超越bios: uefi开发环境的更新换代 - intel developer zone...• pcd entries are used for...

超越BIOS: UEFI开发环境的更新换代

英特尔

平台软件基础架构部

开发经理田鹤

Copyright © 2006-2010 Intel Corporation

EDKII Training 2010Copyright © 2006-2010 Intel Corporation

•Other trademarks and brands are the property of their respective ownersSlide 3

Agenda

• UEFI Technical Specifications updates

• EDK II Changes

• Package

• Library Enhancements

• PCD – Platform Configuration Database



Standard Firmware Interfaces

• UEFI: Unified Extensible Firmware Interface– a new model for the interface

between the OS and platform firmware

• PI: Platform Initialization– Standardization: key to

interoperability across implementations

– Modular components like silicon drivers (e.g. PCI) and value-add drivers (security)

– Preferred way to build UEFI

Pla

tform

Initia

lization

PI Modular components

Hardware

UEFI-

enabled

OS

UEFI

Shell Legacy

OS

Option

ROMs

CPU PEI

Modules

C/S PEI

Modules

UEFI

• • •

UE

FI D

rive

r

DX

E D

rive

r

Co

mp

atib

ility

Su

pp

ort M

od

ule

UE

FI D

rive

r

BD

S

UE

FI D

rive

r

UEFI is Architected for Dynamic Modularity



Latest UEFI Specifications

• Platform Initialization (PI)

1.2 Spec

• Packaging 1.0 Spec

• UEFI 2.3 Spec

• Self Certification Tests

(SCT) for UEFI 2.1 Spec

• Shell 2.0 Spec

Advancements in firmware technologies continue to evolve. Join the UEFI forum www.UEFI.org

Pla

tform

Initia

lization

PI Modular components

Hardware

UEFI-

enabled

OS

UEFI

Shell Legacy

OS

Option

ROMs

CPU PEI

Modules

C/S PEI

Modules

UEFI

• • •

UE

FI D

rive

r

DX

E D

rive

r

Co

mp

atib

ility

Su

pp

ort M

od

ule

UE

FI D

rive

r

BD

S

UE

FI D

rive

r

http://www.uefi.org/



UEFI Specification Timeline

20102009200820072006

UEFI 2.0

PI 1.0

UEFI 2.1

PI 1.1

UEFI 2.3UEFI 2.2

EDK 1.01: UEFI 2.0

Shell 2.0

PI 1.2

Packaging 1.0

SCT UEFI 2.1

EDK 1.04: UEFI 2.1PI 1.0

Specific

ations

Imple

menta

tion

http://uefi.org

Open Source

EDK 1.05: UEFI 2.1+PI 1.0

SCTPI 1.0

SCT UEFI 2.0

EDK II: UEFI 2.3+PI 1.2+

EDK II: UEFI 2.1+PI 1.0

New



Agenda


• EDK II Changes

• Package





What Changed

• Philosophy of EDKII

– Support all UEFI and PI development needs

– Separate tool code from source code

– Build existing EDK modules

• Via EDK Compatibility Package (ECP)

– Package Definition File: DEC

• DEC defines package of modules

– FLASH Mapping Tool

– Move as much as possible to C code



Stand Alone Tools Project

• New project that contains common tools

– Single location for the source, documentation, and instructions

• Adds compatibility with GCC / OS X / Linux

– Microsoft / Windows* based tools still work

• C preferred for binary manipulation

• Python (free & portable) preferred for text manipulation

– Replaced EDK tools MakeDeps and ProcessDSC

– Also use for value added tools not required to build

• EDK II contains binary versions of tools

– Build executes tools directly from binary location

• Build performance improved with faster build tools• Record is ~30 seconds



New Directory Structure

- NT32 Emulation

2 Steps to Build>EdkSetup –-nt32

>Build -p

Nt32Pkg\Nt32Pkg.dsc

-a IA32



Agenda


• EDK II Changes

• Package





Modules

• A module is the smallest separate object

compiled in the EDKII. A module is a single

resultant .EFI file.

• Module examples:

– A UEFI/DXE driver

– A PEIM

– A UEFI application

– A Library



Package Philosophy

• As standards evolve there is a need

to target your development on the

set of standards you care about

• Solution: break the EDK II up into

“packages” and enable customers

to make their own packages.

• Only package together what is

needed



Packages• What is a Package?

– A Package is a group of 0 or more modules. Can be just definitions

– Example package concepts:• Drivers, libraries, and applications relating to specific

hardware

• Drivers, libraries, and applications relating to UEFI spec

– Modules within may be dependant on other packages for definitions or elements

• All modules will reference the “root” package

– Include files may also be contained in a Package.• Standard spec

• PPI

• Protocols



Package Examples

• Nt32Pkg – contains drivers

and applications required for

running over Windows.

• MdePkg – All industry

standards (UEFI, PI, ACPI,

SmBios, etc…), most base

library definitions (IE memory

access), and others with no

outside dependency.



Agenda


• EDK II Changes

• Package





Library Enhancements for EDK II

• Library Instance is selected by platform build and a module only defines the Library Class it requires

• Library Classes are better documented

• More than one instance of a given library class can exist

• Library Classes are phase independent

• Libraries maximize the reuse of source code. – Allows sources to be moved between phases with

little/no porting.



UEFI /PI Execution Phases

Pre EFIInitialization

(PEI)

Driver Execution

Environment (DXE)

Boot DevSelect(BDS)

Transient System Load

(TSL)

After Life(AL)

Power on [ . . Platform initialization . . ] [ . . . . OS boot . . . . ] Shutdown

Run Time(RT)

?

OS-PresentApp

Final OS Environment

Final OS Boot Loader

OS-AbsentApp

Transient OS Environment

Transient OS Boot Loader

Boot Manager

CPUInit

Chipset Init

Board Init

ve

rify

Device, Bus, or Service Driver

ExposedPlatformInterface

Pre Verifier

EFI Driver Dispatche

r

Intrinsic Services

security

Security (SEC)

Same lib classes exist across multiple phases



Agenda


• EDK II Changes

• Package





Platform Configuration Database

Knobs to fine tune your firmware• PCD entries are used for module “parameterization”.

• Benefits:

– Reduce the need to edit source code

– No searching for “magic” #define statements

– Maximize module reuse across platforms

– APIs for access to PCD entries

• PCDs can store platform information– Vital Product Data (VPD)

– Serial Number, etc…

– Setup options

0123

4 5 6789

10 0123

4 5 6789

100123

4 5 6789

10



Platform Configuration DB

• The PCD is generated by the build. It contains

PCD entries specified by:

– DEC – declarations of PCD entries

– INF – which PCDs are referenced

– DSC – value and access method

– FDF – flash layout related values

• The documentation for each file type and the

build spec define how each interacts with the

PCD.

Maximizes the re-use of modules Minimize Source code editing



Summary

• EDK II represents evolutionary improvements

upon EDK

• Technical changes focus tool portability, faster

and more efficient builds, and easier build

control

• New platform configuration separates builds

from flash to ease porting

• PCD allows for significant reuse of modules

without changes made to the code.



Additional resources

• UEFI Web – UEFI Specification and PI Specification– http://www.uefi.org

• UEFI open source Code http://www.tianocore.org– EFI Developer Kit (EDK II)

• EDK II https://edk2.tianocore.org– Nt32, DUET, and Unix environments

– Shell binaries

• EDK II Documentation: https://edk2.tianocore.org/servlets/ProjectDocumentList?folderID=82&expandFolder=82&folderID=0

– EFI Shell• EFI shell https://efi-shell.tianocore.org/

• EFI shell Documentation: https://efi-shell.tianocore.org/servlets/ProjectDocumentList?folderID=50&expandFolder=50&folderID=0

http://www.uefi.org/

http://www.tianocore.org/

https://edk2.tianocore.org/

https://edk2.tianocore.org/servlets/ProjectDocumentList?folderID=82&expandFolder=82&folderID=0

https://edk2.tianocore.org/servlets/ProjectDocumentList?folderID=82&expandFolder=82&folderID=0

https://efi-shell.tianocore.org/



https://efi-shell.tianocore.org/servlets/ProjectDocumentList?folderID=50&expandFolder=50&folderID=0






Intel® UDK2010• Intel® UDK2010 is EDK II

– The current EDK II sources in the Subversion

repository on The UEFI Open Source Community

Website (URL: www.tianocore.org) are UDK2010.

– The UDK2010 contains current content from other

industry standard specification groups as well:

• PCI, ACPI, USB, SAL, SMBIOS, ATAPI, SCSI, TPM, etc

• “UDK2010” represents a milestone EDK II

development

– EDK II development will continue

– EDK II Releases will be designated under the UDK

designation (when appropriate)

24

http://www.tianocore.org/



Intel® Logo



Distribution

• Distribution Package

– Mix of XML and files / directories

– Build independent way to distribute content

• Other

– ZIP or an industry standard compression can be used

– Not build independent, not clear on usage, more

prone to error



Description Content File

Workspace DirectoryBaseTools\Conf\NoSuchCorpPkg \

Bus \Pci \PeerBusDxe \PciBusDxe \SuperDuperIODxe\

Include \Common \GUID \● ● ●

MdePkg \MdeModulePkg\

Distribution Description File<DistributionHeader ReadOnly" true" RePackage="false">

<Name BaseName="NosuchChipset"> NosuchChipset</Name><GUID Version="1.2">AF0DDA2E-EA83-480b-B2CE-

FC0BB2F894C2</GUID><Vendor>NosuchCorporation</Vendor><Date>2008-03-24T09:30:00</Date><Copyright>Copyright©2008, NosuchCorporation.All rights

reserved.</Copyright>

Distribution Package File layout

• Packaging

Specification

Distribution Package File (ZIP, .dist)

Disttribution Description File (XML, .pkg)

Disttribution Content File (ZIP, .content)

超越bios: uefi开发环 境的更新换代 - intel developer zone...• pcd entries are used for...

Documents

超越bios: uefi开发环境的更新换代 - intel developer zone...• pcd entries are used for...