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설 립 1997년
매 출 US$600M(2017년)
인 원 1,940명(2017년)
사업분야 System IC
기술 90nm~0.35um
생산능력 116,000장/월(200mm)
회사 소개
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주요 경영진
최창식 사장 CEO
구교형 부사장 CFO, 경영지원실
최영제 부사장 생산본부
김완식 상무 품질경영센터
강정호 상무 제품기술실
조기석 부사장 Foundry영업본부
최창휘 상무 Brand사업본부
이윤종 부사장 기술개발실
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Fab1(부천) Fab2(상우)
Bucheon
Sangwoo
생산시설
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생산능력
(Unit: K장/월)
55 60 64 67
45 52
52 52
2015 2016 2017 2018(P)
Fab1 Fab2
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글로벌 네트워크
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사업 전략 산업환경
2010년대 4차 산업혁명기술 및 신규응용분야 출현
2016년 스위스 다보스포럼, 4차 산업혁명 최초언급
1970년대 3차 산업혁명(지식정보혁명)
1990년대 PC 상용화
2000년대 후반 스마트폰 상용화
[사물인터넷]
[인공지능]
[빅데이터]
[스마트팩토리]
[AR/ VR]
[웨어러블]
[3D프린팅]
[드론]
[로봇]
[스마트카]
[핀테크] [음악]
[스마트폰]
[게임] [교육]
[영화]
[인터넷]
[금융]
스마트폰 중심의 지식정보사회 초연결·초지능 4차 산업혁명 사회
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429
461 461 476
489
2017 2018 2019 2020 2021
61
66
71
78
84
2017 2018 2019 2020 2021
(Unit: $B)
(Source: IHS ‘18.1Q)
(Unit: $B)
사업 전략 시장전망
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Technology
System Process
Experience • Various Technology Platform
• Competitive Power &
Sensor Technology
• Technology Innovation
• Full PDK Support
• Competitive Cycle Time
• Superior Quality Control System
• 20years of Foundry Experience
• Partnership with Customers
• Track Record of Success
• Improvement Processes
• Customer Relationship
Management Processes
파운드리 경쟁력
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공정 포트폴리오
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응용분야
AUDIO
TABLET
AUTOMOTIVE
WEARABLE SMARTPHONE DATA SERVER
DRONE
AR/ VR
TV
SECURITY AI SPEAKER
NOTEBOOK
IoT
Analog/ Power
Mobile Security Medical Industrial
PMIC Motor Driver IC Wireless Charger DC-DC Converter
eFlash Mixed-Signal
TSC MCU
UHD LDI OLED TDDI
Audio Codec High Precision ADC Fingerprint Sensor WLAN CMOS PA Microdisplay
CIS High Voltage
CMOS
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공정기술 로드맵
LV (≤40V)
MV (≤45V)
HV (≤100V)
UHV (Non-Epi)
Development Planning
AN180(Non-Epi)
BD180LV(Gen2) BD180LVA(Gen3)
AN180LC BD180LV(Fab2)
BD180LVA(Fab2)
BD130LV(Gen1)
BD180LV(Gen4)
BD130LV(Gen2)
BD180MV
BD350
BD180X BD180XH BD130XH
UHV700 UHV700(Gen2)
BD180XH(Gen2)
BD180SOI
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공정기술 로드맵
0.18um
- Stitching
0.13/
0.11um
- Stitching
90nm
IL18SH X-ray, Line sensor
IL13SI
IL13SJ IL13SK
IL09SA
ToF : PPD (Mobile)
ToF : SPAD (ADAS)
Global Shutter
Development Planning
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공정기술 로드맵
0.18um
0.11um
0.11um
RF Front End
90nm
0.13um
eFlash
MS180
HP180 Low noise
MS18BC Low noise
MS18BD Low cost, Low noise
TS11SB Low noise
RF11SB Low noise
TS11SC Low noise/ULL
RF11SC(HRS)
MS18BE Low cost, Low noise
RF11SD & SE(HRS) RS13SA(SOI) RS13SA(SOI)
TS09SA Low noise
SE13SA TE13SB
Development Planning
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공정기술 로드맵
TV
IT
Mobile
LD350 LD160 LD150 LD130
LD180 LD160
LD110 LD110
LD160 LD110
SJ MOSFET(Gen2) 600V/650V/700V
SJ MOSFET(Gen3) 600V/650V
IGBT 1200V Automotive
Microphone(Gen4) Microphone(Gen1) Microphone(Gen2) Microphone(Gen3)
Micro Heater
Development Planning
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Design Environment
Design Infra Application Specific IP
Reference Design Flow
Partner Companies
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YourFabTM Service
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ShuttleChipTM Service
0.11um
0.11um
0.13um
0.15 ~ 0.18um
Tape-out start date
* The shuttle schedule might be changed or canceled if the minimum number of paid seat has not been filled. * Schedule for some ShuttleChip may change due to un-foreseen circumstances, so please contact your account manager for updated schedule. * DB check will be cleared within 7 days before tape-out.
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주요 인증
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