conductive adhesive sheet tsc200 - 欣于實業有限公司€¦ · this electrical conductive...

Copyright © 2011 TOYO CHEM CO., LTD. All Rights Reserved.

Conductive Adhesive sheetTSC200

CONFIDENTIAL

TOYOCHEM CO.,LTD.

Converting material Div.

Ver.1s

2012.7


Conductive Adhesive Sheet TSC200This electrical conductive adhesive sheet for FPC has excellent humidity resistance /

excellent flexibility / excellent electrical conductivity

Ideal for Mobile Phone Hinge, which requires less noise / Camera Module

Release filmConductive adhesive layer

Single Release film type

CONFIDENTIAL


Structure

CONFIDENTIAL

Release Film

Conductive Adhesive Layer

Structure material / feature Thickness

Release film White PET one side non-silicone resin coated 54μm

Conductive adhesive layerUrethane based containing conductive

filler(Isotropic conductive)

40μm;Before press60μm;Before press

Toyo original Urethane based

Dispersion conductive filler


Properties

CONFIDENTIAL

Product name TSC200

Release film 54μm PETConductive adhesive layer Urethane resin basedThickness of Adhesive layer 40μm ±5 (before press)/60μm±5 (before press)Surface resistance Less than 300mΩ/□Peel Strength (PI) More than 10 N/cmPeel Strength （Cu） More than 10 N/cmSolder resistance260℃ solder floating

Excellent(More than 60sec.)

Resin flow amount170℃,2MPa,5min.press

50μm


Features

CONFIDENTIAL

1.Excellent adhesion for PI, SUS, Cu, Ni-Gold plate

2.Excellent Heat durability

3.Electorical conductive reliability

4.Storage stability


Adhesive and Solder test

CONFIDENTIAL

180°peel

[Adhesive test condition]Sample width：10mmPeel speed：50mm/minPeel angle：180°

[Solder reflow Profile] [Solder floating]


Test TSC200 CBF300

1)Peel Strength180°Peel 50mm/min

15 N/cm 11 N/cm

2)Solder reflow260℃20second peak reflow 2pass

Appearance OK OK

Peel Strength 14 N/cm 13 N/cm

3)Solder floating260℃5second 3pass

Appearance OK OK



Appearance OK OK


Picture after peel test TSC200Between TSC200 and SUS

Picture after peel test CBF300Between CBF300 and SUS

Adhesive and Solder test-1 / PI cover-lay

CONFIDENTIAL

CCLPolyimide cover-layTSC200/CBF300SUS(nickel‐plated)

Test Structure


Test TSC200 CBF300

1)Peel Strength180°Peel 50mm/min

9 N/cm 6 N/cm

2)Solder reflow260℃20second peak reflow 2pass

Appearance OK NG

Peel Strength 8 N/cm Delaminate


Appearance OK NG



Appearance OK NG


Picture after peel test TSC200Between TSC200 and Ni-Gold plate

Picture after peel test CBF300Between CBF300 and Ni-Gold plate

Adhesive and Solder test-2 / Ni-gold plate

CONFIDENTIAL

CCLNi-Gold plate（Ni;1um,Gold;0.3um）TSC200/CBF300SUS(nickel‐plated)

Test Structure


3) Solder floating 260℃3PassBetween PI and Cu (CCL)

4) Solder floating 288℃3PassBetween PI and Cu (CCL)

2) Solder reflow 2passBetween TSC200 and Ni-Gold plate

Adhesive and Solder test-2 / Ni-Gold pate TSC

CONFIDENTIAL

PI(CCL)

TSC200

SUS(nickel‐plated)

Nickel Gold

CCL

TSC200


Nickel Gold Cu (CCL)


CONFIDENTIAL

Adhesive and Solder test-2 / Ni-Gold plate CBF

3) Solder floating 260℃3Pass 4) Solder floating 288℃3Pass2) Solder reflow 2pass

Gold

CCL

CBF300


Nickel

Delaminate at between CBF and Ni-Gold plate in any conditions


Conductivity

CONFIDENTIAL

TSC200 CBF300

Surface resistance After press 84 mΩ/□ N/A

Ground connected resistance

Land diameter 1.2mmφ

X-Y 53 mΩ 240 mΩ

Z 50 mΩ 233 mΩ

[Ground connected resistance]

Cu:18um

Surface: Ni-Gold Plate

Cover-lay : PI25um,Adhesive 35um(total:60um)

Cover-lay Land diameter : 1.2mmφ

Distance of pole : 4mm

Width of Adhesive sheet : 10mm

Press conditions

170℃-2MPa-5min press and 160℃-1hr baking

Comparison conductive performance


Ground connected resistance

CONFIDENTIAL

0

10

20

30

40

50

60

1 2 3

Land diameter mmφ

Resi

stac

e [

mΩ

】

TSS200

CBF300

0

10

20

30

40

50

60

1 2 3

Land diameter mm□

Resi

stac

e [

mΩ

】

TSS200

CBF300

X-Y, Land diameter:1mm,2mm,3mm

Land shape “Circle” Land shape “Square”



Surface: Ni/Gold Plate

Cover-lay : PI12.5um,Adhesive 15um(total:37.5um)


Ground connected resistance / 85℃85%RH

CONFIDENTIAL

0

50

100

150

200

250

300

350

400

450

500

0 100 200 300 400 500 600

Time [hour]R

esi

stac

e [

mΩ

】

TSC200

CBF300

Humidity resistance 85℃85%RHGround connected resistance (Land diameter:1mmφ)

0

20

40

60

80

100

120

140

0 100 200 300 400 500 600

Time [hour]

Resi

stac

e [

mΩ

】

TSC200

CBF300

X-Y Z




Cover-lay : PI12.5um,Adhesive 15um(total:37.5um)

Land diameter : 1mmφ(circle)

SUS : Ni plate treated SUS (Thickness 0.3mm)


Cross-section SEM images

CONFIDENTIAL

CBF300

Air gap

TSC200

No Air gap

Conductive adhesive sheet

Conductive filler


Flexibility / Embedment

CONFIDENTIAL

CBF300

Large air gap

Comparison 200um embedment ( Cross-section image x100)

~200um

50um PI film

TSC

Press conditions

170℃-2MPa-5min.press

And 160℃-1hr baking

200μmSmall air gap

TSC200

200μm

section


0

500

1000

1500

2000

2500

0 10 20 30 40 50times

Res

ista

nce

[mΩ

]Bending test / Conductivity

CONFIDENTIAL

Cu:18um


Cover-lay : PI25um,Adhesive 35um



Width of EMI : 15mm

Press conditions170℃-2MPa-5min.press and 160℃-1hr baking.

CBF300

TSC200

Cu

Cu

Cover-lay(60um)TSC

Bending test at 360°


Shielding performance

CONFIDENTIAL

Frequency：500MHz～18GHzASTM D4935Network-analyzer E8361ACondition:28℃60％RH

Eｌectromagnetic wave

Test piece


Comparison

CONFIDENTIAL

TSC200 CBF-300

Adhesive for PI,SUS ○ ○

Adhesive for Ni-Gold plate ○ ×

Solder ◎ △

Ground conductivity ◎ △

Ground conductivityHumidity conditions

○ ×

Shielding performance ○ ○

Storage Stability ○ ×


How to use

CONFIDENTIAL

SUS Stiffener

①Laminate on SUS Stiffener.

②Remove the release film,then laminate on FPC

for temporary fastening.

③Heat press undervacuumed condition.

Then, post cure.

SUS stiffener

FPCRelease Film

TSC

SUS stiffener

FPC

Electric oven

FPC

TSC

SUS stiffener

TSC

* If pressing time is over 60min,

post cure is unnecessary.

Lamination of TSC200 on SUS Stiffener

• Treatment using an iron, heat press, or heated rollers at 100~120℃ for over 5 seconds is recommended.

*If lamination is insufficient, crimples may be caused during the removal of the release film.

Flow chart

SUS Stiffener


How to use

CONFIDENTIAL

Press Condition Post Cure

Temperature Pressure Time Temperature Time

Quick Press & Post Cure

170±10℃ 1~3MPa Over 5min 160±10℃ Over 60min

Press Only 170±10℃ 1~3MPa Over 60min - -

Press condition

StorageTSC200 should be stored under 10℃ / 70%RH

*Storage at room temperature may cause the adhesive layer to stiffen, thusleading to the loss of conductivity.


23℃50%RH

Initial ７days １4days 21days

Peeling strength① 12 N/cm 12 N/cm 13N/cm 14N/cm

Peeling strength② 12 N/cm 12 N/cm 13 N/cm 11 N/cm

Solder float260℃①More than 60sec

OKMore than 60sec

OKMore than 60sec

OKMore than 60sec

OK

260SolderFloat℃②More than 60sec

OKMore than 60sec

OKMore than 60sec

OKMore than 60sec

OK

Solder reflow①5PassOK

5PassOK

5PassOK

5PassOK

Solder reflow②5PassOK

5PassOK

5PassOK

5PassOK

①,② on the above shows the following structure.①；PI/TSC/SUS②；Cu/TSC/SUS

Laminating condition ； 170℃-2MPa-5min.press + 160℃1hr oven curing

Excellent performance 21days after

23℃50%RH / Adhesive and Solder resistance

CONFIDENTIAL


CONFIDENTIAL


Cu:18um


Cover-lay : PI25um,Adhesive 35um(total:60um)




Press conditions

170℃-2MPa-5min press and 160℃-1hr baking

23℃50%RH / Conductivity

0

10

20

30

40

50

60

70

80

90

100

0 7 14 21

23℃50％RH（Day）

Res

ista

nce(

mΩ

）

XY

Z

conductive adhesive sheet tsc200 - 欣于實業有限公司€¦ · this electrical conductive...

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