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TRANSCRIPT
FUJITSU Component Wireless module
Bluetooth Smart Module
MBH7BLZ01-109003 Datasheet
Rev. 0.08
DEC 15, 2014
The above Product is designed, developed and manufactured as contemplated for general
use, including without limitation, general office use, personal use, household use, and
ordinary industrial use, but is not designed, developed and manufactured as contemplated
(1)for use accompanying fatal risks or dangers that, unless extremely high safety is secured,
could lead directly to death, personal injury, severe physical damage or other loss (i.e.,
nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass
transport control, medical life support system, missile launch control in weapon system), or
(2)for use requiring extremely high reliability (i.e., submersible repeater and artificial
satellite), hereinafter referred to as "High Safety Required Use". You shall not use this
Product without securing the sufficient safety or reliability required for the High Safety
Required Use. If you wish to use this Product for High Safety Required Use, please consult
with our sales representatives in charge before such use.
Fujitsu Component Limited
All specifications are preliminary which may be changed without any prior notice
Copyright © FUJITSU COMPONENT LIMITED 2013 - 2014 - 2 -
1. Summary ........................................................................................................................................ 4
2. Features ......................................................................................................................................... 4
3. Applicable Standard ..................................................................................................................... 5
4. Block Diagram ............................................................................................................................... 5
5. Electrical Characteristics ............................................................................................................. 6
5-1. General Features ........................................................................................................................ 6
5-2. Absolute Maximum Rating .......................................................................................................... 7
5-3. Recommendable Operating Condition ........................................................................................ 7
5-3-1. Operating Temperature ........................................................................................................ 7
5-3-2. Operating Voltage (Using Internal LDO Regulator) ............................................................. 7
5-4. I/O Terminal Characteristics ........................................................................................................ 7
5-5. Memory ........................................................................................................................................ 8
5-5-1. Flash Memory ...................................................................................................................... 8
5-5-2. RAM ..................................................................................................................................... 8
5-6. Internal 32.768kHz RC Oscillator ................................................................................................ 8
5-7. External 32.768kHz Crystal Oscillator......................................................................................... 8
5-8. Power Management .................................................................................................................... 9
5-9. Current Consumption .................................................................................................................. 9
5-10. General radio characteristics ................................................................................................. 10
5-11. Transmitter Specifications ...................................................................................................... 10
5-12. Receiver sensitivity ................................................................................................................ 10
5-13. Receiver specifications .......................................................................................................... 10
6. Interface Specification ................................................................................................................ 11
6-1. Debugger Interface .................................................................................................................... 11
7. SoftDevice .................................................................................................................................... 11
8. Pin Description ............................................................................................................................ 12
8-1. Pin assignment and Pin Description ......................................................................................... 12
8-2. Pin State on Reset ..................................................................................................................... 14
8-3. Internal Circuit Diagram ............................................................................................................. 15
9. Mechanical Characteristics ....................................................................................................... 16
9-1. Appearance and Dimensions .................................................................................................... 16
9-2. Marking ...................................................................................................................................... 16
Copyright © FUJITSU COMPONENT LIMITED 2013 - 2014 - 3 -
9-3. Recommended Land Pattern .................................................................................................... 17
10. Appearance specification .......................................................................................................... 17
11. Recommended Reflow Profile ................................................................................................... 18
12. Storage Conditions ..................................................................................................................... 19
13. Packing Specification in shipment ........................................................................................... 20
13-1. Carrier Tape Appearance and Dimensions ............................................................................ 20
13-2. Reel Appearance and Dimensions ........................................................................................ 21
13-3. Taping Direction and Packing Quantity ................................................................................. 21
13-4. Tape Reel Strength ................................................................................................................ 22
13-5. Bar code label ........................................................................................................................ 22
13-6. Package ................................................................................................................................. 23
14. Revision History .......................................................................................................................... 24
Copyright © FUJITSU COMPONENT LIMITED 2013 - 2014 - 4 -
1. Summary
This datasheet applies to the Bluetooth® Smart Module MBH7BLZ01-1090003.
2. Features
This product is surface-mount module compliant with Bluetooth® Specification Version 4.1,
and is possible to communicate in an ISM(Industrial Scientific Medical) band.
You can develop and embed your own application code in this module by using software
development kit(SDK) and software stack provided by Nordic Semiconductor, whose RF SoC
our module based on.
The followings are the key features.
・ Bluetooth® Specification Version 4.1 (Single mode Low Energy radio) Compliant
・ Nordic Semiconductor nRF51822 based
・ All GPIO pins(GPIO_0 to GPIO_30) of nRF51822 are assigned to this module
(Possible to use them as SPI, TWI, UART and ADC)
・ Complete Bluetooth protocol stack provide by Nordic Semiconductor
・ Power Supply: 1.9~3.6V
* Please refer to the section 5-3 for details.
・ RoHS Compliant
・ Surface mount type
・ Small footprint ( 10.5mm x 9.2mm x 1.6mm )
The Bluetooth® word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. and
any use of such marks by FUJITSU COMPONENT LIMITED is under license.
Other third-party brands and names are the property of their respective owners.
Copyright © FUJITSU COMPONENT LIMITED 2013 - 2014 - 5 -
3. Applicable Standard
・ Bluetooth® Specification Version 4.1
QDID: 59305
・ ARIB STD-T66
Radio Act(Japan)
Certification No. 007-AB0237
*Certification has been acquired specifying antennas. If you want to get the certification using other
antennas, please contact our local sales.
* Don't rewrite the SoftDevice from Nordic Semiconductor website.
If rewrote it, the certification might become disabled by the radio law of each country.
Please contact our local sales for details.
4. Block Diagram
Matching
Component
MBH7BLZ01
Crystal
16MHz
nRF51822
VDD
GPIO
SWDCLK
SWDIO/nRESET
RF
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5. Electrical Characteristics
5-1. General Features
Bluetooth® Specification Version 4.1 Compliant
Carrier Frequency: 2400MHz ~ 2483.5MHz
Modulation: GFSK
Symbol Rate: 1Mbps
Data Rate: 1Mbps
Channel: 40ch
Channel Spacing: 2MHz
Output power: +4 dBm max
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5-2. Absolute Maximum Rating
Items Symbol Min Max Unit
Supply voltage (VDD) VDD -0.3 3.6 V
Supply voltage (GND) GND - 0 V
Supply voltage (I/O) VIO -0.3 VDD+0.3 V
Storage Temperature Tstg -40 +85 °C
5-3. Recommendable Operating Condition
5-3-1. Operating Temperature
Items Symbol Min Typ Max Unit
Operating Temperature Topr -25 25 +75 °C
5-3-2. Operating Voltage (Using Internal LDO Regulator)
Items Symbol Min Typ Max Unit
VDD VDD 1.9 3.3 3.6 V
* Supply power to VDD pin, and VDD1.8 pin should be floating.
5-4. I/O Terminal Characteristics
Items Symbol Min Typ Max Unit
Input high voltage VIH 0.7VDD - VDD V
Input low voltage VIL GND - 0.3VDD V
Output high voltage (std. drive, 0.5 mA) VOH VDD-0.3 - VDD V
Output high voltage (high-drive, 5 mA) VOH VDD-0.3 - VDD V
Output low voltage (std. drive, 0.5 mA) VOL GND - 0.3 V
Output low voltage (high-drive, 5 mA) VOH GND - 0.3 V
Pull-up resistance RPU 11 13 16 kΩ
Pull-down resistance RPD 11 13 16 kΩ
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5-5. Memory
5-5-1. Flash Memory
Flash Size Page Size Number of Pages
256kByte 1024Byte 256
Items Max Unit
Endurance 20000 write/erase cycles
Retention 10 years at 40 °C
Number of times an address can be written between erase cycles
2 times
5-5-2. RAM
RAM Size Block Start address Size
16kByte Block0 0x20000000 8kByte
Block1 0x20002000 8kByte
5-6. Internal 32.768kHz RC Oscillator
Description Symbol Min. Typ. Max. Unit
Nominal frequency fNOM,RC32k 32.768 kHz
Frequency tolerance fTOL,RC32k ±2 %
Frequency tolerance (Calibration interval 4s) fTOL,CAL,RC32k ±250 ppm
Run current IRC32k 0.5 0.8 1.1 μA
Startup time tSTART,RC32k 100 ms
5-7. External 32.768kHz Crystal Oscillator
Description Symbol Min. Typ. Max. Unit
Crystal frequency fNOM,X32k 32.768 kHz
Frequency tolerance, Bluetooth low energy applications
fTOL,X32k,BLE ±250 ppm
Load capacitance CL,X32k 12.5 pF
Shunt capacitance C0,X32k 2 pF
Equivalent series resistance RS,X32k 50 80 kΩ
Drive level PD,X32k 1 μW
Input capacitance on XL1 and XL2 pads Cpin 4 pF
Run current for 32.768 kHz crystal oscillator IX32k 0.4 1 μA
Startup current for 32.768 kHz crystal oscillator
ISTART,X32k 1.3 1.8 μA
Startup time for 32.768 kHz crystal oscillator tSTART,X32k 0.3 1.8 s
Note: This product embedding 32.768kHz RC Oscillator, external 32.768kHz Crystal Oscillator is
not necessarily required.
It is possible to add external 32.768kHz Crystal Oscillator satisfying above-mentioned
specification to increase accuracy of clock, or to reduce power consumption.
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5-8. Power Management
Description Symbol Min. Typ. Max. Units
Time Reset is active from VDD reaches 1.7 V with 1 μs rise time
tPOR, 1μs 0.2 2.7
ms
Time Reset is active from VDD reaches 1.7 V with 50 ms rise time
tPOR, 50 ms 6.5 29
ms
Current in SYSTEM-OFF, no RAM retention IOFF
0.4
μA
Current in SYSTEM-OFF mode 8 kB SRAM retention
IOFF, 8 k
0.6
μA
Current in SYSTEM-OFF mode 16 kB SRAM retention
IOFF, 16 k
0.8
μA
OFF to CPU execute transition current IOFF2ON
400
μA
OFF to CPU execute tOFF2ON
9.6 10.6 μs
SYSTEM-ON base current ION
2.3
μA
Current drawn by 1V2 regulator I1V2
290
μA
Startup time for 1V2 regulator t1V2
2.3
μs
Current drawn by 1V7 regulator I1V7
90
μA
Startup time for 1V7 regulator t1V7
2 3.6 μs
* “Power Management“ are guaranteed as SoC (nRF51822).
5-9. Current Consumption
Ta=25±2°C
Description Symbol Min. Typ. Max. Units
TX only run current @ POUT = +4 dBm ITX,+4dBm
16
mA
TX only run current @ POUT = 0 dBm ITX,0dBm
10.5
mA
TX only run current @ POUT = -4 dBm ITX,-4dBm
8
mA
TX only run current @ POUT = -8 dBm ITX,-8dBm
7
mA
TX only run current @ POUT = -12 dBm ITX,-12dBm
6.5
mA
TX only run current @ POUT = -16 dBm ITX,-16dBm
6
mA
TX only run current @ POUT = -20 dBm ITX,-20dBm
5.5
mA
TX only run current @ POUT = -30 dBm ITX,-30dBm
5.5
mA
TX startup current (*1) ISTART,TX
7
mA
RX only run current IRX
13
mA
RX startup current (*2) ISTART,RX
8.7
mA
Run current for 16 MHz crystal oscillator IX16M
470
uA
32.768 kHz RC oscillator Run current IRC32k
0.8 1.1 uA
SYSTEM-ON base current with 16 kB RAM enabled
ION
2.6
uA
Current drawn by 1V2 regulator and 16 MHz XOSC when both are on at the same time
I1V2XO16
810
uA
Current drawn by 1V7 regulator I1V7
105
uA
Run current at 115200 bps IUART115k
220
uA
Run current at 1200 bps IUART1k2
210
uA
Current consumption in addition to IRX RSSICURRENT
250
uA
*1) Average current consumption (at 0 dBm TX output power) for TX startup (130 μs), and when changing
mode from RX to TX (130 μs).
*2) Average current consumption for RX startup (130 μs), and when changing mode from TX to RX (130 μs).
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5-10. General radio characteristics
Ta=25±2°C
Items Condition Min Typ Max Unit
Operating frequencies 2MHz channel spacing 2400 - 2483.5 MHz
PLL programming resolution 1 MHz
Frequency deviation ±225 ±250 ±275 kHz
5-11. Transmitter Specifications
Ta=-25°C~75°C
Items Condition Min Typ Max Unit
Output power -20 +4 dBm
Step size of RF power control 4 dB
RF power control range +20 +24 dB
20 dB bandwidth for modulated carrier 950 1100 kHz
1st Adjacent Channel Transmit Power 1MHz
-20 dBc
2nd Adjacent Channel Transmit Power 2MHz
-40 dBc
Maximum consecutive transmission time 16 ms
Carrier frequency offset and drift
|f0-fn ≦ 50kHz
(n=2,3,4…k) -50 50 kHz
|f1-f0|≦20kHz -20 20 kHz |fn-fn-5|
n=6,7,8…k≦20kHz -20 20 kHz
5-12. Receiver sensitivity
Ta=-25°C~75°C
Items Condition Min Typ Max Unit
Maximum received signal strength < 0.1% PER 0 dBm
Receiver sensitivity
Ideal transmitter -93 dBm
Dirty transmitter -91 dBm
5-13. Receiver specifications
Ta=25±2°C
Items Condition Min Typ Max Unit
RX selectivity
C/I co-channel - 10 21 dB
1st ACS, C/I 1 MHz - 1 15 dB
2nd ACS, C/I 2 MHz - -25 -17 dB
ACS, C/I (3+n) MHz offset [n = 0, 1, 2, . . .]
- -51 -27 dB
lmage blocking level - -30 -9 dB
Adjacent channel to image blocking level (±1 MHz)
- -31 -15 dB
RX intermodulation IMD performance, 3rd, 4th and 5th offset channel
-50 -39 - dBm
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6. Interface Specification
6-1. Debugger Interface
Serial wire Debug (SWD) interface is composed of two lines; SWDCLK pin and SWDIO pin.
RESET is a pin provided as a SWDIO functions.
RESET pin is used as SWDIO in debugger interface mode, and the reset function is disabled
as far as it is in the mode.
7. SoftDevice
This product permits use of the following Softdevice.
・s110_nrf51822_7.0.0_softdevice.hex
Copyright © FUJITSU COMPONENT LIMITED 2013 - 2014 - 12 -
8. Pin Description
8-1. Pin assignment and Pin Description
<TOP View>
MBH7BLZ01-109003 Internal connection with
nRF51822 I/O Description /
External Connection
No Name No Name 1 GND - VSS - Ground
2 VDD1.8 29 DEC2 - Should be floating
3 GND - VSS - Ground
4 GPIO_17 25 P0.17 I/O General purpose I/O pin
5 GPIO_19 27 P0.19 I/O General purpose I/O pin
6 GPIO_18 26 P0.18 I/O General purpose I/O pin
7 GPIO_20 28 P0.20 I/O General purpose I/O pin
8 GPIO_16 22 P0.16 I/O General purpose I/O pin
9 GPIO_15 21 P0.15 I/O General purpose I/O pin
10 GPIO_14 20 P0.14 I/O General purpose I/O pin
11 GPIO_13 19 P0.13 I/O General purpose I/O pin
12 GPIO_12 18 P0.12 I/O General purpose I/O pin
13 GPIO_27 46 P0.27/AIN1/XL1 I/O General purpose I/O pin
Connection for 32.768 kHz crystal oscillator or external 32.768 kHz crystal reference.
14 GPIO_26 45 P0.26/AIN0/XL2 I/O General purpose I/O pin
Connection for 32.768 kHz crystal oscillator.
15 GND - VSS - Ground
16 GPIO_21 40 P0.21 I/O General purpose I/O pin
17 GPIO_22 41 P0.22 I/O General purpose I/O pin
18 GPIO_23 42 P0.23 I/O General purpose I/O pin
19 GPIO_24 43 P0.24 I/O General purpose I/O pin
20 GPIO_6 10 P0.06/AIN7/AREF1 I/O General purpose I/O pin
21 GPIO_5 9 P0.05/AIN6 I/O General purpose I/O pin
22 GPIO_4 8 P0.04/AIN5 I/O General purpose I/O pin
23 GPIO_3 (U_RX) 7 P0.03/AIN4 I/O General purpose I/O pin
24 GPIO_2 (U_CTS) 6 P0.02/AIN3 I/O General purpose I/O pin
25 GPIO_1 (U_TX) 5 P0.01/AIN2 I/O General purpose I/O pin
26 GPIO_0 (U_RTS) 4 P0.00/AREF0 I/O General purpose I/O pin
27 GND - VSS - Ground
28 VDD 1,12 VDD - Power supply
29 GND - VSS - Ground
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MBH7BLZ01-109003 Internal connection with
nRF51822 I/O Description /
External Connection
No Name No Name 30 GPIO_25 44 P0.25 I/O General purpose I/O pin
31 GPIO_29 48 P0.29 I/O General purpose I/O pin
32 GPIO_28 47 P0.28 I/O General purpose I/O pin
33 GPIO_30 3 P0.30 I/O General purpose I/O pin
34 GPIO_7 11 P0.07 I/O General purpose I/O pin
35 GPIO_8 14 P0.08 I/O General purpose I/O pin
36 GPIO_9 15 P0.09 I/O General purpose I/O pin
37 GPIO_10 16 P0.10 I/O General purpose I/O pin
38 GPIO_11 17 P0.11 I/O General purpose I/O pin
39 SWDIO/nRESET 23 SWDIO/nRESET I System reset. (Input must be low for > 0.2μs.)
Also HW debug and flash programming
40 SWDCLK 24 SWDCLK I HW debug and flash programming
41 GND - VSS - Ground
42 GND - VSS - Ground
43 GND - VSS - Ground
44 GND - VSS - Ground
45 GND - VSS - Ground
46 GND - VSS - Ground
47 GND - VSS - Ground
48 GND - VSS - Ground
49 GND - VSS - Ground
50 GND - VSS - Ground
51 RF 31,32 ANT1/ANT2 RF I/O RF Input/Output
52 GND - VSS - Ground
53 GND - VSS - Ground
54 GND - VSS - Ground
55 GND - VSS - Ground
56 GND - VSS - Ground
Copyright © FUJITSU COMPONENT LIMITED 2013 - 2014 - 14 -
8-2. Pin State on Reset
No Name State
4 GPIO_17 Input with disconnect input buffer
5 GPIO_19 Input with disconnect input buffer
6 GPIO_18 Input with disconnect input buffer
7 GPIO_20 Input with disconnect input buffer
8 GPIO_16 Input with disconnect input buffer
9 GPIO_15 Input with disconnect input buffer
10 GPIO_14 Input with disconnect input buffer
11 GPIO_13 Input with disconnect input buffer
12 GPIO_12 Input with disconnect input buffer
13 GPIO_27 Input with disconnect input buffer
14 GPIO_26 Input with disconnect input buffer
16 GPIO_21 Input with disconnect input buffer
17 GPIO_22 Input with disconnect input buffer
18 GPIO_23 Input with disconnect input buffer
19 GPIO_24 Input with disconnect input buffer
20 GPIO_6 Input with disconnect input buffer
21 GPIO_5 Input with disconnect input buffer
22 GPIO_4 Input with disconnect input buffer
23 GPIO_3 (U_RX) Input with disconnect input buffer
24 GPIO_2 (U_CTS) Input with disconnect input buffer
25 GPIO_1 (U_TX) Input with disconnect input buffer
26 GPIO_0 (U_RTS) Input with disconnect input buffer
30 GPIO_25 Input with disconnect input buffer
31 GPIO_29 Input with disconnect input buffer
32 GPIO_28 Input with disconnect input buffer
33 GPIO_30 Input with disconnect input buffer
34 GPIO_7 Input with disconnect input buffer
35 GPIO_8 Input with disconnect input buffer
36 GPIO_9 Input with disconnect input buffer
37 GPIO_10 Input with disconnect input buffer
38 GPIO_11 Input with disconnect input buffer
39 SWDIO/nRESET Pull-up
40 SWDCLK Pull-down
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8-3. Internal Circuit Diagram
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9. Mechanical Characteristics
9-1. Appearance and Dimensions
Unit: mm
9-2. Marking
Product code: BLZ01
Identification number
Lot number: 4 X 00
Serial number: 00 ~
Month: 1 ~ 9, X, Y, Z
Year: The last digit of year
Revision number: AA ~
Logo mark
Example
Copyright © FUJITSU COMPONENT LIMITED 2013 - 2014 - 17 -
9-3. Recommended Land Pattern
Following land pattern is recommended for your board design. However, you may have to
modify it according to your soldering conditions. In such case, please peform evaluation
sufficiently.
Unit: mm
10. Appearance specification
Item Contents Criterion
Shield Case Scratch No illegible character by scratch.
Discoloration No illegible character by discoloration.
PAD (Gold-plated)
Foreign substance adhesion No foreign substance.
Solder adhesion 25% or less of each Pad area.
Marking Marking specification Identical to the marking written in approval specifications for each customer.
Readability Legible.
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11. Recommended Reflow Profile
Following profile is recommended for your reflow soldering. However, this profile may vary
according to the density of components, package types of components, a solder material, or
size of your printed circuit board, etc. Please perform evaluation sufficiently
Heating Preheat Soldering Cooling
50
D3
D2
D1T1 T2
Time (Sec)
Temp.
250
200
150
100
(degC)
*Note: Reflow soldering is recommended two times maximum.
If your soldering conditions are different from our recommendation, please contact our
local sales.
No Item Temperature (°C) Time (sec)
1 Pre-heat D1: 140 to D2: 200 T1: 60 to 120
2 Soldering D2: >= 200 T2: 80 max
3 Peak-Temp. D3: 250°C max
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12. Storage Conditions
Moisture Sensitivity Level: IPC/JEDEC Standard J-STD-020D Level 3
Handling of unopened moisture proof bag:
It is recommended that the modules is stored at 30°C and < 60% RH, and is used within 6
months from the delivery date.
Handling of opened moisture proof bag:
The modules should be stored at 30°C and < 60% RH, and be used within 7 days after
opening the bag. If it exceeds 7 days after opening, perform the baking process (at 125°C,
24 hours) before mounting.
Do not store this modules in the environments exposed to shock or vibration. It may result
in damage, malfunction, or deterioration of quality.
D o not throw or drop cartons containing the modules during transportation. It may result
in damage, malfunction, or deterioration of quality.
Keep the modules in original packing condition until just before use.
Store the modules at recommended storage condition. When deviated from the condition,
check the appearance and function of the modules prior to use.
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13. Packing Specification in shipment
13-1. Carrier Tape Appearance and Dimensions
A B W F E P0 P1 P2 T
Dimensions 9.5 11.2 24.0 11.5 1.75 4.0 12.0 2.0 2.0
Tolerance +/-0.1 +/-0.1 +/-0.3 +/-0.1 +/-0.1 +/-0.1 +/-0.1 +/-0.1 +/-0.1
Unit: mm
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13-2. Reel Appearance and Dimensions
0.2
0.4
0.6
0.8 6 PS06 A B D C
W1
W2
A B C D W1 W2
Dimensions 330.0 80.0 130 21.0 25.4 29.4
Tolerance +/-2.0 +/-1.0 +/-0.2 +/-0.8 +/-1.0 +/-1.0
Unit : mm
13-3. Taping Direction and Packing Quantity
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13-4. Tape Reel Strength
13-5. Bar code label
MSL3
Pb-free
RoHS
Copyright © FUJITSU COMPONENT LIMITED 2013 - 2014 - 23 -
13-6. Package
cardboardcardboardPET/Al/PE 3Layer bagPaperPolystyrene+CarbonPolyesterPolystyrene+Styrenebutadiene
Outer boxInner boxMoisture proof bagHumidity IndicatorReel
Carrier tapeCover tape
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14. Revision History
Revision Contents change Date
Rev. 0.01 Created first edition. JUN 14, 2013
Rev. 0.02 Section 5 was revised. Section 8-2 was revised.
AUG 23, 2013
Rev. 0.03 Changed the description of high safety notice. SEP 30, 2013
Rev. 0.04 Section 3, 5 and 12-6 was revised. Added section 9.
FEB 10, 2014
Rev. 0.05 Section 5 was revised. MAR 31, 2014
Rev. 0.06 Section 2, 5-3 and 7-1 was revised. JUL 9, 2014
Rev. 0.07 Section 5-6, 5-7 and 7-1 was revised. AUG 22, 2014
Rev. 0.08
Changed the version of Bluetooth® Specification. Section 5-6 and 5-7: Added 32.768kHz oscillator specifications. Section 7: Added Revision of Softdevice. Section 3, 8-1 and 9-2 was revised.
DEC 15, 2014