chap04. plasma display panel - …121c771e4c273b84482… · plasma display panel ... ¾역학적:...
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CHAP04. PLASMA DISPLAY PANEL
PDP
PDP
3
PDP
ADS(Address & Display Separation)
Reset period + Address period + Sustain(Display) period
Sub-field Method (Grey scale)
PDP
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What is PDP?
Definition: Plasma Display PanelPDP is the display device using the light emissioncharacteristics of glow discharge.(like a fluorescent lamp)
Array of few millions of micro florescent lamp
HgHgHg+Hg+ UV
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PDP
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What is Plasma?
Plasma is a quasi-neutral gas of charged and neutral particles which exhibits collective behavior
4 () () () ( )
1 eV = 11600K
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Plasma
:
: [(electrial arc welding), plasma torch,(electrical arc furnace), ,(thermionic conversion)
: [MHD , plasma propulsion]
: , (, , CVD)
:
FUSIONFUSION
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()
Metastable levelResonance level
3.8
4.4
10.2
20.7
0.56
(nsec)
12.163P28.31478.45Xe
14.053P2~19.91249.98Kr
15.843P2~1.311.510711.6Ar
21.633P270.816.674.416.5Ne
24.623S121S0
62X10-4
19.820.6
58.421.2He
Level
(sec)
(eV)
(nm)
(eV)
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Collision
+
(, , )
(, , )
()
()
&
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or
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Gas Discharge Reactions
Cathode Surface ReactionCathode Surface ReactionGas Volume ReactionGas Volume Reaction
NeNe, Xe, XeNe, XeNe, Xe
Ne, XeNe, Xe
UVUV
Ne, Xe + hNe, Xe + hNeNemm, , XeXemm
Gas volume reactions
Cathode surface reactions- Secondary electron emission- Sputtering
NeNeXeXe++
Ne*, Xe*Ne*, Xe*NeNemm, , XeXemm
IoniIoni
Ioni
Exci
Relx
NeNe++XeXe++++ Reco Ne, XeNe, Xe
NeNeXeXe++
Excitation
Ne*, Ne*, NeNemm
NeNe
Ne + hNe + h (light)(light)
XeXe
Ne + XeNe + Xe++
Penningionization
Relaxation
NeNe
NeNe
Ionization
NeNe
RecombinationC A
Sheath
21.6eV
16.6eV16.7eV18.7eV
.
.
.Sheath
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Ne Xe
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BombardingIonized Gas
Neutralized Gas
Sputtered Atom
Cathode Surface
Sputtered Atom
Gas
Implantation, Sputtering, Secondary electron emission
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& process
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Self-Sustaining Discharge
1 (N+1)
N
N
(2 )
:
N 1
cathode anode
cell
Collisions
electron- neutral
ion- neutral
recombination
chemistry
Plasma-Field interaction
Diffusion
Criterion of self sustain discharge : (ed-1)1
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)1ln(
)1ln()(
1min
1min
+=
+=
ABeV
AePd
Paschens minimum law
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P D PP D P
AC-PDPAC-PDP AC/DC HybridAC/DC Hybrid DC-PDPDC-PDP
RefreshRefresh MemoryMemory RefreshRefresh MemoryMemoryTriggerTrigger
MatrixMatrix Reflective3-electrodes
surface discahrge(Coplanar)
Reflective3-electrodes
surface discahrge(Coplanar)
AC : &
PDP
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DC PDP AC PDP
AC & DC PDP
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PDP(stripe & rectangular barrier type)
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( 3AC PDP)
Glass
ITO:
Bus electrode:
MgO: 2
Address electrode: Dielectric layer:
Barrier rib:
Phosphor: UV
Transparent dielectric layer: &
Visible emission
layer : 1) 2)()
XY
A
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Glass 2.8
1 14
2 28
ITO 260 100 60
B/S 60B/S 340
MgO 7000
ITO 1500
B/S 4
Bus 7
1080
42Wide PDP Cell
130
12
Glass 2.8
80
15
Address 100 260 360 120
42Wide PDP Cell
1080
Dimensions
B/S
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= +
+
++
++
+
Matrix
Sub-field method
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Time
SF1 SF2 SF3 SF4 SF5 SF6 SF7 SF8
1
.....2
480
128T64T32T16T8T4T2T1T
1TV field (time)
scan
line address
sustain
sub-field
Gray scale : Controlling width of sustain period in each sub-field
PDP TV
ADS Driving (Grey scale: )
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C = C = 00 rr(A/d(A/d); ); CC11 >> C>> C00C = QVC = QV1/C1/Ctottot 2/C2/C111/C1/C00CCtottot CC11CC00/(2 C/(2 C00CC11))VV11/2/2 VV00
C0C1 C1
VV11/2/2
2.
ee
ee
VV00 VVCC11/(2C/(2C0 0 CC11) )
VV11 VV2C2C00/(2C/(2C0 0 CC11) )
1.
VV00
VV11/2/2
VV00 VVCC11/(2C/(2C0 0 CC11))VV11 VV2C2C00/(2C/(2C0 0 CC11))
VV11/2/2
3.
VV00 VsVsVV11 V V VsVs
VV11/2/2
VV00
VV11/2/2
AC -
Dielectric layer
Gas
eeee
ee
eeee
:matrix
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AC ( 1usec )
-> -> ( ) ->
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: 1) (+)= 50V, (-)=-50V, 2) = 500V
3) = 400V
A
BAddress Sustain
Resetby low voltage(weak discharge)
Operation Principle
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20 21 20+21
22 20+22 21+22
20+ 21
+ 220 20
1 2 3
4 5 6
7 0 1
2020
2020
21
212121
22 22 22 22
Gray Scale() Subfield method
8(Gray scale) 3 (lines) X 3 (lines)
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Sub-field
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Discharges in AC PDP cell
Reset discharge: capacitor (AX & AY )Eliminating wall charge for address ( )
Weak discharge(by low voltage, narrow, exponential pulse)Between X(Common electrode) & Y(Scan electrode)
Strong discharge(by Self erasing discharge)Between X(Common electrode) & Y(Scan electrode)
Providing priming particles for addressing ( seed )
Address discharge: capacitor (AY )Between Y(Scan electrode) & A(address electrode)
Generating wall charge for sustain discharge ( ON/OFF )
Sustain discharge: capacitor (XY)Between X(Common electrode) & Y(Scan electrode) electrode
Light output for display ( )
Determined by previous state (Memory function)
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PDP (Ramp reset)
X
Y
A
reset address sustain
Ve=160V
Vset
Vsc=-90V
2nd reset
Vs=190V
1st sub-field 2nd sub-fieldReset : Address
Address : ON/OFF (ON)
Sustain :
Sub-field -> (Grey scale)
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PDP Module
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Fabrication Process of AC PDP
() ()()
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PDP()
+ + + Set
E-beam
Sputter
Ion plating
MgOMgO
coater ()
paste
()Black stripe
paste
Sputter/Photoetching
AgCr/Cu(Al)/Cr
Bus
Sputter/Photoetching
CVD/lift-off
ITOSnO2
paste
Dispenser
(R, G, B)
Sand blast
paste
Additive
+
Barrier rib
coater
Sheet laminator
()
paste
Sputter/Photoetching
Lift-off
Ag
Cr/Cu(Al)/Cr
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Fabrication Techniques
Coating techniquesThick film printing method (Screen printing)
Thin film deposition method (PVD, CVD)E-beam, Sputtering, PECVD
Dispense/ Green sheet/ Ink-jet printing/ Spin coating
Patterning techniquesPrinting method with stencil mask
Sand blast method
Lift-off (Additive) method
Photo process(FODEL) method
Chemical etch method (Wet etching, Dry etching)
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Film Formation Techniques
Screen PrintingScreen Printing
Address line, etc.
Photo PastePhoto PasteThin film depositionThin film deposition
Al
DCAlAlAl
Al
Ar+
Al
Ar+
TARGET
SPUTTERING
ITO
MgO
Photo PastePhoto Paste
UV
Photo PastePhoto Paste
Bus electrode
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Film Formation Technologies
SandblastingSandblasting
Barrier rib
Lift offLift off
SnO2, Barrier rib
Chemical EtchingChemical Etching
ITO
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Coating techniques
GlassPaste
Screen
X-Y- Table
Squeegee
Scraper
V
P
(Target
Thickness)Table
Slit Die
Paste Tank
Paste
Pump
PDP
V
Table
Applicator RollComma Roll
Coating Roll
PDP
(Target
Thickness)
Paste
Nozzle
Syringe
Syringe
NozzleNozzle
Paste
Paste
Glass Glass
Laser
Laser
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Screen printing machine
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Screen Printing vs. Photo Paste
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ITO
Load/Unload
Magnet
Baking Plate
Shutter
C/R
Target
Dark Shield
ITO
ITO ()
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DFR Laminating
ITO () ()
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Sand blast process
(1) (2) DFR Laminating (3)
(6) & (4) (5) Sand Blasting
NozzleSand
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PDP- ALIS & Waffle Rib
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PDP- Deep waffle & Meander Rib
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PDP- CCF &
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AnodeCathode
VISIBLE LIGHTIN PDP CELLPHOSPHOREXCITATION
ELECTRICINPUT POWER
DISCHARGE
VUV RADIATION
DISPLAY LIGHT
TOTALSTEP
70%
15%
50%
25%
70%
LOSS
100
70
10.5
5.3
1.33
1
Circuit Loss
Visible & IR RadiationGas Heating
Self-Absorption &Absorption by MgO
Internal Loss of Phosphors
Absorption by Wall & Bottom
Absorption by ITO& Dielectrics
PDP
LAMP90%
65%
95%
70%
100%40
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Effic
ienc
y(lm
/W)
1990 19911988 1989 1993 1994 20031992 1995 1996 1997 1998
2
3
4
DC PDP
Reflection type
Electrode optimize
AC PDP
1
PDP
- High Xe gas mixture- Deep Waffle structure
- New discharge mode(Long gap structure etc.)- Material improvement
(Phosphor etc.)
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PDP
PDP(2 lm/W) (80 lm/W)
- Positive column -
Positive columnNegative glow
- -
Large-dischargeMicro-discharge
- -
253, 354nm147, 174nm
PDP
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PDP
1.5-inch(35mm) 50 ultrathin PDP ()
(High contrast ratio) 50-inch PDP - (Crystal Emission Layer)
Pioneer()
32 PDP LG
50" Single scan FHD PDP SDI
150 4K2K PDP 24.7mm-thick 50 FHD PDP / 42 FHD PDP - Contrast ratio(30000:1), (5 lm/Watt)
()
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Flexible PDP (Shinoda Plasma)
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