ep&dee no 5

EP&DeeDESIGN & MANUFACTURING JUNE, 2015 ISSUE NO. 5, VOL. 13

E L E C T R O N I C S P R O D U C T S & D E S I G N E A S T E R N E U R O P E

THE EAST EUROPEAN RESOURCEFOR EMBEDDED APPLICATIONS

EP&Dee | June, 2015 | www.epd-ee.eu2

Table of Contents

JUNE 2015

EUROSTANDARD PRESS 2000

Tel.: +40 31 805 9955

Tel: +40 31 805 9887

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www.esp2000.ro

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EP&Dee (Electronics Products & Design Eastern Europe) is published 10 times per year in

2015 by Euro Standard Press 2000 s.r.l.

It is a free to qualified electronics engineers and managers involved in engineering

decisions. Starting on 2010, this magazine is published only in digital format.

Copyright 2014 by Euro Standard Press 2000 s.r.l. All rights reserved.

© 2015 by Eurostandard Press 2000

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Group Publishing DirectorGabriel Neagu

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AccountingIoana Paraschiv

AdvertisementIrina Ganea

WEBEugen Vărzaru

Contributing editorsRadu Andrei Ross Bannatyne

ConsultingMarian BlejanBogdan GrămescuMihai Savu

Asian Reprezentative Taiwan Charles YangTel: +88643223633

[email protected]

DESIGN FEATURES

12 Designer electronics out of the printerOptimized printing process enables custom organic electronicsThey are thin, light-weight, flexible and can be produced cost- and energy-efficiently: printed microelectronic components made of synthetics. Flexible displays and touch screens, glowing films, RFID tags and solar cells represent a future market.

14 HSIC vs. USBA look at the advantages of HSIC over USB and the connection procedures that are involved.

16 Counterfeiting:how it occurs and ways to mitigate riskThe growth in counterfeit components over the past decade has become a key source of concern for everyone in the electronics industry, from component manufacturers through to end-users. Since the early 1990s, the trade in counterfeit goods has risen eight times faster than trade in legitimate goods. The Electronic Component Industry Association (ECIA) has estimated between 5 and 25 per cent of the total available electronic components are counterfeit.

18 #KinetisConnects: Turn your curiosity into tomorrow’s greatest invention

19 Tighter code for your IoT edge node

20 How current technology will be adapted for tomorrow’s needs in automotive

22 The path toward augmented reality with Renesas R-Car familyThe combination of powerful 3D graphics, outstanding computer vision capabilities and optimized video capture to form single chip SoC solutions is key to the success of future parking assistance solutions that include surround view systems using multiple cameras. The second SoC generation from Renesas, called R-Car, aims at providing the appropriate solution to enable ready to use advanced 3D surround view applications and offer the driver an immersive and safe experience.

28 Maximum Integration on Minimum SpaceInfineon's new TLE986x/7x product series is a third-generation system-on-chip solution (SoC) that offers a wide range of functions – all in particularly compact housings. This makes Infineon one of the first semiconductor manufacturers to offer a highly-integrated embedded power series with a powerful microcontroller, flash memory, MOSFET gate driver and an extensive range of analog and mixed signal peripherals on the market.

30 Tape extension sensors

32 Leuze’s optical sensors for packaging applications33 PASCAL Ci4 from LABOM - The intuitive pressure and differential pressure transmitter meeting highest standards

42 Production PackagingDo you need various products at a high level quality? Do you want a single provider for a wide range of technical products, which at the same time can offer you offline or online technical support free of charge? If you want all the above and more like orders without threshold value in a short amount of time, you can choose with confidence the only authorized dealer of RS in Romania.

PRODUCT NEWS

Embedded Systems(p 4, 5, 6, 7, 8, 9, 10, 11)Sensors (31, 34, 35)Active Components(p 36 - 39)Lighting Solutions/Display(p 40, 41)Passive Components(p 48 - 49)

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38

10

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49

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Freescale Semiconductor introduced its vision for a radically innovative appliance con-cept that leverages solid state radio frequency (RF) technology to revolutionize cooking.

Developed in partnership with global product strategy and design firm frog, this break-through proof of concept will help enable fresh, chef-quality meals available at homewith virtually no effort or prep time. With the convenience of a microwave and quality of a traditional oven, this smart, con-nected RF cooking concept can control where, when and how much heating energy isdirected into food – enabling more precise cooking for dramatically improved consisten-cy, taste and nutrition. This fine-tuned heating capability helps prevent overcooking,which can destroy nutritional content, reduce moisture and waste energy. Freescale’ssolid state RF cooking technology can also enable appliance OEMs to create productscapable of cooking multiple dishes and items at the same time within the same appliance,significantly simplifying meal preparation. By precisely controlling the location, cycles, and levels of cooking energy, the appliancewill bring food from a raw or frozen state to a cooked temperature rapidly and withoutintervention. With the addition of convection heating to enable browning and crisping,the oven concept can also support a wide array of cooking types and qualities, fromsearing to browning to baking to poaching. Freescale’s connected RF cooking proof of concept is expected to enable new levels ofconsumer convenience, on par with the single-brew coffee pod’s popularity among cof-fee drinkers at home and in the workplace. This convenience paves the way for a host ofnew business models and opportunities, including internet-driven home delivery offreshly prepared meals from a variety of sources – including restaurants, grocery storesand farm-to-table cooperatives – all quickly and easily cooked in the appliance. The con-cept also holds the broader potential of improving food supply chain efficiency by col-lecting and transmitting Big Data sets which can contribute to more efficient food distri-bution, targeted services and enhanced products. An Internet of Things solution, this connected RF cooking concept could access a virtu-ally unlimited library of recipes, learn new cooking methods within online social commu-nities, adapt to consumer cooking preferences, and add and store recipes in real-time.Additionally, the concept appliance’s solid state RF power technology keeps form factorssmall, allowing for stylish, modern countertop designs. Appliance manufacturers are freeto imagine and create highly differentiated design geometries, features, and functions.And the solution’s narrow band energy allows it to coexist with WiFi, Bluetooth and otherconnected devices. FREESCALE SEMICONDUCTOR www.freescale.com

Freescale Solid State RF Power Innovation EnablesDisruptive New Concept for Cooking at Home

Altera Arria 10 Chosen toSupport Real-Time High-Speed Airborne Ethernet

Interconnection Technologyin Demanding EnvironmentsAltera Corporation announced that its Arria®10 FPGAs have been chosen by Silkan, aprovider of real-time data transmission, for itsnew deterministic real-time high-speedEthernet interconnection technology.

The Silkan CETRAC switch is a plug-and-playsolution, using an Ethernet cable to connectcritical systems in aerospace and defense(A&D) and instrumentations & controls (I&C)markets. It was developed to provide safeconnectivity, low latency, and rapid deliveryof information between these onboard sys-tems, without any data corruption. The solu-tion also supports avionics applications thatmust meet the requirements for Design LevelAssurance (DAL) A, and B, two of the highestsafety levels in avionics.Altera Arria 10 enables Silkan to meetEthernet IEEE802.3 standards with a one-chip programmable platform, and to achievenew levels of performance, and improveconnectivity safety and reliability, along alower cost of ownership. CETRAC switchescan also support non-critical applicationsneeded in flight, offering guaranteed dataintegrity and low latency.

CETRAC is also provided as IP core and isembeddable in Line-Replaceable Unit(LRU), which is a modular component on anairplane, ship or spacecraft. CETRAC offersfull retro-compatibility with the company’sArion100 product, an integrated, industrial,and real-time environment providing com-plete virtualization for a system.

ALTERA www.altera.comSILKAN CETRAC www.silkan.com/cetrac

INDUSTRY NEWS EMBEDDED SYSTEMS

Connected oven proof of concept is designed to dramatically boostconvenience and quality of home cooking, enable compelling newbusiness models and opportunities

Freescale's breakthrough cooking appliance concept will enable fresh, chef-qualitymeals at home with virtually no effort or prep time. (Photo: Business Wire)

www.epd-ee.eu | June, 2015 | EP&Dee 5

Microchip announces the PIC32 Harmony Software Decoder Frameworkand Microsoft Windows® Media Audio (WMA) Decoder Library for 32-bit PIC32 microcontroller (MCU)-based consumer-audio applicationdevelopment within the MPLAB® Harmony Integrated SoftwareFramework. The WMA Decoder Library includes a new modular frame-work for audio decoders, including support for MP3 and AAC, allowingeasier audio application development.

Microchip’s Audio Decoder Framework allows for audio software codecsto be easily added to a PIC32 design project. Rather than having torewrite large sections of application code, the framework allows for easi-er integration into an existing customer application after the correspon-ding decoder library has been purchased. The WMA Decoder increasesthe depth of the library for PIC32 MCU-supported audio decoders, inaddition to MP3 and AAC. This increases the range of audio formats thatdesigners can choose to support. The audio decoder framework withinthe Harmony environment allows designers to easily add, subtract andswitch between various software-based audio decoders. Additionally,including a WMA decoder gives developers an even wider set of optionsand support for audio playback.

The WMA Decoder Library is targeted for low-cost applications in theconsumer markets, such as audio docks, home audio receivers and auto-motive head units. It gives developers added flexibility in decoderoptions that play back from internal or removable media. The addition ofa WMA decoder library further expands the audio application flexibilityof PIC32-based designs, building upon existing USB and Bluetooth®streaming audio solutions.

The Microsoft WMA Decoder Library is supported by Microchip’s freeMPLAB Harmony Integrated Software Framework and the PIC32Bluetooth Audio Development Kit (DV320032) priced at $199.99. Bothare available now.The Microsoft WMA Decoder Library is available for purchase today intwo variants: SW320015 priced at $199.97; and SW320025-1HPMpriced at $199.00.

MICROCHIP TECHNOLOGY www.microchip.com/Harmony-062315a

Microchip Introduces the PIC32 HarmonySoftware Decoder Framework and MicrosoftWMA Decoder Library


EP&Dee is offering you the chance to win an MPLABStarter Kit for Digital Power (#DM330017). This starter kit allows the user to easily explore the capa-bilities and features of the dsPIC33F GS Digital PowerConversion family. It is a digitally controlled power supplyboard that consists of one independent DC/DC synchro-nous Buck converter and one independent DC/DC Boostconverter. Each power stage includes a MOSFET con-trolled 5W resistive load. The kit features an On-Board In-Circuit Debugger /Programmer via USB, LCD display forvoltage, current, temperature and fault conditions and anon-board temperature sensor.

The Digital Power Starter Kit provides closed-loopProportional-Integral-Derivative (PID) control in the soft-ware to maintain the desired output voltage level. ThedsPIC® DSC device provides the necessary memory andperipherals for A/D conversion, PWM generation, analogcomparison and general purpose I/O, preventing theneed to perform these functions in external circuitry.

Win anMPLAB StarterKit for DigitalPower fromMicrochip

For the chance to win an MPLAB Starter Kit for Digital Power, please visit:www.microchip-comps.com/epdee-mplabdigpower

and enter your details in the entry form.



As presented by Renesas Electronics, Renesas Synergy™ is acomplete embedded development platform designed to sim-plify the creation of innovative products in the embeddedspace, particularly for the growing Internet of Things (IoT)market. IAR Systems® now announces that the company, as theonly commercial tools vendor, will provide build and debug-ger tools as part of the new platform. Customers using RenesasSynergy will be able to start product development at a muchhigher level of abstraction and be able to focus completely ondesigning innovative and differentiated features for embed-ded applications and connected devices. Meanwhile, they willbenefit from the high-performance code created by the pow-erful IAR C/C++ Compiler™.

The embedded market is ready for a change. Recent develop-ment has been rapid, leading towards more connectivity andglobalized development teams. Combined with increaseddemands for more time-efficient, less costly projects, this trendhas created urgent needs for simplified development work-flows with high customization possibilities and without geo-graphical limitations. IAR Systems responds to these needs witheasy-to-use, integrated and flexible development tools for IoTand other applications. The company now takes its offering tothe next level by supplying build and debugger tools as part ofa complete all-inclusive solution platform.The Renesas Synergy Platform integrates qualified softwarewith a new family of MCUs and an ecosystem of tools and sup-port options into one scalable and secure platform. As theRenesas Synergy Platform is a fully integrated product and nota set of separately sourced software and hardware compo-nents, Renesas provides technical support and licensing for theplatform. General availability of the first products in theRenesas Synergy Platform is scheduled for Q4 CY 2015. To learn more, go to www.RenesasSynergy.comIAR SYSTEMS www.iar.com

IAR Systems partners with Renesas Electronics for complete

IoT solutions platformIntersil Corporation announced the TW9992 analog video decoder,which features an integrated MIPI-CSI2 output interface that providescompatibility with the newest SoC processors. The decoder’s MIPI-CSI2 interface simplifies design by making it easier to interface withSoCs, while also lowering the system’s EMI profile. The TW9992decoder takes both single-ended and differential composite videoinputs from a vehicle’s backup safety camera, and is the latest additionto Intersil’s video decoder product family for automotive applications.

Designed with built-in diagnostics and superior video quality, theTW9992 addresses the biggest challenges faced by automotivevideo systems. For example, the decoder’s Automatic ContrastAdjustment (ACA) image enhancement feature overcomes a majorchallenge for backup camera systems by adapting to rapidly changinglighting conditions. ACA is able to automatically boost up or reducethe brightness/contrast of an image for greater visibility and safety.

In addition, vehicle backup cameras typically employ differentialtwisted pair cables that require designers to use an operationalamplifier (op amp) in front of the video decoder to convert the dif-ferential signal to single-ended. The TW9992 decoder eliminates theneed for an external op amp by supporting direct differential CVBSinputs, thus reducing system cost and board space. The built-in short-to-battery and short-to-ground detection capability on each differ-ential input channel further enhances video performance and auto-motive system reliability.

Key Features and Specifications:• NTSC/PAL 10-bit ADC analog video decoder with 4H adaptive

comb filter• MIPI-CSI2 output interface• Software selectable analog input control allows for combinations

of single-ended or differential CVBS• Advanced image enhancement features: automatic contrast

adjustment, and programmable hue, brightness, saturation, contrast and sharpness

• Output voltage: 1.8V to 3.3V with 3.3V tolerance• Low power consumption: 100mW typical• Integrated short-to-battery and short-to-ground detection tests• AEC-Q100 qualified

INTERSIL www.intersil.com

Intersil’s Latest Automotive VideoDecoder with MIPI-CSI2 Output InterfaceSupports Next-Generation SoCs

The leading development tools vendor respondsto needs for simplified development workflowswith high customization possibilities by providingits tools as part of the new Renesas Synergy™Platform



Microchip Technology announces that registration is open forits European MASTERs Conference at HTW - Berlin, Germany.

The European MASTERs Conference is a valuable resource fordesigning with Microchip’s products. It provides design engi-neers with an annual forum for sharing and exchanging technicalinformation on the Company’s 8-, 16- and 32-bit PIC® micro-controllers, high-performance analog and interface solutions,dsPIC® digital signal controllers, wireless and mTouch® sensingsolutions, memory products, and MPLAB® development sys-tems - including the industry’s only singular IDE to support anentire 8-, 16- and 32-bit microcontroller portfolio.This three day conference offers a selection of more than 50classes that cover a broad range of topics, taught byMicrochip’s application and design engineers as well as selectedindustry experts.

Learn from these experts and leave with everything needed toget up and running on new designs. Lectures, hands-on classesand unique Open Experts Lab sessions will cover a wide rangeof embedded control topics including new products andperipherals, C programming, firmware design, connectivitysessions on TCP/IP, USB, CAN and Bluetooth, graphics andcapacitive-touch interface development, intelligent powersupplies, motor control, selecting op-amps for sensor applica-tions using an RTOS and low-power system design.

Extracurricular events include a BBQ Dinner and a DinnerCruise along the river Spree.

Registration is now open, with an early-bird discount availableuntil 27th June 2015. MICROCHIP TECHNOLOGY www.microchip.com/eumasters

Registration Opens for Microchip’sEuropean MASTERs Conference;

Premiere Technical Training Event forEmbedded-Control Engineers

Maxim Integrated Products, Inc. makes it easy to calibrate a consum-able medical sensor and to monitor or control unsanitary reuse ofmedical disposables with the DS28E80 gamma-radiation-resistant,nonvolatile (NV) 1-Wire® memory.

Gamma radiation sterilization is typically used on single-use dispos-able medical sensors and consumables because the method is pre-dictable, reliable, faster to process, and usable across a wide array ofproduct materials and packaging types. But, gamma radiation isincompatible with traditional floating-gate memory technologiesused in semiconductors because gamma’s high-ionizing radiationerases the memory.

The new DS28E80 NV memory, however, is resistant to gamma radi-ation up to 75kGy (kilo gray). With flexible programming options, itallows OEMs to factory calibrate their sensors, tools, and accessoriesto their host medical instrument in the field. It can be used to moni-tor or even prevent unsanitary reuse of a disposable medical sensorand consumables. It operates over the company’s trusted 1-Wireinterface, so consumable manufacturers can replace multiple cum-bersome cables with a single contact.

Key Advantages:

• Manufacturing calibration: OEMs can automatically detect and calibrate sensors and accessories to ensure quality.

• Usage tracking: guards against incorrect attachment and warns or prevents unsanitary reuse of consumables.

• Embedded identification: embedded 1-Wire protocol provides unalterable 64-bit factory-assigned serial ID which allows for tracking and can prevent usage of unauthorized consumables.

• Reprogrammable: 248 bytes of user memory organized in 8-byte blocks

• Permanent write protection: flexible per-block options for use memory

MAXIM INTEGRATED www.maximintegrated.com

Gamma Radiation-Resistant MemoryProvides Calibration and Protects fromUnsanitary Reuse in Medical DisposablesMaxim Integrated’s gamma radiation-resistant memoryuses only one contact to simplify implementations insmall, disposable medical sensors. 15th-17th September 2015 at HTW Berlin;

Classes Available for All Experience Levels,From Beginner to Expert


Microchip announces, from Computex Taipei, the first USB3.0 Smart Hubs that enablehost and device port swapping, I/O bridging, and various other serial communicationinterfaces. The USB5734 and USB5744 feature an integrated microcontroller thatenables new functionality for USB hubs while lowering overall BOM costs and reduc-ing software complexity. The USB5734/44 family is USB-IF logo certified (TID330000058) and features best-in-class signal integrity enabling more robust PCBdesigns and reducing sensitivities to cable, connector and layout variations. A Smart Hub is a USB hub that integrates system-level functions typically associated witha separate MCU or processor. Microchip’s new USB3.0 Smart Hubs enable the upstreamhost controller to communicate to numerous types of external peripherals beyond theUSB connection through direct bridging from USB to I2C™, SPI, UART and GPIO inter-faces. This integrated function-ality can greatly reduce thecomplexity of system designby eliminating the need foradditional external microcon-troller, while providingimproved control from theUSB host hardware. Microchip’s patented FlexConnect technology providesthe USB5734 Smart Hub theunique ability to dynamicallyswap between a USB host anda USB device through hard-ware and/or software systemcommands giving the new USBhost access to downstreamresources. This same FlexConnect technology can alsoswitch common downstreamresources between two differ-ent USB hosts. IncorporatingFlexConnect into a system sim-plifies the overall softwarerequirements of the primaryhost, as class drivers and appli-cation software stay local to the Device-turned-Host. System developers can easily con-figure ports and choose application settings with low-cost resistor bootstraps. If moreadvanced functionality is required, the USB5734/44 can be configured and pro-grammed with Microchip’s configuration tool, ProTouch2.The USB5734 and USB5744 USB3.0 controller hubs serve a wide range of applicationsin the computing, embedded, medical, industrial and networking markets. Examplesof end applications include HDTV, tablets, notebooks, eReaders, cameras, docking sta-tions, monitors, handheld devices, point-of-sale equipment, ATMs, set-top boxes,break-out boxes and motion sensors, among others. Available in a 56-pin, 7 × 7 mmpackage, the USB5744 is the industry’s smallest USB3.0 Hub for applications whereboard space is important. The USB5734 and USB5744 are supported by Microchip’s USB 3.0 Controller HubEvaluation Board (EVB-USB5734) priced at $399.00, and USB 3.0 Small Form FactorController Hub Evaluation Board (EVB-USB5744) priced at $299.00, which are avail-able today. The EVB-USB5734 includes mezzanine cards that can be used as presetapplication configurations for easy testing and development of a USB5734 system. The USB5734 is available today for sampling and volume production in a 64-pin QFN(9 × 9 mm) package. The USB5744 is available today for sampling and volume produc-tion in a 56-pin QFN (7 × 7 mm) package.

MICROCHIP TECHNOLOGY www.microchip.com/USB5734-Page-060215a

Microchip’s new Smart Hub with FlexConnectbroadensapplication space of USB3.0 Hubs

Altera Reveals Stratix 10Innovations Enabling the

Industry’s Fastest andHighest Capacity FPGAs

and SoCsAltera Corporation revealed architecturaland product details of its Stratix® 10 FPGAsand SoCs, the next generation of high-endprogrammable logic devices deliveringbreakthrough levels of performance, integra-tion, density and security.

Stratix 10 FPGAs and SoCs leverage Altera’srevolutionary HyperFlex™ FPGA fabric archi-tecture built on the Intel® 14 nm Tri-Gateprocess to provide 2X higher core perform-ance over previous generation FPGAs.Combining the industry’s highest perform-ance, highest density FPGA with advancedembedded processing capabilities, GPU-class floating point computation perform-ance and heterogeneous 3D SiP integration,enables Altera customers to uniquelyaddress design challenges in the next gener-ation of communications, data center, IoTinfrastructure, military and high-perform-ance computing systems.HyperFlex Architecture “Registers Everywhere”Approach Stratix 10 FPGAs and SoCs are thefirst Altera devices to leverage the company’snew HyperFlex architecture, the FPGA indus-try’s most significant fabric architecture inno-vation in over a decade. The HyperFlex archi-tecture, along with a full process node advan-tage from the Intel 14 nm Tri-Gate process,provides a 2X core logic frequency improve-ment over competing next-generation high-end FPGAs.

The HyperFlex architecture enables high-per-formance designs to operate up to 70 percentlower power by reducing logic area require-ments. Find more information atwww.altera.com/hyperflex.

ALTERA www.altera.com


Dialog Semiconductor plc, a provider of highly integrated power man-agement, AC/DC power conversion, solid state lighting (SSL) andBluetooth® Smart wireless technology, announces the DA9312, a powermanagement IC that enables the design of smaller, thinner notebookcomputers and tablets powered by dual cell stacked (2S) Li-ion or Li-Polymer batteries. The notebook industry is moving towards designspowered by 2-cell, rather than 3-cell batteries and tablets are movingfrom single cell to 2-cell batteries. Dialog is supporting these trends withthe most integrated power management solution currently available.

Using the DA9312 with a just few external components requires only 80mm2 of board space, a fraction of that of discrete component powerconverters. The device delivers industry-leading efficiency of 98%, min-imising thermal management challenges and boosting product reliability.Rated at 90W, the DA9312 is the first high power device of its type in theindustry. It accepts an input voltage from 5.5V to 10.5V, which then feedsthree independent power supplies. The main power converter uses capac-itors to store charge and requires no external inductor. The device’s twohigh-frequency buck converters switch at a frequency of 1.5MHz, so tiny 1mm high inductors and very small capacitors can be used on the outputs.The power converter, which outputs half the input voltage, is rated at up to10A and the two buck converters can each deliver up to 5A at between2.8V and 5.35V. Alternatively, the buck converter outputs can be com-bined to turn the device into a dual phase regulator capable of supplyingup to 10 A on each output. All power supplies within the PMIC have inte-grated FET power switches to minimise external component count andboard size, and no Schottky diodes are needed. The DA9312 comes in aWL-CSP 6.345 x 2.815 mm package and implements Dialog’s RouteEasy™ball layout for high density routing on low cost printed circuit boards. ThePMIC operates with a die temperature from -40°C to +125°C.

DIALOG SEMICONDUCTOR www.dialog-semiconductor.com

Dialog Semiconductor Achieves HighestPower Density and Efficiency in PoweringFuture Computing Platforms

MSC Technologies presents twoCOM Express module families with

latest Intel processorsMSC Technologies presents two COM Express™ Type 6module families, which are based on the latest Intel® 14nm process technology. The MSC C6C-BW modulewith quad-core or dual-core Intel® Pentium® or Celeron®processors (codenamed Braswell) offers outstandinggraphics performance with low power consumption.

The MSC C6B-8SB high-end module, which isequipped with quad-core 5th GenerationIntel® Core™processors (Broadwell), features a significant leap for-ward in computing and graphics performance. Thanks to the integrated Gen8 Intel® HD Graphics, theMSC C6C-BW module family ‒ in the compact formfactor of 95 mm x 95 mm ‒ offers twice the graphics per-formance of the previous model with Intel® Atom™ CPU(Bay Trail). Three independent displays with up to3840 × 2160 pixels can be connected via the HDMI,DisplayPort and Embedded DisplayPort graphics inter-faces. DirectX® 11.1, OpenGL 4.2 and OpenCL™ 1.2 aresupported. The Computer-On-Module (COM) istherefore particularly suitable for graphics-intensiveembedded applications for the presentation of high-resolution imaging and fast videos. The low power con-sumption of the embedded platform is between 6 Wand 9W, and the integrated Braswell processors have athermal design power (TDP) of 4W to 6W. The mod-ules can be equipped with up to 8GB dual-channelDDR3L SDRAM with high memory bandwidth via two204-pin sockets. The wide range of modern interfacesincludes two SATA 3, four USB 3.0, four USB 2.0 and upto five PCI Express™ x1 channels. A microSD card can beplugged in as an on-board mass storage device.With the MSC C6B-8SB module platform, which inte-grates the latest 5th Generation processors, MSCTechnologies rounds off the top end of its COM Express™product portfolio based on the 4th Generation Intel®Core™ processors. The module is offered with two differ-ent Intel® Core™ processors (i7-5700EQ or i7-5850EQ),each with four processor cores. In addition to a compre-hensive range of interfaces, the COM ‒ in the Basic formfactor of 125 mm × 95 mm ‒ offers an Intel® HD Graphicscontroller GT2 or GT3e with additional graphics memory,Turbo Boost capabilities for the CPU and graphics con-troller, hardware-accelerated video encoding and decod-ing as well as enhanced security features.

MSC TECHNOLOGIES www.msc-technologies.eu




Silicon Labs unveiled a dual-modeBluetooth® Smart Ready modulesolution that gives embeddeddevelopers unparalleled flexibilityto integrate both Bluetooth Smartand Bluetooth BasicRate/Enhanced Data Rate(BR/EDR) wireless technologieswhile minimizing design time, costand complexity. The newBluetooth Smart Ready BT121module from Bluegiga, a SiliconLabs company, provides a pre-cer-tified, fully integrated, high-per-formance solution that includesthe Bluetooth radio, microcontroller (MCU) and on-board Bluetooth software stacksupported by Silicon Labs’ complimentary Bluetooth Smart Ready software develop-ment kit (SDK) and easy-to-use BGScript™ scripting language.The BT121 Bluetooth Smart Ready module and software are designed to help devel-opers accelerate time to market and reduce development costs and compliance risksby providing a versatile, plug-and-play Bluetooth solution. The BT121 module is idealfor applications requiring connectivity to legacy devices that only support BluetoothBR/EDR, as well the latest applications using Bluetooth Smart such as connected home,health and fitness, wearables and point-of-sale terminals. There are millions of legacysmart phones, tablets and PCs still in service that do not support Bluetooth Smart tech-nology. Additionally, some applications require the higher throughput advantages ofBluetooth Classic technology, which Bluetooth Smart is not designed to achieve. The BT121 module provides a “best of both worlds” solution for both ultra-low-power and high-data-rate Bluetooth connectivity applications. The module can con-nect to legacy devices that only support Bluetooth SPP or Apple® iAP2 profiles, forexample, as well as to devices that support Bluetooth Smart. The easy-to-use BT121module integrates a high-performance Bluetooth radio with an extended range of upto 400 meters, a low-power ARM® MCU, and a fully certified Bluetooth Smart Readyprotocol stack in a compact 11 mm × 14 mm surface-mount package, making this oneof the smallest Bluetooth Smart Ready modules in the market. No RF or Bluetooth protocol development expertise is necessary to implement theBT121 module in Bluetooth designs. The module can be used as a peripheral alongwith an external host MCU, or applications can be embedded into the built-in MCUwith the Bluegiga BGScript scripting language, creating a completely standalonedesign with minimal external components.

Available for download at no charge from Bluegiga (www.bluegiga.com), the BluetoothSmart Ready SDK is a set of software tools for simplifying the development ofBluetooth Smart Ready applications. Developers can access dozens of exampleBluetooth Smart application profiles, which can be used as templates, enabling themto accelerate development time. Silicon Labs continues to expand its library ofBluetooth profiles as part of its roadmap to support new and emerging wireless appli-cations and use cases. The Bluetooth Smart Ready stack and SDK are fully compatiblewith Silicon Labs’ recently announced Blue Gecko Bluetooth Smart modules. This com-patibility makes it easy for developers to migrate their designs between Silicon Labs’Bluetooth Smart and Smart Ready modules with a consistent set of application pro-gramming interfaces (APIs) and software tools.SILICON LABS www.silabs.com

Silicon Labs Introduces Industry’s Most FlexibleDual-Mode Bluetooth Module Solution

Freescale introduces world’ssmallest integrated smart

system for the IoTToday at the Freescale Technology Forum(FTF) in Austin, Texas, Freescale unveiled thefirst product in its new SCMportfolio.Designed to function as a comput-er on a chip, the i.MX 6Dual SCM is enabledfor DDR memory and combines the per-formance of Freescale’s i.MX 6Dual applica-tions processor together with a power man-agement integrated circuit (PMIC), flashmemory, embedded software/firmware, andsystem-level security technology includingrandom number generation, cryptographiccipher engines and tamper prevention.

SCM products are engineered to dramatical-ly reduce time-to-market, allowing an esti-mated 25 percent reduction in hardwaredevelopment time – as well as greater than50 percent reduction in size versus currentdiscrete solutions. The module’s exceptionalperformance and connectivity allow cus-tomers targeting IoT markets to incorporatesophisticated predictive data analytics capa-bilities into their products, allowing for highlycompelling and potentially disruptive end-products. Freescale’s SCM modules are idealfor applications such as 3D gaming goggles,where battery life and power are important;next-generation IoT drones requiringextreme processing performance for objectrecognition; and other IoT products, wherehighly advanced graphics and user interfacesare considered key to more mainstreamadoption. Other markets well suited forFreescale’s SCM technology include wear-ables, next-generation medical equipmentand autonomous sensing applications. Freescale’s SCM portfolio products aredelivered as a fully tested and software-enabled platform for consumer and indus-trial applications.

FREESCALE SEMICONDUCTOR www.freescale.com


Easy-to-Use Module, Software Stack and Scripting LanguageAccelerate Applications Requiring Bluetooth Smart and Bluetooth®Classic Connectivity

Freescale's breakthrough single chipmodule technology integrates a full featured dual core processor and morethan 100 other components into a package the size of a U.S. dime.(Photo: Business Wire)


Designers of electrical utility meters now have the flexibility to accommo-date the G3-PLC™, Prime, and P1901.2 standards in the CENELEC A, ARIB,and FCC frequency bands with a single chip, the ZENO™/MAX79356powerline communications (PLC) modem system on a chip (SoC) fromMaxim Integrated Products, Inc.Powerline communication standards and frequency bands vary by regionand country, and until now PLC modems could not support them all. Metermanufacturers had to develop multiple modems to ensure standards com-patibility, or even pass up markets because they did not have the time orresources to develop new modems. That dilemma is now solved. TheZENO/MAX79356 PLC modem SoC is software configurable to accommo-date all worldwide standards. Now manufacturers and utilities can use thesame device to build meters and data concentrators for any region thatwants to use powerline communication. This allows meter designers tobring their products to market faster and be prepared for future standards.In addition, the integration of the analog front-end (AFE) and baseband ina single chip reduces chip count and lowers expenses.

MAXIM INTEGRATED www.maximintegrated.com

Support All Narrowband PowerlineCommunications Utility Standardswith One Modem

Excelsys Xsolo Power Supplies Meet Medical Performance

SpecificationsExcelsys Technologies announced today that its Xsolopower supplies have been designed and tested to meetboth the B and BF type requirements per the IEC 60601standard. This makes them suitable for applications thatneed these levels of performance for power suppliesused in medical applications. Excelsys’ testing proce-dures were performed in accordance with require-ments for B (body) and BF (body floating) medical endproducts. The goal of the testing was to help manufac-turers optimize their medical designs to achieve thehighest performance and safety levels, enabling first-pass success during agency approvals.

B-type applied parts, which are not typically attachedto the patient for long periods of time, include LEDlighting, medical lasers, medical imaging (e.g., MRI), hos-pital beds and phototherapy equipment. Type BFapplied parts have conductive long-term contact with apatient. These can include incubators, therapy systemspatient heating and cooling equipment, ultrasoundmonitoring, cardiac monitoring, as well as long-termdiagnostic equipment and blood pressure monitoring.To demonstrate that its power supplies are suitable forthese applications, Excelsys tested both its basic andlow-leakage Xsolo models (XS1000-48N-000 andXS1000-48N-004) to the 60601 standard using an ACsource providing 264 VAC at 63 Hz to recreate worse-case conditions. Copies of the test report are availableon request. Manufacturers often need to incorporate multiple powersupplies into a given system and still meet stringentrequirements. To help meet these requirements, Excelsysalso offers low-leakage power supply versions, whichenable the incorporation of multiple power supplies intovarious medical-type rated systems, depending on theapplication. As a world-class power supply manufacturer,Excelsys has a global applications team to support andassist customers with their specific system needs.

EXCELSYS www.excelsys.com


Key Advantages• Versatile: software configurability supports today’s PLC

standards and will adjust for future standards; certified by the G3-PLC Alliance for all three major frequency bands (CENELEC A, ARIB, and FCC) and for PAN Device and PAN Coordinator

• Low power: uses 80% less power when listening for PLC communication (55mW vs. 300mW); active transmission power consumption is 70mW

• Space efficient: up to 3x smaller than other PLC modems.


Designer electronics out of the printerOptimized printing process enables customorganic electronics

Solar cells out of a printer? This seemedunthinkable only a few years ago. Therewere hardly any alternatives to classical sili-con technology available. In the mean timetouch screens, sensors and solar cells can bemade of conducting polymers.

Flexible monitors and glowing wall papermade of organic light emitting diodes, so-called OLEDs, are in rapid development.The “organic electronics” are hailed as apromising future market.However, the technology also has its pitfalls:

To manufacture the components on anindustrial scale, semiconducting or insulatinglayers – each a thousand times thinner thana human hair – must be printed onto a carri-er film in a predefined order. “This is a high-ly complex process, whose details need to befully understood to allow custom-tailoredapplications,” explains Professor PeterMüller-Buschbaum of the Chair ofFunctional Materials at TU München.A further challenge is the contacting betweenflexible, conducting layers. Hitherto electron-ic contacts made of crystalline indium tinoxide were frequently used. However, thisconstruction has numerous drawbacks: Theoxide is more brittle than the polymer layersover them, which limits the flexibility of thecells. Furthermore, the manufacturing processalso consumes much energy. Finally, indium isa rare element that exists only in very limitedquantities.

Polymers in X-ray light A few months ago, researchers from theLawrence Berkeley National Laboratory inCalifornia for the first time succeeded inobserving the cross-linking of polymer mol-ecules in the active layer of an organic solarcell during the printing process. In collabo-ration with their colleagues in California,Müller-Buschbaum’s team took advantage ofthis technology to improve the characteris-tics of the polymer electronic elements.The researchers used X-ray radiation gener-ated in the Berkley synchrotron for theirinvestigations. The X-rays are directed to thefreshly printed synthetic layer and scattered.The arrangement and orientation of the

They are thin, light-weight, flexible and can be produced cost- and energy-efficiently: printedmicroelectronic components made of synthetics. Flexible displays and touch screens,glowing films, RFID tags and solar cells represent a future market. In the context of an inter-national cooperation project, physicists at the Technische Universität München (TUM)have now observed the creation of razor thin polymer electrodes during the printingprocess and successfully improved the electrical properties of the printed films.

Claudia M. Palumbiny investigates transparent thin film electrodes made ofconducting polymers printed on flexible substrates.Photo: Wenzel Schürmann / TUM

DESIGN ORGANIC ELECTRONICS


molecules during the curing process of theprinted films can be determined fromchanges in the scattering pattern.“Thanks to the very intensive X-ray radiationwe can achieve a very high time resolution,”says Claudia M. Palumbiny. In Berkeley thephysicist from the TUM investigated the“blocking layer” that sorts and selectivelytransports the charge carriers in the organicelectronic components. The TUM researchteam is now, together with its US colleagues,publishing the results in the trade journalAdvanced Materials.

Custom properties“In our work, we showed for the first time everthat even small changes in the physico-chemi-cal process conditions have a significant influ-ence on the build-up and properties of thelayer,” says Claudia M. Palumbiny. “Addingsolvents with a high boiling point, for example,improves segregation in synthetics compo-nents. This improves the crystallization in con-ducting molecules. The distance between themolecules shrinks and the conductivityincreases”.In this manner stability and conductivity canbe improved to such an extent that the

material can be deployed not only as ablocking layer, but even as a transparent,electrical contact. This can be used toreplace the brittle indium tin oxide layers.“At the end of the day, this means that all lay-ers could be produced using the sameprocess,” explains Palumbiny. “That would bea great advantage for manufacturers.”To make all of this possible one day, TUMresearchers want to continue investigatingand optimizing the electrode material fur-ther and make their know-how available toindustry. “We have now formed the basis forpushing ahead materials development withfuture investigations so that these can be takenover by industrial enterprises,” explains Prof.Müller-Buschbaum.

The research was supported by theGreenTech Initiative “Interface Science forPhotovoltaics” (ISPV) of the EuroTechUniversities together with the InternationalGraduate School of Science and Engineering(IGSSE) at TUM and by the Cluster ofExcellence “Nanosystems Initiative Munich”(NIM). Further support came from the EliteNetwork of Bavaria’s International DoctorateProgram “NanoBioTechnology” (IDK-NBT)

and the Center for NanoScience (CeNS) andfrom “Polymer-Based Materials for HarvestingSolar Energy” (PHaSE), an Energy FrontierResearch Center funded by the U.S.Department of Energy, Office of Basic EnergySciences. Portions of the research were carriedout at the Advanced Light Source whichreceives support by the Office of Basic EnergySciences of the U.S. Department of Energy ￭

Publication:The Crystallization of PEDOT:PSS PolymericElectrodes Probed In Situ during PrintingClaudia M. Palumbiny, Feng Liu, Thomas P.Russell, Alexander Hexemer, Cheng Wang,and Peter Müller-BuschbaumAdvanced Materials, June 10, 2015, 27, 22,3391-3397 – DOI: 10.1002/adma.201500315http://onlinelibrary.wiley.com/doi/10.1002/adma.201500315/full

Contact:Prof. Dr. Peter Müller-BuschbaumTechnische Universität MünchenDepartment of Physics, E13Chair for Functional MaterialsE-mail: [email protected] www.functmat.ph.tum.dewww.polymer.ph.tum.de

“Organic electronics”,based on conductingpolymers, are hailedas a promising futuremarket.Cover illustration of“Advanced Materials”(10.1002/adma.201570148.Artwork: Christoph Hohmann /Nanosystems InitiativeMunich

DESIGN ORGANIC ELECTRONICS


DESIGN USB

HSIC vs. USB

The high-speed inter-chip (HSIC) interface is becoming more pop-ular due to its notable advantages over USB for hard-wired inter-chipapplications. The interface is a two signal, source synchronous inter-face that can provide USB high-speed data at 480Mbit/s. The datatransfers are 100% host driver compatible with traditional USBtopologies. Full-speed (FS) and low-speed (LS) are not supported bythe format, however a hub with HSIC can provide FS and LS support.The interface differs from USB in the physical layer only. Significantfeatures include no chirp protocol, source-synchronous serial datatransmission and no hot removal or attach as the interface is alwaysconnected.It has 1.2V signal levels designed for low-power applications at stan-dard LV CMOS levels. Maximum trace length is 10cm.The protocol for data transactions between host and device viaHSIC is the same as USB, as shown in figure 1. The primary difference is that all information is transmitted via a sin-gle data line, and a strobe signal communicates when to sample thereceived data signal. HSIC uses double data rate (DDR) signalling;data are sampled at both the rising and falling edges of the strobesignal. The strobe signal oscillates at a frequency of 240MHz, whichprovides a total data rate of 480Mbit/s.

Advantages over USBAs mentioned, HSIC has significant advantages over USB. For a start,it is a fully digital standard and thus no analogue front end isrequired. The lack of an analogue front end means die sizes can bereduced, and thus so can cost. Figure 1: Data packet transferred from host to device.

A look at the advantagesof HSIC over USB and theconnection proceduresthat are involved.

Author: Andrew Rogers,

Applications Engineer, Microchip Technology Inc.


DESIGN USB

Additional die reduction can also be made due to the decreasedamount of digital logic required by the simplified connection protocol.The HSIC standard does not inherently reduce power consumption,but the removal of the analogue front end can lead to lower powerdesigns, especially since analogue circuitry does not necessarilyscale one-to-one with digital circuits for reductions in process fea-ture size. HSIC is especially low power when placed into the sus-pended state as there is no current draw on the strobe or data lines.By comparison, standard USB draws a minimum of 200μA on D+through a 1.5kΩ pull-up resistor when suspended.Because HSIC is only different from USB at the physical layer, migrat-ing from USB to HSIC is not like changing to a completely new stan-dard. This means existing USB software stacks and USB protocolknowledge bases can be quickly transitioned to HSIC.

Data samplingWith standard USB, every data packet begins with a sync pattern toallow the receiver clock to synchronise with the phase of the incom-ing data. The differential sign of the D+/D- signal is then sampledaccording to the sync pattern. HSIC uses a separate strobe line totell the receiver when to sample the incoming data. The HSIC datasignal is sampled at the rising and falling edges of the strobe signal.If the strobe and data signals become skewed for any reason, thesampled data may become corrupted. The HSIC ElectricalSpecification defines the maximum allowable skew as 15ps.To make sure skew does not become an issue, the HSIC traces mustbe kept as short as possible and must not be longer than 10cm. Thedata and strobe traces must be the same length and they should berouted to 50Ω single-ended impedance.To illustrate the amount of skew possible in the real world, figure 2shows the beginning of a test packet transmitted from a host to adevice with equal lengths.

The same packet transmitted from the same host with a strobe tracethat is about 10cm longer than the data trace is shown in figure 3.The resulting skew is about half of a nanosecond. This is an extremeexample, but the results suggest that even a small amount of lengthmismatch may result in an HSIC specification violation.The single-ended nature and differences in signal termination causesome difficulties when attempting to probe HSIC lines. Standard USBsignals can be easily monitored and deciphered by placing a differen-tial probe connected to an oscilloscope at either the transmitter side

or receiver side. HSIC signals are more sensitive and thus transmissionline theory should be considered when attempting to probe them.A good general guideline is to probe at the side opposite to thesource of the signal that needs to be observed. For instance, toobserve the signals originating from a device, place a probe at thehost-side terminals. To observe the signals originating from a host,place the probes at the device-side terminals.

When attempting to probe signals originating from a device whileprobing at the device side, the signal becomes distorted. This is likelydue to interference caused by the signal reflecting back on itself. Themiddle of the trace can also be probed, but the results are typicallynot as clean as if probed properly from one side. The ideal would beto probe simultaneously from both ends. A series protocol analysermay be able to sample the signals accurately in both directions, butthe 10cm trace length restriction makes this option impractical.

Making the connectionThe HSIC interface is structured such that a host or peripheral canbe powered on in any order. To ensure a false connection is notdetected, the host, hub and peripherals must ensure that the strobeor data lines do not float to an undetermined value, commonlyreferred to as tri-stated.

Figure 2: Equal HSIC trace lengths.

Figure 3: Strobe trace 10cm longer than data trace.

Figure 4: The connect sequence from idle and suspend to connecting and resuming signalling.


DESIGN USB

Figure 4 shows an oscilloscope capture of a connectsequence. This connect sequence is much simpler thanthe USB connect sequence because there are no speedsto negotiate. This sequence can be handled by a verysimple state machine, reducing die size requirements.With standard USB, the host can determine if a down-stream port has been disconnected by monitoring themagnitudes of the DP/DM signal voltages. If the voltageexceeds the disconnect voltage threshold, the host canconclude that the device has been disconnected. HSICdoes not support a disconnect protocol because it isintended to be a hard-wired, always on connection.However, it is still possible to have a situation where adownstream device may appear to have disconnected,and care must be taken to ensure the host does notpermanently lose its connection with the device.This apparent disconnection or standoff can occurbecause the host always maintains an idle state whilethe bus is unused, and the idle state is identical to thesuspend state from a signal perspective. The host hasno way of knowing if or when a downstream device hasbeen powered down or disconnected. Since the sus-pend signalling is identical to the idle signalling, it ispossible to reach a state where a downstream devicebelieves it is has been suspended while the upstreamhost thinks there is no device downstream and waitsindefinitely for a connect signal to arrive. A similarstandoff condition could occur if the upstream host dis-ables the port while the device believes it has beensuspended. This condition is not likely to occur between hosts anddevices that never cycle power or soft reset. If this issueis encountered it must be dealt with in an applicationspecific manner at either the link or software stacklevel. This can be done by programming the softwarestack or designing the link in a way that prevents thecondition from occurring in the first place.Alternatively, the SoC can attempt to deal with a down-stream device after it disconnects by resetting the HSIChub. The device discovery sequence will occur and theconnection will be re-established. On Microchip’s USB254x, USB3613, USB3813,USB4604 and USB4624 devices, the SoC can use theVBUS_- DET pin to re-establish the connection. Pullingthe pin low suspends the hub while pulling the pin highwill wake it up.

ConclusionThe HSIC standard has advantages over USB in hard-wired applications as long as the correct connectionand disconnection procedures are observed. Theseprocedures are particularly important when trou-bleshooting some issues involving HSIC connectivity ￭www.microchip.com

Very often, counterfeit goods are not cheap copies but failed, unsuitableor non-functional components made to look like high-value parts. If theseparts enter the supply chain there is a high risk that equipment using themwill not be able to perform the job for which it is designed. This presentsconcerns to any manufacturer. But for those making industrial and criticalsystems it can lead to dangerous situations. Counterfeit circuit breakers have been found in nuclear power plants –barely functional devices that probably would not trip correctly in theevent of an overload. In 2011, counterfeit parts were tracked down tonight-vision systems used by the military.There are a number of ways in which counterfeiters attempt to pass theirproducts off as working components.

Author: Dave DohertyPresident and COODigi-Key

The growth in counterfeit components overthe past decade has become a key source ofconcern for everyone in the electronicsindustry, from component manufacturersthrough to end-users. Since the early 1990s,the trade in counterfeit goods has risen eighttimes faster than trade in legitimate goods. The Electronic Component Industry Association(ECIA) has estimated between 5 and 25 percent of the total available electronic componentsare counterfeit. The association believes the practice ofcounterfeiting costs the electronics industryas much as $100bn a year.

Counterfeiting:how it occurs andways to mitigate risk

INDUSTRY NEWS

Some high-volume, relatively simple partsare copied by manufacturers and made tofunction similarly to their targets, albeitwithout the guarantees provided by legiti-mate manufacturers. These devices areharder to identify as counterfeits by func-tional testing as they are likely to have simi-lar behaviour to the real parts. Such devicescan be identified by chemical testing – asmanufacturers will use subtly differentrecipes for key processes in their plants –and by discrepancies with the packagesused by the real product.

Many counterfeiters make no attempt to pro-vide functional devices. Instead they exploitweaknesses in the supply chain itself.Manufacturers will normally mark productswith logos and identifying codes but it maynot be clear to a customer whether the marksthey find on a received part distinguish it as agenuine product or a clever fake.

A common technique is overmarking inwhich a cheaper device suitable only for usein systems are used in the standard temper-ature range is repackaged as a part that isclaimed to be able to withstand moreextreme temperatures. These componentsare then sold at a very high margin.Manufacturers of critical systems face thebrunt of this type of counterfeiting becausethe high-value parts designed for safety-critical systems and equipment intended forextreme environments provide the greatestprofit to the counterfeiter.

Another technique used by counterfeiters isto locate products that were rejected duringtest but which were not destroyed properly,or to use products recovered from electron-ic waste when it is recycled. These parts maybe repackaged to make them look newalthough they are commonly simply ‘black-topped’ to remove any old markings anddate codes and a new set of markingsscreenprinted over the top. Simple attemptsat black-topping can be identified by chem-ical tests and often simply by rubbing thesurface of the component as the new ink willjust rub off. The real markings are oftenetched into the surface of the package andare therefore much harder to remove.One technique that has appeared in recentyears is for contract manufacturers to ‘over-build’ – make too many products and thenattempt to sell the excess on the grey market.Although these are not counterfeits in thesame sense as blacktopped or copycat prod-

ucts, they do not have the same support orguarantees as genuine parts and expose cus-tomers to greater supply-chain risk.Companies supplying industrial, medicaland military are often likely to find them-selves the targets of counterfeiters becausethey have to maintain long-term support fortheir systems and therefore are moreexposed to component obsolescence. Theproduction cycles of many components,particularly those based on semiconductors,have been compressed dramatically. Many devices are designed primarily for usein consumer markets, where the emphasis ison a rapid pace of development. For exam-ple, IC manufacturers attempt to take fulladvantage of the advances in process tech-nology that occur typically on a two-yearcadence to reduce prices and improve per-formance.

Manufacturers of industrial, medical andmilitary systems cannot move as rapidly asthey need to seek approvals for redesignsand will often commit to long-term supportagreements for their systems. The ability tosource replacement parts for these prod-ucts gets harder as time passes and legisla-tive changes, such as the introduction ofbans on materials such as lead, increase therisk of counterfeits entering the supplychain. When manufacturers discontinuedthe manufacture of some of their lead-based components because sales volumesdid not justify redesigns to use lead-freematerials, counterfeiters stepped in. Theysimply took similar lead-free parts andmarked them up with the codes used by thelead-based components. Even if the partsworked correctly, the use of these compo-nents increased the risk of solder-based fail-ures in the field.There is no single solution to the problem ofcounterfeiting but customers can protectthemselves from the practice. Manufacturersare actively investigating the use of anti-counterfeiting measures, such as the use ofpackaging marks that are very hard to copy.One example is laser marking, in which aunique pattern is inscribed into the surfaceof the package. Only legitimate devices willpass an optical inspection using equipmentdesigned to read the laser-marked codes.However, these efforts are at an early stageand so cannot protect the majority ofdevices on a BoM.It is possible to use direct analysis of parts todetermine their provenance. But many ofthese techniques involve destructive testing

and are expensive to implement as theyrequire access to equipment such as X-raysources and mass spectrometers. Even thenonly a sample of goods incoming can beinspected this way. The only 100 per centcertain method for ensuring that no coun-terfeit items have entered the factory is totest all of them – leaving none remainingwith which to build the systems. Intelligence on the techniques that counter-feiters are using to mark their products canbe a useful weapon in dealing with fakes.Manufacturers are now much more carefulabout the way in which they put trademarksand other identifying marks on their prod-ucts. Counterfeiters often miss these sub-tleties and hope that their victims will aswell. But databases introduced by supply-chain organisations in recent years provideusers with vital information on which fakes tolook out for. However, this is a strategy thatrelies on constant vigilance from the user.The most effective strategy is to engage withsupply-chain partners who work to ensurethat they have access to legitimate parts.Many counterfeit components enter thesupply chain through the grey market. Bypresenting them as overstocked parts ordevices that have been returned fromOEMs, counterfeiters can effectively laun-der their wares through conventional saleschannels. Franchised distributors engagedirectly with manufacturers and can estab-lish a complete audit trail, complete withdetailed information on date codes andother supporting evidence, for the compo-nents they supply.

To help counter the rise in fake components,the ECIA has put together a number of initia-tives that include the creation of theAdvocacy and Industry Promotion Council,of which Digi-Key is a member, to raise aware-ness of the issues caused by counterfeit parts.The ECIA is active in advising on legislationdesigned to reduce the supply of counterfeitparts and is actively supporting the role offranchised distributors through services suchas ECIAauthorized.com, recognising thatthese supply-chain partners have the rela-tionships with manufacturers and resourcesto maintain counterfeit-free networks.

Counterfeiting remains a hazard for any userof electronic components but armed with theright information and with access to the rightpartners, there is no need to become a victimand aid the growth of this insidious crime ￭www.digikey.com

INDUSTRY NEWS COUNTERFEITING


We all are born with an innate sense ofcuriosity about the world. A curiosity thatparents and teachers know all too well aschildren are very inquisitive – constantlyasking questions about the world aroundthem. Feeding that curiosity is importantbecause as we grow older, it becomesincreasingly more difficult to find the time tolearn new things. Working at Freescale, I amso fortunate to be surrounded by market-leading technologies that help make theworld a smarter and more secure place. Atthe heart of these technologies are engi-neers, who have fostered their curiosity –turning those questions of ‘why’ and ‘how’into the next greatest things.Regardless of your profession, I think we allstill harness a curiosity at times about howthings work and perhaps even have ideas onhow to make things better. For example:Ever wonder why your remote control bat-teries have to be replaced so often or howthe tray in your microwave spins around?Or what makes your refrigerator run?

Enter Kinetis MCUs … It is no secret thatKinetis MCUs are ‘connected’ to people,making things better for our lives every day.Whether we realize it or not, MCUs are animportant part of our daily lives; from themoment our alarm clock goes off in themorning until the moment we finish ourbook and turn off the eReader for theevening. In fact, even the bed we sleep inmay be using an MCU. Microcontrollers areembedded in almost every device connect-ed to power or a battery. I would venture tosay that the average household has at least50 electronic gadgets and appliances withMCUs in them – spanning from your garagedoor opener to your smart watch, andeverything in between. The increasing pop-ularity of microcontrollers in end products isbecause MCUs are more full-featured, lowercost, and easier to develop with than everbefore. Kinetis MCUs in particular, arefocused on the following four key areas tomake the experience even better for theengineers designing with them and the con-sumers using the end products.

Security – But with the addedprivilege of connectivity, comesthe increasing responsibility to

secure it all. We want to make sure that onlyauthorized users are seeing our information,using our devices, and that the devices inour home are not easily accessed by hackers. The security features of the Kinetis MCUsare designed to prevent unwanted attacksand protect the device. Freescale.com/security

Connectivity – Our homes aregetting smarter. I am old enoughto remember the days before

remote controls – when changing the chan-nel required us to physically get up andchange the dial. The wireless remote controlwas invented as a way to connect the userand the TV remotely. That idea has spannedthroughout much of the home and the wayin which devices connect is more advancedthan ever. The thermostat is talking to the

ceiling fan, the home alarm system is talkingto the iPAD, and I feel like my kids are ableto control way too many things around thehouse just from their gaming system.Integrated into Kinetis MCUs are smart waysfor the devices to connect with each other –both wireless and wired connections. Freescale.com/Kinetis

Low Power – Have you evermissed the opportunity to cap-ture a video or picture of animportant milestone because

your camera battery died or got discon-nected from something important as thebattery icon on your phone drifted to 0%?The low-power capabilities of Kinetis MCUsenable longer battery life and are more“green” for the environment by helping saveon overall system power. Freescale.com/lowpower

Ease-of-Use – Kinetis MCUs areenabled by a variety of softwareand hardware tools. Just like a

hammer and screwdriver make it easier tobuild a house, tools like the FreescaleFreedom boards and Kinetis SDK make iteasier to build the next great electronicsproduct. By making Kinetis MCUs easier touse and design with, we allow the engineersto focus their time on new features andadded differentiation. Freescale.com/Kinetis/SW

As the world of technology continues toevolve, I’m excited to see what the futureholds. But it first starts with you and yourcuriosity. What challenges do you have withtechnology today? How could you useKinetis MCUs to design the next great thing?Comment below and let us know. Also, stay tuned for more information onhow #KinetisConnects and how you can getinvolved in 2015 ￭www.freescale.com

By Kathleen Jachimiak Kathleen Jachimiak is product marketing manager for Kinetis MCU at Freecale

DESIGN MCUs

#KinetisConnects: Turn your curiosityinto tomorrow’s greatest invention

1919www.epd-ee.eu | June, 2015 | EP&Dee

DESIGN MCUs

100% GNU GCC compatible with patented resequencingtechnologySOMNIUM DRT builds upon the heritage of the Eclipse IDE andGNU tools technology, widely deployed for almost 30 years acrossa huge number of users. DRT’s toolchain is fully GNU GCC compat-ible, so your existing CodeWarrior GCC and Kinetis Design StudioIDE source code will migrate with no changes required. Our patent-ed resequencing technology improves developer productivity,automatically optimizing to build smaller, faster executables. Thisenables you to potentially use a more cost-effective Kinetis solutionthan you would otherwise.DRT users also benefit from access to SOMNIUM’s support team,providing help and advice on our product, when you need it.

Faster, tighter code for your specific edge nodeSOMNIUM DRT uses our patented Device-awareResequencing to optimize for performance, code size andenergy. Traditional code generation tools only considerthe processor’s instruction set and don’t optimize for yourchosen device’s memory system. DRT is different. Theentire code generation flow is device-aware and considersthe respective Kinetis MCUs core architecture, which isbased on an ARM Cortex®-M core, and the memory hier-archy (e.g. cache configuration, buffers, on-chip flash,RAM etc.) for your specific IoT edge node design. Thewhole process is automated and transparent, with no newcommands or extra compilation steps.From the first invocation of the compiler, code generationis tuned for your Kinetis MCU. At the linking stage, thewhole program is resequenced to get the best “fit” forhow it interacts with the processor and memory system, toensure the smallest most efficient program is generated.No changes to your source code or working practices are required.DRT’s features allow you to leverage your existing source code, andcontinue to use Freescale’s Processor Expert software and theKinetis software development kit (SDK) to access the rich set of on-chip peripherals and off-chip interfaces provided on Kinetis MCUs.This is key to getting your IoT design to market quickly, in a highlycost optimized form.

Using Kinetis MCU demonstration applications as shown on theFreescale IoT Center community, we’ve seen impressive results ofthe DRT product in action. Code size reductions of over 20% cou-pled with performance improvements have proven that DRT letsyou do more with less. An example application can fit into a 64 KBflash device rather than 128 KB device typically required using tra-ditional development tools. This can enable a step-change in thecapability and range of your IoT design choices, further reducingsystem cost and development time.DRT’s familiarity and compatibility with existing Kinetis tools andsource code combined with patented optimizations generate thebest result for the Kinetis MCUs you are using, and enable anexpanded range of choices.

What’s next?SOMNIUM DRT, Freescale Kinetis MCU edition, will be on generalavailability for product purchase and 30-day evaluation later thismonth. For further information and demonstrations of DRT’s fea-tures and benefits please take a look at the SOMNIUM page on theFreescale IoT Center. ￭www.freescale.com

SOMNIUM® Technologies has been working closely with Freescale to provide solutions forKinetis MCU software developers to address the IoT node design challenges. This blog wascontributed by David Edwards, founder, CEO and CTO of SOMNIUM.The degree of sophistication within modern embedded system designs is phenomenal. MCUstoday provide more processing and memory capacity than ever before. At the same time, IoTnode design brings a familiar set of challenges – the constraints of cost, memory capacity,processing power and energy consumption. IoT edge nodes may have the most severeconstraints, perhaps only containing 8 KB of flash, and 1 KB of RAM, but still requiring aconventional software development environment.

By David Edwards, SOMNIUM Founder and CEO/CTO

Tighter code for your IoT edge node


DESIGN MCUs

Google shocked the automotive industry byshowing the world its self-driving car, whichdoesn’t have a steering wheel or pedals.BMW showed the public its “highlyautonomous driving” demo during CES2014, in which the car takes control of thewheel using various sensors and actuators.Audi has their own self driving system called“Piloted Driving,” which can steer to followlanes and maintain distance with nearbyvehicles controlling the pedals, assisted bylight detection and ranging. But when arethe drivers going to enjoy the perks of semior fully assisted driving? Is the market readyto adopt these technologies?Although most people may cringe at the ideaof relaying the control of their vehicle to acomputer or a processor, they are likelyunaware that most of the functions of theircars, and the majority of cars on the road, arealready being managed by devices such assensors, processors, and microcontrollers thatare the backbone of the autonomous vehicle.

Let’s take a quick look under the hoodEngine control units (ECUs) or powertraincontrol modules (PCMs) are computers thatcontrol a series of actuators on internal com-bustion engines based on arrays of sensors toensure optimal engine performance. Theyread a multitude of embedded sensors with-in the engine and decide in real time when toopen and close the air and fuel intakes andwhen to fire the spark plugs. Computers havebeen in charge of these vital vehicle functionsfor more than three decades. In 1980,Freescale (Motorola at the time) introducedthe world’s first electronic engine control unitand since then the microprocessor controlledelectronic fuel injection system has been thestandard approach. Transmission controlunits are devices that control modern elec-tronic automatic transmissions. These con-trollers typically use sensors from the vehicleas well as data provided by the engine to cal-culate how and when to change gears in thevehicle for optimum performance, fuel econ-omy, and durability. Automatic gear changesin vehicle transmissions are no longer enactedby transmission fluids or mechanical means.

Instead, a computer is in charge of decidingwhen to change gears and uses an electro-mechanical actuator to shift the gear.Anti-lock Braking Systems (ABS) are automat-ed systems that allow the wheels of a vehicleto maintain tractive contact with the roadwhile braking, this prevents the wheels fromceasing rotation to avoid uncontrolled skid-ding. This means that a computerdecides in real time how much brak-ing fluid is actually applied to thebraking system using hydraulicvalves. Auto manufacturers such asChrysler and Mercedes have reliedon processors to control this vitalfunction in vehicles since 1971, withothers adopting this soon after.Drive by wire uses an electro-mechanical system to replace thetraditional human machine inter-faces of a vehicle. For example,when you turn the steering wheelor press the gas pedal, the driver is nolonger driving a mechanical system that isultimately causing the wheels to turn ormore gas to be pumped to the engine.Instead, this action is causing sensors to beactivated and information is transmitted tothe appropriate control unit, and a comput-er applies the intended mechanical action -steering, acceleration or braking. Nissan wasthe first manufacturer to place this system ina production model, allowing flexibility andconfigurability in the drivers’ operation.

How will the current technology connect to the future?These are examples of the current markedadoption of embedded electronics, andclearly indicate the auto manufacturers’ trustin current solutions. They are also ready tobe part of autonomous driving systemsbecause they communicate with their envi-ronment through a CAN or Flexray commu-nications bus. These computer signals willnot distinguish if a turn or acceleration com-mand was originated by human action or byan electronic control unit that decides whatto do based on maps and sensors.But what will the future entail? What elec-

tronic systems and underlying silicon solu-tions can enable autonomous driving tobecome a reality in production models?Freescale and its partners have paved theroad with hardware and software solutionsto achieve this as soon as 2017.The market is ready to adopt active safetysystems that take the wheel to avoid danger,

such as safety brake assist, traction control,and collision avoidance systems. Safetybrake assist detects when a potential dan-gerous situation exists and pumps up thepower of the brakes. Studies have shownthat even when drivers react in time, theymay not apply enough brake to avoid a col-lision. Collision avoidance systems use radar,laser, and camera sensors to detect an immi-nent crash. Once the detection is made, thesystem may just provide a warning or takeaction autonomously without any driverinput. Applications include 360 degree sur-round view and camera based park assist,cross traffic alert and blind spot detection.People will remain skeptical handing overcontrol of their vehicle to a computer, but asI’ve explained above, the foot is already inthe door for most OEMs. Slow, useful, andpractical implementation by OEMs may justbe the key to mainstream acceptance.Driving a car can be one of the most danger-ous, risky, time consuming activities in yourday. Autonomous vehicles are not abouttaking control away from the driver, rather,making the process of driving a safer andstress free experience ￭www.freescale.com

By Luis OleaLuis Olea is an Automotive Applications Engineer at Freescale Semiconductor.

How current technology will be adaptedfor tomorrow’s needs in automotive

DESIGN AUGMENTED REALITY

The path toward augmentedreality with Renesas R-Car family

The combination of powerful 3D graphics, outstanding computer vision capabilities andoptimized video capture to form single chip SoC solutions is key to the success of futureparking assistance solutions that include surround view systems using multiple cameras. Thesecond SoC generation from Renesas, called R-Car, aims at providing the appropriate solu-tion to enable ready to use advanced 3D surround view applications and offer the driver animmersive and safe experience.

Key words: ADAS, 3D surround view, 3D graphics, computer vision, image recognition, structure from motion, Ethernet AVB, video compression, low latency


Author: Simon Oudin,Senior Marketing EngineerRenesas Electronics Europe


INTRODUCTIONSurround view monitoring will become acommon functionality in cars. This feature ispart of the parking assistance system. From aniche market first driven by Asian car mak-ers, it has become an option offered by themajority of car manufacturers, with the con-sequence of a higher requirement in termsof driver experience and solution scalability.

Renesas, as a lead SoC vendor for infotain-ment and ADAS applications, is already amajor player for supporting surround viewrequirements in their early phase. Today,Renesas provides a new generation of SoCto answer global market needs with a scala-ble and innovative approach.

SURROUND VIEW WITH R-CAR GEN2 FAMILIEThe purpose of surround view monitoring isto display a panoramic view of the car’simmediate surroundings. This representa-tion, at 360 degrees with 2D perspectivefrom the sky, is called “bird view” or “topview”. The different views are stitchedtogether thanks to the correct geometricalignment of the cameras. The brightnessand colour of the different cameras’ videosare modified for the harmonization of thesurround view [1] [2].Nevertheless, displaying only this representa-

tion does not generally help the driver dur-ing the parking process. To facilitate thismanoeuvre, additional information can beshown to the driver as 2D overlays or rearview [1]. A complementary approach is toimprove the driver apprehension of the dis-tances with a 3D representation of the car’ssurroundings. The target is to use 2D camerasaround the car to create a 3D comprehensiverepresentation of its immediate vicinity with a3D generated car as a driver perspective ref-erence. It should reflect a realistic representa-tion of the distances to nearby elements(pedestrians, cars and buildings). The 3Dsphere perspective should dynamicallychange according to the car movement. Themodel car has to be properly integrated inthe overall scene with light or reflection onthe model car [2].

This level of application drives the perform-ance required in terms of 3D graphics andcomputer vision in an automotive embed-ded platform. Renesas created the SoC fam-ily called R-Car in order to enable this levelof applications. The second R-Car genera-tion was first officially released in March2013 and supports a wide variety of appli-cations, such as connectivity, entertainmentexpansion and ADAS. This family providesoutstanding performance with optimalpower consumption capabilities [3] and a

common API for reducing customer devel-opment efforts. From this family, twodevices support surround view application:the R-Car H2 and the R-Car V2H.

3D IMMERSIVE EXPERIENCE WITH R-CAR H2R-Car H2 is the first device released in March2013 and tailored to integrated cockpit solu-tions with the 3D surround application. Forthis utilisation, we first need to consider 3Dgraphic engine performance requirement.We should particularly pay attention to thetwo parts of the scene: the texture mappingof the 2D camera images on a 3D sphere andthe 3D car representation. The polygon count of the scene depends onthe deformation of the 3D sphere and therendering effects on the car model. For betterrendering, the graphic engine must be able toprocess a significant polygon count in a shorttime. Moreover, as the application can use dif-ferent shader programs for one scene, thegraphic engine must come with a powerfulshader engine. Those performance require-ments must be supported by a high GPU fre-quency, which will allow fast data processing.All these performance aspects justify Renesas’decision to integrate an outstanding 3Dgraphics engine in R-Car H2. Indeed, its 3Dgraphic engine provides similar performancethan the latest iPad Air 3D graphic engine.



THE PATH TOWARDS AUGMENTED REALITYThe sensing of the scene in 3D is the otherimportant aspect required to provide easyto understand content. This can be achievedwith two techniques. The first is human-likestereo vision, although it has the disadvan-tage of double the camera cost and integra-tion effort. The other option is to create theStructure from Motion (SfM) of the car, thusproviding stereo vision over time. Renesashas implemented vision-dedicated hard-ware accelerators into the R-Car family topower this algorithm on the four cameras inreal-time, meeting both performance andlow power consumption requirements. The SfM algorithm issues a list of flow vec-tors representing the motion of the vehicleand surrounding objects. The next non-triv-ial task is to find the car’s egomotion by cal-culating the essential movement from flowvectors and matching the majority of them.From this fundamental matrix, flow vectorscan be sorted corresponding to static anddynamic objects in the surroundings. Staticobject flow vectors directly provide the dis-

tance of the object inversely proportional tothe flow length. Figure 1 (a) shows an example running on R-Car H2. The circles represent the static fea-ture points which are the outcomes of thestructure computation. The colours corre-spond to the clustered objects which arethen fed back to the model deformation.Those can then be used to adapt the 3Dmodel of the environment in real time asshown in Figure 1 (b). Finally, a realistic repre-sentation of the car environment is createdbased on this 3D model mapped with the 3Dsphere generated by the graphic engine.

ETHERNET: FLEXIBLE APPROACHWITH R-CAR V2HThe R-Car family also includes the R-CarV2H, which provides a unique video pathapproach from the camera video acquisitionover the Ethernet network down to the dis-play interface. This pipelined approach not only releasesthe requirements to the rest of the system(e.g. overall latency, memory bandwidth andCPU intervention), but also drastically

reduces the software development com-plexity for the system maker. Figure 2 shows this special video path of theR-Car V2H. There is no external memoryaccess from the four cameras demultiplexingto the geometric video transformation andeach hardware accelerator is dedicated forone camera.System cost reduction is a main aspect con-tributing to the higher adoption of the sur-round view. Cabling is a non-negligible por-tion of that. In the past year, two approach-es have emerged to reduce current LVDSbased surround view systems [4]. One usesEthernet over an unshielded twisted pair,the alternative being an update of LVDS tocost-effective coaxial cables. Both approach-es lead to a similar system cost. However,the Ethernet solution not only helps systemcost reduction but also offers flexibility forfuture applications. For example, with theincreasing adoption of drive recording sys-tems, new features like multi-channel simul-taneous video recording could be support-ed with very limited impact on costs, as onlythe SD card interface would be required.


Figure 1: SfM algorithm implemented in R-Car H2. Outcome of SfM algorithm running on one camera with R-Car H2 (above). 3D model of the environment based on SfM process outcomes (below)

The other benefit of Ethernet over LVDS liesin the standardized approach from bothMAC levels with AVnu Alliance and PHYlevel with Open Alliance.

OPTIMAL LATENCY VIDEO PATHOne of the main aspects requiring carefuldesign is latency – in the transport includingcompression and decompression, as well as

in the processing chain. Indeed, the overalllatency from camera capture to displayshould be below 100ms in order to enablereal-time perception to the driver.


Figure 2: Surround view video path on R-Car V2H with Ethernet input




Currently, cameras run at a frame-rate of 30frames/sec. When using the global shutter,the sensor cells charge during the exposure

time and all at the same time. Then theimager starts to output pixel by pixel.Consequently, the last pixel is sent around 1frame (33ms) after the capture. This is thefirst frame delay, which cannot be reduced.The other incompressible delay is for thedisplay, where pixels must all be transmittedbefore they can be displayed, again around33ms. Finally only 33ms remain to performthe rest of the tasks described in Figure 3.The first item of the chain is the data transmis-sion. The Ethernet protocol does not providededicated mechanisms to ensure low latencytransport and camera synchronization. This iswhy Renesas introduced the first GigabitEthernet MAC with advanced AVB hardwaresupport in the R-Car family [5]. This specificimplementation provides the necessary hard-ware to reduce CPU load and optimize theoverall compressed video reception. Somespecific mechanisms have been implementedas intelligent packet decapsulation and cam-era video filtering. The multi-view cameraapplications are part of the AVnu AllianceAVB Automotive profile with fast start-up,low latency (maximum delay of 2ms) consid-erations for camera video [6].

The first multi-camera systems with Ethernetused low latency Motion JPEG (MJPEG) com-pression. This technology is based on the

well-known JPEG standard widely used inconsumer digital cameras. Nevertheless, theimpact on quality video with this technolo-gy could limit the vision processing per-formance [7]. Consequently, Renesas con-sidered H.264 compression technology tobe the best solution for camera video trans-mission [8]. It provides a better compres-sion ratio for improved vision processingperformance [7] [9]. It has been also mas-sively adopted in all consumers’ equipmentthat could be connected to the car throughRenesas Infotainment connectivity solution.With the R-Car V2H, Renesas has imple-mented the first HD multi-channel, H.264compliant, low latency decoder in an auto-motive SoC.The ultimate step to reduce the latency is todecrease the latency in the processing por-tion. Indeed, traditional DSP based systemsrequire a double buffering approach for thevideo capture. The R-Car V2H features adedicated engine called IMR that processesthe image geometric transformation on thefly. This feature supports direct streamingfrom up to 5 low latency video decoders.Thanks to the direct path in R-Car V2H, the

overall latency in an Ethernet network isreduced in comparison with a classic LVDSapproach, as shown in Figure 3.

REPRESENTATION AND DETECTIONThe IMR is also capable of using a look-uptable (LUT) to modify the viewpoint trans-formation to a 2D or 3D surround view rep-resentation on the fly.

The camera viewpoint can be modified foreach input frame, enabling animated transi-tion between the user’s viewpoints. Bilinearfiltering is natively supported, providingexcellent image quality. Thanks to thisapproach, the R-Car V2H natively supports3D surround view with very low memoryrequirements. The R-Car V2H offers thesame image recognition hardware as the R-Car H2. Consequently, it can also enable SfMcomputation or even pedestrian detection.

It is capable of detecting pedestrians foreach of the four cameras in parallel, usinghistogram of gradient and support vectormachine classification. This feature has beenalready demonstrated on the R-Car V2Hduring the Renesas Developer Conferencelast September in Japan, and at Electronicalast November in Germany. Figure 4 showsthis proof of concept [10].

Figure 3: Latency for video transportation and geometric transformation



CONCLUSIONIn this article, we have presented the trendof automotive multi-camera applicationsfocusing on the 3D surround view for park-ing assistance systems.

We have also introduced the scalable R-Carautomotive SoC family. R-Car H2 is capableof creating 3D comprehensive representa-

tion of a car’s immediate surroundings tofacilitate parking manoeuvres. In the R-CarV2H, a unique direct Ethernet video pathhas been introduced with Ethernet AVBMAC and multi-channel H.264 low latencydecoder for ultra-low latency video pro-cessing and memory bandwidth reduction. Considering that this application would bepart of an autonomous parking assistance

system, Renesas has already introduced keyfeatures to target an ASIL B at system level ￭www.renesas.com

Simon Oudin is Senior MarketingEngineer for surround view appli-cations in the newly created“Global ADAS Solution Group” atRenesas Electronics Europe.

References[1] Mengmeng Yu and Guanglin Ma, Delphi Automotive “360° Surround View System with Parking Guidance”, May 2014[2] M. Friebe, J. Petzold, “Visualisation Functions in Advanced Camera-Based Surround View Systems”, 2014[3] Peter Fiedle, “Mehr Power weniger Leistungsaufnahme”, February 2014[4] N. Noebauer, “Is Ethernet the rising star for in-vehicle networks?”, September 2011[5] S. Oudin, N. Kitajima „Das zukünftige Ethernet-AVB Netzwerk“, November 2012 [6] AVnu Alliance White Paper “AVB for Automotive Use” http://www.avnu.org/knowledge_center, October 2014[7] J. Forster, X. Jiang and A. Terzis “The Effect of Image Compression on Automotive Optical Flow Algorithms”. 2011[8] T. Wiegand, G. J. Sullivan, G. Bjøntegaard, and A. Luthra, “Overview of the H.264/AVC Video Coding Standard”, Juli 2003[9] T. Nguyen, D. Marpe, “Performance analysis of HEVC-based intra coding for still image compression”, May 2012

[10] http://am.renesas.com/edge_ol/topics/21/index.jsp

Figure 4: 3D surround view demonstration with pedestrian detection based on R-Car V2H


DESIGN POWER ICs

Embedded Power ICs

With various versions, graded by the size ofthe internal RAM and flash memory, CPUclock speeds and communication interfaces,developers are free to choose the idealmodule for each application.

Two base types with an integrated two-phasegate driver or three-phase gate driver formthe core structure of the embedded powerICs. Both are based on single-chip technologyand include an ARM® Cortex™ M3 processorwith a clock speed of 24 MHz or 40 MHz.

The Cortex™ M3 Core opens up entirely newopportunities in the field of motor controlalgorithms. The 32-bit μC range addresses

precisely the BLDC segment that was servedby 16-bit controllers in the automotive indus-try in the past.Infineon has also set new standards in theselection of the housing – the space-savinghousing concept, known as the “VQFN48package”, which has only been available tothe automotive sector since recently. Thispackage enables automotive system manu-facturers to develop much more compactand efficient systems that are optimized touse the available space. Whereas up to 150different components may be used in mod-ern circuits, the use of the new TLE986x/7xembedded power range enables this to bereduced to less than 30.

Of course, all TLE986x/7x components areAEC Q100-qualified.

Today, with the numerous intelligent andhighly complex motor drive systems thatvehicles host, it is more important than everto develop refined control systems in orderto keep system costs manageable, optimizesystems in terms of their energy efficiency,and ultimately also improve convenience indevelopment. Infineon's new third-genera-tion range of products unites all of this.The TLE986x series with gate drivers forfour n-channel FETs with H-bridge topologyas a power stage was specifically conceivedto drive two-phase DC motor systems.

Infineon's new TLE986x/7x product series is a third-generation system-on-chip solution(SoC) that offers a wide range of functions – all in particularly compact housings. Thismakes Infineon one of the first semiconductor manufacturers to offer a highly-integratedembedded power series with a powerful microcontroller, flash memory, MOSFET gatedriver and an extensive range of analog and mixed signal peripherals on the market.

Maximum Integration onMinimum Space

Mathias Müller, Product Sales Manager Power Semiconductors and member of the new Automotive Business Unit ,Rutronik Elektronische Bauelemente GmbH


DESIGN POWER ICs

It is conceivable that it might be used inautomated car sunroofs or to control doorwindows.Of course, the modules of the TLE986xseries can also be used for all H-bridge-based drive systems in the car.

The TLE987x product group with its six n-channel FET drivers is suitable for drivingthree-phase (BLDC) motor applications,including fuel pumps, motor fans, blowersfor air conditioning systems, water pumps,and a variety of other pumps and fans insensorless or sensor-based PWM motorcontrol applications.

The optional LIN transceiver of theTLE986x/7x product group is consistentwith the LINstandard 2.2, and has been cer-tified by IBEE Zwickau and the C&S Group.

The peripheral set of both modulesincludes a current sensor and a 10-bit ADC(analog-digital converter) that operatesusing the successive approximation methodand is synchronized with the capture/com-pare unit (CAPCOM6) for PWM (pulsewidth modulation control) and 16-bittimers. This is especially important in time-synchronized signal generation, for examplewith PWM or the synchronous analog signalprocessing in the ADC.

For communication with the component, anintegrated LIN transceiver, UARTs, SPIs and avariety of general purpose I/Os (GPIOs) are

available. Both product families have a linearvoltage controller integrated on the chip tosupply the internal modules and a controllerfor external loads (e.g. sensors), as well asbetween 36 kB and 128 kB of scalable flashmemory. A nominal voltage supply range of5.4 to 28 V is also accommodated. The inte-grated charge pump enables low-voltageoperation of the MODFET bridge at as lowas 5.4 V with the minimal external integra-tion of two capacitors into the circuit. Thiscuts the BoM (bill of material) costs signifi-cantly when compared to the frequentlyused bootstrap method for low-voltageoperation. The bridge drivers can also beused to program the charge and dischargecurrents. Combined with the patented flankcontrol for the power profile, this enablesthe EMC behavior to be optimized at sys-tem level for a wide variety of MOSFETs.

Both series can support up to 40 V and cantherefore accommodate typical 'load dump'scenarios. At the same time, an expandedoperating range of up to 3 V is enabledthrough keeping the microcontroller andthe flash memory fully functional.

For this, Infineon offers a testing and debug-ging tool for the TLE986x and TLE987xembedded power IC series.

The TLE986X EVALB_JLINK or TLE987XEVALB_JLINK evaluation board provides afull testing interface for all functions, periph-erals and properties of the TLE986x/7x

product family module in question, andenables a motor to be started directlythanks to the MOSFETs present on theboard. The design of the evaluation boardsallows for the handling of loads with a maxi-mum power consumption of 30 A.Depending on the model, the MOSFETs onthe evaluation boards are either arranged inan H-bridge configuration for a DC motoror in a B6 pattern for BLDC motors. UARTand LIN communication, direct access to allI/O pins, and a J-Link debugger are alsoavailable.

An extensive toolset, ranging from an editor,compiler and debugger to a code configu-rator and a variety of example programs, areavailable to level out the learning curve ofapplication development with theTLE986x/7x module family.

Power at RutronikPower semiconductors and their applicationshave been a focus of Rutronik since back in1980, meaning that today's team can providemany years of experience, in-depth know-how and close partnerships with the world'sleading semiconductor companies ￭

Rutronikwww.rutronik.comMore information at:www.rutronik-tec.com/powerContact: [email protected]

Tape extension sensors

A similar principle has been used for many years using a plaitedstainless steel wire winding over the circumference of a precisiondrum. More demanding industrial applications requiring higherduty cycles mean that in certain cases this is no longer suitable forthe life expectancy of the process equipment.

ASM has made significant improvements by utilising a 10mm wideand 0.08mm thick stainless steel tape. This is the core difference inthe evolution of the Tape Sensor compared to a wire sensor. Thelife of the tape is unaffected when using mul-tiple direction changing pulley’s forthose difficult to reach places. In awire sensor the life can bereduced by as much as80% by using multiplepulleys. TheTape Sensorgives thelife require-ment andreliabilityexpectedby today’sindustries. Itsflat smooth surfaceprevents ice build-up so itis also suited to harsher climateswhere mechanical devices are oftenprone to failure.At the heart of the sensor is an ASM none-contact

PRAM absolute, multi-turn encoder with on board signal condi-tioning. This is magnetically coupled to the drum arrangementwhich allows the tape to be over wound onto its self in continuousspiralling layer which is all kept under a constant tension with atensator spring.

To attain the high positional accuracy required the sensor is onlyprogrammed and linearised after assembly. This is due to the overwinding of the tape which would otherwise not give a linear out-put. This new improved system enables us to offer a standard lin-earity of 0.10%. Optionally a higher linearity of 0.05% is also avail-able all in a wide range of compact housings.

The main failure mode of conventional ‘contacting’ position sen-sors is that they wear out much more quickly than ‘non-contacting’systems. By using theASM PRAM non-con-tact Magnetic Encoderthe performance isimmediately improvedcompared to systemsusing potentiometersor other contactingtechnologies. The per-formance of the stain-less steel tape enablesthe operating lifeexpectancy of the sen-sor to be unaffectedespecially when incor-porating directionalchanging pulleys. Also due to the over-wind design of theinternal tape pulley ifthe sensor is accelerat-ed beyond its specifi-cation then the tape isunable to ‘jump off ’the pulley as is sometimes the case with a ‘wire draw’ system.The new PRAM sensing element electronics are fully encapsulatedenabling them to work in much harsher environments where shockand vibration as well as dust, grease and condensation may havecaused previous concerns. For safety critical areas devices can alsobe offered with a redundant output which can be used as an inde-pendent output or for error checking and failure of supply voltageA wide range of both analogue and digital absolute outputs areavailable including CAN bus options to meet today's variedrequirements.


PRODUCT NEWS AUTOMATION

Looking to extend and improve its already wide range of linear measurement sensors, ASM has taken the basic principal of a standard manual tape measure and re-engineered it to give an electronic output using a high specification stainless steel tape thatis highly flexible. Integration of this to a re-wind spring arrangement and an ASM PRAM encoder results, says the company, in theoperating principles of a new measuring device.

Tel. +40 256-201346 • [email protected] • www.oboyle.ro


n Optical sensorsn Sensors for logistic applicationsn Safety at work

n Optical Sensorsn Inductive Sensors

n Color Sensorsn True Color Sensors, Spectrometersn Gloss Sensors

Leuze

Contrinex

Sensor Instruments

n Linear Sensorsn Angle Sensorsn Tilt Sensors

n PLCsn Temperature Controllern Timer

n Flowmetersn Level Indicators and Switchesn Pressure Sensors and Switches

ASM

Selec

Kobold

n IP69K

GMW

Industrial connectors

Special Approvals

n Circular connectors M8; M12; M23n Cable and Connectors for Sensorsn Valve Connectorsn Distribution Blocks

n Digital panel metersn Panel indicatorsn Bus bar isolatorsn Current transformers

AUTOMATION

Cost-effective solution with Contrinex C44Container-handling cranes inbusy British seaports operatearound the clock. Sensors on eachhoist carriage detect its position

with respect to the crane struc-ture and prevent it travelling out-side preset limits. Mechanical playin the hoist carriage allows a small

amount of lateral drift as it travelsalong the crane structure.Adequate sensing distance isessential to prevent the sensorcolliding with the crane structure.

Customer value• Reliable sensing of hoist-

carriage position in a busy container seaport

• Significant reduction in crane downtime

• Marked decrease in maintenance costs for replacement sensors

Advantages of C44 inductivesensor from Contrinex• Sensing distances up to

20 mm in industry-standard 40 × 40 mm housing

• IP68/IP69K

PRODUCT NEWS SENSORS

• Tel. +40 256-201346• [email protected]• www.oboyle.ro

Tel. +40256 [email protected]



Container detectionTriggering sensors Leuze PRK 3B/6.42 – the clear solution ￭ Works perfect with transparent containers – no time and costs for changing the form and kind of container ￭ Teach button – easiest adjustment with optimized function reserve and highest sensor performance for yourmachine. Don`t waste time and money with down time!￭ Small and robust – easy to integrate. Space saving design of your machines is no problem ￭ The universal solution – for all functions of your machine. Triggering, presence detection or break control –solve all challenges with the same sensor

Container detectionTriggering sensors Leuze PRK 5 – the economical alternative ￭ Robust plastic housing for industrial use – safes function of your machine even in a harsh environment ￭ Integrated metal threads – mounting is easy and saves your time and costs. Mechanical damage will be eliminat-ed compared with plastic threads ￭ Bright light spot and LED indicator – easy start-up and function check saves time and money during installationand operation ￭ The universal economical solution – for all functions of your machine. Triggering, presence detection or breakcontrol – solve all challenges with the identical technology

End of tape detection with diffuse sensor Leuze HRTR 3B-XL – the solution for clear on clear labels ￭ Detects all materials due to a special designed extended light spot – also clear on clear. No expenses forchangeover work ￭ Adjustment is easy and fast with a visible light spot and LED monitor – all this will bring you a benefit in time andcosts ￭ No reflector needed – you will get less expenses for mounting and installation

End of tape detection with diffuse sensorDiffuse sensor Leuze FT 5 – the economical alternative ￭ Visible light spot and LED indicator – easy start-up and function check￭ Robust plastic housing with integrated metal threads – reduction of maintenance time and costs caused bymechanical damaged sensors ￭ Flush fit mounting with cable exit at the corner – space saving design is possible without any compromise to thefunctionality

End of tape detection with diffuse sensor Leuze HRTR 3B - end of roll detection without reflector ￭ Detects all materials with smallest influence from the surface of the material. No readjustment necessary whenthe label change.￭ Adjustment is easy and fast with a visible light spot and LED monitor – all this will bring you a benefit in time andcosts ￭ No reflector needed – you will get less expenses for mounting and installation ￭ Sensors with measuring function and output are available from Leuze electronic as well

Leuze’s optical sensors for packaging applications

Tel. +40 256-201346 • [email protected] • www.oboyle.ro

The all-rounder for maximum performanceThe ultimate in measuring accuracy, processrobustness combined with intuitive andconvenient operation - that‘s the PASCALCi4 range. The HART7 standard guaranteesflexible integration into control systems andcompatibility with similar equipment. The high-resolution, illuminated graphic dis-play can also be read in poor light and can befitted up to 10 metres away to service hard-to-reach measuring points. Even unusual tem-peratures of - 30°C and up to + 80°C do notharm the readability of the display. The intuitive 4-button operation assistsusers with help texts and information dia-logues. With just a few clicks, users can haverapid access to device parameters directlyon the display. Comprehensive diagnosticand simulation functions round off this highgrade measuring instrument.

Process connections￭ Wide range of different threaded

connectors￭ Suitable for use with all LABOM

diaphragm seals￭ Additional components, like capillaries or

temperature decouplers, are also available￭ Optional rear-sided connection or front

flange for flush mounting

Communication￭ HART7 standard￭ Integration in SIEMENS PDM 6 and 8￭ Integration in FDT environments

(z. B. PactWare, FieldCare) via DTM￭ Field Communicator 375 / 475￭ Simple icons indicate device status

Case design￭ Proven basic concept with process

connection underneath, electrical connection at the rear and front display￭ IP 65 / 67 or IP 69K protection rating

Electrical connection￭ Circular connector M 12 × 1, cable gland

M 16 × 1.5, M 20 × 1.5, both polyamide or stainless steel, 1/2“ NPT polyamide￭ Multi-chamber housing with large, easily

accessible terminal compartment￭ Three different terminal blocks

(spring clamp, pole, screw terminals)

External features￭ Type plate with indestructible laser

marking￭ Material: Wetted parts are made of

stainless steel 316L￭ Hygienic version: Stainless steel front

cover with safety glass

Removable control unit￭ The display and

control unit can optionally be fittedup to 10 metres away from the measuring point if it is concealed or hard-to-reach

￭ Fully-operational control module with the same functionality as when operating directly on the unit￭ It can be fixed in place by means of a wall

bracket or clips

Optimised menu navigationThe quick setup summarises all the majorparameters in a single menu. Various config-urable displays enable users to select whichand how many subordinate variables aredisplayed. All parameterisation data can becopied from the devices into the configura-tion memory in the display module. Thedata is permanently stored there. Theparameters can be transferred simply andquickly to other devices.

Calibration options￭ Zero point correction￭ Position correction￭ Lower / upper adjustment￭ Current adjustment

Diagnostic functions￭ Resettable pointers for pressure and

temperature (sensor)￭ Operating hour counter￭ Maintenance timer, device generates a

service signal after a period of time that can be set (displayed by the icon on the display and by HART)￭ Error messages: The device displays the

last error message in plain text




- High-resolution graphic display- Intuitive operation

- Quick setup function- Removable display / control unit

PASCAL Ci4 from LABOMThe intuitive pressure and differential pressuretransmitter meeting highest standards


Contrinex C23 Full Inox: flat, rugged, efficient

With this sensor’s all-metal housing, appli-cations do not need to pull any punches.Shock and vibration can do no harm to thislittle problem solver, thanks to its Condettechnology and stainless steel housing.

Installation is very simple from the front ofthe device using the two drill holes.Thanks to Contrinex ASIC technology, the

new C23 is highly accurate and has an IO-Link interface. This gives the customer vari-

ous parameterization options, such asswitching between NO and NC operationor programming an ON or OFF delay.

Your advantages• Indestructible sensor• Factor 1 on steel and aluminum• Long operating distances• IO-Link

Typical applications• Grippers and clamping devices• Gantry robots


PRODUCT NEWS AUTOMATION

The new, flat C23 from Contrinex is ideal for applications where space is scarce but long operating distances are still indispensable.

ContriNet: the powerful RFID network forlow and high frequency

ContriNet not only allows up to 31read/write modules (RWMs) to be connect-ed to an industrial fieldbus, but also themixing of low and high frequency RWMs inthe same network. In addition, since allContrinex high frequency transponders areISO/IEC 15693 compatible, equipmentfrom different manufacturers can be com-bined.Threaded RWMs are available with S12connector and RS485 output. The rangeincludes rugged all-metal RWMs with an

impervious sensing face and high-tempera-ture RWMs for up to +125°C (257°F).Interfaces are provided for most industrialfieldbuses and USB.The highly flexible ContriNet network is apowerful tool in the hands of RFID systemintegrators for smart factories.

Application: washing stationIn the harsh environment of a washing sta-tion, RFID transponders and read/writemodules are exposed to hot water,

mechanical shocks, corrosive chemicals andhigh-pressure jetting. Despite these chal-lenges, identification systems must operatecontinuously with high reliability.Typically, RFID tags are mounted on thepart carriers. On arrival at the washing sta-tion, information from the tag is used toselect the correct washing cycle for the parttype and process.

ConIdent advantagesConIdent passive tags require no powersource and minimal maintenance. Rugged,low frequency tags with all-metal housingsare sealed to IP67 or IP69K to resist waterpenetration and can withstand tempera-tures up to 180°C (+356°F). Their extend-ed sensing range reduces the risk ofmechanical damage. Read/write units inter-face directly with customer control systems


Users of industrial RFID can maximize the flexibility of their systems with the powerful ContriNet RS485 network from Contrinex.

Mouser Electronics is nowstocking the BMI160 6-AxisInertial Measurement Unit(IMU) from Bosch Sensortec.This low-power, low-noise unitis designed for mobile applica-tions that require highly accu-

rate, real-time sensor data, suchas augmented reality, immersivegaming and indoor navigation.The BMI160’s tiny 2.5 × 3.0 ×0.83mm, 14-pin LGA packageand built-in configurable powermanagement unit (PMU) makeit the smallest inertial measure-ment unit in the market.

The Bosch Sensortec BMI160 6-Axis Inertial Measurement Unit,available from MouserElectronics, features a 16-bit, 3-axis accelerometer and an ultra-low power 16-bit, 3-axis gyro-scope that consume only 950μA in full operation withoutinternal duty cycling — idealfor always-on applications likewearable devices. Further sup-porting always-on applications,a configurable on-chip inter-rupt engine provides contextawareness for operations suchas any- or no-motion detection,tap/double tap sensing, orien-tation detection, free-fall, orshock events. The IMU alsooffers 6- and 9-axis sensorfusion, synchronizing data withan external sensor, such as amagnetometer.MOUSER ELECTRONICSwww.mouser.com

Mouser Stocking Industry’s Smallest InertialMeasurement Unit, the BMI160 6-Axis fromBosch Sensortec

Panasonic Automotive &Industrial Systems has intro-duced a new series of humandetection proximity sensors. MAMotion series sen-sors are 35 % thin-ner than previousversions and aresimple to installthanks to their‘plug and play’nature. More, thenew devices fea-ture built-intrigonometric background sup-pression, so they are unaffectedby changing scenes or by peo-ple passing by outside thedetection range. Also, changinglight conditions and bright day-light measuring up to 30k lux atthe sensor’s surface will notaffect the performance of thesensor. Like previous versions,the proximity sensors measure

10mm wide and 20mm high, buttheir depth is only 12.7mm com-pared with 19.5mm. The timingof the signals can be adjusted so

that the beam fre-quency of eachadjacent sensor willnot interfere withthe other. For adja-cent use or energysaving Panasonicalso offers a versionwith external trig-ger input.

Thin MA Motion proximityswitches feature a detectiondistance of 5 to 200cm and areavailable with NPN and PNPoutput trans./versionsin PNP orNPN open collector versions.They operate from 4.5 to5.5VDC or in a wilder voltageversion from 5.5 to 27 VDC.PAISEU http://eu.industrial.panasonic.com

‘Plug & Play’ proximity switches from Panasonic arethin, and feature background suppression for morereliable detection

Avago Technologies announceda new series of high resolution3-channel optical incrementalencoder modules, the AEDT-981x, designed to enable a newgeneration of robust, highprecision motion controlapplications including DCservo motors, linear androtary actuators, factoryautomation equipment,3D printers, robotics anddrones.Expanding upon Avago’smarket-proven HEDS-914x module series, thenew AEDT-981x moduleseries features a built-in inter-polator supporting a widerange of encoding resolutionfrom 1,000 to 5,000 counts perrevolution (CPR) using a code-wheel of 11mm optical radius.The new module series is indus-trial grade with operating tem-

perature from -40°C to +115°C.Compared to competitive solu-tions on the market, the AEDT-981x is 70% lower in supplycurrent minimizing encoder

power consumption and has awide spatial play tolerance andcodewheel gap, providing easeof motor shaft alignment andenhancing photo detector sig-nal integrity.AVAGO TECHNOLOGIESwww.avagotech.com

SensoInk is an innovative, reli-able and highly accurate sens-ing solution based on printedpolymer pastes. SensoInk is a5V analog solution with lowpower requirements and oper-ates at 5V. By using polymer thick filmtechnology, SensoInk isextremely flexible, and can beprinted as potentiometers,resistors, switches orkeyboard contactson circuit boards orelectronic compo-nents. It enablesdevice developersto quickly and easilyimplement individ-ual specificationswithout sacrificing quality. Byusing SensoInk, there are nonegative electromagneticeffects (Electromagnetic com-patibility). Only two compo-nents are required for signaltransformation: a printed

potentiometer track on a carri-er material (e.g. FR4 or PET foil)and a conductive wiper. Sensofoil® thin-film membranepotentiometers are the world'smost reliable membrane posi-tion sensors. SensoFoil offers aflat design of 0.5 mm to 1 mm,repeat accuracy of 1mm to10μm, easy to achieve redun-dancy and problem-free device

integration. The standard linearSensofoil is available in lengthsof 50 mm up to 500 mm, 40mmwide rotary, and custom sizesand shapes. HOFFMANN + KRIPPNER GROUPwww.hoffmann-krippner.com

Hoffmann-Krippner Unveils Sensor Solutions for theInternet of Things and M2M

Avago Technologies Launches New HighResolution Motion Feedback Encoders forIndustrial Motion Control




New HiperPFSTM-3 Power FactorCorrection ICs from PowerIntegrations Target Light-LoadPerformance

PRODUCT NEWS ACTIVE COMPONENTS

Murata announced it has increased theperformance of it’s LXES ceramic ESDprotection device series by 20% com-pared to the peak voltage perform-ance characteristic of previous models.Murata’s ceramic protection devicesuse the gap between twoelectrodes as a dischargeelement. By narrowing thegap between the elec-trodes the dielectricstrength of the ceramicbecomes weaker whenhigh voltages up to 8KVare repeatedly applied. Inorder to overcome thisweakness Murata hasapplied it’s many years ofceramic technology expertise in orderto fabricate a multi-layer ceramic tech-nology that can offer low voltage ESDprotection together with the dielectricstrength to withstand continued highvoltage discharge. Bringing the voltage

protection down by typically 20% thenew LXES15AAA1-153 andLXES03AAA1-154 devices bring alevel of ESD protection performancethat is equivalent to that of a silicon-based transient voltage suppression

device (TVS) but with a ultra-lowcapacitance. Such TVS ESD protectiondevices are not able to achieve theperformance characteristics availablewith these new ceramic devices.MURATA www.murata.com

Murata improves performance of ceramic ESD deviceseries by 20%

XP Power announced the ITQ series of6 Watt DC-DC converters. Packaged ina compact SIP 8-pin format, with a foot-print measuring just 21.9 × 11.1 ×9.2mm, the ITQ series takes up lessboard space, giving designers moreroom to add features or the ability toreduce end product size. The convert-er delivers a power density of up to 44Watts per cubic inch and is highly effi-cient, typically 87%, making it well suit-ed to modern green standard endproducts. The high efficiency meansthe ITQ produces less wasted heat anddoes not require forced airflow orheatsinking for cooling. The fully regu-lated single and dual output modelsaccept a wide 4:1 input voltage rangeof 9-36 VDC or 18-75 VDC. Single out-put models provide standard +3.3, +5,+9, +12, +15, +24 VDC and duals ±5,±12 or ±15 VDC. Standard input/out-put isolation is rated at 1.5 kVDC withan optional 3k VDC isolation availablein –H models. All models provide aremote on/off input that allows externalcontrol of the converter for sequencingor automatically powering it on or off.The ITQ series can operate in most

environments without requiring forcedairflow and has a wide operating tem-perature range from -40 to +100°C. Fulloutput power can be delivered up to+70°C without derating. The ITQ rangecompliments the 2:1 input version of 6

Watt SIP DC-DC converters, the ITXseries, released recently. The ITQ seriesis available from Farnell, element14,Digi-Key, approved regional distribu-tors, or direct from XP Power and comewith a 3 year warranty.XP POWER www.xppower.com

6 Watt DC-DC converters offer an extra wide 4:1input range in a compact SIP package

Power Integrations announced its HiperPFSTM-3family of power factor correction ICs, which offerhigh power factor and high efficiency across theentire load range. Targeting applications with con-tinuous power demands up to 405 W for universalinput and 900 W for high-line, the ICs feature effi-ciency levels of better than 95% from 10% load tofull load and consume less than 60 mW under no-load conditions. A power factor of above 0.92 iseasily achievable at 20% load.

The highly integrated HiperPFS-3 devices includethe variable frequency CCM controller, high-volt-age power MOSFET and a Qspeed™ low QRRboost diode. The new devices also employ aninnovative means of controlling EMI withoutadversely affecting power factor at light loads.Poor system power factor at light load is caused byX capacitors that are used to reduce differentialmode EMI being fed back to the AC line. HiperPFS-3 ICs incorporate a digital power factor-enhancing circuit that activates during light loadconditions; this increases the compensation toovercome the reactance of X capacitors in the EMIfilter, minimizing the phase angle differencebetween the input voltage and the current.Consequently, designers may increase the size ofthe X capacitors while minimizing or eliminatingdifferential-mode chokes, thereby reducing EMIwithout degrading light load power factor per-formance. This results in a smaller, lower cost, EMIfilter stage.Comments Edward Ong, product marketing man-ager at Power Integrations: “Standby energy-usestandards such as ErP Lot 6 have previously forceddesigners of PCs and other systems to include both amain PSU and standby power supply. The excellentlight load efficiency of our new HiperPFS-3 ICsenables them to eliminate the standby power supply,saving components, design time, space and cost.”

POWER INTEGRATIONSwww.power.com

Silicon Labs Announces Industry’s FirstSingle-Chip Clock IC For Wireless BaseStations



High-side current/power sensor fromMicrochip is world’s first to feature both a configurable analogue output and a 2-Wire digital busMicrochip announces, from the Sensors Expo, a combined ana-logue and digital current sensor: the PAC1921. This new deviceis the world’s first high-side current sensor with both a digitaloutput, as well as a configurable analogue output that can pres-ent power, current or voltage over the single output pin.Simultaneously, all power-related output values are also avail-able over the 2-Wire digital bus, which is compatible with I2C™.The PAC1921, available in a 10-lead 3×3 mm VDFN package,was designed with the 2-Wire bus to maximise data and diagnos-tic reporting, while having the analogue output to minimise datalatency. The analogue output can also be adjusted for use with3V, 2V, 1.5V or 1V microcontroller inputs.

The PAC1921 is ideal for networking, power-distribution, power-supply, computing and industrial-automation applications thatcannot allow for latency when performing high-speed powermanagement. A 39-bit accumulation register and 128 times gainconfiguration make this device ideal for both heavy and light sys-tem-load power measurement, from 0V to 32V. It has the ability tointegrate more than two seconds of power-consumption data.Additionally, the PAC1921 has a READ/INT pin for host control ofthe measurement period. This pin can also be used to synchronisereadings of multiple devices. The PAC1921 is supported byMicrochip’s new PAC1921 High-Side Power and Current MonitorEvaluation Board (ADM00592), which is available today priced at$64.99. The PAC1921 is available now for sampling and volumeproduction, in a 10-lead 3×3 mm VDFN package.

Key Facts:• PAC1921 maximises data and diagnostic reporting while

minimising data latency• Outputs power, current or voltage over a single pin and over

the 2-Wire digital bus• Analogue output adjustable for 3V, 2V, 1.5V or 1V

microcontroller inputs• Integrated 39-bit accumulation register and 128 times gain

configuration• Supports high-speed power management of light and heavy

loads from 0V to 32VMICROCHIP TECHNOLOGY www.microchip.com/PAC1921-042915a

Silicon Labs introduced the industry’s most highly integrated clockIC for wireless infrastructure applications including small cell andmacro cell base stations. Silicon Labs’ new Si5380 clock generatoris the industry’s first clock IC capable of replacing a low phasenoise integer-N clock, voltage-controlled crystal oscillator(VCXO), discrete loop filters and voltage regulator componentswith one single-chip device. The Si5380 clock provides compara-ble phase noise performance to discrete conventional solutionswhile delivering breakthrough advancements in solution footprint,bill of materials (BOM) cost, power consumption, performanceand ease of use.According to a recentCisco study, globalmobile data traffic willsoar nearly ten-foldbetween 2014 and2019, driven by videostreaming services andthe widespread adop-tion of IoT-connecteddevices. While base sta-tion suppliers are taskedwith developing new4G/LTE equipment thatincreases network capac-ity and coverage, it isbecoming an increasingly difficult design challenge for small cellsbecause they are often deployed in space-constrained, low-poweroutdoor locations in congested urban environments. Silicon Labs’new Si5380 clock is the industry’s first single-chip wireless clock ICoptimized for size, power, integration and performance, making it anideal fit for small cell applications.The Si5380 clock leverages Silicon Labs’ latest fourth-generationDSPLL technology to provide a purpose-built solution optimizedfor next-generation small cells and macro cell remote radio head(RRH) designs. DSPLL technology’s innovative dual-loop mixed-sig-nal architecture integrates a single high-performance 15 GHz ana-log voltage-controlled oscillator within a digital phase-locked-loop(PLL) architecture that eliminates the need for discrete loop filtersand low-drop-out (LDO) regulators. The resulting clock solutionprovides an optimal combination of ultra-low phase noise clocksynthesis with best-in-class PLL integration. The Si5380 clock has a66 percent smaller printed circuit board (PCB) footprint and 30percent lower power consumption than competing VCXO-basedclock IC solutions. Power-efficient timing components are especial-ly important for today’s small cells, which have limited power budg-ets and often are powered using Power over Ethernet (PoE) tech-nology. Given that the DSPLL integrates all PLL and power supplyregulation elements on-chip, the Si5380 device delivers highboard-level noise immunity, integrated power supply noise rejec-tion and consistent, repeatable phase noise performance acrosstemperature. While VCXO-based clock solutions often suffer fromdegraded spurious performance when subjected to vibration, theSi5380 device’s integrated DSPLL technology provides excellentspurious response regardless of the system environment. SILICON LABS www.silabs.com


Murata’s cost effective powereddata isolator module provides dataand power isolation in critical USBenvironments


Lattice Semiconductor Corporationannounced its iCE40 LM FPGA hasbeen integrated in the recentlyreleased ZTE Star 2 flagship smart-phone to perform IR remote control,and sensor hub functions.From wearables to smart-phones, the iCE40 LM family ofdevices offer exceptionally lowpower consumption andextremely small footprint – andhave been specifically designedto enable manufacturers ofmobile consumer products toimplement top of line featuresfast and efficiently, without sac-rificing performance. The ultra low power iCE40 LMdevice allowed ZTE to set the Star 2apart by implementing critical always-on functions. In the crucial battle toreduce energy consumption, it canrecognize various gestures and activi-ties while the application processorremains inactive, significantly reducingpower usage. Minimizing the applica-

tion processor usage allows ZTE tomaximize the battery life of the Star 2.ZTE considered a software-basedsolution for IR remote control, butintegrated hard IP found in Lattice’siCE40 LM offered better reliability

and performance.ZTE was able to individually decidewhich functions to incorporate, target-ing the features of each model, whilesimultaneously saving board space,cost and power.LATTICE SEMICONDUCTORwww.latticesemi.com

ZTE Chooses Lattice Semiconductor for FeatureDifferentiation and Integration on Star 2 Smartphone

Exar Corporation, a leading supplierof high-performance integrated cir-cuits and system solutions, introducesthe XR79120 – a 20A single output,synchronous step-down power mod-ule in a compact, market leading12mm × 14mm × 4mm footprint.Although small, the XR79120 stilloffers greater than 93% peak efficien-cy and leverages Exar’s patentedadvanced constant on-time (COT)control architecture across a 4.5V to22V input voltage range.The XR79120 provides an easy to use,fully integratedpower con-verter integrat-ing MOSFETs,inductors, andinternal inputand outputc a p a c i t o r s .Q F N - b a s e dpackage tech-nology pro-vides superiorthermal per-

formance, eases electrical debuggingand improves manufacturability withhigher assembly yield and the abilityto visually inspect solder joints. At50°C with no airflow, no thermal de-ratings are required for output volt-ages of 1.8V and below.The XR79120 will be available in aRoHS compliant, green/halogen free,space-saving 74-pin 12mm x 14mm x4mm QFN package. The XR79120 ispriced at $13.95 in 1,000-piece quan-tities.EXAR www.exar.com

Exar Introduces Industry’s Smallest 20A PowerModule

Murata has introduced the NMUSB202MC, anextremely competitively priced surface mountpowered data isolator module that convenientlyprovides dual port USB data and power isolationfrom a single upstream port with full power(500mA) available from each port. Used with ahost controller a single module counts as two USBhubs for cascaded applications with the level ofsafety isolation additionally providing effectivebreaking of ground loops and immunity to EMI inharsh environments.

The module is aimed at industrial control applica-tions where USB is becoming increasingly commonfor communications with sensors. It is also ideal foruse in medical environments with the increasinguse of USB for low cost sensing and communicationwhere isolation is necessary for safety and noiseimmunity.‘Full’ USB speed operation (12Mbps) is supported,limited by the data isolation chipset. The module isalso able to switch automatically between low(1.5Mbps) and full speed operation, as the appli-cation requires.The module’s full compliance with USB 2.0 specifi-cation enables hassle free, full ‘plug and play’ oper-ation and its surface mount package for placementon the host motherboard enables the USB isola-tion function with a single SMT component.Full power, 5V/0.5A, meeting the USB bus standardis available from each downstream port and usersmay power any USB compatible device from theNMUSB module. The ports are short circuit andoverload protected. The source power of 5V canbe provided by an external adapter or system volt-age rail. The NMUSB202MC’s reinforced safetyisolation barrier meets the requirements of250VAC systems in IT and medical environmentsfor operator protection, so users may confidentlyuse the product to provide safety isolation in USBconnections in critical applications.

MURATA www.murata.com

Go for the Triple Play with the TDK-Lambda75W Triple-Output, Low-Profile CUT75 AC/DCPower Supplies Now at Mouser


IDT Adds 3.3V PCIe Clock Generators to World’sLowest Power PCI Express Timing FamilyIntegrated Device Technology, Inc. (IDT®) announced the additionof 6 and 8 output 3.3V clock generators to its low-power PCIExpress® (PCIe) portfolio of clock generators. The 3.3V family ofdevices joins the existing 1.5V and 1.8V families. The new productsoperate at approximately 100 milliwatts, making them the lowestpower 3.3V PCIe clock generators on the market. By operating atroughly one-fifth the power of traditional PCIe clock devices, theIDT 3.3V devices effectively eliminate thermal concerns.

With their integrated terminations, the 9FGL06 and 9FGL08devices’ ultra-compact 5×5- and 6×6-millimeter packages candeliver up to a 90 percent reduction in board area. Factory pro-grammable versions provide quick turn device optimizations tomeet exact customer requirements. The SoC-friendly devicesgreatly exceed the phase jitter requirements of the PCIe Gen3specification in anticipation of the upcoming PCIe Gen4 specifi-cation, and are also suitable for applications needing less than3ps rms 12k-20M phase jitter, such as gigabit Ethernet and otherhigh-performance applications..The 3.3 V devices are pin-compatible to IDT’s highly successful 1.5V 9FGU-series and 1.8 V 9FGV-series PCIe clock generators. Thetiming family targets power- and space-constrained designs inboth consumer and high-performance applications, providingenterprise-level performance while lowering the total cost of own-ership. Potential applications include multi-function printers,servers, set-top boxes and solid state drives. The entire family iscompliant with PCIe generations 1, 2 and 3.

The 3.3 V (L-series) family offers industry firsts that include:• Output-by-Output configuration of output impedances,

allowing a single part to be used in mixed impedance environments without external termination components.

• Factory programmable versions that allow user-defined default configurations including output impedance, control input polarity, internal pull up or pull down resistors, and wake-on-LAN mode for the crystal oscillator. This removes the need for practically all external glue logic.

IDT plans to quickly follow this initial offering with 3.3 V versionsof low-power PCIe buffers and multiplexers that are pin-compati-ble to the successful 9DBU/V and 9DMU/V families.IDT www.idt.com

Mouser Electronics, Inc. is now stocking the CUT75 Series PowerSupplies from TDK-Lambda. Based on a two-converter topology,the CUT75 series of 75W triple-output, low-profile AC/DC powersupplies supports zero minimum load operation, good regulation,and convection-cooling; and provides 500VAC isolation betweenthe 5V and the secondary outputs for easier system configuration.The CUT75 series is available in two standard models: TheCUT75-522 offers 5V and ±12V output voltages, while theCUT75-5FF comes with 5V ±15V output voltages; both can beconfigured as dual-output power supplies (5V/24V or 5V/30V).

The TDK-Lambda CUT75 Series Power Supplies, available fromMouser Electronics, feature a 64 percent smaller design, lighterweight, and up to 85 percent better efficiency than the earliergeneration of TDK JWT75 power supplies. The CUT75 Series hasa universal operating input voltage of 85 to 265VAC, with500VAC isolation between the 5V and the secondary outputs.The 5V output is user adjustable from 5V to 5.25V. Both theCUT75-522 and the CUT75-5FF are convection-cooled and fea-ture a wide operating temperature range from 20°C to 70°Cambient (with appropriate de-rating above 60°C). Standard fea-tures of the CUT75 Series include overcurrent protection andovervoltage protection, and neither power supply model requiresminimum loading. For easier system configuration, output 1 of theCUT75 Series is isolated from outputs 2 and 3.The CUT75 Series from TDK-Lambda is now available at MouserElectronics in a 3 in. × 5 in. footprint with a 1.06 in. height. TheCUT75 Series meets the conducted and radiated EMC require-ments of EN55011/EN55022-B, FCC-B and VCCI-B, as well asIEC61000-4-2, -3, -4, -5, -6, -8, -11 immunity and safety approvalsto EN/UL/CSA60950-1. It is also approved for medical applica-tions by IEC60601-1 3rd Edition (2×MOOP) and designed to meetANSI/AAMI ES60601-1. Both models are delivered with TDK-Lambda’s 3-year warranty, and carry the CE mark according to theLV (low voltage) and RoHS2 Directives.TDK-Lambda’s CUT75 Series Power Supplies are ideal for a vari-ety of power supply applications within the industrial, broadcastand test and measurement sectors.MOUSER ELECTRONICS www.mouser.com


Spotlight Shines on LumiledsLUXEON CoB Compact RangeLEDs, Available Now at MouserElectronics

PRODUCT NEWS Lighting Solutions / Display

NLT Technologies, Ltd. has developeda prototype 19.5-inch auto-stereo-scopic LCD developed by NLTTechnologies with full HD resolution in3D mode, adopting the company’sproprietary glassless 3D display tech-nology, H×DP (Horizontal ×times Density Pixels).The new prototype is expect-ed to be utilized for educa-tional or high-end medicalapplications that demandmore precise and realisticthree-dimensional imagingthan achieved with traditionalnaked-eye 3D displays.The display has a 19.5-inchdiagonal screen size, which isthe largest NLT auto-stereoscopic dis-play demonstrated to-date. The dis-play combines full HD 3D resolutionwith a high luminance of 700cd/m2,enabling bright, high-resolution display

of 3D images. In the 2D display mode,the display achieves a wide viewingangle of 176 degrees at vertical andhorizontal, providing vivid images with-out color inversion even when viewedoff-angle. HxDP is a multi-viewable

auto-stereoscopic display technologythat uses a unique pixel alignment toachieve crisp high-density 3D images(the prototype is a 2-view model). TIANMA NLT EUROPE www.tianma-nlt.eu

New 19.5-inch Full HD Auto-Stereoscopic LCD withHxDP Technology

The Electronic Assembly EAeDIPTFT70 ATC graphic display is aperfect symbiosis of intelligence andattractive design. The TFT touchpanel display features an extensive setof intelligent display functions, makingit ideal for microcontroller systemarchitectures. Other outstanding fea-tures include a bright, high-contrastscreen and an elegant appearance. The display has a 7 inchdiagonal screen, 800 x 480pixel resolution and anoptional capacitive touchpanel. It is the perfect cen-terpiece of your machineand equipment “com-mand center”. Its highlyattractive appearancemakes it equally suitablefor high-quality consumergoods which look nice inthe living room. The extremely bright,high-contrast screen is easy to readeven in bright sunshine, making the EAeDIPTFT70 ATC perfect for parkingticket vending machines and informa-tion booths. The 6H surface isabsolutely scratch resistant and dirtrepellent, guaranteeing excellent long-term optical performance. The displayretains its attractive appearance even

when strong cleaning agents are used,for example on the production flooror in machine rooms. For the reallytough jobs, the display can be easilymounted behind a protective glasspanel up to 4 mm thick which acts as adeterrent to vandalism. In addition,the EA eDIPTFT70 ATC has a high-grade capacitive touch panel whichreacts even when the user is wearing

gloves. The display copes well withmulti-touch action. The high-precisionsensor function ensures that user com-mands are executed correctly. Thetouch screen reacts to user input with80 different messages, change of out-put voltage level or data sent over theon-board RS 232, SPI or I²C ports.ELECTRONIC ASSEMBLYwww.lcd-module.de

A Masterful Blend of Elegance and Intelligence

Mouser Electronics, Inc. is now stocking LUXEONCoB Compact Range LEDs from Lumileds. TheseLEDs offer high flux densities in a very small lightemitting surface (LES), which provides good centerbeam candle power (CBCP).

The Lumileds LUXEON CoB Compact Range LEDs,available from Mouser Electronics, feature a single6.5mm optical LES that provides high flux densitiesand high efficacy. Industry-leading thermal resist-ance allows for smaller heat sinks, and the assem-bly’s ceramic substrate offers excellent protectionin high-potential (HiPot) testing. All the LUXEONCoB Compact Range LEDs devices are binned witha single 3-step (80 and 90 color index rating)MacAdam ellipse to ensure optical performance inretrofit lamps and spotlight applications. LUXEONCoB Compact Range LEDs are all hot-tested at85°C, so that luminaire design is simplified andtesting can be minimized.

The LUXEON CoB Compact Range LEDs fromLumileds are now available through MouserElectronics, designed for a broad array of generalpurpose lighting and directional lighting applicationsincluding retrofit lamps, spotlights, and luminaires.

To learn more, visit:www.mouser.com/new/lumileds/lumileds-luxeon-cob-compactTo visit Mouser’s Lighting Applications site, go to:www.mouser.com/applications/lighting

With its broad product line and unsurpassed cus-tomer service, Mouser caters to design engineersand buyers by delivering What’s Next in advancedtechnologies. Mouser offers customers 21 globalsupport locations and stocks the world’s widestselection of the latest semiconductors and elec-tronic components for the newest design projects.

MOUSER ELECTRONICS www.mouser.com


Development of new prototypes applied“Wet & Glove” technology, that keeps touchpanels functional even when the screen iswet or the operator is wearing gloves

PRODUCT NEWS Lighting Solutions / Display

OLED Alphanumeric Display Designedfor Wide Temperature RangeElectronic Assembly has added the EA W202 XDLG to its rangeof high-quality alphanumeric displays. The technology has theadvantage of high contrast for good visibility combined with lowenergy consumption. The new EA W202 XDLG also features anonboard controller which supports user-friendly connectivityoptions, and it operates over a temperature range, making it suit-able for automotive applications.

The EA W202 XDLG displays two lines containing 20 characterseach. The character height is 9.66 mm which is currently the maxi-mum in the OLED display range. The onboard controller is compat-ible with the popular HD44780, so when using the EA W202 XDLGsystem developers will find themselves on familiar ground. Thecontroller has an SPI interface for communication with the outsideworld. It can also be connected to a 4 or 8 bit data bus also. A rangeof functions including Clear Display, Shift Display, Shift Cursor andCursor on/off can be performed with a single command.The complete ASCII character set including special characters isfactory installed in the character ROM. The user has the choiceof 4 different fonts: English, European I, European II and Cyrillic.In addition, 8 characters are user definable.ELECTRONIC ASSEMBLY www.lcd-module.de

EVERLIGHT Electronics introduces new IRemitter and PIN photodiode

EVERLIGHT ELECTRONICS CO., LTD. introduces a new infraredemitting diode in a miniature SMD package, IRR60-48C/TR8, anda high speed, high sensitive PIN photodiode, PD60-48C/TR8,both sized 6×4.8×1.1mm for oximeter detector applications.According to past experience, red 660nm together with infrared905nm appear best to detect the oxygenation of the blood whichprovides accurate diagnosis on oximeters. EVERLIGHT's IRR60-48C/TR8, together with PD60-48C/TR8, feature such unique opti-mized wavelengths of red 660nm and infrared 905nm, enabling amost accurate oximeter diagnosis. The infrared 905nm can also becustomized upon request to 940nm or 910nm. Furthermore, bothIRR60-48C/TR8 and PD60-48C/TR8 are discrete designs whichallow the feasibility on use, no matter if the oximeter requires atransmission or reflective design. Both products are Pb free.EVERLIGHT ELECTRONICS www.everlight.com

NTL Technologies, Ltd. has developed new prototypes whichapplied "Wet & Glove" technology enabling projected capacitive(PCAP) touch panels to be operated even when the screen is wetand the operator is wearing gloves.The prototypes allow the touch screen be operated even whenthe operator is using a medical gel on the surface of the screen, orwhen the operator wearing gloves up to 5mm thickness. Withthese added capabilities coupled with NLT’s advanced productspecifications, this touch display is ideally suited for high-endmedical, such as surgical or examination equipment used with gels,or gloves up to 5mm thickness. The touch display may also be use-able in equipment in work environments where thick gloves (5mmthickness or less) are used as protection against certain hazard.

The main features of the NLT’s Wet & Glove technology are as follows.

(1) Combination of two detection methodsTouch coordinates are detected using a combination of mutual-capacitance and self-capacitance sensors. This enables the touchposition to be detected with high precision even when the screenis wet and the user is wearing gloves, and means the panel can alsosupport multi-touch functionality and gesture operation.

(2) Proprietary sensitivity adjustment tool enables operationwhile wearing thick glovesDue to the touch panel’s sensitivity adjustment, using a propri-etary touch panel controller developed by NLT, accurate positionor touch detection is still possible even when the screen is wet andthe user is wearing gloves.

(3) Wide variety of design specifications accommodatedWet and Glove touch technology also supports various designoptions such as glass bonding or surface film, as with all PCAPproducts NLT offers. Treatments to protect against fingerprints orreduce glare can be accommodated so end-product designers canset specifications to suit a broad range of applications.

TIANMA NLT EUROPE www.tianma-nlt.eu



INDUSTRY PRODUCT NEWS

Do you need various products at a high level quality? Do you want a single provider for a wide rangeof technical products, which at the same time can offer you offline or online technical support freeof charge? If you want all the above and more like orders without threshold value in a short amountof time, you can choose with confidence the only authorized dealer of RS in Romania. Aurocon COMPEC is the solution for your needs, giving you the option to choose more than600.000 products from over 2.500 manufacturers, being the optimum choice for a wide range oftechnical products for several industries. We rely on 20 years of experience and on our qualifiedpersonnel so we can guarantee the best products and high quality services at competitive prices,based on customer feedback. We put at your disposal all of this so that you can place the ordervery easy by email, phone, fax or online on our user friendly website.On our website, you can find details about each product including the technical data sheet, prices,information regarding product availability or several methods of packaging and shipment.

We supply parts in industry standard packaging typesIndustry standard packaging and production packaging(look for the logos below when you're ordering)

We are permanently adding new technology devices to our elec-tronics range, and now offer more than 75,000 components inindustry-standard packaging ready for insertion into your produc-tion machinery. Wherever you see the “P” symbol, you can purchaseelectronic products in flexible quantities direct from stock, andcompetitively priced – including free re-reeling.With a range of support services for prototyping and small-batchproduction orders, RS helps keep your production running.• Industry standard packaging: a full reel or tube of components

for your pre-production needs, at a very attractive price. This can be more cost effective than buying individual items as you'll always get our best price.

• Production packing: if you need a small number of components for samples, prototypes or small batch production, we can supplythem individually or packaged ready for insertion into your pick and place machinery.

Production Packaging

What is it?With Production Packaging and our range of Production Services,we help reduce costs and increase reliability in small-batch produc-tion runs.

• Flexible quantities that mean no MOQs or long lead-times. Just order the amount you need for your production run.

• Competitive prices so you save money when buying from RS. We give volume discounts on higher quantities for production, and continually pass on new price reductions

• Reduce costs with free re-reeling on our range of reeled products, and no hidden charges on delivery

• Available when you need because all our Production Packaging range is available direct from stock to your order schedules

• Quality you can trust in our packaging standards and delivery service. You'll get the products you need, in the packaging required, exactly when you want them

Production Packaging Benefits

About Production Packaging



To give you some brief view of our products we illustrate several representative items that ourcompany can offer you.

If you're looking for a wide variety of Amplifiers and Comparators, then RS Components canhelp. We stock all the latest technologies and can support your existing design or futureprojects - order today and remember to go to our Electronics Centre to see how our freedesign tools can help you.

You are able to develop and improve your electronics design with our range of Clocks,Timing & Frequency Control Circuits. Our partnership with leading semiconductor brandsmeans we always have a great choice of products for you to buy from.

Several representative items

The AD835 is a complete four-quadrant, voltage output analog multiplier, fabri-cated on an advanced dielectrically isolated complementary bipolar process. Itgenerates the linear product of its X and Y voltage inputs with a −3dB outputbandwidth of 250MHz (a small signal rise time of 1ns).

Full-scale (−1V to +1V) rise to fall times are 2.5ns (with a standard RL of 150Ω), andthe settling time to 0.1% under the same conditions is typically 20ns. Its differen-tial multiplication inputs (X, Y) and its summing input (Z) are at high impedance.The low impedance output voltage (W) can provide up to ±2.5V and drive loadsas low as 25Ω. Normal operation is from ±5V supplies.

Though providing state-of-the-art speed, the AD835 is simple to use and versatile.For example, as well as permitting the addition of a signal at the output, the Z input provides the means to operate the AD835 with volt-age gains up to about ×10. In this capacity, the very low product noise of this multiplier makes it much more useful than earlier products.

www.compec.ro Semiconductors

• RS Stock No.: 523-6973 / 523-6973P • Mfr. Part No. : AD835ARZ

Also available inindustry standardpackaging

The M41T11 is a low-power serial real-time clock (RTC) with 56 bytes of NVRAM.A built-in 32.768 kHz oscillator (external crystal controlled) and the first 8 bytes ofthe RAM are used for the clock/calendar function and are configured in binary-coded decimal (BCD) format. Addresses and data are transferred serially via a two-line bidirectional bus. The built-in address register is incremented automaticallyafter each write or read data byte.The M41T11 clock has a built-in power sense circuit which detects power failuresand automatically switches to the battery supply during power failures. The ener-gy needed to sustain the RAM and clock operations can be supplied from a smalllithium coin cell. Typical data retention time is in excess of 5 years with a 50mA/h,3V lithium cell. The M41T11 is supplied in an 8-lead plastic small outline package or 28-lead SNAPHAT® package.The 28-pin, 330 mil SOIC provides sockets with gold plated contacts at both ends for direct connection to a separate SNAPHAT housingcontaining the battery and crystal. The unique design allows the SNAPHAT battery package to be mounted on top of the SOIC packageafter the completion of the surface mount process. Insertion of the SNAPHAT housing after reflow prevents potential battery and crystaldamage due to the high temperatures required for device surface-mounting. The SNAPHAT housing is keyed to prevent reverse insertion.


STMicroelectronics M41T11M6F Real Time Clock,Calendar, Clock, 56B RAM, I2C, 5.5 V, 8-Pin SOIC

• RS Stock No.: 829-0399 / 829-0399P • Mfr. Part No.: M41T11M6F


AD835ARZ, Analogue Multiplier 4-Bits 8-Pin SOIC



The STWD100 watchdog timer circuits are self-contained devices which preventsystem failures that are caused by certain types of hardware errors (non-respond-ing peripherals, bus content, etc.) or software errors (bad code jump, code stuckin loop, etc.).

The STWD100 watchdog timer has an input, WDI, and an output, WDO. Theinput is used to clear the internal watchdog timer periodically within the specifiedtimeout period, twd. While the system is operating correctly, it periodically togglesthe watchdog input, WDI. If the system fails, the watchdog timer is not reset, a sys-tem alert is generated and the watchdog output, WDO, is asserted.

The STWD100 circuit also has an enable pin, EN, which can enable or disable thewatchdog functionality. The EN pin is connected to the internal pull-down resistor.The device is enabled if the EN pin is left floating.

Features:• Current consumption: 13μA typ.• Available watchdog timeout periods are 3.4 ms, 6.3 ms, 102 ms and 1.6 s• Chip enable input• Open drain or push-pull WDO output• Operating temperature range: –40 to +125 °C• Package SOT23-5, SC70-5 (SOT323-5)• ESD performance – HBM: 2000 V / RCDM: 1000 V

Applications: telecommunications, alarm systems, industrial equipment, networking, medical equipment, UPS (uninterruptiblepower supply).



STWD100YNPWY3F, Watchdog Timer, 2.7 → 5.5 V, 5-Pin SOT-23

Microchip Technology’s MCP2515 is a stand-alone Controller Area Network (CAN) controller that implements the CAN specification, ver-sion 2.0B. It is capable of transmitting and receiving both standard and extended data and remote frames. The MCP2515 has two accept-ance masks and six acceptance filters that are used to filter out unwanted messages, thereby reducing the host MCU’s overhead. TheMCP2515 interfaces with microcontrollers (MCUs) via an industry standard Serial Peripheral Interface (SPI).

CAN Controller MCP2515T-I/ST 1Mbit/s CAN 2.0B Sleep 20 TSSOP

Technical characteristicsMaximum Data Rate 1Mbit/s Number of Transceivers 1 Standard Supported CAN 2.0B Power Down Mode Sleep Maximum Supply Current 10 mA Mounting Type Surface Mount Package Type / Pin Count TSSOP / 20Dimensions 6.6 mm × 4.5 mm × 1.05mm Operating Supply Voltage Range 2.7V - 5.5V Operating Temperature -40°C to +85°C

Choose from our large range of Interface ICs. We stock products from the world's leadingSemiconductor Manufacturers which mean you're sure to find the ideal product for your application.

• RS Stock No.: 823-7890 / 823-7890P • Mfr. Part No.: MCP2515T-I/ST


• RS Stock No.: 829-1516 / 829-1516P • Mfr. Part No.: STWD100YNPWY3F





Murata SCR1100-D02-004Gyroscope 50 Hz SPI 3 → 3.6 V, 4.75 → 5.25 V, 32-Pin SMD

SCR1100-D02 is a single axis highperformance gyroscope. It is partof Murata's high performance gyrofamily and it has the same gyro sec-tion as the combined gyro acceler-ation product SCC1300-D02.

The sensor is based on Murata'sproven capacitive 3D-MEMS tech-nology and it has highly sophisti-cated signal conditioning ASICwith digital SPI interface.

Small robust packaging guaranteesreliable operation over productlifetime. The housing is suitable forSMD mounting and the compo-nent is compatible with RoHS andELV directives.

SCR1100-D02 is designed, manu-factured and tested against highstability, reliability and qualityrequirements. The angular ratesensor provides highly stable out-put over wide ranges of tempera-ture and mechanical noise.

The bias stability is in the elite ofMEMS gyros and the componenthas several advanced self diagnos-tics features.

SCR1100-D02 is targeted to appli-cations with high stability andtough environmental requirements.

Typical applications are:

• Inertial Measurement Units (IMUs) for highly demanding environments

• Platform stabilization and control

• Motion analysis and control

• Roll over detection• Robotic control systems• Guidance systems• Navigation systems

We stock a full rangeof sensors and trans-ducers for everydayelectronics applica-tions. The rangeincludes temperature,image, pressure, andHall Effect sensors.

• RS Stock No.: 799-9244 / 799-9244P • Mfr. Part No.: SCR1100-D02-004




Author: Bogdan GrămescuAurocon Compec

We are offering a wide range of memory chip products from leading Semiconductor suppliers. Ifyou're looking for all those products that are essential for the creation of your next design, thencheck out our Electronic Essentials page to find everything you need in one place.

AT45DB642D is a 2.7V, dual-interface sequential access Flash memory ideally suitedfor a wide variety of digital voice-, image-, program code- and data-storage applica-tions. AT45DB642D supports RapidS™ serial interface and Rapid8™ 8-bit interface.RapidS serial interface is SP compatible for frequencies up to 66MHz. The dual-interface allows a dedicated serial interface to be connected to a DSP and a dedicat-ed 8-bit interface to be connected to a microcontroller or vice versa. However, theuse of either interface is purely optional. Its 69,206,016-bits of memory are organ-ized as 8,192 pages of 1,024-bytes (binary page size) or 1,056-bytes (standardData-Flash® page size) each. In addition to the main memory, the AT45DB642D alsocontains two SRAM buffers of 1,024-(binary buffer size) bytes/1,056-bytes (standard DataFlash buffer size) each. The buffers allow receiving of data while a page in the main Memory is being reprogrammed, as well as writing a continuous data stream.EEPROM emulation (bit or byte alterability) is easily handled with a self-contained three step read-modify-write operation. Unlike conven-tional Flash memories that are accessed randomly with multiple address lines and a parallel interface, the DataFlash uses either a RapidS seri-al interface or an 8-bit Rapid8 interface to sequentially access its data. The simple sequential access dramatically reduces active pin count,facilitates hardware layout, increases system reliability, minimizes switching noise, and reduces package size. The device is optimized for usein many commercial and industrial applications where high-density, low-pin count, low-voltage and low-power are essential. To allow for simple in-system reprogrammability, the AT45DB642D does not require high input voltages for programming. The deviceoperates from a single power supply, 2.7V to 3.6V, for both the program and read operations.



AT45DB642D-CNU, Parallel, Serial-SPI FlashMemory, 8192 pages x 1056 bytes 64Mbit, 6ns,2.7 → 3.6 V, 8-Pin

• RS Stock No.: 696-3474 / 696-3474P • Mfr. Part No.: AT45DB642D-CNU


Unlock your electronics design with our range of Power Management ICs. Our Partnership withLeading Semiconductor brands means we always have a great choice of Power Managementproducts for you to buy from stock.

The LT M®4609 is a high efficiency switching mode buck-boost power supply.Included in the package are the switching controller, power FETs and support com-ponents. Operating over an input voltage range of 4.5V to 36V, the LTM4609 sup-ports an output voltage range of 0.8V to 34V, set by a resistor. This high efficiencydesign delivers up to 4A continuous current in boost mode (10A in buck mode).Only the inductor, sense resistor, bulk input and output capacitors are needed tofinish the design. The low profile package enables utilization of unused space on thebottom of PC boards for high density point of load regulation. The high switchingfrequency and current mode architecture enable a very fast transient response toline and load changes without sacrificing stability. The LTM4609 can be frequency synchronized with an external clock to reduce undesir-able frequency harmonics. Fault protection features include overvoltage and fold back current protection. The DC/DC μModule ® regula-tor is offered in small 15mm × 15mm × 2.82mm LGA and 15mm × 15mm × 3.42mm BGA packages.

LTM4609EV#PBF Buck/Boost Converter, 4A,Adjustable, 0.8 → 34 V, 400 kHz, 141-Pin LGA

• RS Stock No.: 711-2523 / 711-2523P• Mfr. Part No.: LTM4609EV#PBF



PRODUCT NEWS PASSIVE COMPONENTS

Vishay Intertechnology's New MiniatureHousing Enables Rapid Prototyping for IRReflective Presence and Proximity SensorsVishay Intertechnology, Inc. broadens its optoelectron-ics portfolio with the introduction of a miniature plas-tic housing for the rapid prototyping of reflective pres-ence and proximitysensors. The hous-ing is uniquelydesigned to pro-vide optical isola-tion between a 3mm (T1) infrared(IR) emitter and anyof Vishay's TSSP-type presence or proximity sensors. For reflective sensor applications such as automatichand dryers, automatic towel dispensers, toys, andvending machines, optical isolation between the emit-ter and sensor is an absolute necessity. With theirextremely high sensitivity, Vishay Semiconductors TSSPsensors can be inadvertently activated by even verysmall light leakage. To prevent this, designers have tra-ditionally had to spend valuable time constructingtheir own mechanical housings and light isolation.VISHAY INTERTECHNOLOGY www.vishay.com

Mouser Electronics, Inc. is now stockingthe VEML6070 UV Light Sensor fromVishay Intertechnology. TheVEML6070 is an advanced, CMOSultraviolet (UV) light sensor with an I2Cprotocol interface and high dynamic

detection resolution. With an integrat-ed signal conditioning IC, photodiode,amplifiers, and analog/digital circuits ina single chip, the VEML6070 providesexcellent measurement in a small 2.35

× 1.8 × 1.0mm package, which makes itideal for applications such as handhelddevices, wearables, and health and fit-ness devices. The Vishay VEML6070 UV LightSensor, available from MouserElectronics, contains an 8-bit commandregister written via the I2C bus.

All operations can be controlled by thecommand register, with a simple com-mand structure that enables engineersto easily program the operation settingand latch the light data from the sensor. The sensor offers 16-bit resolution toconvert solar UV light intensity to dig-ital data, and includes an activeacknowledge feature that allows it totransmit ultraviolet index (UVI) alertsbased on programmable thresholds.MOUSER ELECTRONICSwww.mouser.com

Mouser Electronics Now Shipping theVishay VEML6070 UV Light Sensor

New Vishay Intertechnology 20 V ChipscaleMOSFET in 0.8 mm by 0.8 mm Package SavesSpace and Power in Mobile ApplicationsVishay Intertechnology, Inc. introduced a newTrenchFET® 20 V n-channel MOSFET in the chipscaleMICRO FOOT® 0.8 mm by 0.8 mm package with an ultra-thin 0.357 mm profile. Designed to save space, decreasepower consumption, and extend battery usage in smart-phones, tablets, wearable devices, solid-state drives, andportable medical devices such as hearing aids, the VishaySiliconix Si8824EDB provides the industry's lowest on-resistance for any 20V device with a 1 mm square or <0.7mm squareoutline. Optimized foruse as a loadswitch, small-signal switch,and high-speedswitch in powerm a n a g e m e n tapplications, the Si8824EDB features extremely low on-resistance of 75 mΩ at 4.5V, 82mΩ at 2.5V, 90mΩ at1.8V, 125mΩ at 1.5V, and 175mΩ at 1.2V. These rat-ings are up to 25% lower than the closest competing20V MOSFET in an identical CSP package, and up to65% lower than the closest competing 20V device inthe DFN 1 mm by 0.6 mm package. The MOSFET's 20VVDS, ESD protection, ratings down to 1.2V, and low on-resistance provide a combination of safety margin, gatedrive design flexibility, and high performance for lithi-um-ion battery-powered applications.VISHAY INTERTECHNOLOGY www.vishay.com


Vishay Intertechnology High-Voltage Thin FilmFlat Chip Resistors Enable Precise VoltageMeasurement While Reducing Component Countsand Saving Board SpaceVishay Intertechnology, Inc.introduced a new series ofhigh-voltage thin film flat chipresistors that is the industry'sfirst to combine precisionproperties - low VCR < 1ppm/V, tight tolerances to±0.1%, and low TCR down to±10 ppm/K - with high oper-ating voltages to 1000V. With typical thin film chip resistors incomparable case sizes only offering voltages to 200V, VishayDraloric TNPV e3 series devices reduce component counts tosave board space and lower costs in precision high-voltage circuitsby replacing larger resistors and multiple devices in similar casesizes. Special high-voltage thick film resistors can also be replaced,which allows for significantly enhanced performance due to supe-rior voltage coefficient and unrivaled precision properties at highvoltages. Available in the 1206 and 1210 case sizes, Vishay's TNPVe3 series covers a resistance range from 121kΩ to 3.01MΩ, oper-ates over a temperature range of -55°C to +125°C, and offersrated dissipation to 0.33W at an ambient temperature of 70°C. VISHAY INTERTECHNOLOGY www.vishay.com

Rutronik presents Real-Time Clocks with Best inClass Accuracy from EpsonEpson announces the volume production of its new RX8130CEand RX8900CE Real-Time Clocks (RTCs). Thanks to its long bat-tery life, small size, and best in class accuracy they are the mostadvanced Real-Time Clocks available on the market. DistributorRutronik offers them as of now.Both new modules, RX8130CE andRX8900CE RTC, are offered inEpson’s smallest ever (3.2 × 2.5 ×1.0mm) package and include an ICand crystal in the package. By inte-grating the crystal, the modulessave board space, reduce cost, andimprove accuracy as well as functional safety. Applications usingreal time clocks are much more reliable and can be more accu-rate compared to applications using clock crystals with32,768kHz. They keep track of time in all sorts of electronicequipment and are extensively used in automotive, smartmeter, internet security, wireless and wireline networking, data-center, medical, and IoT. Epson’s RX8130CE is a cost optimizedlow power (300nA) RTC Module featuring a built-in power switchfunction optimized for rechargeable batteries and achieving anaccuracy of 5 ±23 ppm at 25°C. It is designed for use of any powersource including discharging battery as primary supply. Due to thebuilt-in power switch function no external circuits are required forthe switch from primary to backup power supply in case the mainsupply is turned off. The RX8900CE module uses DTCXO tech-nology to achieve ±5 or ±3.4 ppm accuracy over the entire -40 to+85°C operating range. Its power is 700nA, which is three timeslower than competing DTCXO RTCs. RUTRONIK www.rutronik.com

PRODUCT NEWS PASSIVE COMPONENTS

On 10 June 2015, theWürth Group inauguratedthe Group's new data centerin Waldzimmern, Germany.The 5,220sqm buildingcomplex accommodates a1,000sqm state-of-the-art,energy-efficient data centeras well as 125 workplaces for software development, IT infrastructure,network technology, virtualization, server technology and storage ofboth the Würth Group and the Würth Elektronik Group. Prof. Dr. h. c. mult. Reinhold Würth, Chairman of the SupervisoryBoard of the Würth Group's Family Trusts, District Administrator Dr.Matthias Neth and Achim Beck, Mayor of the town of Niedernhall,participated in the inauguration ceremony.The IT technology center in Waldzimmern will be the new “digitalheart” of the Würth Group. The new data center with its forward-looking architecture forms part of the so-called “Hohenlohe ring”,which also comprises the existing data centers in Gaisbach andWaldenburg. This real-time backup network can be considered amilestone of IT availability and IT security for the entire group ofcompanies. Owing to modern air conditioning including the use ofwaste heat thanks to heat exchangers, the new data center will require70 percent less energy than comparable facilities. Almost all facilitieshave an efficiency of more than 90 percent.

Commitment to the regionBesides Prof. Dr. h. c. mult. Reinhold Würth, District Administrator Dr.Matthias Neth and Mayor Achim Beck, Bernd Herrmann, Member ofthe Central Managing Board of the Würth Group, Jörg Murawski,Executive Vice President of the Würth Group, Oliver Konz, ManagingDirector of the Würth Elektronik eiSos Group and architect SiegfriedMüller emphasized the significance of the new technology center intheir addresses and speeches. The new building complex inWaldzimmern is trend-setting not only with regard to technology andits architecture. As a large investment including high-end workplaces,it is above all a commitment of the globally operating Würth Groupto their home region preparing the ground for future growth.

WÜRTH ELEKTRONIK www.we-online.de

Würth and Würth Elektronik inaugurate ITtechnology center: Modern data center forthe Würth Group

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