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  • 7/31/2019 datasheet tic116d

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    TIC116 SERIES

    SILICON CONTROLLED RECTIFIERS

    2

    APRIL 1971 - REVISED JUNE 2000

    P R O D U C T I N F O R M A T I O N

    NOTE 5: This parameter must be measured using pulse techniques, tp = 300 s, duty cycle 2 %. Voltage sensing-contacts, separate from

    the current carrying contacts, are located within 3.2 mm from the device body.

    electrical characteristics at 25C case temperature (unless otherwise noted)

    PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

    IDRMRepetitive peak

    off-state currentVD = rated VDRM TC = 110C 2 mA

    IRRMRepetitive peak

    reverse currentVR = rated VRRM IG = 0 TC = 110C 2 mA

    IGT Gate trigger current VAA = 12 V RL = 100 tp(g) 20 s 8 20 mA

    VGT Gate trigger voltage

    VAA = 12 V

    tp(g) 20 s

    RL = 100 TC = - 40C2.5

    VVAA = 12 V

    tp(g) 20 s

    RL = 100 0.8 1.5

    VAA = 12 V

    tp(g) 20 s

    RL = 100 TC = 110C0.2

    IH Holding current

    VAA = 12 V

    Initiating IT = 100 mA

    TC = - 40C100

    mAVAA = 12 V

    Initiating IT = 100 mA 40

    VTOn-state

    voltageIT = 8 A (see Note 5) 1.7 V

    dv/dtCritical rate of rise of

    off-state voltageVD = rated VD IG = 0 TC = 110C 400 V/s

    thermal characteristics

    PARAMETER MIN TYP MAX UNIT

    RJC Junction to case thermal resistance 3 C/W

    RJA Junction to free air thermal resistance 62.5 C/W

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    3

    APRIL 1971 - REVISED JUNE 2000

    TIC116 SERIES

    SILICON CONTROLLED RECTIFIERS

    P R O D U C T I N F O R M A T I O N

    THERMAL INFORMATION

    Figure 1. Figure 2.

    Figure 3. Figure 4.

    AVERAGE ON-STATE CURRENT

    TC

    - Case Temperature - C

    30 40 50 60 70 80 90 100 110

    IT(AV)-MaximumAverageOn-StateCurrent-A

    0

    2

    4

    6

    8

    10

    12

    14

    16TI03AA

    DERATING CURVE

    Continuous DC

    Conduction

    Angle

    0 180

    = 180

    MAX ANODE POWER LOSS

    IT

    - Continuous On-State Current - A

    01 1 10 100

    PA-MaxContinuous

    AnodePowerDissipated-W

    01

    1

    10

    100TI03AB

    ON-STATE CURRENT

    vs

    TJ

    = 110C

    SURGE ON-STATE CURRENT

    Consecutive 50 Hz Half-Sine-Wave Cycles

    1 10 100

    ITM

    -PeakHa

    lf-Sine-WaveCurrent-A

    1

    10

    100TI03AC

    CYCLES OF CURRENT DURATION

    vs

    TC 70C

    No Prior Device Conduction

    Gate Control Guaranteed

    TRANSIENT THERMAL RESISTANCE

    Consecutive 50 Hz Half-Sine-Wave Cycles

    1 10 100

    RJC(t)-Transien

    tThermalResistance-C/W

    01

    1

    10TI03AD

    CYCLES OF CURRENT DURATIONvs

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    TIC116 SERIES

    SILICON CONTROLLED RECTIFIERS

    4

    APRIL 1971 - REVISED JUNE 2000

    P R O D U C T I N F O R M A T I O N

    TYPICAL CHARACTERISTICS

    Figure 5. Figure 6.

    Figure 7. Figure 8.

    GATE TRIGGER CURRENT

    TC

    - Case Temperature - C

    -50 -25 0 25 50 75 100 125

    IGT-GateTriggerCurrent-mA

    1

    10

    TC03AA

    CASE TEMPERATURE

    vs

    VAA

    =12 V

    RL

    = 100

    tp(g)

    20 s

    GATE TRIGGER VOLTAGE

    TC

    - Case Temperature - C

    -50 -25 0 25 50 75 100 125

    VGT-Gate

    TriggerVoltage-V

    0

    02

    04

    06

    08

    1TC03AB

    CASE TEMPERATURE

    vs

    VAA

    =12 V

    RL

    = 100

    tp(g)

    20 s

    HOLDING CURRENT

    TC

    - Case Temperature - C

    -50 -25 0 25 50 75 100 125

    IH-Ho

    ldingCurrent-mA

    1

    10

    100TC03AD

    CASE TEMPERATURE

    vs

    VAA

    = 12 V

    Initiating IT

    = 100 mA

    PEAK ON-STATE VOLTAGE

    ITM

    - Peak On-State Current - A

    01 1 10 100

    VTM

    -PeakOn-StateVoltage-V

    0

    05

    1

    15

    2

    25TC03AE

    vsPEAK ON-STATE CURRENT

    TC

    = 25 C

    tP

    = 300 s

    Duty Cycle 2 %

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    5

    APRIL 1971 - REVISED JUNE 2000

    TIC116 SERIES

    SILICON CONTROLLED RECTIFIERS

    P R O D U C T I N F O R M A T I O N

    TO-2203-pin plastic flange-mount package

    This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plasticcompound. The compound will withstand soldering temperature with no deformation, and circuit performance

    characteristics will remain stable when operated in high humidity conditions. Leads require no additional

    cleaning or processing when used in soldered assembly.

    MECHANICAL DATA

    TO-220

    ALL LINEAR DIMENSIONS IN MILLIMETERS

    1,231,32

    4,20

    4,70

    1 2 3

    0,97

    0,66

    10,0

    10,4

    2,54

    2,95

    6,0

    6,6

    14,55

    15,32

    12,7

    14,1

    5,6

    6,1

    1,07

    1,47

    2,34

    2,74

    4,68

    5,28

    3,71

    3,96

    0,41

    0,64

    2,40

    2,90

    NOTE A: The centre pin is in electrical contact with the mounting tab.

    18,0 TYP.

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    TIC116 SERIES

    SILICON CONTROLLED RECTIFIERS

    6

    APRIL 1971 - REVISED JUNE 2000

    P R O D U C T I N F O R M A T I O N

    IMPORTANT NOTICE

    Power Innovations Limited (PI) reserves the right to make changes to its products or to discontinue any

    semiconductor product or service without notice, and advises its customers to verify, before placing orders, that the

    information being relied on is current.

    PI warrants performance of its semiconductor products to the specifications applicable at the time of sale in

    accordance with PI's standard warranty. Testing and other quality control techniques are utilized to the extent PI

    deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily

    performed, except as mandated by government requirements.

    PI accepts no liability for applications assistance, customer product design, software performance, or infringement

    of patents or services described herein. Nor is any license, either express or implied, granted under any patent

    right, copyright, design right, or other intellectual property right of PI covering or relating to any combination,machine, or process in which such semiconductor products or services might be or are used.

    PI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE

    SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS.

    Copyright 2000, Power Innovations Limited