移动平台超频方法 - ftps.zdnet.com.cnftps.zdnet.com.cn/files/3/21816.pdf · 5 •...

DPTS002

Mike Moen Dan Ragland

主任硬件工程师主任硬件工程师

基于英特尔® 微架构（Nehalem）的台式和移动平台超频方法

2

• 介绍/警示

• 支持超频的平台设计考量

• Intel® Core™ i7-900 台式机至尊系列处理器

• 超频和Intel® Turbo Boost 技术的互动

• Intel® Core™ i7-900XM 笔记本至尊系列处理器

• Intel® Core™ i7-800 台式机系列处理器


• 超频的关键平台要素

• 总结

议程

3

介绍

• 什么是超频？

–超出规格的时钟速率渐增过程

• 为什么超频？

–增加系统性能

• 如何实现超频？

–改变时钟和（或）乘法器

–逐渐增加电压

–渐增额外的VR能力

–渐增积极的冷却方案

4

超频警示

• 警示: 改变时钟频率和/或电压可能：

（一）降低系统稳定性和系统,处理器的使用寿命;

（二）造成处理器和其他系统组件失效;

（三）导致系统性能下降;

（四）造成额外的热或其他损害;

（五）影响系统数据的完整性。

• 英特尔目前没有测试计划，也不担保由于超出其处理器规格

的操作。

5

• 介绍/警示








• 总结

议程

6

狂热者/超频设计方向

• 最佳的IO方案–双显卡

–固态硬盘/磁盘冗余阵列

• 通过开关电源多相供电以及各种散热方案，增加VR的峰值和维持电流供应能力

• 通过CPU的散热解决方案，增加逼近Tjmax的余量

• 提高关键总线的电参数余量–处理器负载线下调到最低程度

–通过缩短走线，减少电源岛和走线的参考以减轻串扰

• 选择适当的电源规格

7

主板设计考量增加CPU散热余量

Frequency (GHz)

Details & Disclaimer:• This is an estimate

based on limited sample size.

• Measurements taken on single random sample

• Actual TDP levels may vary based on external factors

• 3DMark Vantage CPU test used as workload

• Simulated case temp shown

• This data does not imply a guarantee to support overclocking

• i7-920XM specifications call for 55W TDP without overclocking.

0.000

20.000

40.000

60.000

80.000

100.000

2.00 2.40 2.66 2.93 3.06 3.19 3.33 3.47

超频功耗估计

示例: i7-920XM

at 50C at 80C

TD

P (

Wat

ts)

更低的温度＝更低的功耗＝更高的频率

8

• 通常的三个电压控制区域:–Processor (VCCP), DDR3 (VDD), Uncore (MC 电压)

• 确保稳固的CPU VR设计

–更高的电流汲取能力

–增加供电相数或者提高VR元件数量

–增加场效应管散热器，提供更多的系统气流

主板设计考量设计电压调整器的余量

9

主板设计考量设计最佳的电源传输电路和V(die)

• V die = VID – VR DC tolerance – VR Ripple tolerance –(Load Line * Imax) - Package IR drop

• 为获得超频带来的好处– 提高 VR DC Tolerance (高品质的组件 – 控制器, FETs, 电容, 扼流电感)

– 提高 VR Ripple tolerance (选择电感和大容量电容)

– 减小 Load Line (board IR Drop) (例如更多的低ESR大容量电容, VR和主板负载线匹配, 更多的接地层, 更多的铺铜 – 2oz, 更多的MLCC解耦电容)

Load line target

核心CPU频率与该峰值直接相关。随着峰值 (主板上 IR 跌落)的增加,性能递减

Frequency

Impe

danc

e lo

okin

g fr

om d

ie

Influence of board

低频条件下提高主板上 IR 的跌落(Load Line * Imax)为核心CPU频率的提高带来更大空间

10

• 限制信号串扰– 为DDR通道设计通道隔离；每层一个通道

– 原生内置带走线：DDR通道只在内层走线

– 增加板层，或者选择特别的板材以达到更加严格的阻抗控制

– 保持通道足够短，不超过最低设计指导

• 限制内存控制器通道的负载– 最好是每个通道一个DIMM ，每个通道一个插槽

• 提供重要的电压和时间参数调节能力（Vddq，时钟Clock等）

– 有助于信号的眼图对中

• 图例设计对信号完整性的影响：时序 vs 电压眼图

• 大的、中间的、对称的眼图= 改善的信号余量，减少的误码，更多的超频空间（例如，更少的蓝频）

Bad Good

主板设计考量精心设计取得最佳 DDR 信号完整性

11

• 介绍/警示








• 总结

议程

Intel® Core™ i7-900台式机至尊系列处理器关键特征

•45nm 和32nm Nehalem 架构

•Intel® 睿频技术

•Intel® 超线程技术 (可达 6个核心， 12个线程)

•可达 12MB Intel®智能高速缓存

•集成内存控制器（IMC）支持3通道DDR3

•Intel® QuickPathInterconnect (Intel® QPI) 到X58芯片组

•独立的PCI Express * 2.0显卡配置多个图形（2x16至4x8）的灵活性

•为发烧友充分的开启超频选项

3Ch. DDR3

Intel ®X58 Express Chipset

QPI

DiscreteGraphics

OR

Intel® Core™ i7-900 台式机至尊系列处理器电压分解图

13

3个分开的电压岛

请参考VR datasheet，满足设计规格

非核心

DDR

核心末级高速缓存

QPI

VCC

VTT

VDDQ

QPI - Intel® QuickPath Interconnect (Intel® QPI)

14

非核心

DDR


QPI

BCLK @133 MHz

BCLK在133 MHz的总线时钟，驱动CPU内部

所有4个区域

Intel® Core™ i7-900台式机至尊系列处理器时钟树状图


15

Intel® Core™ i7-900台式机至尊系列处理器处理器区块

非核心

DDR


DDR 频率Turbo

限制

QPI

Uncore

频率

QPI

频率

全部可以通过软件和BIOS修改


16

Intel® Core™ i7-900台式机至尊系列处理器DDR 时序覆盖

支持内存时序覆盖模式

Intel® Extreme Memory Profile (XMP)

Intel® Extreme Memory Profile (Intel® XMP)极限内存规格

包含检测内存SPD时序的合理设置，通过BIOS或软件方便实现超频设计

符合Intel® XMP技术要求的内存厂商 Corsair, OCZ, Kingston, Patriot,

Crucial, Geil & others

17

• 介绍/警示








• 总结

议程

18

Intel® 睿频技术概况

• 自动使处理器运行速度超过基频

限制

温度处理器最大温度

功率 (TDP) 由输入VR的IMON和Vcc VID计算得出

电流 (TDC) 从VR输入的IMON

活动内核的数目为所有活动内核设置最大可能的倍频

– 依赖活动内核的数目

– 必须低于电源、温度和电流规格限制

– 受大多数制约因素限制

19

Intel® 睿频技术超频技术互动

• 至尊处理器选项– 可以改变功率（TDP）和电流（TDC）的限制

– 可以改变核心Turbo频率的限制

• C-状态互动– 处理器的核心状态C3和C6被禁止时，仅限于4个核心的Turbo频率激活

– 处理器的核状态C3和C6被启用时，可以获得3/2/1个core的Turbo频率激活

• 如果关闭英特尔® 睿频技术，频率将无法运行高于总线时钟*最大非turbo核心比率

• 如果打开英特尔® 睿频技术，频率将运行到总线时钟*最大非turbo核心比率

Turbo的区块/限制是最大化超频体验的最佳路径

Intel® Core™ i7 980X台式机至尊处理器演示

20 Photos courtesy of Intel Corp. and Corsair

21

• 介绍/警示








• 总结

议程

22

Intel® Core™ i7-920XM笔记本至尊系列处理器

关键特征

•基于新的Nehalem微架构


•Intel® 超线程技术 (4 核心， 8 线程)

•8MB的Intel®智能高速缓存

•集成的内存控制器（IMC）-DDR3

•为发烧友充分的开启超频选项

Intel® Core™ i7-920XM 系列

Intel® 5 series Chipset

DMI

DiscreteGraphics

DDR3 2x8

23

Intel® Core™ i7-920XM笔记本至尊系列处理器电压分解图

非核心

DDR


PCIeDMI

VCC

VTT

VDDQ


请参考电压设计规范

PCIe = PCI Express* XE = Extreme Edition

非核心

DDR


24

Intel® Core™ i7-920XM笔记本至尊系列处理器时钟树状图

分开的时钟输入供给PCIe/DMI,

BCLK供给其他部分

BCLK @133 MHz

PEG_CLK @ 100 MHz

PCIeDMI


25

DDR Freq

非核心

DDR


PCIeDMI

Intel® Core™ i7-920XM笔记本至尊系列处理器处理器区块


Intel® XMP

手动覆盖

Intel® Extreme Memory Profile (Intel® XMP)

Turbo限制

XE = Extreme Edition


26

Intel® Core™ i7 920XM笔记本至尊处理器演示

Photos courtesy of CLEVO, Alienware Corporation, and Kingston Technology Company, Inc

27

• 介绍/警示








• 总结

议程

1: Not all features are available on every processor line itemsIntel® FDI: Intel Flexible Display Interface

•基于新的Nehalem微架构


•Intel® 超线程技术 (4 核心， 8 线程)


•集成的内存控制器（IMC）- 2通道DDR3

•支持独立显卡 – 1x16 或2x8

Core™ i7-800 Series

Intel® 5 series Chipset

DMI

DiscreteGraphics

Intel® Core™ i7-800台式机系列处理器关键特征

3Ch. DDR3

2 Ch. DDR3 2x8

29

Intel® Core™ i7-800台式机系列处理器电压分解图

非核心

DDR


PCIeDMI

VCC

VTT

VDDQ


PCIe = PCI Express*


非核心

DDR


30

Intel® Core™ i7-800台式机系列处理器时钟树状图

分开的时钟输入供给PCIe/DMI, BCLK供给其他部分

BCLK @133 MHz

PEG_CLK @ 100 MHz

PCIeDMI

PCIe = PCI Express*

31

DDR 频率

非核心

DDR

核心

PCIeDMI

Intel® Core™ i7-800台式机系列处理器处理器区块


Intel® XMP

手动覆盖

Intel® Extreme Memory Profile (Intel® XMP)

末级高速缓存

PCIe = PCI Express*

32

Intel® Core™ i7 870处理器演示

Photos courtesy of Intel Corp., Corsair and CoolIT Systems Inc.

33

• 介绍/警示








• 总结

议程

Core™ i5-600 Series

Intel® 5 series Chipset*

DMI

DiscreteGraphics

3Ch. DDR3

2 Ch. DDR3 2x8

* Shown with Intel® P55 Chipset

Intel® Core™ i5-600台式机系列处理器关键特征

•32nm的Nehalem微架构（Westmere)


•Intel® 超线程技术 (2核心，4线程)


•集成的内存控制器（IMC）- 2通道DDR3，达到1333MHz

•支持Intel®高清显示或独立显卡（1x16 或 2x8）

35

DDR

核心

Gfx

VCCVTT

VDDQ

4个分开的电压岛PCIe = PCI Express*

VAXG

PCIe

DMI

末级高速缓存

Intel® Core™ i5-600台式机系列处理器电压分解图


DDR

核心

Gfx

PCIe

DMI

36

BCLK @133 MHz

PEG_CLK @ 100 MHz

PCIe = PCI Express*

分开的时钟输入供给PCIe/DMI, BCLK供给其他部分

Intel® Core™ i5-600台式机系列处理器时钟树状图

末级高速缓存

37

Intel® Core™ i5-600台式机系列处理器处理器区块


手动覆盖

DDR

核心

Gfx

PCIe

DMI

末级高速缓存

PCIe = PCI Express*

38

• 介绍/警示








• 总结

议程

39

Intel®极限内存规范

• Intel® XMP -标准DDR3内存规范的扩展– UDIMM支持台式电脑的Core i7 900 系列， Core i7 800系列

– SODIMM支持笔记本电脑的Core i7 920XM– 启用强劲的超频解决方案，旨在充分发挥以Intel®技术为基础的电脑内置的超级游戏

功能

– 包含检测内存SPD时序的合理设置，通过BIOS或者XTU软件方便实现超频设计

符合Intel® 极限内存规范的DIMMs 模组厂商– Corsair, OCZ, Kingston, Patriot, SuperTalent, Crucial, Geil & others– http://www.intel.com/consumer/game/extreme-memory.htm

Intel® XMP 能够支持高性能内存超频到2.4GHz

40

SODIMM1. 系统启动时，XMP配置的主板

BIOS会读取内存模组的SPD芯片的信息, JEDEC 和 XMP规范参数储存在uDIMM或者SODIMM的SPD芯片中

2. 系统启动后就根据SPD芯片中参数信息自动配置JEDEC相应的内存最高工作时序，从而可以充分发挥内存条的性能。

3. 预设和检测Intel® XMP 规范, 用户可以在BIOS设置中重新选择

Intel® XMP 超过了 JEDEC 时序和系统电压: 它正在超频

4. 重新启动系统

Intel®极限内存规范如何工作

Intel®极限内存调整工具(XTU)针对初学者和发烧友的简单易用的工具

• 简单易用的windows应用程序

• 自动及手动调整性能，压力测试和系统监控

• 为发烧友平台提供了一系列共同的基本能力设置

• ODMs可以定制这个软件插件，或使用英特尔提供的图形界面

• ODMs必须遵循最小的极限调整工具BIOS规范

XTU为所有Core™ i7, i5 and i3 系列处理器调整内存参数提供支持

42

LGA1366 散热方案 DBX-B• 和参考设计比有10%性能提升，Theta CA = .21 C/W • 采用静音模式满足现存的防噪目标。超频采用高性能运行模式。

• 该热管技术在现有的LGA1366 XE散热结构设计指导之内

• 在一个支架组件内实现强劲的结构解决方案

极限笔记本电脑散热方法

冷却Dock

冷却Dock：

•吸入冷空气

• 10’C温降可能

•切实提升性能

加强现有设计：

•提高风扇转速

•底座上实现直接风扇吸入

•选择最佳风扇和热交换器以便适应主板的相关尺寸要求

44

• 介绍/警示








• 总结

议程

45

极限设计总结Nehalem超频检测清单

√ 特征

支持至尊版: 满足处理器和平台的最低规范要求

Turbo Mode 超频: BIOS 支持覆盖Turbo 限制 (TDP, TDC, 最大的 Turbo 比率). Intel已经记录在平台调

整指导手册

总线始终超频：BIOS支持CK505或者PCH实现BCLK超频

Intel® XMP Hooks in BIOS 或 XMP 启用的MRC: Intel在标准的Clarksfield/Lynnfield内存

参考代码中提供了对XMP支持。

Intel® Extreme Tuning Utility: BIOS支持Intel超频软件。参考XTU BIOS 指导.

提高散热支持：过高的CPU和VR散热设计方案允许更高的超频。在超频模式下覆盖风扇速度（超过通常的噪声限

制）。

CPU 电压控制: 处理器电压控制, BIOS可编程. 参考设计线路图. 也可以咨询VR 控制器厂商获取更多的信息

内存电压控制 (离散电路):伴随微小的电压增加，启用更高内存超频的潜力，参考设计线路图.

从你司的英特尔代表获得平台性能调整指导手册

Minimum

Softw

ar

e/BIOS

Enhanced

Overc

lockin

g

Clarksfield = four core mobile processor used on the Intel® 5 series chipset based platform codename CalpellaLynnfield= four core desktop processor used on the Intel® 5 series chipset based platforms.

XMP= Intel® Intel® Extreme Memory Profile (Intel® XMP)

46

总结

• Intel® Core™ i7-900 台式机至尊系列处理器支持增加核心、非核心、DDR和Intel® QPI 的频率

• Intel® Core™ i7-920 XM笔记本至尊系列处理器支持增加核心、DDR和Intel® QPI 的频率

• Intel® Core™ i7-800台式机系列处理器支持增加DDR的频率

• Intel® Core™ i5-600台式机系列处理器仅仅支持对DDR时序的控制

• 超频选项能通过软件或BIOS设置

• 英特尔目前没有测试计划，也不担保由于超出其处理器规格的操作。

48

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The gross margin percentage could vary significantly from expectations based on changes in revenue levels; capacity utilization; start-up costs, including costs associated with the new 32nm process technology; variations in inventory valuation, including variations related to the timing of qualifying products for sale; excess or obsolete inventory; product mix and pricing; manufacturing yields; changes in unit costs; impairments of long-lived assets, including manufacturing, assembly/test and intangible assets; and the timing and execution of the manufacturing ramp and associated costs. Expenses, particularly certain marketing and compensation expenses, as well as restructuring and asset impairment charges, vary depending on the level of demand for Intel's products andthe level of revenue and profits. The current financial stress affecting the banking system and financial markets and the goingconcern threats to investment banks and other financial institutions have resulted in a tightening in the credit markets, a reduced level of liquidity in many financial markets, and heightened volatility in fixed income, credit and equity markets. There could be a number of follow-on effects from the credit crisis on Intel’s business, including insolvency of key suppliers resulting in product delays; inability of customers to obtain credit to finance purchases of our products and/or customer insolvencies; counterparty failures negatively impacting our treasury operations; increased expense or inability to obtain short-term financing of Intel’s operations from the issuance of commercial paper; and increased impairments from the inability of investee companies to obtain financing. The majority of our non-marketable equity investment portfolio balance is concentrated in companies in the flash memory market segment, and declines in this market segment or changes in management’s plans with respect to our investments in this market segment could result in significant impairment charges, impacting restructuring charges as well as gains/losses on equityinvestments and interest and other. Intel's results could be impacted by adverse economic, social, political and physical/infrastructure conditions in countries where Intel, its customers or its suppliers operate, including military conflict and other security risks, natural disasters, infrastructure disruptions, health concerns and fluctuations in currency exchange rates. Intel's results could be affected by adverse effects associated with product defects and errata (deviations from published specifications), and by litigation or regulatory matters involving intellectual property, stockholder, consumer, antitrust and other issues, such as the litigation and regulatory matters described in Intel's SEC reports. A detailed discussion of these and other risk factors that could affect Intel’s results is included in Intel’s SEC filings, including the report on Form 10-Q for the quarter ended June 27, 2009.

Rev. 7/27/09

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