great company great people 이동통신기술연구소이동통신기술연구소 lg electronics...

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이동통신기술연구소

LG Electronics Inc.

휴대인터넷 단말 기술 및 개발 현황

2005. 4. 13.Jin-Sung Choi Ph.D

Head of Mobile Communication Technology Research Lab.

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Contents

1. WiBro 단말 개요2. WiBro 단말 Requirement 3. WiBro 단말 Architecture4. WiBro 단말 개발 현황

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1. WiBro 단말 개요

1) WiBro 서비스와 단말 types2) WiBro 서비스 및 단말기 발전 전망3) WiBro 표준화 현황

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WiBro 단말 개요

WiBro 서비스와 단말 Types 대략 4 개의 SVC Category 로 구분되며 Focus 하는 서비스 내용에 따라 Con

cept 차별화 및 다양한 형태의 단말기가 출현할 것으로 예상됨

Information

Entertainment

Communication

Commerce / Biz

Web Browsing File Downloading 원격 교육 / 의료

대용량 VOD, MOD, AOD 실시간 Streaming 방송 3D Network Game

Instant Messaging 서비스 Multimedia Messaging 서비스 화상 채팅 및 게시판

M-Commerce 텔레매틱스 물류 등 전문 서비스

SVC Category 단말 형태

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WiBro 단말 개요

WiBro 서비스 및 단말기 발전 전망

단말기

사업자 제공서비스

- Web Browsing 을 통한 자료검색 및 D/L

- E-mail

- 채팅 및 메신저 SVC

-

유선인터넷의 무선확장

- VOD/MOD- 실시간 방송- MMS- 위치기반 Push SVC- Network Game- 화상 Chatting- Mobile to Mobile SVC

EV-DO Data SVC 의 WiBro 망 이용

저렴 / 고품질 Multimedia SVC 제공

- Upgrade VOD/MOD- VoIP- 화상통화- 위치기반 확장 SVC- 텔레매틱스- 그룹웨어 연계- Commerce/Payment

Value added 차별화 SVC

도입기도입기 성장기성장기 성숙기성숙기

Modem 1 Chip 화

Notebook + WiBro(PCMCIA Type)

CDMA / WiBroDBDM Handset

PDA + WiBro Module

SmartPhone

`06 년 초 `07 년 ~ `09 년 ~

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WiBro 단말 개요

WiBro 표준화 현황

Phase I개정

2004.6 2004.10

정통부 WiBro 기술 권고안 발표(’04. 7 월 )

현재 TTA 휴대인터넷 표준은 사실상 IEEE802.16 의 Subset 임

TTATTA

Mobile WiMAX

(802.16e)

Mobile WiMAX

(802.16e)

Session 34

2004.11 2004.11.30 2004.12

TTATTA(HPi)

TTA (HPi)802.16d/e구 분

O-PUSC(M),O-FUSC(M),

AMC(M)

PUSC(M), FUSC(M)

Permutation

BWBW x 8/7Sampling Frequency

2 Symbols1 SymbolPreamble

2005.2Q

802.16d/e 802.16d/e

TTA구 분

PUSC 지원Permutation

BW x 8/7Sampling Frequency

1 SymbolPreamble

Phase I Phase II

2004.4Q ~ 2005. 4Q

• PHY Harmonization• MAC Harmonization

• 최대전송속도 (50Mbps)• AAS, MIMO 적용

• OFDMA/TDD• 1024FFT, BW : 10MHz

Issue 802.16e/D6

802.16e/D6Sponsor Ballot

IEEE 802.16ePublished

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2. WiBro 단말 Requirement

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WiBro 단말 Requirement 기본 Requirement

기존 유선 수준의 다양한 서비스를 제공하기 위해 기존의 이동통신단말에 비해 향상된 사양 필요

High Quality Display 고성능 CPU 대용량 Memory

단말 type 별 Requirement WiBro 서비스에 따라 단말의 Requirement 세분화

Information, Communication SVC Wide LCD, QWERTY KBD, Camera 등

Entertainment SVC Wide LCD, Game Pad, T-DMB 기능 등

Other Requirement 무게 , 확장 Memory, 외부 interface (CF, IrDA, Bluetooth, USB) 등

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3. WiBro 단말 Architecture

1) WiBro DBDM 단말 Architecture2) WiBro PDA 단말 Architecture3) WiBro Laptop (PCMCIA) Architecture

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WiBro 단말 기술

WiBro DBDM 단말 Architecture

EBI2

RFInterface

GPIO(UIM)

GPIO(I2C)

GPIO(USB)

GPIO(Others)

EBI2

GPIO(MMC)

GPIO(IrDA)

SDRAM

16Mx32bit

RF Module

GPIOEXPENSION

Module

GPIO(UART1)

USBTransceiver

NANDFLASH

MSM6550

Glue Logic

GPIO (WiBro)

GPIO(Camera)

RS232-CTransceiver

Key pad, Power management,

etc.

IrDASIR

MAC/BB RF

MIDI

3M Pixel

WiBRO Module

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WiBro 단말 기술

WiBro PDA 단말 Architecture

WiBRO Module

MAC/BB RF

T-DMB Module

/ WLAN 802.11b/g

Key Pad, Qwerty keyboard

Battery Module

SD Socket

IrDASIR

Intel Monahans @ 806MHz( Discrete )

AudioCodec

NOR Flash

128MB

SDRAM

64MB

3.5” VGA TFT LCD

NAND Flash

128MB

RS232-C

Transceiver

USB Transceiver

Headset

3M Pixel

(TBD)

Mic

Speaker

GPIO

GPIO(camera)

GPIO(UART)

GPIO(SD/MMC#2)

GPIO(LCD Controller)

GPIO(FFUART)

GPIO(USB)

GPIO(USB)

GPIO(AC97)

GPIO(SD/MMC)

GPIO

DFI

EMPI

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WiBro 단말 기술

WiBro Laptop (PCMCIA) Architecture

WiBRO PCMCIA Card

MAC/BB RF

68

PIN

C

on

necto

r

Laptop

Con

necto

r to

h

ost PCMCIA

Driver

CardServices

SocketServices

MemoryCard

DeviceDriver

MemoryTechnology

Driver

Flash File System

BIOS

Operating System

Application Software

68 PIN Socket

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4. WiBro 단말 Technical Issue

1) Chipset Size and Power consumption2) Device Driver Porting3) Interface between CDMA and WiBro chipset

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WiBro 단말 Technical Issue

Chipset Size and Power consumptionSoC Type : Feb `06

Reasonable Size : 16 x 16 mm2 Power Consumption (TBD) : about Max 700 mw All in one solution (RF + BB)

FPGA Type (Two Chip) : May `05 Reasonable Size (Area) : 25 x 25 mm(RF + BB) But Power Consumption : We won’t care of it at this chips

RF

BB

Filter

Filter

TC

XO

Amp

S/Wdip

lexer

This layout is just an example.

25mm

25m

m

16mm

16

mm

SoC

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How will WiBro Module “Device Driver Porting” to “Rex OS ” in the MSM Chipset (CDMA/WiBro DBDM)WiBro Module won’t depend on CDMA S/W Module

REX OS : Qualcomm’s CDMA S/W moduleBut can provide API and device driver for WiBro Module

Tx/Rx Buffer M

gmt

Device Driver Interface

Frame Processing

Lower MAC

RAM WiBro PHY SoC

Qualcomm SoftwareWiBro Module

CS

WiBro Module Driver

Host IO

REX

TCP/UDP

UI interface, sockets, …

WAP, WIPI, HTTP,FTP

Physical

Data Link

Network

Transport

Session

DHCP Client

Serial I/O API, …

RLP,PPP

Host IO

EAP-MD5, -TLS,-TTLS, -LEAP

Applications

Upper MAC

IPWiBro

Extension

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Interface between “CDMA MSM Chipset ” and “WiBro BaseBand chipset” (CDMA/WiBro DBDM)

i) The First Choice Memory BUS Interface (DPRAM)

ii) The Second Choice SDIO Interface flexible host bus interface (can be converted to SDIO using Glue L

ogic)

MSM 65xx Wibro Chip

Digital Core voltage

TBD

Peripheral Voltage

TBD

Analog voltage

TBD

MMC Interface

SD/SDIO1bit and 4 bit

interface

1.375V 5%

1.8 V 5%2.7 V 5%

2.5 ~ 2.7 V

Digital Core voltage

Peripheral Voltage

Analog voltage

In case of SDIO Interface - 1bit transfer mode (SD/SDIO) - 4bit transfer mode (SD/SDIO)

1.8 V 5%2.7 V 5%

I/F

Rex_OS OS ?

3.3 V

MSM65XX Chipset doesn’t support “Wait

signal”

MSM65XX Chipset doesn’t support “Wait

signal”

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Memory BUS Interface

We can use Dual Port RAM at this Interface

MSM

EBI2

EBI1

NAND(Flash)

SDRAM

MAC/BB

PHY/BB

RF

ADC

AFC

DAC

2.3G~2.4G

Wibro

Memory (?)

Interface between MSM and Wibro BB ChipSet

EBI2 - External Bus Interface 2

8bit or 16bit

interface

Core : 1.65V~1.95V Typ:1.8V I/O : 2.6V~2.8V Typ:2.7V

I hope to use the same I/O voltage in your Wibro chipset

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CF, PCI, SDIO interface

MSM

MAC/BB

PHY/BB

RF

ADC

AFC

DAC

2.3G~2.4G

EBI2

EBI1

SDRAM

NAND

We can also choice a CF or PCI Interface.

But in this case, we have to make a Glue Logic

for digital signal conversion.

We can also choice a CF or PCI Interface.

But in this case, we have to make a Glue Logic

for digital signal conversion.

CFGLUE

LOGIC

SD I/F

SDIO I/F

MSM chipset internally has a SDIO Interface.(MSM6500 -> 1bit, MSM6550 -> 4 bit)

therefore it will be one of the most simple connection between MSM and Wibro BB chipset.

MSM chipset internally has a SDIO Interface.(MSM6500 -> 1bit, MSM6550 -> 4 bit)

therefore it will be one of the most simple connection between MSM and Wibro BB chipset.

PCI

MEMORY

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5. WiBro 단말 개발 현황

1) Intel WiMAX Chip Roadmap2) WiBro 단말 개발 Schedule

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WiBro 단말 기술 Intel WiMAX Chip Roadmap: Nov 2004

PlanningDevelopment

20042004 20062006 2007200720052005

Exploration

Refe

ren

ce

Pla

tform

(s)

802.16-2004 MAC/PHY solution

Q1’05

802.16e MAC/PHY solution

2H’06

Silic

on

/Soft

ware

Silic

on

Refe

ren

ce

Pla

tform

(s)

802.16-2004WiMAX Modem

802.16e Express Card Reference Design

802.16-2004 PHY & MAC API

1H’07

802.16e Infrastructure Silicon & Reference Platform (2007)

Q2/Q3’05

Q3’05*

802.16e Handset Silicon & Reference Platform(2008)

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WiBro 단말 개발 현황

LGE PSS 개발 Schedule 현재 PDA, 핸드셋 단말 위주로 Chipset Solution 발굴 및 개발

진행 중이며 DBDM(CDMA+WiBro) Type 으로 `06 년 3Q 에 시장 출시 예정 (*PSS : Portable Subscriber Station)

2Q1Q

’06

4Q3Q4Q3Q2Q1Q4Q3Q

’05‘04

기술 확보 모듈 확보 CDMA/WiBro 상용 폰 개발

WiBro Test Module (FPGA Type)Performance Test & Parameter Optimization

WiBro Test Module (FPGA Type)Performance Test & Parameter Optimization

• WiBro Requirement Spec

• WiBro Test Module 개발• Phase : - Module Base Ⅰ 선행 개발 (’05.3Q)

(CDMA 폰 Interface 활용 정합 )

- 성능시험 최적화 (’05.4Q)

• Field Test• Phase : Ⅱ 상용 DBDM 단말 개발 - PDA Type(’06.2Q)

- DBDM Type(’06.3Q)

WiBro Network 상에서의 Business 기회 점검

WiBro 핵심 SVC 발굴WiBro 서비스 상에서 최적 UI 및단말기 Form Factor, Feature 개발

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LG Electronics Inc.

Great Company Great Great Company Great

PeoplePeople

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great company great people 이동통신기술연구소이동통신기술연구소 lg electronics...

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