NEP14-01E
Low-Ag/Ag-free solder pastes with lower void
LS720V Series
Features
Specifications
● Reduces voids by improving �uidity of �ux during solder melting● Reduces voids even in bottom surface electrode type components by improving solder wettability ● LS720V �ux which can be used for low-Ag/Ag-free alloys
● Main reason of void formation and the measure
● Comparison of crack progression between Sn-Cu-Ni-Ge and M773
● The effect of LS720V is observed in suppressing void formation
● Joint strength improved with the addition of Bi and Ni (compared to 0% Ag material)
● Effect of Ni addition
Although voids are tend to occur when bottom surface electrode type components such as QFN frequently, it can be reduced by LS720V
100% Crack progression Approximately only 30% crack progression
Replacing Cu with Ni makes the construction of the bonding surface �ner and thus increases strength
Cycle conditions: -40℃ to +125℃, after 1000 cycles
Surface treatment: Cu-OSP
Bottom surface electrode
Conventional product LS720V product
Appearance of QFN
Improvement
Without Ni
Reflow: 1time
Reflow: 4times
With Ni
PWB
QFN
SolderVoid
Conventional product LS720V Conventional product LS720V
4mm QFN 8mm QFN
50
40
30
20
10
0
Void
are
a ra
tio (%
)
● Development of Ag-free/M773 alloy
M705M40M47M773
Price
Lowerprices
2000 2010 2013
Achieves Ag-free while confrming reliability
Solder paste
M705
M40
M47
M773
3.0% Ag
1.0% Ag
0% Ag
0.3% AgSn-3.0Ag-0.5CuSn-1.0Ag-0.7Cu-1.6Bi-InSn-0.3Ag-0.7Cu-0.5Bi-NiSn-0.0Ag-0.7Cu-0.5Bi-Ni
Stre
ngth
(N)
Number of temperature cycle (Cycle)
M705;SAC305M773
Sn-Cu-Ni-Ge
M773;Sn-Cu-Bi-Ni80
70
60
50
40
30
20
0 200 400 600 800 1,000 1,200 1,400 1,600
-40℃/30min ⇔ +85℃/30minEvaluation using chip resistors
Sn-Cu-Ni-Ge M773
Voids are caused by reducing gas from residual �ux and poor solder wettability
Sufficient quantity of solder and excellent fusibility that makes mounting of 0201-type chip components possible
NEP14-02E
M705-RGS800HF Type6
Features
Specifications
● Suf�cient solder quantity ensured by using Type 6 size �ne powder● Newly developed highly active �ux facilitates removal of oxide �lm● Uniquely developed �ux suppresses reoxidation in re�ow
● Printing on a pattern with openings φ130µm in diameter and a mask 60 µm in thickness with various types of powders
● Flux developed along with �ner solder powderSolder paste for 0201-type chip components
Type 6 ensures suf�cient printing
0402-type component mounting 0201-type component mounting
Component supplier: Murata Manufacturing Co., Ltd.
With Type 6 powder, the surface area and the oxide �lm area are doubled compared to Type 5 powder
Type4
Type4
Type4
Type5
Type6
Type6
Type4
Insufficient printing with too much flux
Fusion defect
Halogen-free
Conventional �ux RGS800
Narrower pitch
● Type 6 powder is necessary for land patterns for 0201-type chip components
● Ultra-high density mounting made possible by mounting of microscopic components
Suf�cient solder quantity cannot be obtained with large solder particle size
Type4
Type6
Insufficient printing
Sufficient printing
Type4
Average particle size:Approx. φ30 µm
Type5
Average particle size:Approx. φ20 µm
Type6
Average particle size:Approx. φ10 µm
Type5
Insufficient printing with too much flux
Type6
Sufficient quantity of printing
● Finer solder powder proportionate to smaller land area
Solder paste for 0201-type chip components
Type4
Type5Type6
Sold
er p
owde
r dia
met
er
0603-type 0402-type 0201-type
Land area
Φ30μm
Φ20μm
Φ10μm
Development
2000
2020
2010
1005-type 0603-type 0402-type 0201-type
GRN360
GWS
S70G
RGS800
RGS800
● Fusion defects are caused with a paste consisting of Type 6 powder and conventional �ux
Promises good wettability despite being Ag-free
NEP14-03E
NEO2 M24AP
Features
Specifications
● Quick initial wetting with the use of fast acting active agents ● Smooth wet spreading achieved by improving �uidity of �ux● Highly heat-resistant activator makes good detachability possible
● Enables Fast soldering
● Highly heat-resistant activator inhibits formation of spikes and bridges
● Good results compared to Sn-Cu-Ni-Ge
● Mixture of different types of materials does not cause problems
● High reliability and Ag-free realize the lower price
Achieves Ag-free while con�rming reliability
2000 2010 2015 2020
Flux cored
Paste
M705M794
M35
M40
M24AP
M47
M773
3.0% Ag
1.0% Ag
0.3% Ag
0% Ag0% Ag
0.3% Ag
5
4
3
2
1
0
NEO M24APSn-Cu-Ni-Ge-P
Sn-Cu-Ni-Ge
NEO M24AP
Sn-Cu-Ni-Ge-P
Sn-Cu-Ni-Ge
NEO M24APSn-Cu-Ni-Ge-P
Sn-Cu-Ni-Ge
50
45
40
35
30
25
20
15
10
5
0
100
90
80
70
60
50
40
30
20
10
00 1 3 5 10 20 50 80 90 95 97 99 100NEO M24AP
Sn-Cu-Ni-Ge-P
Sn-Cu-Ni-Ge
Price
Lowerprice
Insulation reliability
Wetting speed
Wetting spread
Heat resistance
Scattering resistance
Color appearance
Cost
Smoke
Shorter time = Improves working efficiency = Realizes cost cuts = Contributes to energy saving
Working ef�ciency up by 33%
Time reductionby 33%
Elapsed time 0s 0.5s 1.0s 0.5s
Tens
ile s
treng
th [M
pa]
Brea
king
elo
ngat
ion
[%]
M24AP Mix Ratio
Tensile strengthBreaking elongation
Choose the optimum chip solder from among three types
NEP14-04E
Chip solder
Features
Specifications
● They come in tape and reel packaging which allows simultaneous automatic placement on surface mount devices● Melts in tandem with solder paste, requiring no additional soldering● Provides an appropriate amount of solder to ensure high connection reliability
Chip solder
Solder preform Flux Highly viscose flux
·Mounted and fused on solder paste
·Low price type
·Improved solder wettability·Inhibits reoxidation in re�ow ovens·Allows air re�ow soldering
·Directly mounted and fused on copper lands or components
Flux coated chip solder Type A
Flux coated chip solder Type B
● Choose from among three types that applies to your intended use
(unit: mm)
l
±0.05
±0.1
±0.1
±0.1
0402
0603
1005
1608
±0.05
±0.1
±0.1
±0.1
w
±0.05
±0.05
±0.05
±0.05
t
Reference exhibit
● Automatically mounts chip solder, which melts simultaneously with solder paste
Solder pasteprinting
Componentmounting
Re�ow
Chip solder
Chip soldermounting
Solder pasteprinting
Componentmounting
Re�ow
● For joint reinforcement of large components
Componentmounting
Land Solder paste
Solder pasteprinting
Largecomponent
Largecomponent
Chip solder
Solderingcomplete
● Improves mounting precision by smoothing the suction face
Air enters when the suction ace is curved,weakening the suction force
No air enters when the suctionface is �at and the suction face is strong
Chip solder
Air Air
Chip solder witha smooth
suction face
Smoothing of thesuction face
Improvement ofmounting precision
* Smooth suction face design is available in sizes smaller than the 0603-size type* Patent pending
● Chip solder dimension tolerance
Form 120µm-pitch bumps with Φ4μm alloy powder
Solder Paste for Bump Forming BPS Series
NEP14-05C
Features
Specifications
● Excellent sticking characteristic forms �ne bumps in each process● Realizes excellent melting characteristic even when Type 7 or �ner powder● Good solder wettability enables bump formation with fewer voids
● Trend towards �ne pitch
● Pitch sizes and bump formation in various supplying methods
● Excellent �ux prevents heat sags and forms good bumps
● Even though �ne powder, still has good wettability and forms bumps with fewer voids
● Forms good bumps even when using paste with �ne powder because of excellent melting property
● Forms 120 µm pitch bumps with φ4µm alloy powder
Metal mask Type 7 (φ1 to 10 μm) Type 7 or �ner (φ1 to 6 μm)
120 µm pitch printing
Opening size
Solder
Narrower and thinner
Mask opening size
Conventionalproduct
Conventional product
Preheating
180˚C-3min
Preheating
180˚C-3min
BPSseries
BPS series
After printing Bump formation after re�ow
Uniquely developed �ux prevents oxidation
MovementRolling
Movement
Stencil Pressurization
RollingMovement
Dry �lm
Type 7 or �ner90 to 150 mm pitch
Type7110 to 180 mm pitch
Type6160 mm pitch or more
Dry �lm methodCartridge methodOpen squeegee method
NEP14-06E
A high-reliability WLCSP solder ball
M758
Features
Specifications
● Forms bumps with high joint strength on wafer electrodes
● Good wettability on copper plating such wafer electrodes
● Packaged M758 has excellent thermal fatigue resistance
● M758 forms bumps having high joint strength on wafer electrodes
● Good wettability on copper plating such wafer electrodes
● Packaged M758 shows good results in temperature cycle test
Failure mode5
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
SAC305 SAC405 M758
Shear height
CuPlating
Shear tool ShearFailure Mode Mode1
Pad Solder Solder & Interface Interface
Mode2 Mode3 Mode4
M758 forms bumps having high strength on the package level by the surface reforming effect of added Ni
The failure mode in every test is Mode 4: Interface failure
Stre
ngth
(N)
Shear Strength
1.3
1.2
1.1
1
0.9
0.8
SAC305 SAC405 M758M758 has good wettability for Cu plated package
M758 has excellent thermal fatigue resistance due to solid solution strengthening with Bi added compared to conventional products, such as SAC305 and SAC405.Also, M758 has drop impact resistance equivalent to or more than that of conventional products
Leng
th(m
m)
Spreadability test resultTesting method
Reflow oven(245℃) O₂;<200ppm
Flux
Cu plating
Measured location
Measuredlocation
99.9
10
1100 1,000 10,000 100 1,000 10,000
99.9
10
1
TCT Drop
Accu
mul
atio
n ra
te.%
Cycle number Drop number
Accu
mul
atio
n ra
te.%
ProductName Composition Melting
Point (%) Note
M705 SAC305 217-220 Pb-free Standard
M710 SAC405 217-229
M758 205-215 Suitable material for WLP
S/F : Cu WLCSP : Size 7 x 7mm
Cu core ball facilitate 3D packaging and narrow-pitch mounting
Cu Core Ball
Features
Specifications
NEP14-07E
● Ensures space to easily realize a highly-reliable component-built structure● Enables narrow-pitch mounting that can be performed through Cu pillar mounting using existing equipment● Promises high heat dissipation and electromigration countermeasures
● Ensures space through its multilayer structure with a Cu core
● Cu core ball facilitate 3D packaging
Cu ball
Solder plating
Cu ball
Ni plating
Solder plating
Cu core ball (spacer)
The Cu core ball ensure space to easily realize a highly-reliable component-built structure
Realizes good drop resistance Exhibits a temperature cycle equivalent to that of a conventional product
● Characteristics
● Enables narrow-pitch mounting without short circuit risk with existing equipment
● Drop test and temperature cycle test
PKG
PCBPCB
PKG
PCB
PKG
Solder ball
Cu core ball
Superior electromigration resistance
Temperature cycle test
Ensures appropriatespace
Inclination
Short
PCB
PKG
Cu has good thermal conductivity
PCB
PKG
PCB
PKG
Electromigration Ensures space Heat dissipation
Solder platingCu plating
Eliminates the plating processes required in Cu pillar mounting
Cu pillar mounting Cu core ball mounting
Cu core ball
Drop Number
Cum
ulat
ive
Freq
uenc
y
Drop testC-Cu M90M705 (conventional product )
C-Cu M90M705 (conventional product)
Cycle Number
Cum
ulat
ive
Freq
uenc
y
1
10
100
1 10 100 10001
10
100
1 10 100 1000
NEP14-08E
A superactive low-volatile/high heat-resistant water-soluble flux for ball soldering
WF6317
Features
Specifications
● Mounts solder balls with good squeezing property and ball holding force
● No �ux residue after washing with warm water at 40˚C
● Low-volatile �ux inhibits contamination of re�ow ovens
Solder ball
Flux printing Flux transfer Ball mounting Ball fusion and bondingFlux
Suction head
Suction head
Suction headSuction head
Package
Suction head
Package
Suction head
● Washing with water within 8 hours after mounting can remove �ux residue
Washed after 0h Washed after 4h Washed after 8h Washed after 12h
Residue
Washingwith water
No flux residue
● Excellent wettability even on Cu-OSP PBC
WF-6317 Conventional flux
Res
idue
(%)
100
50
0250Reflow temperature (˚C)
Low-volatile fluxWF-6317
Low-residue flux
Residue-free flux
● Low viscosity and high tacking power stabilize ball holding force and ensures excellent solder wettability● Easy to wash out water-soluble �ux which can be used for Pb-free re�ow soldering at 250˚C● Prevents and inhibits contamination of re�ow ovens with low-volatile �ux
NEP14-09E
Achieves excellent heat dissipation characteristics in horizontal packaging that suppresses void formation
Solder Paste Containing Ni Balls
Features
Specifications
Increased voids Decreased electrical resistance
and heat dissipation
Uniform thickness Void reduction High quality alloy
● Suppresses cracks caused by solder thickness or inclination and achieves soldering with high heat dissipation● Bare chips without inclination enable highly reliable wire bonding● Suppresses voids by an originally developed method by optimally blending Ni balls of a uniform size
● Solves problems with power device mounting
● Originally developed Ni balls of a uniform size allow high heat dissipation
● Optimal formulation of Ni balls suppresses void formation
● Achieves horizontal mounting using solder paste with Ni balls
Solves problems with power device mounting
Normal solder pastes have a risk of inclination of chips
Air layers in cracks inhibit heat conductivity and reduce heat dissipation
Ni balls reduce variation in solder thickness
Solder thickness at each measured point
Printing Mounting Fusion
Printing Mounting Fusion
●Without Ni balls
Good heat dissipation●With Ni balls
Solder paste with Ni balls allows horizontal packaging by using spacer effects
Development of Ni balls of a uniform size
Spacer With spacer Without spacer
Development oforiginal paste
Development of various alloysaccording to intended use
Sold
er th
ickn
ess
[µm
]
With Ni balls Without Ni balls
Solder
Solder
Powder
Chip
PCB
Powder
Bare chipPreform
Ni ball
Ni ball
Crack causedby inclination
Crack due tothin solder layer
Ni ball
Semiconductor device
Insulated substrate
Heat sink
Cracks generated at thin portions during cooling cycle
Selection of a solder alloywhich can withstand severe conditions
The chip is inclined and the solder thickness is uneven
Ni balls secure standoff for parts
NEP14-10E
Void-free soldering with residue-free paste
NRB70
Features
Specifications
● Achieves void-free soldering of power devices with the vacuum re�ow oven SVR-625GT
● Changing heat-evaporating materials decreases the �ux residue ratio to 5% or less and realizes no-clean solder paste
● Residue-free and excellent wettability even with N2 re�ow oven
● Residue-free mounting of �ne pitch microscopic components made possible with Type 5 powder and NRB70H
● No interference with repletion of under�ll in BGA mounting
Degree of vacuum (Pa)
ø200 µm dot printing part 0.4 mm pitch part 0603 -type component
20
15
10
5
0No vacuum 30000 20000 10000 5000
Paste: M705-NRB70
Void
are
a ra
tio %
The void area ratio is decreased to 1% by controlling the degree of vacuum
Resi
due
(%)
100
50
0250Reflow temperature (℃)
Low-volatile flux
Low-residue flux
Residue-free fluxNRB70
Residue-free = Residue ratio is 5% or less(defined by SMIC)
General-purpose paste
Residue-free paste
Oxygen density: 1500 ppm or less
φ200 µm dot printing part 1005 -type chip component
● Vacuum re�ow oven SVR-625GT realizes void-free and residue-free soldering● Achieves highly reliable soldering with residue-free and no-clean solder paste● No cleaning liquid reduces environmental burden and realizes lower price
NEP14-11E
Ideal as a lead-free high-temperature solder alternative
Ag Nano Paste
Features
Specifications
● Sinters and binds at 250℃ and does not remelt at temperatures of up to 960℃, which is the melting point of Ag
● Ohmic contact with resistance values similar to that of silver
● Sintered state
● Photos of Ag nano sintered body
● Performance list
● Applicable to various uses by taking advantage of paste that does not remelt at temperatures of up to 960℃
Best for mounting of power modules and LEDs of which operating temperatures are high For LEDs of which
operating temperatures are high
For die bonding of devices
For internal connection in 3D mounting
Adjacent particles reduce surface area and join with one another (necking)
Protects with organic molecules to prevent sintering at room temperature
The protective layer is decomposed at 250℃
25
20
15
10
5
0
Ag nano paste Ag nano paste
PCB
Bare chip
Sintering
Ag Sn Conductive paste Ag nano paste
Comparison of speci�c resistance values
Spec
ific
resi
stan
ce v
alue
/ µΩ
・cm
Item
MetalSintering
temperatureForm
Particle sizeViscosity
Specific resistance valueInsulation resistance
Migration(85℃,85%RH)
Flux content
Tackiness
12
345678
9
10
Powder
Paste
Silver nano particle200 to 300℃
Thin foil< 300mm
30 to 100 Pa·s< 10µΩ·cm
1×1010 Ω or moreNo occurrence
(1000h)10 to 12%
1.0N
- - - -TG-DTA
(differential thermal analysis)SEMSEM
RheometerResist mat
Based on JIS Z 3284Based on JIS Z 3284
TG-DTA(differential calorimetry)Based on JIS Z 3284
Performance Test method
Ag nano sintered body
Cu
Si
Ag nano sintered body
● Sinters and binds at 250℃ and does not remelt at temperatures of up to 960℃, which is the melting point of Ag● Ohmic contact with resistance values similar to that of silver● Can be supplied both for printing and dispensing
NEP14-12E
Features
Specifications
New alloy with excellent thermal fatigue characteristics developed for automotive industry (ECU)
Solder Paste M794 Series
● Comparison of the crack growth after Thermal Cycle Test
● Microstructure of M794 as re�ow
● Distribution of the crack growth ratio after 2000 cycle Thermal Cycle Test
Crystal Grain became coarse by TCT in SAC305
[SAC305]
Sn-3Ag-3.0Bi-3.0Sb-Ni-x
Cra
ck G
row
th R
atio
(%)
–40℃/30min ⇔ 125℃/30min
Number of cycles (cycle)
Shea
r stre
ngth
(N)
● Comparison of thermal fatigue resistance between alloys
● Addition of Ni +x limits the coarsening of the formation and blocks crack growth elements
Cycle
100
80
60
40
20
00 500 1,000 1,500 2,000 2,500
3216CR,–40℃/30min ⇔ 125℃/30min
Cra
ck G
row
th R
atio
(%)
M794SAC305
SAC305
100
80
60
40
20
0M794
100
80
60
40
20
0
Initial TCT 3,000cyc
M794 keep the fine grain scale after TCT
[M794]Ni and x added
Initial TCT 3,000cyc
Solid solution elements Bi and Sb are added to Sn-Ag-Cu eutectic composition to improve the mechanical strength. Also, Ni and x are added to inhibit coarsening.
(n=11 samples)
● High proof thermal fatigue is realized by using an effect of solid solution and intermetallic compounds● The electric connection is maintained by prevention of crack progress● Halogen free paste is available● Options for nitrogen and air re�ow are available
M794
M705
60
50
40
30
20
10
00 500 1,000 1,500 2,000 2,500 3,000 3,500