dertm-clk - alba · 2017-10-31 · 3 x ertm (3 x 6hp) (6hp) j 13 le ) rtm-pm (6hp) j11 j10 j10 j13...
TRANSCRIPT
U. Mavric, M. Fenner, J. Branlard, H. Schlarb, DESY K. Czuba, WUT-ISE D. Makowski, A. Mielczarek, P. Perek, F. Makowski, TUL-DMCS
DeRTM-LOG1300
MicroRF Backplane Concept
Purpose
• The MicroRF Backplane extends the connectivity of RTMs and introduces eRTMs (extended
RTMs).
• The CLKs, LOs, REFs and Pilot Tone can now be distributed over the backplane
• It allows to make a better use of the available space in the crate
Features
• Extends the MTCA.4 board management to the rear
• Each RTM can be powered by rear power supplies
• 3 Additional slots for RF-related purposes (LO, CLK generation, signal generation etc.)
• Improves isolation between digital PICMG, AMC backplane and RF domain
Evaluation of the extension of the MicroTCA.4 board connectivity to the rear side of crates.
The contribution summarizes recent activities in the extension of the
MicroTCA.4 connectivity to the rear side of standard MicroTCA.4
crates. The need for such an extension started as a need for a
cleaner and more isolated environment from digital areas present in
the front side of the crate. Local-oscillator generation, clock
generation and their distribution were moved into a MicroTCA.4 crate
and they could benefit from the standard MicroTCA.4 board
management layer and connectivity. For this reason an RTM-
backplane manager which sits in the rear side of the management
carrier hub was used as a bridge from the front side to the rear. The
backplane manager provides power, management layer and PCIe
connectivity to the rear. Special emphasis was put on the layout of
the digital signals in the rear MicroRF-backplane in order to avoid the
possibility of pollution of high sensitivity signals. Finally an example
of practical usage of the new extension is presented.
This project is supported by Helmholtz Validation Fund HVF-0016 “MTCA.4 for Industry”.
Abstract
eRTM Modules
Purpose
• CLK, LO generation
• Used on 21 RF stations (42 crates)
in the Eu-XFEL
• REF, LO, CLK distribution
Features
• 9 LO Outputs, 9 REF outputs, 9 Pilot
Outputs, 22 diff. CLK outputs
• Active temperature control of the RF
sections
• Integration into MTCA.4 framework
LO/CLK generation module Rear backplane manager
J21 J21 J21 J21 J21 J21 J21 J21 J21 J21J21
J30
J31 J31
J30
# 15 # 14 # 13 # -1 # -2 # -3# 12 # 11 # 10 # 9 # 8 # 7 # 6 # 5 # 4 # 3 # 2 # 1
J14
J10
J10
J21 J21
FRU
J31
J11
J12
J30
RTM-PM(6HP)12 x uRTM (12 x 4HP)
MCH-RTM-BM (6HP)3 x eRTM (3 x 6HP)
J13
RT
M P
ow
er
Mo
du
le(R
TM
-PM
)
RTM-PM(6HP)
J11
J10 J10
J13
J14
J12
J10 J10 J10 J10 J10 J10 J10 J10 J10 J10
Zone 1
Zone 2Zone 3
RT
M P
ow
er
Mo
du
le(R
TM
-PM
)
DeRTM-CLK
Monitoring, Histories, Events,
Control, … System Integration
On-Board RF Temperatures
• The Peltiers regulate the
temperature of the circuit.
• The regulation efficiency is 0.05
deg (out-of-loop)
On-Board Rel. Humidity
• The PCB is not isolated against
humidity changes
• An on-board humidity sensor shows
rel. humidity changes in the crate
RF Power Monitoring
• CLK, LO and REF power is logged
PCB Hotspots
• The hottest areas of the PCB are
logged
DC Power
• DC power consumption of various
subsections is logged
• The picture shows the power
consumption of the Peltier
controllers
DOOCS Interface
• On the application level we can control the LO, CLK
generation, monitor the RF power, monitor various
temperatures, control the Peltier elements etc.
Board Management
• Standard MTCA.4 management
is extended to the rear and is
managed by the front MCH
Board Management
• The front MCH sees the rear eRTM similar as
the front AMC modules
/dev
• The LO, CLK generation module is
recognized as one of the devices in
the PCIe tree.
Purpose
• Universal CLK generation
• Dual PLL, External CLK, Internal
free-running CLK, CLK divider, CLK
fan-out\
• Fractional-N based
Features
• 22 diff. CLK outputs
• Integration into MTCA.4 framework
• Possible mounting of external mezz.
with external CLK generation