April 1998

FDS6680 Single N-Channel Logic Level PWM Optimized PowerTrenchTM MOSFET General Description Features

Absolute Maximum Ratings TA = 25oC unless other wise noted

Symbol Parameter FDS6680 Units

VDSS Drain-Source Voltage 30 V

VGSS Gate-Source Voltage ±20 V

ID Drain Current - Continuous (Note 1a) 11.5 A

- Pulsed 50

PD Power Dissipation for Single Operation (Note 1a) 2.5 W

(Note 1b) 1.2

(Note 1c) 1

TJ,TSTG Operating and Storage Temperature Range -55 to 150 °C

THERMAL CHARACTERISTICS

RθJA Thermal Resistance, Junction-to-Ambient (Note 1a) 50 °C/W

RθJC Thermal Resistance, Junction-to-Case (Note 1) 25 °C/W

FDS6680 Rev.E1

11.5 A, 30 V. RDS(ON) = 0.010 Ω @ VGS = 10 V RDS(ON) = 0.015 Ω @ VGS = 4.5 V.

Optimized for use in switching DC/DC converters with

PWM controllers.

Very fast switching.

Low gate charge (typical Qg = 19 nC).

SOT-23 SuperSOTTM-8 SOIC-16SO-8 SOT-223SuperSOTTM-6

This N-Channel Logic Level MOSFET has been designedspecifically to improve the overall efficiency of DC/DCconverters using either synchronous or conventional switching PWM controllers.

The MOSFET features faster switching and lower gatecharge than other MOSFETs with comparable RDS(ON)

specifications.

The result is a MOSFET that is easy and safer to drive (evenat very high frequencies), and DC/DC power supply designswith higher overall efficiency.

1

6

7

8

2

4

3

5

© 1998 Fairchild Semiconductor Corporation

Electrical Characteristics (TA = 25 OC unless otherwise noted )

Symbol Parameter Conditions Min Typ Max Units

OFF CHARACTERISTICS

BVDSS Drain-Source Breakdown Voltage VGS = 0 V, I D = 250 µA 30 V

∆BVDSS/∆TJBreakdown Voltage Temp. Coefficient ID = 250 µA, Referenced to 25 oC 23 mV/ oC

IDSS Zero Gate Voltage Drain Current VDS = 24 V, VGS = 0 V 1 µA

TJ = 55°C 10 µA

IGSSF Gate - Body Leakage, Forward VGS = 20 V, VDS = 0 V 100 nA

IGSSR Gate - Body Leakage, Reverse VGS = -20 V, VDS= 0 V -100 nA

ON CHARACTERISTICS (Note 2)

VGS(th) Gate Threshold Voltage VDS = VGS, ID = 250 µA 1 1.7 3 V

∆VGS(th)/∆TJGate Threshold Voltage Temp.Coefficient ID = 250 µA, Referenced to 25 oC -5 mV/oC

RDS(ON) Static Drain-Source On-Resistance VGS = 10 V, ID = 11.5 A 0.0085 0.01 ΩTJ =125°C 0.014 0.017

VGS = 4.5 V, ID = 9.5 A 0.0125 0.015

ID(ON) On-State Drain Current VGS = 10 V, VDS = 5 V 50 A

gFS Forward Transconductance VDS = 15 V, ID = 11.5 A 40 S

DYNAMIC CHARACTERISTICS

Ciss Input Capacitance VDS = 15 V, VGS = 0 V, f = 1.0 MHz

2070 pF

Coss Output Capacitance 510 pF

Crss Reverse Transfer Capacitance 235 pF

SWITCHING CHARACTERISTICS (Note 2)

tD(on) Turn - On Delay Time VDS= 15 V, I D = 1 A 13 21 ns

tr Turn - On Rise Time VGS = 10 V , RGEN = 6 Ω 10 18 ns

tD(off) Turn - Off Delay Time 36 58 ns

tf Turn - Off Fall Time 13 23 ns

Qg Total Gate Charge VDS = 15 V, ID = 11.5 A, 19 27 nC

Qgs Gate-Source Charge VGS = 5 V 7 nC

Qgd Gate-Drain Charge 6 nC

DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS

IS Maximum Continuous Drain-Source Diode Forward Current 2.1 A

VSD Drain-Source Diode Forward Voltage VGS = 0 V, IS = 2.1 A (Note 2) 1.2 V

Notes:

1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed bydesign while RθCA is determined by the user's board design.

Scale 1 : 1 on letter size paper

2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.

FDS6680 Rev.E1

c. 125OC/W on a 0.006 in2 padof 2oz copper.

b. 105OC/W on a 0.04 in2

pad of 2oz copper.a. 50OC/W on a 1 in2 pad

of 2oz copper.

FDS6680 Rev.E1

0 0.5 1 1.5 2 2.50

10

20

30

40

50

V , DRAIN-SOURCE VOLTAGE (V)

I ,

DR

AIN

-SO

UR

CE

CU

RR

EN

T (

A)

3.5

4.04.5

DS

D

V = 10VGS

5.06.0

3.0

0 10 20 30 40 500.5

1

1.5

2

2.5

3

I , DRAIN CURRENT (A)

DR

AIN

-SO

UR

CE

ON

-RE

SIS

TA

NC

E

V = 3.5VGS

D

R

,

NO

RM

ALI

ZE

DD

S(O

N)

10

6.0

4.0

5.0 4.5

Typical Electrical Characteristics

Figure 1. On-Region Characteristics. Figure 2. On-Resistance Variation with Drain Current and Gate Voltage.

-50 -25 0 25 50 75 100 125 1500.6

0.8

1

1.2

1.4

1.6

1.8

T , JUNCTION TEMPERATURE (°C)

DR

AIN

-SO

UR

CE

ON

-RE

SIS

TA

NC

E

J

V =10VGS

I = 11.5AD

R

, N

OR

MA

LIZ

ED

DS

(ON

)

Figure 3. On-Resistance Variation with Temperature.

0 1 2 3 4 50

10

20

30

40

50

V , GATE TO SOURCE VOLTAGE (V)

I ,

DR

AIN

CU

RR

EN

T (

A)

25°C125°C

V = 10VDS

GS

D

T = -55°CJ

Figure 5. Transfer Characteristics.

0.2 0.4 0.6 0.8 1 1.20.0001

0.001

0.01

0.1

1

10

50

V , BODY DIODE FORWARD VOLTAGE (V)

I ,

RE

VE

RS

E D

RA

IN C

UR

RE

NT

(A

)

T = 125°CJ

25°C

-55°C

V =0VGS

SD

S

Figure 6. Body Diode Forward Voltage Variation with Source Current and Temperature.

2 4 6 8 100

0.01

0.02

0.03

0.04

V ,GATE-SOURCE VOLTAGE (V)

DR

AIN

-SO

UR

CE

ON

-RE

SIS

TA

NC

E I = 11.5AD

GS

R

,(

OH

M)

DS

(ON

)

T = 125 CAo

T = 25 CAo

Figure 4. On-Resistance Variation with Gate-to-Source Voltage.

FDS6680 Rev.E1

0 10 20 30 400

2

4

6

8

10

Q , GATE CHARGE (nC)

V

, G

AT

E-S

OU

RC

E V

OLT

AG

E (

V)

g

GS

I = 11.5AD V = 10VDS

15V

20V

0.1 0.2 0.5 1 2 5 10 30 500.01

0.1

1

3

1020

50100

V , DRAIN-SOURCE VOLTAGE (V)

I ,

DR

AIN

CU

RR

EN

T (

A)

DS

D

1s

100ms

10s

10ms

RDS(ON) LIMIT

1ms

100us

DCV = 10VSINGLE PULSE

R = See Note 1cT = 25°C

GS

A

θJA

0.001 0.01 0.1 1 10 100 3000

10

20

30

40

50

SINGLE PULSE TIME (SEC)

PO

WE

R (

W)

SINGLE PULSER =See Note 1c

T = 25°CθJA

A

Figure 10. Single Pulse Maximum Power Dissipation.

0.1 0.2 0.5 1 2 5 10 20 30100

200

500

1000

2000

3000

V , DRAIN TO SOURCE VOLTAGE (V)

CA

PA

CIT

AN

CE

(pF

)

DS

C iss

f = 1 MHzV = 0VGS

C oss

C rss

Figure 8. Capacitance Characteristics.Figure 7. Gate Charge Characteristics.

Figure 9. Maximum Safe Operating Area.

Typical Electrical And Thermal Characteristics

0.0001 0.001 0.01 0.1 1 10 100 3000.001

0.002

0.005

0.01

0.02

0.05

0.1

0.2

0.5

1

t , TIME (sec)

TR

AN

SIE

NT

TH

ER

MA

L R

ES

IST

AN

CE

r(t)

, NO

RM

ALI

ZE

D E

FF

EC

TIV

E

1

Single Pulse

D = 0.5

0.1

0.05

0.02 0.01

0.2

Duty Cycle, D = t /t1 2

R (t) = r(t) * R R =See Note 1c

θJAθJA

θJA

T - T = P * R (t)θJAAJ

P(pk)

t 1 t 2

Figure 11. Transient Thermal Response Curve. Thermal characterization performed using the conditions described in Note 1c.

Transient thermal response will change depending on the circuit board design.

TRADEMARKS

ACEx™CoolFET™CROSSVOLT™E2CMOSTM

FACT™FACT Quiet Series™FAST®

FASTr™GTO™HiSeC™

The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and isnot intended to be an exhaustive list of all such trademarks.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORTDEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.As used herein:1. Life support devices or systems are devices orsystems which, (a) are intended for surgical implant intothe body, or (b) support or sustain life, or (c) whosefailure to perform when properly used in accordancewith instructions for use provided in the labeling, can bereasonably expected to result in significant injury to theuser.

2. A critical component is any component of a lifesupport device or system whose failure to perform canbe reasonably expected to cause the failure of the lifesupport device or system, or to affect its safety oreffectiveness.

PRODUCT STATUS DEFINITIONS

Definition of Terms

Datasheet Identification Product Status Definition

Advance Information

Preliminary

No Identification Needed

Obsolete

This datasheet contains the design specifications forproduct development. Specifications may change inany manner without notice.

This datasheet contains preliminary data, andsupplementary data will be published at a later date.Fairchild Semiconductor reserves the right to makechanges at any time without notice in order to improvedesign.

This datasheet contains final specifications. FairchildSemiconductor reserves the right to make changes atany time without notice in order to improve design.

This datasheet contains specifications on a productthat has been discontinued by Fairchild semiconductor.The datasheet is printed for reference information only.

Formative orIn Design

First Production

Full Production

Not In Production

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FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHERNOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILDDOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCTOR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENTRIGHTS, NOR THE RIGHTS OF OTHERS.

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