Download - R&D lines @ IFCA
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Jornadas Futuros Aceleradores, Barcelona May8th ‘09
R&D lines @ IFCA
Iván Vila Álvarez Instituto de Física de Cantabria
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Main Actors, Roles & R&D communities
Physicists: Celso Martínez, Alberto Ruíz, Marcos Fernández, Amparo L. Virto & Iván Vila
Students: Jordi Duarte + new student. Engineer: David Moya (mechanics),
Richard Jaramillo (electronics) and J. Gonzalez (software).
R&D playgrounds: EUDET, SiLC, CEC (CMS upgrade), Spanish groups.
2Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
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3Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
Outline: R&D lines
R&D on sensors Improved IR-semitransparent sensors. Thin micro-strips sensors. Strixels sensors
R&D on mechanics Integration of Fiber Optic Sensors on CF composites Mechanical design and FEA simulation.
DAQ software DAQ integration with EUDET pixel telescope (EUDAQ)
Facilities Outlook and next steps
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R&D on Sensors4Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
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5Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
RD on Sensors: IRuS for alignment
Statement of the issue: Real time position monitoring of the tracker during
detector operation with a few microns accuracy. Reference laser lines going through tracker’s sensors. Name of the game, increase the IR transmittance of
the microstrip sensors introducing minimal modifications to the sensor layout: same materials, avoid fine tuning.
R&D targets: ILD FTD, SiD tracker, CMS tracker upgrade.
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6Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
RD on Sensors: IRuS for alignment (2)
1st Validation of optical simulation software with material samples. (done)
2nd Babysensor baseline design (p on n; AC coupling, 50 um pitch) minimal design modifications to boost sensor IR transmittance. (done)
3th Production of IR mini-sensors. (on progress) 4th Bench and beam testing of sensors 5th Know-how transfer to main vendors.
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Difference calibrated-fitted thickness= 2 nm
• Simulation predicts calibrated thickness of 6 calibrated bands of SiO2 [d=0-500] nm on a 1-sided polished Si wafer,
from Ocean Optics
• Si characterized from 1st band (not shown)
Difference calibrated-fitted
thickness= 1 nm !!
CEC Meeting, Apr 09 - Marcos Fernandez -IFCA 9
Validation of the optical simulation (1)
7Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
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CNM wafer + diffraction Al pattern, using GICSERV07 access.
40 diffraction orders45 nm Al roughness
CEC Meeting, Apr 09 - Marcos Fernandez -IFCA 12
Validation of Full Optical Simulation (diffraction pattern)
8Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
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IR transparent mini-sensors Final-Design
Currently being produced (GICSERV08)
9Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
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R&D on sensors: thin ustrips
GICSERV09 access on ustrip thin sensors.
Direct wafer bonding and deep anisotropic etching.
Aim: frame layout design, FEA analysis, mechanical characterization of dummies, bonding tests, bench & test beam testing.
R&D Targets: CMS upgrade
11Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
Figure 2: Thinning of double-sided processed detectors. See text and ref. [6] for further details.
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R&D on Sensors: CMS upgrade HPK Run
12Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
AachenDESY
HamburgKarlsruheLouvain
SantanderViennaVilnius
Warsaw
Pixel cells
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R&D on sensors: HPK sensors
13Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
6 each
6
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14Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
R&D on Mechanics
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System DesignForward Tracker Disk @ ILDOuter layers already on official ILD full simulation geometry.
15Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
R&D on mechanics (1)
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R&D mechanics: Alignment Requirements
LICTOY tracking simulation software from HEPHY
16Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
SiD LoI geometrySingle muon events.
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R&D on mechanics: Alignment requirements
17Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
DPt/Pt vs. alignment errors 1um, 7um, 10um (5um nominal)
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18Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
R&D on mechanics(2): SMART structures
Well know monitoring technologies in aeronautics and civil works based on optical fiber sensors (OFS)
Distributed strain & temperature sensors are conventionally used for structure health monitoring : SMART structures
Other OFS for acceleration & radiation dose and rate.
In aeronautics (embedded or bonded) on the of the CFRP composite ( for instance, plane radar redome)
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19Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
R&D on mechanics: Bragg grating
Fiber Bragg Grating optical transducer very common to measure strain and temperature
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R&D on mechanics: Bragg grating
21Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
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OFS & FBG advantages
22Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
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23Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
Integrating OFS & carbon fiber composites
For the Track structure would be interesting to use a embedded fiber optic sensor. more precise and reliable data
It could be use 2 side solution Better understanding of the
results Useful to quantify the thermal
strain
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Plans
R&D Targets: ILD, SiD, SCMS, SBelle Current activities:
Market survey and contact with OFS vendors Contacting CF producers (Inta, Fermilab,…)
Next activities: Testing of standalone OFS. Prepare CFRP test samples with embedded OPS Preparing some CF test structures with bonded or
embedded fibers. Mechanical and thermal characterization of the test
structures.
24Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
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25Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
R&D on Daq S/W
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DAQ software : EUDAQ Framework
Integration of SiLC and CMS APV25 r/o software with EUDET telescope f/w.
As members of the EUDET project we have been active users of the “EUDET pixel telescope” .
We have carry-out the its integration with other daq and trigger DUT (thanks to EUDAQ software from the University of Geneva)
26Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
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CmdReceiver
CmdReceiver
DataReceiver
CmdReceiver
CmdReceiver
DataSender
GUI CmdSender
LogServer
CmdServer
HardwarePolling
DataServer
LogReceiver
Storage
Run Control
Logger
Producer
MonitorData Collector
Hardware
DataMerge
Storage
GUI
GUI
M
N
1
1
1
DataSender
MN
Application
Thread
Buffer
Key:
ListeningSocket
Command Data
Logging
Signal/data
Hierarchy, distribution and communication between applications:
• DAQ software: C++• Communication: POSIX• GUIs: Qt• Online Monitor: ROOT
• Runs on Mac OS X, Linux, and Windows (using cygwin).• Highly modular. Easy integration of devices into the DAQ.
EUDAQ FRAMEWORK
27Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
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Short-term Outlook
In 2009: Increase our participation on SiD and ILD tracking
groups. The IR alignment sensor fully tested with laser and
source test bench using ALIVABA electronics. Maybe test beam.
Thin sensors produced, mechanical dummies tested. Improved mechanical design. OFS proof of principle for tracking deformation
monitoring. HPK order in production. SCMS and SiLC test beams.
28Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
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THANK YOU
29Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
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BACKUP30Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila
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Naïve FEA model
Simple Geometry with frame + thinned area.Support: Four corners fixed.All Silicon structureMeasured dummy structure shows 20 um bow
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Naïve FEA: gravitational bend
Gravity parallel to Z axisDeformation in Z directionMax deformation 12 um
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Naïve FEA: Longitudinal (X) strain
Top surface
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Naïve FEA: Transversal (Y) strain
Top surface
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Naïve FEA: Strain vs. Deformation
0.00E+00 5.00E-06 1.00E-05 1.50E-05 2.00E-05 2.50E-05 3.00E-050.00E+00
2.00E-05
4.00E-05
6.00E-05
8.00E-05
1.00E-04
1.20E-04
1.40E-04
Z DOF / X STRAIN DIFERENT g´s
X STRAIN
Z DO
F
0.00E+00 5.00E-06 1.00E-05 1.50E-05 2.00E-05 2.50E-05 3.00E-050.00E+00
2.00E-06
4.00E-06
6.00E-06
8.00E-06
1.00E-05
1.20E-05
Y STRAIN / X STRAIN DIFERENT g`s
X STRAIN
Y ST
RA
IN
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Naïve FEA: Conclusions
Gravitation bend depends linearly with top surface strain
Output values for nominal conditions: Maximum deformation of 12 um Maximum longitudinal strain about 2.5 me at the
middle of the DEPFET “frame”. Maximum transversal strain about 1 me at the middle
of the DEPFET “frame”.
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A possible commercial solution
Deformation monitoring with 750nm resolution
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An event cleaner/lighter solution ?
Several options: Embdeding of fiber sensors on suporting structures
(BTeV)
Or event much better, embedding the sensing element on the depfet frame,Integrating a Bragg grating on it, still studying its feasibility.
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Summary and next steps
FBG commercial sensor will provide 750nm monitoring resolution with small amount of extra material.
More realistic FEA simulations are still needed: thermal loads, better mechanical supports,…
Eventually, a realistic test with a mock-up will be needed.