PCB Report 2015 Movements on the global markets
of PCB-related products Purpose: To provide basic data on the global PCB-related markets.
Publication Date: October 30, 2015
Format: A4 Size 224 Pages
<Prices>
*210,000 JPY (Only a Bound Book)
*230,000 JPY (a Bound Book and a CD) Chapter 0: a General Outline of the Global PCB Market
Chapter 1: Global PCB Market Size & Forecast
Chapter 2: PCB Materials
Chapter 3: PCB Manufacturing Equipment
Chapter 4: PCB Manufacturers Case Studies
Japan Marketing Survey Co., Ltd. 3-10-14 Higashi-Nihonbashi, Chuo, Tokyo,
103-0004 JAPAN
TEL: +81-3-5641-2871 FAX: +81-3-5641-0528
E-Mail: [email protected]
Web Site: http://www.jms21.co.jp/
Table of the Contents
A General Outline of the Global PCB Market
Chapter 1 Global PCB Market Size & Forecast
1. Market Forecast for PCB by Applications
1.1 Overall ········································································································ 4
1.2 Single Sided PCB ························································································· 6
1.3 Double Sided PCB ························································································ 8
1.4 Multi Layer Board (4-10 Layer) ······································································ 10
1.5 Multi Layer Board (12-20 Layer)····································································· 12
1.6 Multi Layer Board (22 Layer and over) ···························································· 14
1.7 HDI ·········································································································· 16
1.8 IC Substrates ····························································································· 18
1.9 FPC & R/F PCB·························································································· 19
1.10 Others ···································································································· 21
2. Market Forecast for PCB by Types
2.1 Overall ······································································································ 23
2.2 PCB for Computer ······················································································ 25
2.3 PCB for Mobile Phone ················································································· 27
2.4 PCB for Communication Equipment for Infrastructure········································· 29
2.5 PCB for Consumer Devices ·········································································· 31
2.6 PCB for Automotive ····················································································· 33
2.7 PCB for Industry ························································································· 35
2.8 PCB for Aerospace & Defense Equipment ······················································· 37
2.9 IC Substrates ····························································································· 39
Major Manufacturers’ Share of the Global PCB Market
1. Sales Amount of PCB Manufacturers by Applications in 2014
1.1 Overall ······································································································ 41
1.2 Single Sided PCB ······················································································· 49
1.3 Double Sided PCB ······················································································ 51
1.4 Multi Layer PCB ························································································· 53
1.5 Multi Layer (4-10 L) PCB ·············································································· 56
1.6 Multi Layer (12-20 L) PCB ············································································ 59
1.7 Multi Layer (22 L & Over) PCB······································································· 62
1.8 HDI ·········································································································· 65
1.9 IC Substrates ····························································································· 70
1.10 FPC ······································································································· 73
1.11 Others ····································································································· 76
2. Sales Amount of PCB Manufacturers by PCB types in 2014
2.1 Overall ······································································································ 78
2.2 PCB for Computer ······················································································ 80
2.3 PCB for Mobile Phone ················································································· 82
2.4 PCB for Communication Equipment for Infrastructure········································· 84
2.5 PCB for Consumer Devices ·········································································· 86
2.6 PCB for Automotive ····················································································· 88
2.7 PCB for Industry ························································································· 90
2.8 PCB for Aerospace & Defense ······································································· 92
2.9 IC Substrates ····························································································· 94
Chapter 2 PCB Materials
1 Copper Clad Laminate (CCL)
1-1 Classification and description of CCL ······························································ 97
1-2 Manufacturing site and capacity of major CCL manufacturers ······························ 98
1-3 Market Scale Forecast ··············································································· 100
2 Electro deposited copper foil
2-1 List of Major manufacturers ········································································ 101
2-2 Manufacturing sites and production capacity of major manufacturers ·················· 101
2-3 Price range (2014) ···················································································· 102
2-4 Market size, actual and forecast for 2013 through 2020 ···································· 102
3 Dry film photoresist for the patterning
3-1 Manufacturers list ····················································································· 103
3-2 Production sites and capacity of major manufacturer ······································· 103
3-3 Major Manufacturers’ Movements ································································ 104
3-4 Price range (2014) ···················································································· 104
3-5 Market size, actual and forecast for 2013 through 2020 ···································· 105
3-6 Market Share by Types (2014) ···································································· 105
4 Solder Resist
4-1 Major manufacturers list ············································································· 106
4-2 Production site and capacity of major manufacturers ······································· 106
4-3 Price range (2014) ···················································································· 107
4-4 Market forecast for photosensitive solder resist ··············································· 107
4-5 Market forecast for Thermal Cure & UV cure solder resist ································· 108
5 Copper plating
5-1 Market Scale Forecast ··············································································· 109
5-2 Sales Amount of Major Manufacturers in 2014 ················································· 110
Chapter 3 PCB Manufacturing Equipment
1 Direct Imaging Machine
1-1 Market Overview ······················································································· 113
1-2 Model List ································································································ 113
1-3 Market Scale Forecast: 2010-2018 ································································ 114
1-4 Manufacturers Sales Amount: 2013-2014 ······················································· 115
2 Full Auto Exposure Machine
2-1 Market Overview ······················································································· 116
2-2 Model List ································································································ 116
2-3 Market Scale Forecast: 2013-2020 ································································ 117
2-4 Sales amount of Major Manufacturers ···························································· 118
3 Laser Drilling Machines
3-1 Outside Appearance of Laser Drilling Machines ·············································· 120
3-2 Global Laser Drilling Machine Market Size and Forecast, 2012 - 2019 ················· 121
3-3 Manufacturers’ Share of the Global Laser Drilling Machine Market in 2014 ··········· 123
3-4 Average Selling Prices of Laser Drilling Machines in 2014 (Reference Information) 126
4 Mechanical Drilling Machines
4-1 Outside Appearance of Mechanical Drilling Machines ······································ 127
4-2 Global Mechanical Drilling Machine Market Size and Forecast, 2012 - 2019 ········· 128
4-3 Manufacturers’ Sales in the Global Mechanical Drilling Machine Market and Their
Share of the Market in 2014 ······································································· 130
4-4 Average Selling Prices of Mechanical Drilling Machines in 2014 (Reference Information)
·················································································································· 140
5 Automated Optical Inspection Machine (AOI)
5-1 Market overview ······················································································· 141
5-2 Model List ······························································································· 141
5-3 Market Scale Forecast for AOI: 2012-2020 ···················································· 142
5-4 Sales amount of Major Manufacturers ··························································· 143
6 Bare Board Tester
6-1 Market Overview ······················································································ 144
6-2 Model List ······························································································· 144
6-3 Market Scale Forecast for bare Board Tester ·················································· 145
6-4 Sales amount of Major Manufacturers ··························································· 146
Chapter 4 PCB Manufacturers Case Studies
*AT & S Austria Technologie & Systemtechnik Aktiengesellschaft ··································· 151
*Chin-Poon Industrial Co., Ltd.················································································ 154
*CMK CORPORATION ························································································· 157
*Compeq Manufacturing Co. Ltd. ············································································ 159
*Daeduck Group ·································································································· 162
*Fujikura LTD. ····································································································· 166
*Gold Circuit Electronics Ltd. ·················································································· 167
*HannStar Board Co., Ltd. ····················································································· 170
*IBIDEN CO., LTD. ······························································································· 173
*Kingboard Chemical Holdings Ltd. ········································································· 175
*Kinsus Interconnect Technology Corporation ···························································· 178
*KYOCERA Circuit Solutions, Inc. ··········································································· 181
*LG Innotek Ltd. ·································································································· 183
*Meiko Electronics Co., Ltd. ··················································································· 185
*Multek Corporation ······························································································ 187
*Multi-Fineline Electronix, Inc.················································································· 190
*Nan Ya Printed Circuit Board Corporation ································································ 191
*NIPPON MEKTRON. LTD. ···················································································· 194
*Samsung Electro-Mechanics Co., Ltd. ···································································· 195
*SHINKO ELECTRIC INDUSTRIES CO., LTD. ·························································· 198
*Simmtech Co., Ltd. ····························································································· 200
*SUMITOMO ELECTRIC PRINTED CIRCUITS CO., LTD. ··········································· 203
*Taiwan PCB Techvest Co., Ltd. ·············································································· 204
*Tripod Technology Corporation ·············································································· 207
*TTM Technologies, Inc. ························································································ 210
*Unimicron Technology Corporation ········································································· 213
*WUS Printed Circuit Co., Ltd. ················································································ 216
*Young Poong Group ···························································································· 219
*Zhen Ding Technology Holding Limited ··································································· 222
Sample Contents
[Application Form]
FAX to +81-3-5641-0528. Date: To: Japan Marketing Survey Co., Ltd.
Report Title: PCB Report 2015
Corporate Name:
Applicant’s Name:
Applicant’s Department:
Corporate Address:
TEL: FAX:
Email:
Total Cost: JPY
Card Type:
Card Number:
Name on the Card:
Expiration Date:
Signature:
<NDA> In case you purchase a soft copy, please put the corporate name and the applicant’s signature
in the blanks below.
promises not to release the contents of the report above to
a third party without obtaining written consent from Japan Marketing Survey Co., Ltd.
A Corporate Manager’s Signature:
For Those Who Prefer Wire Transfer
Please remit the payment to the following bank account:
Bank: MIZUHO BANK (Swift code: MHCBJPJT)
Branch: Kobunacho Branch (Phone: 81-3-3661-3111)
Branch code: 105
Branch Address: 8-1 Nihonbashi-kobunacho Chuo, Tokyo
103-0024 JAPAN
Account Number: 105-1653912
Account Name: Japan Marketing Survey Co., Ltd. Please make the payment in 15 business days.
Please transfer the payment the way the amount above will be deposited in our account.
Informative Matters
