2013/8/19

1

大氣電漿於織物之表面處理應用

馗鼎奈米科技股份有限公司 王亮鈞

LC_Wang@creating-nanotech.com

Tel: 06-2323927

2013.08.23

Plasma Cleaning Principles

Physical sputter

and/or

Chemical etching can be chosen

2013/8/19

2

電漿的作用-清潔

Scan 3次 Before plasma treatment Scan 10次

PET treatment

Air, 6M/min

粗糙度變大

電漿的作用-表面粗化

2013/8/19

3

Before plasma treatment

Surface analysis - ESCA

C1s spectrum of PMMA

COOH C=O

C-C

C-O

O-C=O

-[CH2-C-]-

CH3

C=O

O

CH3

|

|

|

|

C-N

電漿的作用-表面改質

After plasma treatment

Ions generated in plasma can be accelerated toward the substrate to physically bombard away the atoms of contaminants.

The physical sputtering rate increases as the plasma density, acceleration voltage or the mass of bombardment atoms increases. Physical sputtering is also enhanced by lowering the pressure to increase the ion energy.

Therefore, a high cathode bias will enhance the sputtering rate . H+ or H2+ will have little physical sputtering effect. Ar+ will have strong sputtering effect.

Physical sputtering by high energy ions

2013/8/19

4

Advantages: Highly efficient cleaning effect can be achieved. Gas consumption

rate can be very low. Disadvantages:

Non - selective etching by physical sputtering may induce over – etching problems. The products sputtered out may be highly unstable and tend to deposit again downstream, inducing the redeposition problem.

Operation: The effect of physical sputtering is increased as the pressure

decreases or as the cathode bias and Ar concentration increase.

Physical sputtering by high energy ions

e- + H 2 2H•

e- + O 2 2O• O•+ O2 O 3

Highly reactive free radicals generated in plasma may react with the hydrocarbon contaminants or surface oxide.

Both H• and O• can react with grease or oil on surface to form volatile hydrocarbons.

H• (g) + CnH2n+2(s) CH4(g)

O• (g) + CnH2n+2(s) CO(g) + CHxOy (g) + H2O (g)

O• is more reactive than H•. But O• may also react with surface metal to form oxide, deteriorating the material properties. And, H• can also reduce metal oxide back to metal.

H• + MeO Me + H2O

O• + Me MeO

Chemical reactions by free radicals

2013/8/19

5

Advantages:

Stable gas products are formed. There is no redeposition problem. High etching selectivity can be obtained.

Disadvantages:

Higher concentration of H2 or O2 is required to ensure an appropriate etching rate. H2 safety or O2 strong oxidation ability needs to be monitored.

Operation:

The effect of chemical reactions is increased as the pressure increases.

Chemical reactions by free radicals

Applications of Plasma

產業 應用

LCD 面板驅動IC貼合前 各水洗製程前、後

IC、LED wire bond前清潔 molding前清潔 die attach前清潔

PCB、FCCL 進溼式清洗槽前、後 Laser鑽孔後之膠渣去除

IC、LED、Wafer

殘餘光阻去餘

車產業 車門邊緣O-ring黏著前 車燈黏合上膠前 鈑金上烤漆前

其他 光學塑膠鍍膜印刷前 特殊薄膜塗佈前 各式基板表面需清潔、活化、改質

2013/8/19

6

常見的常壓電漿

Corona Partial discharge

High voltage, low power density

Arc Torch Low voltage, high current discharge

High gas temperature

Point source

3-D treatment

Dielectric Barrier Discharge Need dielectric layer

Filamentary discharge

2-D treatment

Atmospheric Pressure Glow Discharge Low voltage glow discharge

Low plasma temperature

Need inert gas (He or Ar)

2-D or 3-D treatment

常壓電漿在LCD業界的應用（一）

Module段

提昇ACF與面板端子間的附著力

COG COF

Plasma清潔 ACF黏貼 IC組裝

IC

Glass

端子

IC

ACF

Arc Torch

2013/8/19

7

常壓電漿在LCD業界的應用（二）

Array段

素玻璃清潔

去除玻璃表面光阻剝離後的有機殘留物

濕蝕刻前的基板表面親水性提昇

鍍膜前清除玻璃表面的有機物

提昇光阻與玻璃之間的附著力

去除乾蝕刻後的變性光阻

常壓電漿在LCD業界的應用（三）

Color Filter段 ITO濺鍍前的基板清潔

提昇色阻及over coat與基板間的附著力

Over Coat

Glass

Glass

ITO Film

Plasma

Glass

Resist

Plasma

CF(RGB)

Glass

Over Coat

Glass

Plasma

Plasma

Glass

2013/8/19

8

常壓電漿在LCD業界的應用（四）

Cell段

PI塗佈前的基板清潔

常壓電漿清潔

提昇表面潤濕性 水洗

常壓電漿清潔

去除殘留有機物 PI塗布

Plasma在LED的應用

一、支架

二、封裝製程

固晶/

黏晶

銲線/

打線

封膠

烘烤

切割

測試分類

包裝

Die

attached

Wire

bonding Molding

Plasma Plasma

Plasma

沖壓

支架電鍍

射出成型

Plasma

2013/8/19

9

應用實例：Touch Panel

應用實例：FCCL 出貨前清潔

2013/8/19

10

應用實例：FCCL -PI出貨前清潔

應用實例：PCB軟板

2013/8/19

11

4mm

設備運作示意圖

Plasma

HV

HV

Roller

Roll to Roll Plasma System

2013/8/19

12

常壓電漿在塑膠業的應用

增加塑膠布潤濕性 電池隔膜處理 PI鍍銅前處理

增加附著力 雙色射出 鞋底黏合 鍍膜前處理

粗化表面並提高表面能 表面清潔，去除吸附層（油污或水氣）

印刷前處理 比火焰法溫度低 PP, PTFE等材質亦可有效處理

家電業的應用

設計產品時可以使用新材料組合，以增加產品價值

利用電漿活化表面，射出成型時可將不同材料直接在模具內結合，增加產品的質感，減少射出後的加工步驟

可以使用水性顏料來印刷

減少工廠內的有機溶劑污染

2013/8/19

13

包裝業的應用

取代火焰處理 電漿可使被處理物表面能高於60 dyne/cm，所以，可以用水性墨水來印刷

活化塑膠表面以利水性墨水印刷

軟性包材之抗透氣處理

紙盒包裝 活化表面，減少膠合時的膠水用量

提高附著力：可以用低溫壓合，以節省能源成本

鋁箔前處理：去油脂，改善印刷與壓合作業性

醫藥業的應用

增加附著力 針筒組裝前處理

殺菌 藥液瓶封口前殺菌

醫療器具低溫殺菌

基材表面處理 親水處理：濾膜

活化處理：接枝

分解醫療廢棄物 利用高溫電弧分解廢棄物

2013/8/19

14

plasma

PECVD

PVD

DLC

TiN

Diamond

Plasma cleaner

Plasma desmear

Plasma asher

PECVD coater

AP plasma

Plasma jet

DBD N2 analyzer

Contact angle

電漿的應用

Thanks!

!