future industrial equipments profile-partial

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Provide sets solutions of automation equipment, non‐standard automation equipment etc for LCD, TP, FPD products & other industrial automation industry

Future Industrial,

Liande Shenzhen

Machine Catalog

Provide sets snon‐standardFPD products

Automati

Automati

Automati

Non-stan

Professio

• LPL-070Usage: a

Product D

Accuracy

Capacity:

Outline D

Process:

Panel loa

POL load

• LPL-050Usage: ap

Product D

Accuracy

Capacity:

Outline D

Process:

Panel loa

POL load

• LCOG-0Usage: It’s

app

Product D

Accuracy

Capacity:

Outline D

Process:

Panel loa

contrapos

• FLOG-0Usage: it’

(1

Product D

Main Bu

solutions of automd automation equs & other industria

ion equipments

ion equipments

ion production

ndard automati

onal autom

02A Automatipplicable to lami

Dimension: 1~5”

y: ±0.1 mm

: 900pcs/h

Dimension *4 (m

ding contrapos

ing film removi

00S Semiautoplicable to lamin

Dimension: 1~5”

y: ±0.1 mm

: 900pcs/h

Dimension (mm)

ding contrapos

ing film removi

0500S COG Bs a semiautomati

plicable to bond

Dimension: 1~5

y: Pre-bonding±

: 650pcs/h

Dimension (mm)

ading mechanic

sition automatica

0502S FOG Bo’s a semiautoma

1”~5.3”) bond wit

Dimension: 1~5

usiness Sc

mation equipmentipment etc for LCDal automation ind

s for FPD, LCD

s for TP

line & logistics

on customized

mation equ

ic Polarizer Lnation between p

”

mm):1650X800X1

sition cleaning

ng correction

omatic Polariation between pa

”

):1150X800X170

sition cleaning

ng correction

Bonding Machc bonding mach

IC on LCD lamin

.3”

2.5µm, final bond

):2760X1200X18

cal contraposition

ally and correctio

onding Machtic FOG bonding

th LCD/TP

.3”

cope

t, D, TP, ustry

D/LCM

s line，

d equipment & f

uipments f

Laminator panel etc and PO

750 (exclude FF

zer Laminatoanel etc and PO

0 (including FFU

hine ine with pre-bond

nated with ACF

ding±4µm

00

n IC loading aut

n pre-bonding

ine g machine, applic

Laminat

Lamina

2 / 16

fixture

for LCD/F

OL;

FU)

or L;

U)

ding & final bond

tomatically CCD

final bonding

cable to FPC

ting and unloadin

ting and unloadin

PD

ding function,

D

unloading autom

ng

ng

matically


Accuracy

Capacity:

Outline D

Process:

Loading a

loading

• LGP-050Usage: ap

Product D

Accuracy

Capacity:

Outline D

Process:

Panel con

• LGP-050Usage: ap

Product D

Accuracy

Capacity:

Outline D

Process:

Panel con

• LAL-070Usage: it

it

Product D

Accuracy

Capacity:

Outline D

Process:

Loading m

• LAL-130Usage: it c

als

Product D


y: X:±0.01 mm Y

: 1000pcs/h

Dimension (mm)

automatically(con

FPC&PANEL co

00A Automatplicable to LCD a

Dimension: 1.5~

y: ±0.075 mm

: 900pcs/h

Dimension (mm)

nveyer loading c

B

01A Automatplicable to LCD a

Dimension: 2.8~

y: ±0.075 mm

: 1000pcs/h

Dimension (mm)

nveyer loading e

00F ACF Lamput ACF laminat

can also put AC

Dimension: spec

with

y: X:±0.15 mm Y

: 700pcs/h

Dimension (mm)

manually vacuu

00L ACF Lamcan put ACF lami

o put ACF lamin

Dimension: pane


Y: ±0.01 mm

):2800X1320X18

nveyer) mecha

ontraposition by m

tic Assembly and BLU assemb

~5”

):2300X1300X22

contraposition f

BLU loading co

tic Assembly and BLU assemb

~5”

):2500X1550X22

early contraposit

BLU loading e

minator te on Panel and

F laminate on FP

cially applied to A

h size less than 7

Y: ±0.1 mm

):700X7000X140

um suction star

minator inate on Panel an

ate on FPC and

el less than 13”

Contrapo

Contrapo

t, D, TP, ustry

00

nical contraposit

manually FPC p

Machine bly

50

film removing C

ntraposition C

Machine bly

50

tion film removi

arly contrapositio

Film, with specia

PC and PCB

ACF lamination o

7”, max laminatin

0

rt laminating

nd Film, with spe

PCB, it can also

sition laminating

osition laminating

3 / 16

ion ACF lamina

pre-bonding FP

CCD image capt

CD image captu

ng CCD image

on CCD image

al position fixture

on Touch Panel p

g length is 100 m

unloading

ecial position fixtu

be multi-segme

and unloading

g and unloading

ating automatica

PC final bonding

ture

re

e capture

e capture

,

product

mm

ure, it can

nt laminated

lly inspecting a

unloading auto

automatically FP

omatically

PC

4 / 16


Accuracy: X:±0.2 mm Y: ±0.2 mm

Capacity: 600pcs/h

Outline Dimension (mm):820X820X1500

Process:

Loading manually vacuum suction start laminating unloading

• LHS-0725G Heat Bonding Machine Usage: applicable to hot bond panel with FPC, TAB

Product Dimension: less than 7”

Accuracy: X:±0.015 mm Y: ±0.015mm

Capacity: 400pcs/h


Process:

Panel loading vacuum suction FPC loading vacuum suction

contraposition adjustment start hot bonding unloading

• LHS-1031L Heat Bonding Machine Usage: applicable to hot bond panel with FPC, TAB etc, it can be multi-segment

laminated with pre-bonding function

Product Dimension: panel less than 10.4”


Capacity: 320pcs/h (contraposition time is 3s)


Process:

Panel loading vacuum suction FPC loading vacuum suction pre-bonding

displacement FPC loading vacuum suction pre-bonding……displacement final

bonding return unloading

• LHS-1511F FOG Heat Bonding Machine Usage: applicable to final bond between pre-bonded panel & FPC

Product Dimension: panel less than 16”

Accuracy: X:±0.01mm Y: ±0.01 mm

Capacity: 200pcs/h (bonding time is 8 seconds)


Process:

Panel loading vacuum suction displacement final bonding return unloading

LHS-151AF FOB Heat Bonding Machine Usage: applicable to bonding between PCB and FPC with ACF as media

Product Dimension: panel less than 16”

Accuracy: X:±0.015mm Y: ±0.015 mm

Capacity: 200pcs/h (bonding time is 8 s)


5 / 16


Process:

Panel loading vacuum suction PCB loading vacuum suction

contraposition & adjustment hot bonding return unloading

• LHS-1231L Heat Bonding Machine Usage: with pre-bonding & multi-segment FPC main bonding function, Applicable to

FPC to PCB and FPC to glass’s contraposition, pre-bonding and final bonding.

Product Dimension: panel product less than 12.1”


Capacity: 70pcs/h (as example of 3 piece of FPC’s contraposition & pre-bonding,

3 times pre-bonding, 1 time final bonding)

Outline Dimension (mm):1700X985X2211 (including FFU)

Process:

Panel loading vacuum suction FPC loading vacuum suction contraposition &

adjustment pre-bonding displacement FPC loading vacuum suction contraposition

& adjustment pre-bonding……displacement final bonding return unloading

• LBZD-5 Backlight Film Laminating Machine Usage: applicable to automatic combination backlight multi-ties of polarizer

in display module

Product Dimension: 2.0”~5.0”

Accuracy:±0.1 mm

Capacity: 1000pcs/h


Process:

Put in backlight plastic box artificially, the equipment will assemble diffuser, down prism

sheet, up prism sheet and shading film automatically, conveyer unloading automatically.

•

Automation equipments for TP • LFOG-0530S Semiautomatic FOG Connection Machine

Usage: applicable to double-side FPC hot bonding of DITO CTP

Product Dimension: 1.5”~5.3”


Capacity: 450pcs/h

Outline Dimension (mm): 6400X1280X1860

Process:

Loading automatically(loader) optional unit mechanical

contraposition ACF laminating automatically inspecting

automatically FPC loading & contraposition manually

FPC pre-bonding final bonding panel turning mechanical


contrapos

automatic

final bo

• LFOG-0Usage: a

Product D

Accuracy

Capacity:

Outline D

Process:

Loading m

inspecting

adjustme

final bond

turning 60

• LFOG-0Usage: ap

pro

Product D

Accuracy

Capacity:

Outline D

Process:

Loading a

laminatin

FPC co

unloading

• LOL-120Usage: a

Product D

Accuracy

Capacity:

Outline D

Process:

SG/CG lo

OCA lo


Laminating

sition ACF lam

cally FPC turnin

onding unloadin

0500R Automapplicable to G+F

Dimension: 1.5”~

y: X:±0.02 mm

: 600pcs/h

Dimension (mm)

manually turnta

g automatically

nt automatically,

ding automaticall

00 unloading au

0702A OGS Aplicable to FPC h

ocessing of OGS

Dimension: 2.5”~

y: X:±0.01 mm

: 600pcs/h

Dimension (mm)

automatically (Co

ng automatically

ontraposition aut

g automatically

00S Flex to Rpplicable to OCA

Dimension: 4.3~

y: ±0.1 mm

: 150pcs/h

Dimension (mm)

oading manually

oading automatic


g and unloading

minating automat

ng automatically

ng automatically (

atic G+F+F FF+F FPC bonding

~5.3”

Y: ±0.02mm

): 2800X1840X18

able turning 600

turntable turnin

FPC pre-bondin

y 1 turntable tu

utomatically by ro

utomatic Bonhot bonding on O

S (panel) industry

~7”

Y: ±0.01mm

): 4650X1380X18

onveyer) mecha

inspecting auto

tomatically FPC

Rigid LaminatA laminate on SG

~12”

):1630X1390X22

film removing m

cally film remov

t, D, TP, ustry

tically inspectin

FPC pre-bondi

(unloader) option

OG Bondingg in ACF process

800

ACF laminating

ng 600 CCD co

ng automatically

urning 600 fina

obot

nding MachinOGS or panel pro

y

800

anical contrapos

omatically FPC

C pre-bonding

tor G or CG (adapt sc

00

manually cleani

ving automatically

6 / 16

ng

ing

nal unit

Machine sing of CTP pane

g automatically

ontraposition &

turntable turnin

al bonding 2 tu

ne oducts in ACF

ition ACF

C loading manua

final bonding

creen laminating

ng CCD imagi

y CCD imaging

el

ng 600

urntable

ally

g)

ng

g


Cola

• LOCA-1Usage: ap

Product D

Accuracy

Capacity:

Outline D

Process:

SG/TP loa

CG/LCM

• LOCR-0Usage: a

p

Product D

Accuracy

Capacity:

Outline D

Process:

Big piece

Small piec

• LOCR-1Usage: ap

Product D

Accuracy:

Capacity:

Outline Di

Process: 1. put

va

2. put

3. lam

4. lam

5. Lev


Contraposition vacuum chambreaking vacuum

ontraposition & aaminating UV p

200S Rigid toplicable to lamin

Dimension: 4.3~

y: ±0.1 mm

: 150pcs/h

Dimension (mm)

ading manually

loading manually

0500B Automapplicable to put s

rocess (water glu

Dimension: 3~5”

y: ±0.03 mm

: 80pcs/h

Dimension (mm)

of glass loading

ce of glass loadin

101S UV Gluplicable to TP UV

Dimension: 2~1

: ±0.15 mm

90Pcs/h (based

mension(mm)

CG on the board

acuum, start to d

ITO glass in spe

minating platform

mination platform

veled fixture put i


& adjustment ber vacuum sm opening vacu

adjustment autompre-solidifying u

o Rigid Automate TP with LCM

~12”

):1400X1600X230

film removing m

y film removing

atic UV Glue small glass lamin

ue as media)

”

):1500X1200X200

manually CCD

ng manually dis

ue Laminator V glue process la

1”

d on 7” product)

:4000Х1200Х1

d up flipping plat

dispense, flip the

ecial fixture and t

support the fixtu

declining, fixture

nto UV oven afte

t, D, TP, ustry

automaticallysuction laminatuum return loa

matically unloading

matic VacuumM or SG with CG

00

manually CCD i

manually CCD

Laminator (Lnate with big glas

00

D imaging

spensing turnin

(LOCA Laminamination (cover

1600 (exclude FF

form, PIN contra

platform after dis

transmit to lamin

re to lamination

e flowing into IR h

er pre-inspection

7 / 16

close ting ading

m Laminator(OCA as media)

maging

D imaging

LOCA Laminass in OGS

ng CCD imaging

nator) r glass+ ITO glas

FU)

aposition, press to

spensing.

ating position wit

position to comp

high speed strea

for pre-solidifyin

ator)

g

ss)

o start

th conveyer.

plete lamination

m open hearth w

ng, unloading.

with belt line.


6. Rep

• LVLM-0Usage: ap

Product D

Accuracy

Capacity:

Outline D

Process:

SG feedin

chamber

• LFL-050Usage: a

Product D

Accuracy

Capacity:

Outline D

Process:

Film feedi

Glass feed

adjustmen

• LFL-100Usage: a

F

Product D

Accuracy

Capacity:

Outline D

Process:

Film feedi

Glass feed

CCD imag


peat step from 1~

503R Hard toplicable to TP OC

Dimension: 2~7”

y: ±0.10 mm

: 400Pcs/h

Dimension(mm):

ng manually CG

vacuum suction

00S Soft to Happlicable to lami

Dimension: 2~5

y: ±0.1 mm

: 240Pcs/h

Dimension(mm):

ng manually film

ding manually

nt automatically

02S Soft Filmpplicable to lami

(Film) process

Dimension: 2.8~

y: ±0.1 mm

: 180Pcs/h

Dimension(mm):

ng manually film

ding manually

ging and adjustm


~5 for massive p

o Hard VacuuCA process lami

1140Х900Х170

G feeding manua

n laminating b

ard Laminatonate Film on CG

5”

1000Х750Х160

m removing man

film removing m

laminating ret

Laminator nate OCA or film

~10.4”

1450Х820Х180

m removing man

film removing m

ment laminating

t, D, TP, ustry

production.

m Laminatornation(cover glas

00

ally start turnin

break vacuum r

or G (Cover Glass) in

00

nually, cleaning

manually, cleaning

turn unloading

m on CG (Cover G

00

nually, cleaning

manually, cleaning

return unload

8 / 16

r ss+ ITO glass)

ng close vacuu

return unloading

n G(Glass)+ F(F

CCD imaging

g CCD imagin

Glass) in G (Glas

g

ding

um

g

ilm) process

ng

ss) +

9 / 16


• LAL-0701F ACF Laminator Usage: applicable to laminate ACF on panel

Product Dimension: panel below 7”

Accuracy: X: ±0.5 mm Y: ±0.1 mm

Capacity: 700Pcs/h

Outline Dimension(mm): 730Х680Х1450

Process:

Feeding manually vacuum suction start laminating unloading

• LAL-1300L ACF Laminator Usage: applicable to laminate ACF on panel


Accuracy: X: ±0.2 mm Y: ±0.2 mm

Capacity: 600Pcs/h


Process:

Feeding manually vacuum suction start laminating unloading

• LHS-0721F Heat Bonding Machine

Usage: applicable to hot bonding panel with FPC (media ACF)


Accuracy: X: ±0.015 mm Y: ±0.015mm

Capacity: 320Pcs/h (bonding time is 8s)


Process:

Panel feeding vacuum suction FPC feeding vacuum suction

contraposition & adjustment start bonding unloading

• LHS-1229L Heat Bonding Machine Usage: applicable to hot bond panel with FPC (media ACF)

Product Dimension: panel below 12.4”


Capacity: 320Pcs/h (bonding time is 8s)


Process:

Panel feeding vacuum suction FPC feeding vacuum suction pre-bonding

displacement FPC feeding vacuum suction pre-bonding…… displacement

final bonding return unloading

10 / 16


• LHS-0526F OGS manual FOG bonding machine,

Usage: applicable to hot bond panel with FPC (media ACF)

Product Dimension: panel below 5.5”


Capacity: 320Pcs/h (bonding time is 8S)

Outline Dimension (mm): 900Х830Х1500

Process:

Up CCD contraposition, adapt image temporary storage technology,

complete OGS product contraposition, dual platform move front & rear

independently to complete bonding process

• LHS-1320 OGS Manual FOG Bonding Machine Usage: applicable to hot bonding panel with FPC (media ACF)





Process:

Up CCD contraposition, adapt image temporary storage technology,

complete OGS product contraposition, dual platform move left & right

independently to complete bonding process

• LPHM-0720F Pulse Heat Bonding Machine Usage: applicable to bonding between FPC & panel or FPC &

PCB (media: ACF or Tin)





Process:

Down (up) CCD contraposition, dual platform move front & rear

independently, adapt pulsed heating to complete bonding process

• LPHM-1210F Pulse Heat Bonding Machine Usage: applicable to bonding between FPC & panel or FPC &

PCB (media: ACF or Tin)


Accuracy: X/Y: ±0.015 mm

Capacity: 130Pcs/h (contraposition time is 3s, hot holding time is 12s)


Process:

Down (up) CCD contraposition, dual platform move front & rear independently,

adapt pulsed heating to complete bonding process

11 / 16


• LPHM-0520G Double-side Pulse Heat Bonding Machine Usage: applicable to double-side bonding process with ACF media, double-side

main bonding between panel (double-side pre-bonding completed) and FPC



Capacity: 360Pcs/h


Process:

Pulsed heating, upper and lower pressure head can be heating

simultaneously, fixed platform.

• LMP-0500S Film Laminating Machine Usage: applicable to laminate protective film on lens

Product Dimension: 1.5~5”

Accuracy:±0.01 mm

Capacity: 600Pcs/h (exclude loading and unloading time)


Process:

Put LENS on workbench manually, tear film using synchronous mood,

protective film absorbed on attached head, it will conduct x, y adjustment

via optical fiber, protective film will be laminated on LENS.

• LMP-1201S Film Laminating Machine Usage: applicable to laminate protective film on lens

Product Dimension: 5~12”

Accuracy:±0.15mm

Capacity: 600Pcs/h (exclude loading and unloading time)


Process:

Put LENS on workbench manually, protective film will be positioned

via ultrasonic optical fiber, protective film will be laminated on LENS

after machine conduct x, y, θ adjustment via optical fiber,.

• LAM-0700S Mouth-Type Glue Laminating Machine Usage: applicable to lamination between TP & mouth-type glue and

lamination between TP laminated with mouth-type glue & LCM.

Product Dimension: 1.5~7”

Accuracy:±0.1mm


12 / 16


Process:

1. Put TP on material stage and start vacuum suction manually,

tear film and clean it manually.

2. Put mouth-type glue & LCM on material stage and start vacuum

suction manually, tear film and clean it manually.

3. Visual system capture product MARK and display on monitor,

conduct X.,Y. Φ fine turning to adjust and position.

4. Press start button, the rotation mechanism will transfer and turn

TP to the above the position where the mouth-type glue & LCM

will be laminated

5. Place mouth-type glue & LCM on jacking mechanism and raise

them, then start laminate mouth-type glue with LCM

6. Release vacuum automatically, respective mechanism return

• LDX-0901S Double Station Engraving Machine Usage: applicable to precision machining for glass panel in LCD, TP industry

Working stroke (X,Y.Z): 310x420x80 (mm)

Motion accuracy: 0.01/300 mm repeating contraposition accuracy: 0.008 mm


Max traverse speed: 12m/min

Max processing speed: 9m/min

Spindle speed: 0~60000RPM

Feature:

Marble machine body, X.Y.Z triaxial adapt high precision THK linear

guide, high precision THK grinding ball screw, preload nut, precision

couplings, high precision & sensitivity on the knife; machine has

independent lubrication system, high speed and multi-axis motion

controller, internal cooling the spindle device, outer tool cooling

device, cooling system configuring high speed spindle, special cooling

device etc to prevent dust into it. The processing platform made of

hard aluminum alloy material, fully sealed water circulation system in

the control cabinet to ensure multi-stage filtration of water, open software

interface for easy use, wide range of applications.

• LDX-2211S Singly Station Engraving Machine(with CCD) Usage: applicable to precision machining for glass panel in OGS process

for LCD, TP industry, the machine can integrate motion control and

image recognition effectively with CCD image processing function to

achieve automatic positioning and automatic machining.

Working stroke (X,Y.Z): 470x420x80 (mm), CCD effective stroke is 350X420 (mm)

Motion accuracy: 0.01/300 mm repeating contraposition accuracy: 0.008 mm

CCD contraposition accuracy: ±0.005mm

CCD camera: 130 pixel CMOS camera, light source is a point light source

and the ring light, object distance is 70 mm


13 / 16


Feature:

The machine has all functions and features of LDX-0901S CNC double-stations

engraving machine, it can integrate motion control and image recognition

effectively with CCD image processing function to achieve automatic positioning

and automatic machining, this will help to increase stability and yield in OGS production process.

• LOCA -0501R Vacuum Laminating Machine (rigid to rigid lamination) Equipment profile

1．1 The device is a vacuum lamination machine suits for lamination between sensor glass & cover lens with OCA as media, and OCA laminated on sensor glass already.

1．2 The device is applicable for product size 2"～5", the vacuum

chamber size is 320*240mm. 1．3 Device precision: (1) Fixture(template) precision: ±0.02mm(relative position between

sensor glass & cover lens tank’s template) (2) Lamination precision: ±0.1mm(according to specified testing

standard, distance deviation between specified outer outline of glass & lens) 1．3 Device efficiency: device empty operation cycle≤25S/chamber(not including

loading and unloading time), 3 pieces of products at most once each chamber, set 3.5” product size as example. (1) If loading and unloading time exceed empty operation time, the efficiency

of each piece of product is: loading unloading time/products number each chamber

(2) If loading and unloading time less than empty operation time, the efficiency of each piece of product is: 25S/products number each chamber.

• S74 Laminating Machine (flex to rigid lamination) Equipment profile

1.1 Application area: soft film laminated on hard board, and soft film laminated on soft film(G+F/G+F+F process);

1.2 Corresponding raw material: Film, OCA and other soft film, Glass(LCD) and other hard board;

1.3 Function description: mainly used in large and mid-size CG(cover glass) lamination, also applicable to OCA+TP & SENSOR+ CG lamination, effective Stage size is 500×700mm.

Product Dimension: 32” or below

Accuracy:±0.1mm


• LOCA -1207S Vacuum Lamination machine(rigid to rigid lamination) Project Profile：

1.1 Application area：Suits for lamination between sensor glass laminated with

OCA already & cover lens(or TP & LCM) in TP industry.

1.2 Corresponding raw material: Sensor Glass，Cover Lens （or TP & LCM）,

OCA may laminated on the back of TP and LCM.

1.3 Function description: mainly used in lamination between sensor glass laminated

with OCA already & cover lens (or TP & LCM) , product size is 4”~12”(size shall

prevail with length*width specified in specification).

Accuracy:±0.1mm


14 / 16


We provide good tailor-made equipments service to our customers, customer’s equipment will be developed based on it’s

specific product requirements, manufacturing process etc, above only are our partial equipments specifications, more

equipments specifications will be provided upon customer’s inquiry.

Our equipments are used to manufacture TP (Touch Panel), LCD screen of Apple, Samsung, Amazon, Huawei, Lenovo etc

Automation production line & logistics line •

SMT group transmission line Parallel transfer machine

•

•

•

•

Intelligent logistics and distribution system LCM antistatic assembling line

FOG antistatic belt production line FFU clean desk and LCM assembly line

Double aging Display multilayer aging test

15 / 16


Non-standard customized automation equipment & fixture--partial

FPC hardening device PSI inspection machine High voltage tester

Thermoforming machine Hot melt machine 3 points soldering machine

LMP-6050A shading tape laminator Automatic bead filling machine Car antenna automatic punching M/C

Tensile testing machine XYZ adjustable contraposition fixture BL testing fixture

G for 4 Half module tester IC heavy machine Electrical test stand

16 / 16


Half module tester Triangular prism measurement fixture Module tester (lot 3)

LCD testing standard Cut gate fixture BMW test carrier

Module 50 FVT tester Gemini flash I/O FVT tester Manual test fixture Manual test fixture

Company Add: Unit 2508A,25F bank of America Tower 12 Harcourt Road Central Hong Kong

Factory Add: No. 68 Tongfucun Industrial Park, Dalang Street, Bao'an District, Shenzhen, PRC

Contact person: David Zhang

Position: Sales & Marketing Director

Mobile: +86 13613051580

E-mail: [email protected]

[email protected]

Skype: Davidzhanggy

Facebook: Davidzhanggy

Twitter: Davidzhanggy

Contact Information

future industrial equipments profile-partial

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