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Lecture 1:
Intro to MEMS
Dong-il “Dan” Cho
S h l f El i l E i i d C S i S lSchool of Electrical Engineering and Computer Science, Seoul National University
Nano/Micro Systems & Controls Laboratory
Email: [email protected]: http://nml.snu.ac.kr
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What is MEMS ?
• Different physics in nano and micro scales– High viscosity (> inertia), stiction, friction & surface tension are g y
dominant in micro world
Antz, Dreamworks
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What is MEMS ?
• MicroElectroMechanical Systems
h f b i i f d i i h l f• The fabrication of devices with at least some of their dimensions in the micrometer range.
• Increase performance and decrease cost.
• Application for electronics, communications, pp , ,mechatronics, medicine, military
• Commercial product : an accelerometer sensor forCommercial product : an accelerometer sensor for the car air-bag, an inkjet printer header, a pressure sensor, components of RF and Optics
• As a new solution for IT, BT, ET, and NT many countries investment MEMS.
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What is MEMS ?
• A brief MEMS history
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What is MEMS ?
• Scales and dimensions
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What is MEMS ?
• Uses IC manufacturing techniques to fabricate moving structures in micro scale
(C ll)
(Http://www.analog.com)
(Cornell)
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(Http://www.analog.com)
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What is MEMS ?
• Scaling law– As system becomes smaller, the scaling of the force also
determines the acceleration, a; transit time, t; power per unit volume P/VO generated and dissipated
– the mass of a system : m, scales as (S3)f li d i h f li F
F
1 -2 1.5S S S⎡ ⎤ ⎡ ⎤ ⎡ ⎤⎢ ⎥ ⎢ ⎥ ⎢ ⎥
– for generalized case with a force F scaling as (SF)– where x = distance
1
2
SS⎡ ⎤⎢ ⎥⎢ ⎥
[ ][ ]
[ ][ ][ ]( )
F -3
1
Fa = = S Sm2xm
2 -1 1
3 0 0.5
4 1 2.0
S S SF = a = t =
S S SS S S
⎢ ⎥ ⎢ ⎥ ⎢ ⎥⎢ ⎥ ⎢ ⎥ ⎢ ⎥⇒ ⇒⎢ ⎥ ⎢ ⎥ ⎢ ⎥⎢ ⎥ ⎢ ⎥ ⎢ ⎥⎣ ⎦ ⎣ ⎦ ⎣ ⎦
3
4
SF =
SS
⎢ ⎥⎢ ⎥⎢ ⎥⎣ ⎦
[ ][ ][ ]( )1 3 -F 22xmt = = S S SF
P Fx=
-2.5
-1
S S SSSP
⎣ ⎦ ⎣ ⎦ ⎣ ⎦⎡ ⎤⎢ ⎥⎢ ⎥
O O
V tV
0.5
O
2
SP = SVS
⎢ ⎥⎢ ⎥⎢ ⎥⎣ ⎦
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What is MEMS ?
• Long slender beams are very strong in micro scale
• But moving through air in micro scale is difficult (like l
Http://www.memspi.com Nano/Micro Systems & Controls Lab, SNU
swimming in molasses)
Dong-il “Dan” Cho Nano/Micro Systems & Controls Lab.This material is intended for students in 4541.844 class in the Spring of 2009. Any other usage and possession is in violation of copyright laws 8
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What are MEMS driving forces ?
• MiniaturizationSmall feature: fast precise
Wearable PC
– Small feature: fast, precise, gentle, reach narrow space
• Multiplicity– Batch fabrication: mass
production low costproduction, low cost– Pre-assembled system and
parallel processing: high density
IBM Millipede(800 Gbit/i 2)density
• Microelectronics
(800 Gbit/in2)
HDD: 230 Gbit/in2
DRAM: 10 Gbit/in2
Fresh RAM: 250 Mbit/in2
Microelectronics– Integration with electronic
circuits
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MEMS Market
MEMS Market Forecast, 2007-2012
Source: Yole Développement July 2008
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Source: Yole Développement, July 2008
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Intro to Micromachining
1992J of MEMS
~1995SOI process
1991IOP JMM“MEMS”
coined
1988 UC Berkley micromotor:
Beginning of
1992 ADI accelerometer
1993 Cornell
SCREAM process
1997SNU
SBM process
Multi Chip Packaging
1980 1990 2000
the surface micromaching
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Bulk Micromachining (70’s)
• Anisotropic wet etching– Anisotropic etchants etch much faster in one direction than in p
anotherExposing the slowest etching crystal planes over time (111) planes have the slowest etch rate(111) planes have the slowest etch rate
– Several solutions: Alkalic OH (KOH, NaOH), TMAH, EDP– Etching at concave corners on (100), stop at (111) intersections,
convex corners are under cutconvex corners are under cut
Silicon anisotropic wet etching of (100) and (110) silicon
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Bulk Micromachining (70’s)
• Anisotropic silicon etching
Optical bench using (100) silicon Silicon tip using (111) silicon
(SNU NML)
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( )
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Surface Micromachining (’85-’95)
• Typical surface micromachining process steps– In HF, oxide etches fast for sacrificial release,
substrate: (100), p- type substrate: (100), p- type
(b) nitride deposition, sacrificial oxide deposition(a) oxide/nitride deposition, polysilicon deposition & patterning& patterning
(c) anchor patterning, polysilicon deposition & (d) sacrificial wet etch in HF
substrate: (100), p-type substrate: (100), p-type
(c) anchor patterning, polysilicon deposition & patterning
(d) sacrificial wet etch in HF
(SNU MEMS MPC)
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( )
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Surface Micromachining (’85-’95)
• Micro gear chain • Actuated micromirrors • Micro gear chain (four polysilicon)
• Actuated micromirrors (three polysilicon hinge structure)
(UC Berkeley, Pister Ph.D. thesis)(Sandia Lab.)
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Surface Micromachining (’85-’95)
• Aphid on mirror • 6 gears• Aphid on mirror • 6 gears
(Sandia Lab.)
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Deep Silicon Reactive Ion Etching (’90- )
• Uses high density plasma to alternatively etch silicon and deposit etch resistant polymer on sidewall– Unconstrained geometry 90O side walls– High aspect ratio 1:30– Easily masked (PR SiO )– Easily masked (PR, SiO2)
• Bosch process: sidewall passivation etch sidewall passivation etch …
Etch Deposit polymer Etch
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Deep Silicon Reactive Ion Etching (’90- )
• Fabrication example
350 µm depth 100 µm depth 80 µm depth, 4.5 µm space width, 2 µm line width
Gyroscope Accelerometer (170 µm depth)
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Gyroscope Accelerometer (170 µm depth)
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Applications – Smart Sensors
• Smart sensor– A sensor with built-in intelligence
Measuringg
– The intelligence is partially or fully integrated on a single chip
Sensing Element
• Smart sensor architecture– Sensing element
Element
l nin
g
Micro&
P
– Interface element for signal conditioning and data conversion
– Processing element (this includes a microcontroller with an
Signal
onditio
n oco
ntro
llePro
cessor
PowerEnergy
a microcontroller with an associated memory and software)
– Communication elementPower source
Communication
Co er
r
– Power source
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Applications – Smart Sensors (cont’d)
• Trend of the smart sensors
• Intelligence ↑
Signal
Conditioning &
Intelligence ↑- Self identification- Self diagnosis- Self calibration- Multi sensing
• Integration ↑- Smart sensor system- Complex systems for sensing, transforming
and signal processing
Conditioning &
Processing
Mechanical
• Miniaturization ↑- Small scale Mechanical
Thermal Chemical
- Integration- Nanotechnology
ActuatorsMulti-Sensing
Magnetic Radiant
• Performance ↑- Accuracy- Linearity- Reliability
Current Trend in Sensors &
SystemsMagnetic
Electrical
Radianty- Maintenance free • Standardization ↑
- Economies of scale- Importance of codes- Compatibility
Smarter Cheaper
Integration
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p y g
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Applications – Smart Sensors (cont’d)
• Smart pressure sensors: piezoresistive or capacitive– Sensor + Electronics Smaller & Cheaperp– Key trends
• The growth of the medical and automotive business is stable• New application like the TPMS are boosting this marketNew application like the TPMS are boosting this market
1991Bipolar integrated ?
2010Battery less TPMS
Bipolar integrated
1999CMOS i t t d
2003Smart pressure sensor(TPMS)
?
1980
CMOS integrated(DSP)
( )
Uncompensated
1985Temperature
compensated
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Applications – Smart Sensors (cont’d)
• Smart pressure sensors application– Engine optimization, emission control, and safety enhancementg p , , y
• Manifold intake air pressure (MAP) and barometric air pressure (BAP) for the engine control unit
• Tire pressure monitoring system (TPMS) and side airbag pressure p g y g psensor
– Medical applications• Sleep apnea, asthma monitoring, blood pressure meter p p g p
MAP sensor(Delphi)
Airbag pressure sensor(Bosch)
Wheel mounted TPMS(Siemens)
Blood pressure meter(Motorola)
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Applications – Smart Sensors (cont’d)
• Smart accelerometer: capacitive or thermal– Smaller devices with multiple axis sensingp g– Key trends
• The automotive business is increasing rapidly with the growth of ESP• Consumer applications have really started use MEMS sensors inConsumer applications have really started use MEMS sensors in
volume for application like mobile phone, GPS, and game controller
Dual-axis thermal accelerator(MEMSIC)
Capacitive accelerometer(ADI)
MEMS accelerometer with IC(NML SNU)
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Applications – Smart Sensors (cont’d)
• Smart gyroscope : capacitive or piezoelectric– Smaller devices with multiple axis sensingp g– Key trends
• The ESP market is growing very fast, with adoption of the system in medium end cars. (Silicon vs. Quartz)( Q )
• GPS is another growth area, both for automotive and autonomous systems
X-axis gyroscope(SNU, NML)
Z-axis gyroscope(Motorola)
iMEMS ADXRS(ADI)
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( , ) ( )( )
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Applications – Smart Sensors (cont’d)
• Smart accelerometer & gyroscope for automotive applications– Crash accident recording, Rollover sensing, ESP, GPSg, g, ,
Rollover sensing
High performance GPS navigation with gyroscopeElectronic Stability Programs/Vehicle Dynamic Control
(ESP/VDC)
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High performance GPS navigation with gyroscope (ESP/VDC)
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Applications – Smart Sensors (cont’d)
• Smart accelerometer & gyroscope for consumer electronics– Video game controller, camera image stabilization, HDD g g
protection, mobile phone, human computer interface
Video game controller (Nintendo)
iPhone (Apple)Lens shifting type (Nikon)
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g yp ( )
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Applications – Smart Sensors (cont’d)
• MEMS microphone– Since 2004, the industry has seen increasing sales of MEMS devices
l i l li i i h MEMS i h f llacross multiple consumer applications, with MEMS microphones for cell phones leading the pack.
– The market for overall MEMS microphones will be 432 million units in 2008 according to Yole report2008, according to Yole report.
• MEMS microphone applications: mobile phone, PDA, digicam, camcorder, lab-top, automotive (hand-free calling)
Surface mountable monolithic digital microphone & Fabrication process for MEMS microphone (Akustica)
Silicon microphone(Knowles Acoustics)
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Fabrication process for MEMS microphone (Akustica)(Knowles Acoustics)
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Applications – Smart Sensors (cont’d)
• Smart biomedical sensors– Biomedical sensors with integrated circuitry– Biomedical sensors with integrated circuitry– Implanted in the human body or wearable – Will improve people’s health, comfort and safety– Typical future sensor node
• Example applications– Glucose level monitorGlucose level monitor– Transplant organ viability
monitorBl d i– Blood monitor
– Cancer detection/monitor– Health monitor
Hand-Held Device
– Retinal and cortical prosthesis
Wireless Body Area Network (WBAN)
Hand-Held Device(receiver unit)
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y ( )
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Applications – Fluidics and BioMEMS
DNA chip (TorreyPath) Dynamic cell culture array(U.C. Berkeley)
Presure sensor (Caltech)( y)
Nanopump (De GENEVE Univ.) Microfluidic system (U C Berkeley)Microneedle (NML SNU)
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(U.C. Berkeley)
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Applications – Fluidics and BioMEMS (cont’d)
DNA chip (Roche) Bio-MEMS Gripper(BYU)p ( ) pp ( )
Biosensor (IMEC )Wireless intraocular pressure sensor (Doheny Eye Institute)
Dong-il “Dan” Cho Nano/Micro Systems & Controls Lab.This material is intended for students in 4541.844 class in the Spring of 2009. Any other usage and possession is in violation of copyright laws 30
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Applications – Fluidics and BioMEMS (cont’d)
• Neural Chip - The New Bionic Man– Retina Implant– Cochlear Implant– Edinburgh Arm– Heart Assist Pump– Nose on a chip– Electronic Tongue
NCP (NeuroCybernetic Prosthesis)– NCP (NeuroCybernetic Prosthesis): relief for the epileptic seizures, VNS (Vagus Nerve Stimulation)
– Plastic muscle– Silicon Sensor
(Science, 8 February, 2002)
Dong-il “Dan” Cho Nano/Micro Systems & Controls Lab.This material is intended for students in 4541.844 class in the Spring of 2009. Any other usage and possession is in violation of copyright laws 31
(Science, 8 February, 2002)
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Applications – Fluidics and BioMEMS (cont’d)
• Cochlea prosthesis
Cochlear Inc.
Dong-il “Dan” Cho Nano/Micro Systems & Controls Lab.This material is intended for students in 4541.844 class in the Spring of 2009. Any other usage and possession is in violation of copyright laws 32
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Applications – Fluidics and BioMEMS (cont’d)
• Vision prosthesis
Extraocular Unit
Intraocular Unit
Extraocular Unit
Intraocular Unit
(The Univ. of Utah)(Arrow-head Micro Electro Array, SNU)
Dong-il “Dan” Cho Nano/Micro Systems & Controls Lab.This material is intended for students in 4541.844 class in the Spring of 2009. Any other usage and possession is in violation of copyright laws 33
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Applications – Fluidics and BioMEMS (cont’d)
• MEMS Neural probe
(The Univ. of Tokyo) (Caltech)
Dong-il “Dan” Cho Nano/Micro Systems & Controls Lab.This material is intended for students in 4541.844 class in the Spring of 2009. Any other usage and possession is in violation of copyright laws 34
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Applications – OMEMS (cont’d)
• DLP(digital light processing)
(http://www.dlp.com)DLP Pico Projector Phone
Dong-il “Dan” Cho Nano/Micro Systems & Controls Lab.This material is intended for students in 4541.844 class in the Spring of 2009. Any other usage and possession is in violation of copyright laws 35
(http://www.dlp.com)
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Applications – OMEMS (cont’d)
Micro Lens Scanner (UC Berkeley) Mi i f t l (SNU)Micro-Lens Scanner (UC Berkeley) Micromirror array for telescope (SNU)
Fast on/off optical switch (NML SNU)4×4 matrix switch for optical fiber switching (Neuchatel Univ )
Dong-il “Dan” Cho Nano/Micro Systems & Controls Lab.This material is intended for students in 4541.844 class in the Spring of 2009. Any other usage and possession is in violation of copyright laws 36
Fast on/off optical switch (NML SNU)4×4 matrix switch for optical fiber switching (Neuchatel Univ.)
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Applications – RF MEMS
Improved millimetric sensors (MMW)RFID (TAGS)
Electronics (77 GHz anti-collisionRadar on-board GPS)Satellite Radar, on board GPS)
Adjustable
SatelliteCommunications
RF MEMS Tranmission/reception - Handsets- Basestations
Other wireless products
Adjustableantennas
LANs: i t lli t h i
RF MEMS
Other wireless products(portable PCs, GPS)Radar systems
(phase-delay systems)
LANs: intelligent housing(2.4 GHz and 5.2 GHz) local radio loop for SOHO internet connections (5 GHz to 30 GHz)
Dong-il “Dan” Cho Nano/Micro Systems & Controls Lab.This material is intended for students in 4541.844 class in the Spring of 2009. Any other usage and possession is in violation of copyright laws 37
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Applications – RF MEMS (cont’d)
• RF MEMS components for wireless devices
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Applications – RF MEMS (cont’d)
• Vibrating RF MEMS devices
• Filters60-MHz wine-glass disk resonator (Michigan) Side-supported SCS disk resonator (Georgia Tech.)
Quadrature mixer-filter (Michigan) Disk array composite μMechanical filter (Michigan)
Dong-il “Dan” Cho Nano/Micro Systems & Controls Lab.This material is intended for students in 4541.844 class in the Spring of 2009. Any other usage and possession is in violation of copyright laws 39
Quadrature mixer-filter (Michigan) Disk array composite μMechanical filter (Michigan)
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Applications – RF MEMS (cont’d)
• MEMS switch
(Omron) (RadantMEMS)
Dong-il “Dan” Cho Nano/Micro Systems & Controls Lab.This material is intended for students in 4541.844 class in the Spring of 2009. Any other usage and possession is in violation of copyright laws 40
(Omron) (RadantMEMS)
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Applications – RF MEMS (cont’d)
• MEMS inductor
Stressedmetal (PARC) Tunable inductor (Univ. of Waterloo)
Dong-il “Dan” Cho Nano/Micro Systems & Controls Lab.This material is intended for students in 4541.844 class in the Spring of 2009. Any other usage and possession is in violation of copyright laws 41
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Applications – USN
• USN (Ubiquitous Sensor Network)– Everywhere, everything with RFID tags Ubiquitousy y g g q– Sensing ID and environmental information Sensor– Real-time monitoring & control via network Network
Dong-il “Dan” Cho Nano/Micro Systems & Controls Lab.This material is intended for students in 4541.844 class in the Spring of 2009. Any other usage and possession is in violation of copyright laws 42
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Applications – USN (cont’d)
• Sensor network and sensor nodes– Sensor network is composed of a large number of sensor nodes with
i i & i l i i bili isensing, processing & wireless communication capabilities– Sensor nodes are small, low cost, low-power devices that have following
functionality:Communication on short distances due to power limitation• Communication on short distances due to power limitation
• Sense environment data• Perform limited data processing
– Network usually also contains “sink” node which connects it to theNetwork usually also contains sink node which connects it to the outside world
Sensor Nodes
Multiple Sensor
H/W (CPU, Memory)Wireless Network y
S/W (O/S, DB, Application)Battery
Self-organizing wireless sensor network nodes: Mote (Intel)
Dong-il “Dan” Cho Nano/Micro Systems & Controls Lab.This material is intended for students in 4541.844 class in the Spring of 2009. Any other usage and possession is in violation of copyright laws 43
g g ( )
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Applications – USN (cont’d)
• Sensor Network Applications– Military Applicationsy pp– Environment and Habitat Monitoring– Manufacturing
Transportation– Transportation– Seismic Study– Health Care– Home Network
Transportation
Building automation systemSoil moisture sensor nodesMilitary applications
Dong-il “Dan” Cho Nano/Micro Systems & Controls Lab.This material is intended for students in 4541.844 class in the Spring of 2009. Any other usage and possession is in violation of copyright laws 44
Building automation systemSoil moisture sensor nodesMilitary applications