO2,Spinels (e.g. NiAl2O4,NiCr2O4), Silica Glasses,SnO2, SrLaAlO4, SrRuO3, SrTiO3, Ta2O5, TiO2,V2O5, WO3, YBa2Cu3Ox, YbBa2Cu3Ox, YIG, YSZ,YSZAl2O3, YSZ-Ni, ZrO2, ZnO (+ dopants inmany cases)

Over 10 polymers(polyimides,NafionTM,epoxies), numerous

composites of metals,ceramics and polymers

Substrates Used

Al, Brass,Ag, Cu, Pt,Ni, Stainless and C-Steel,Al2O3,Fiber Tows, Glass, Graphite, LaAlO3, MgO,NafionTM,

NiCr,Optical fibers,OPP, PET, Polycarbonate, Silica, Si, Si-Ti/Pt wafers, SiC, Si3N4, Superalloys, TeflonTM, Ti,

TiAl alloy, YSZ, powders

Some Applications

Adhesion, capacitors, catalytic applications,corrosion resistancecorrosion resistance,gas diffusion barriersgas diffusion barriers,, electronics,engines, ferroelectric materials, flat panel displays, fuel cells, interfacelayers, optics, piezoelectrics, resistors,RF and millimeter wave components solar cells, superconductors, thermal barrier, thermal control, and wearresistance

VT LIU PH


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PLD-3000


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Bia


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Thit b gi

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