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DISCO雷射介紹
2017/04/09 Ver1.0 Derek
DISCO HI-TEC TAIWAN
TRAINING CENTER
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2/**
什麼是超精密切割技術
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認識DISCO製造相關産品
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4/**超精密切割技術
何謂小・何謂精密?
頭髮的斷面上分割35分
直徑0.09mm的頭髮
直径0.5mm的自動鉛筆芯
DISCO設備加工後的0.1mm晶粒
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•晶圓結構示意圖
超精密切割技術
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6/**什麼是雷射
直接翻譯的話:
經由幅射放大的光
PS:中國大陸稱為"激光"
Light Amplification by Stimulated Emission of Radiation
光 増幅 激勵 放出 放射
L A S E R
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7/**白光與雷射光
•統整比較
白光 雷射光
方向 散亂 單相
波長 紫~紅 單色
能量密度 低 高
相位 不一致 一致
加工源 不適合 適合
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8/**日常生活中的雷射
【任天堂 Wii】専用コントローラ3D加速度センサー
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9/**
•何謂相位(Phase)?
相位弱化技術 相位強化技術
“Noise cancelling”濾波器
Laser
DISCO
DISCO的雷射
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10/**
DISCO雷射的發展
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11/**
可以對應多樣化的Device
Low-k wafer 噴渣減少
薄wafer+DAF加工
LED的加工
解決方案的提供 高度的雷射技術
切割道縮減
化合物wafer的高速・高品質
加工
設備 / 砥石 / 應用製程
複合材料的加工
雷射切割的開發背景
高周波數
高能量
短脈衝
短波長
高安定性
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12/**雷射切割的開發背景
•切割道的寬度縮小
•對於薄/硬/脆等各種材質的加工
•對於切割之後的外觀的重視
需求的多樣化
雷射切割技術的開發
輪刀切割ONLY FOR KUAS REFERENCE
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13/**Laser加工原理
•雷射光集中發射於集光鏡進行加工
•以昇華的方式進行加工
•何謂昇華– 雷射光照射固體表面,所照射的能量強度在一定的界限値以上, 固體表面
的電子,熱能,光學極力學所産生的能量變換,被爆發性的發射出來,在固體表面形成的蝕刻製程。
– (參考文獻 - 電気学会:「雷射製成及其應用」)
•昇華原理
除去熱能,光學式的能量變換
雷射 光的吸收 昇華溶融物飛散
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14/**
•Kiru of the Laser
雷射加工概念
Laser & Dicer
除去熱能,光學式的
能量變換雷射 光的吸收昇華・蒸発溶融物飛散
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15/**
DISCO雷射的應用
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16/**
應用製程Ablation
(燒蝕加工)
Stealth Dicing
(隱形加工)
機型DFL7160, DFL7161, DFL7260,
DAL7020, DFL7020
DFL 7360, DFL7361,
DFL7340, DFL7341 , DFL7348
加工方式
短脈衝照射後氣化加工 由SD雷射内部極光後形成
優點 應用製程範圍廣 切割道細、乾切割
缺點 産生融渣
SD可加工材質的限制
(e.g. 素材、晶粒大小、有無金属膜等)
SiSi
雷射應用
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17/**Laser Ablation
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18/**Stealth Dicing
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19/**雷射切割的開發背景
No delamination / No debris(After spinner cleaning)
Laser grooving + Blade full cut
Laser grooving
Laser Saw + Dicer Saw
Delamination from dicing
Blade half cut(#1500 resin blade)
Blade half cut + Blade full cut
Dicing Saw Only
Laser saw DFL7160 / 7161 Dicing saw DFD6362
TEG
Low-k layer
Metal wiring
Silicon
Tape
HogoMax LaserDebris
Silicon
Tape
1. Apply a protective coating 2. Laser grooving 3. Spinner cleaning 4. Blade dicing
Silicon
Tape
No debris
Silicon
Tape
Blade
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20/**Laser saw + Dicer saw
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21/**Laser saw + Dicer saw
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22/**Laser saw + Dicer saw
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23/**Laser加工外觀 (Narrow + Wide Beam)
Laser grooving profile 會根據加工物件材質及加工條件會有不一樣的溝槽呈現
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24/**
DISCO雷射技術製品
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25/**這也是DISCO的KKM技術(iPhone4)
T.I.様Samsung様Infineon様
T.S.M.C.様Intel様
DISCO的客戸群們使用著我們KKM的産品來生産製造。
Samsung様
Skyworks様
Skyworks様
Skyworks様
TriQuint様TriQuint様
Infineon様
S.P.I.L.様
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26/**這也是DISCO的KKM技術(iPhone6)
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27/**
被使用於各式工法的記憶媒體
Wafer的薄化加工: Kezuru Migaku薄Wafer的晶粒化加工: KiruSD記憶卡的外型加工: Kiru
23/29這也是DISCO的KKM技術(記憶卡)
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END
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