harvatek corp. v. nichia corp. - complaint

8/13/2019 Harvatek Corp. v. Nichia Corp. - Complaint

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IN THE UNITED STATES DISTRICT COURT

FOR THE EASTERN DISTRICT OF TEXAS

TYLER DIVISION

HARVATEK CORPORATION,

Plaintiff,

v.

NICHIA CORPORATION AND NICHIA

AMERICAN CORPRATION,

Defendants.

Civil Action No. 6:13-cv-901

JURY TRIAL DEMANDED

ORIGINAL COMPLAINT FOR PATENT INFRINGEMENT

This is an action for patent infringement in which Harvatek Corporation (Harvatek or

Plaintiff) makes the following allegations against Nichia Corporation (Nichia Corp.) and

Nichia America Corporation (Nichia America) (collectively, Defendants):

PARTIES

1. Plaintiff Harvatek is a Taiwanese corporation, with its principal place of businesslocated at No.18, Lane 522, Sec.5, Chung Hwa Road, Hsinchu City 30094, Taiwan (R.O.C.).

2. Harvatek was founded in 1995 in Hsinchu, Taiwan. The company is principallyengaged in the research, development, design, and manufacturer of seminconductor chips and

light emitting diode (LED) packages. Harvateks products are used as luminous sources for

communication products, information technology products, household appliances, automobiles,

security products, among others.

3. On information and belief, Defendant Nichia Corp. is a corporation organizedunder the laws of Japan with its principal place of business at 491 Oka, Kaminaka-Cho, Anan-

Case 6:13-cv-00901 Document 1 Filed 11/22/13 Page 1 of 9 PageID #: 1


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Shi, TOKUSHIMA 774-8601, Japan. On information and belief, Nichia Corp. may be served

via office or director at the above address.

4. On information and belief, Nichia America is a subsidiary of Nichia Corp. and acorporation organized under the laws of the state of Michigan with its principle place of business

at 48561 Alpha Drive, Ste. 100, Wixom, MI 48393. Nichia America may be served via its

registered agent: Susumu Wako, 48561 Alpha Drive., Ste. 100, Wixom, MI 48393.

JURISDICATION AND VENUE

5. This action arises under the patent laws of the United States, Title 35 of theUnited States Code. This Court has subject matter jurisdiction pursuant to 28 U.S.C. 1331

and 1338(a).

6. Venue is proper in this district under 28 U.S.C. 1391(c) and 1400(b). Oninformation and belief, each Defendant has transacted business in this district, and has

committed and/or induced acts of patent infringement in this district.

7. On information and belief, each Defendant is subject to this Courts specific andgeneral personal jurisdiction pursuant to due process and/or the Texas Long Arm Statue, due at least to its substantial business in this forum, including: (i) at least a portion of the infringements

alleged herein; and (ii) regularly doing or soliciting business, engaging in other persistent courses

of conduct, and/or deriving substantial revenue from goods and services provided to individuals

in Texas and in this Judicial District. Furthermore, Nichia Corp has previously availed itself of

the jurisdiction of this Court by bringing suit in the Eastern District of Texas.



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COUNT I

INFRINGEMENT OF U.S. PATENT NO. 6,008,529

8. Plaintiff is the owner by assignment of United States Patent No. 6,008,529 (the529 Patent) titled Laser Diode Package. The 529 Patent issued on December 28, 1999. A

true and correct copy of the 529 Patent is attached as Exhibit A.

9. Upon information and belief, Defendants directly or through intermediaries havebeen and are now infringing the 529 Patent in the State of Texas, in this judicial district, and

elsewhere in the United States, by, making, using, providing, supplying, distributing, selling,

and/or offering for sale products and/or systems (including at least its model numbers

NCSU034B, NCSU033B, NSSU123, NSSU100D, and NSSU100C) that includes a package

comprising, a substrate on which a laser diode is mounted on, a first and second plated-through

conduit each having one end connected to a first and second bonding pad and another end

connected to a first and second circuit contact as covered by one or more claims of the 529

Patent. Defendants are directly infringing, literally infringing, and/or infringing the 529 Patent

under the doctrine of equivalents. Defendants are thus liable for infringement of the 529 Patent

pursuant to 35 U.S.C. 271.

10. On information and belief, to the extent any marking was required by 35 U.S.C. 287, all predecessors in interest to the 529 Patent complied with any such requirements.

11. As a result of Defendants infringement of the 529 Patent, Plaintiff has sufferedmonetary damages and is entitled to a money judgment in an amount adequate to compensate forDefendants infringement, but in no event less than a reasonable royalty for the use made of theinvention by Defendants, together with interest and costs as fixed by the court, and Plaintiff willcontinue to suffer damages in the future unless Defendants infringing activities are enjoined bythis Court.



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12. Unless a permanent injunction is issued enjoining Defendants and their agents, servants, employees, representatives, affiliates, and all others acting on in active concerttherewith from infringing the 529 Patent, Plaintiff will be greatly and irreparably harmed.

COUNT II


13. Plaintiff is the owner by assignment of United States Patent No. 6,300,674 (the674 Patent) titled Flat Package for Semiconductor Diodes. The 674 Patent issued on

October 9, 2001. A true and correct copy of the 674 Patent is attached as Exhibit B.



and/or offering for sale products and/or systems (including at least its model numbers NSSM032,

NSSM227A, NSSW064A, NSSB064, NSSR064, NESW064A, NESL064A, NESB064,

NESG064, NESA064, NHSW064, NHSL064, NHSB064, NHSG064, NSSW063A,

NHSW046A, NHSB046A, NHSW046, NHSL046, NHSB046, NHSG046, NHSA046, and

NHSW046H) that includes a flat package comprising, a semiconductor diode with a top and

bottom surface and two electrodes, two contact pads for electrically connecting with the package,

and a protective glue covering the diode and contact pads as covered by one or more claims of

the 674 Patent. Defendants are directly infringing, literally infringing, and/or infringing the 674

Patent under the doctrine of equivalents. Defendants are thus liable for infringement of the 674

Patent pursuant to 35 U.S.C. 271.




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17. Unless a permanent injunction is issued enjoining Defendants and their agents, servants, employees, representatives, affiliates, and all others acting on in active concert

therewith from infringing the 674 Patent, Plaintiff will be greatly and irreparably harmed.

COUNT III


18. Plaintiff is the owner by assignment of United States Patent No. 6,841,934 (the934 Patent) titled White Light Source from Light Emitting Diode. The 934 Patent issued on

January 11, 2005. A true and correct copy of the 934 Patent is attached as Exhibit C.




NFSW157A, NFSW157A-H3, NS2W157AR, NS2W157AR-H3, NSSW157A, NSSW157-H3,

NESW157B, NHSW157B, NSSW757A-V1, NS2W757A-V1, NF2W757AR-V1, NVSW119B,

NVSW219B, NJSW172, NFSW172, NSSW064A, NESW064A, NHSW064, NSSW063A,

NHSW046A, NHSW046, NHSW046H, NSSW088A, NSSW129, NNSW208C, NSSW206C,

NSSW204C, NS2W157BR, NSSW157B, NESW157B, NF2W557BR, and NS2W557BR) that

include a light emitting diode, having a light emitting diode chip, a bottom electrode, a second



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electrode, emitting a short wavelength color light, a split metal substrate with a first and second

metal sections, connected to the first and second electrodes, a fluorescent glue covering the LED

chip converting the short wavelength color light into white light, and terminals for said LED

formed by the outer ends of the first and second metal section, not covered by said fluorescent

glue as covered by one or more claims of the 934 Patent. Defendants are directly infringing,

literally infringing, and/or infringing the 934 Patent under the doctrine of equivalents.

Defendants are thus liable for infringement of the 934 Patent pursuant to 35 U.S.C. 271.




COUNT IV

INFRINGEMENT OF U.S. PATENT NO. D659,655

23. Plaintiff is the owner by assignment of United States Patent No. D659,655 (the655 Patent) titled Led Package Base. The 655 Patent issued on May 15, 2012. A true and

correct copy of the 655 Patent is attached as Exhibit B.



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NNSW208C, NNSW206C, and NNSW204C) which embody the design covered by the 655

Patent.

25. Defendants products including at least its model numbers NNSW208C,NNSW206C, and NNSW204C) infringe the 655 Patent because they include substantially the

same design elements as claimed and shown in at least Figures 1-3, and 6-8 of the 655 Patent.

The Accused Products include substantially the same packaging elements as shown and claimed

in the 655 Patent






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PRAYER FOR RELIEF

WHEREFORE, Plaintiff respectfully requests that this Court enter:

1. A judgment in favor of Plaintiff that Defendants have infringed the 674, 934,and 655 Patents;

2. A permanent injunction enjoining Defendants and their officers, directors, agentsservants, affiliates, employees, divisions, branches, subsidiaries, parents, and all others acting in active concert therewith from infringement, inducing the infringement of, or contributing to the infringement of the 674, 934, and 655 Patents, or such other equitable relief the Court

determines is warranted;

3. A judgment and order requiring Defendants pay to Plaintiff its damages, costs,expenses, and prejudgment and post-judgment interest for Defendants infringement of the 674,

934, and 655 Patents as provided under 35 U.S.C. 284, and an accounting of ongoing post-

judgmentinfringement; and4. Any and all other relief, at law or equity, to which Plaintiff may show itself to be

entitled.

DEMAND FOR JURY TRIAL

Plaintiff, under Rule 38 of the Federal Rules of Civil Procedure, requests a trial by jury ofany issues so triable by right.



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DATED November 22, 2013 Respectfully submitted,

By: \s\Hao Ni

Hao NiTexas Bar No. 24047205

[email protected]

Timothy T. WangTexas Bar No. 24067927

[email protected]

Neal G. MassandTexas Bar No. 24039038

[email protected]

Stevenson Moore V

Texas Bar No. 24076573

[email protected]

Ni, Wang & Associates, PLLC

8140 Walnut Hill Ln., Ste. 310

Dallas, TX 75231

Tel: (972) 331-4600Fax: (972) 314-0900

ATTORNEYS FOR PLAINTIFF

HARVATEK CORPORATION



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Exhibit A

Case 6:13-cv-00901 Document 1-1 Filed 11/22/13 Page 1 of 12 PageID #: 10


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US006008529AUlllted States Patent [ 1 9 ] [ 1 1 ] P a t e n t N u m b e r : 6 , 0 0 8 , 5 2 9Wu [ 4 5 ] Date o f P a t e n t : D e c . 2 8 , 1 9 9 9[ 5 4 ] LASER DIODE PACKAGE A t t o r n e y , A g e n t , o r FirmH. C . L i n , P a t e n t A g e n t[ 7 5 ] I n v e n t o r : J a h n - C h a n g Wu, H s i n - C h u , T a i w a n [ 5 7 ] ABSTRACT[ 7 3 ] A s s i g n e e : B i l y Wang, H s i n - C h u , T a i w a n A u r f a c e mount s e m i c o n d u c t o r l a s e r d i o d e p a c k a g e h a s a

s u b s t r a t e on which t h e l a s e r d i o d e i s mounted. The t o p[ 2 1 ] A p p l - N O - I 0 9 / 1 0 4 , 7 6 2 e l e c t r o d e o f t h e l a s e r d i o d e i s w i r e - b o n d e d t o t h e t o p e n d o f[ 2 2 ] F i l e d . Jun 2 5 1 9 9 8 a p l a t e d - t h r o u g h c o n d u i t t h r o u g h t h e s u b s t r a t e , a n d t h e

. . ,6 bottom end o f t h e p l a t e d - t h r o u g h c o n d u i t i s connected t o a[ 5 1 ] I n t . C l . . . . . . . . . . . . . . . . . . . . . . . . . . . H01L 3 / 4 9 5 ; H01L 3/02 C i r c u i t C o n t a c t p l a t e d a t t h e bottom S u r f a c e o f t h e s u b s t r a t e[ 5 2 ] US . C l . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 7 / 6 7 6 ; 2 5 7 / 6 7 8 ; The bottom e l e c t r o d e Ofthe l a s e r d i o d e i s ? i p _ c h i p mounted[ 5 8 ] F i e l d o f S e a r c h 2 5 7 / 6 7 6 , 6 7 8 , t o g h e f t o ? e n d o f g n o l t h e i i p l g t e d - t ? r o u g g f o r i d u l t a n d b g t t o m2 5 7 / 6 9 8 , 6 7 0 , 9 9 , 7 8 7 , 1 0 0 , 7 7 8 e n 0 t e s e c o n p a t e - t r o u g c o n u 1 t ~ 1 s c o n n e c t e t o asecond c i r c u i t c o n t a c t . Each l a s e r diode i s covered With a[ 5 6 ] References Cited t r a n s p a r e n t l i d o r a l i d with a l e n s . For mass p r o d u c t i o n , a

US PATENT DOCUMENTS l a r g e n u m b e r o f t h e l a s e r d i o d e s a r r a n g e d i n a m a t r i xforma tion are mounted on a common u b s t r a t e . W a l l s are5 , 2 2 0 , 1 9 5 6/1993 McShane e t a l . . . . . . . . . . . . . . . . . . . . . . . . 257/666 erected around each l a s e r d i o d e A r a n s p a r e n t Cover i s5,629,952 5/1997 Barthol omew e t a l . 257/678 _5 7 6 8 9 7 0 9 1 1 1 / 1 9 9 7 H a m z e h d o o s t e t a L 2 5 7 / 7 0 0 p l a c e d o v e r t h e w a l l s . A l l t h e p l a t e d - t h r o u g h c o n d u i t s a t t h e5 , 7 6 7 , 5 2 8 6/1998 S u n i e t a 1 , , , , , , , , , , , , , , 257/778 edges of t h e l a s e r diodes i n a s a m e c o l u m n a r e aligned and5 , 7 7 3 , 8 7 9 6 / 1 9 98 F u s a y a s u e t a l . 2 5 7 / 6 7 8 sawed t h r o u g h t o g e t h e n

P r i m a r y ExaminerMahshid S a a d a tA s s i s t a n t ExaminerJhihan B l a r k 1 5 C l a i m s , 8 Drawing S h e e t s

5 3 236P l

Il-_ _ _ _ _l

38F

30W 303 6

3 8I I /

32 __8F36F-



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U.S. Patent D e c . 2 8 , 1 9 9 9 S h e e t 1 o f 8 6,008,529F i g . 1 A .

F i g . 1 B .

16P

______-J18F



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U.S. Patent D e c . 2 8 , 1 9 9 9 S h e e t 2 o f 8 6,008,529

F i g . 2 A .



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F i g . 2 B .

2 626P

2 828P



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U.S. Patent D e c . 2 8 , 1 9 9 9 S h e e t 4 o f 8 6,008,529F i g . 2 C .

F i g . 2 D .282 28

C 3 6 6 G 6



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36P



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F i g . 3 C .

30W 3936

38

32 __8F

36B 38B



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48F



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6 , 0 0 8 , 5 2 91

LASER DIODE PACKAGEBACKGROUND OF THE INVENTION

T h i s i n v e n t i o n i s r e l a t e d t o a s e m i c o n d u c t o r p a c k a g e , i np a r t i c u l a r t o a s u r f a c e mount package f o r a l a s e r d i o d e .

Conventional l a s e r d i o d e package has a an m e t a l l i c e X t er i o r a n d t h e t e r m i n a l s a r e p r o t r u d e d o u t s i d e t h e p a c k a g e . Thep a c k a g e o c c u p i e s a l a r g e v o l u m e , W h i c h i s u n d e s i r a b l e .

SUMMARYAn b j e c t o f t h i s i n v e n t i o n i s t o m i n i a t u r i Z e a s u r f a c emount a s e r d i o d e p a c k a g e . A n o t h e r o b j e c t o f t h i s i n v e n t i o ni s t o p r o v i d e a l a s e r d i o d e package s u i t a b l e f o r mass p r o

d u c t i o n .T h e s e o b j e c t s a r e a c h i e v e d b y p r o v i d i n g t W o p l a t e d

t h r o u g h c o n d u i t s t h r o u g h a s u b s t r a t e on Which t h e l a s e rd i o d e i s m o u n t e d . One p l a t e d - t h r o u g h c o n d u i t h a s i t s t o p e n de X t e n d e d t o a b o n d i n g pad t o Which t h e t o p e l e c t r o d e o f t h el a s e r d i o d e i s W i r e - b o n d e d , a n d i t s bottom end c o n n e c t e d t oa c i r c u i t c o n t a c t a t t h e bottom o f t h e s u b s t r a t e . Anotherp l a t e d - t h r o u g h c o n d u i t h a s i t s t o p e n d e X t e n d e d t o a n o t h e rb o n d i n g p a d t o Which t h e b o t t o m e l e c t r o d e o f t h e l a s e r d i o d ei s ? i p - c h i p b o n d e d , a n d i t s b o t t o m e n d c o n n e c t e d t o a n o t h e rc i r c u i t c o n t a c t a t t h e bottom o f t h e s u b s t r a t e . Each l a s e rd i o d e i s e n c l o s e d W i t h f o u r W a l l s and c o v e r e d W i t h at r a n s p a r e n t l i d o r a l i d With a l e n s .

I n mass p r o d u c t i o n , a common u b s t r a t e i s used t o mounta m a t r i X o f l a s e r d i o d e s W i t h t h e p l a t e d - t h r o u g h c o n d u i t sa l i g n e d . Walls a r e ? r s t e r e c t e d and t h e n covered W i t h at r a n s p a r e n t l i d . The s t r u c t u r e i s s a W e d t h r o u g h t h e p l a t e dt h r o u g h c o n d ui t s a l o n g t h e same column a n d t h e n saWedroW by roW t o y i e l d i n d i v i d u a l d i c e .

BRIEF DESCRIPTION OF THE INVENTIONF I G . 1A hoWs t h e c r o s s - s e c t i o n a l vieW o f t h e l a s e r d i o d e

p a c k a g e b a s e d o n t h e p r e s e n t i n v e n t i o n .F I G . 1 B shoWs t h e t o p vieW o f t h e p a c k a g e r e l a t i v e t o t h e

placement o f t h e l a s e r d i o d e and t h e t e r m i n a l s o n a s u b s t r a t e .FIG. 2A hoWs a mass p r o d u c t i o n arrangement o f a m a t r i X

o f t h e l a s e r d i o d e p a c k a g e s .F I G . 2B shoWs t h e t o p vieW o f t h e mass p r o d u c e d l a s e rd i o d e p a c k a g e s .FIG. 2C hoWs a t r a n s p a r e n t cover f o r t h e mass producedl a s e r d i o d e p a c k a g e m a t r i X .F I G . 2 D shoWs t h e c o v e r f o r t h e l a s e r d i o d e m a t r i X W i t h

t r a n s p a r e n t l e n s e s .F I G . 3A hoWs t h e t o p vieW o f t h e l a s e r d i o d e m a t r i X W i t hh e a t i n g d i s s i p a t i n g m e t a l l a y e r .F I G . 3 B shoWs a n e n l a r g e d t o p vieW o f a l a s e r d i o d e

p a c k a g e shoWn i n F I G . 3 A .F I G . 3 C shoWs a c r o s s - s e c t i o n a l vieW o f t h e l a s e r d i o d e

p a c k a g e shoWn i n F I G . 3 B .F I G . 4A hoWs t h e t o p vieW o f t h e l a s e r d i o d e m a t r i X

h a v i n g t h e h e a t i n g d i s s i p a t i n g m e t a l s e r v i n g a s a n e l e c t r o d e .F I G . 4B shoWs t h e e n l a r g e d t o p vieW o f t h e l a s e r d i o d e

m a t r i X shoWn i n F I G . 4A.F I G . 4 C shoWs t h e c r o s s - s e c t i o n a l vieW o f t h e l a s e r d i o d e

p a c k a g e shoWn i n F I G . 4 B .DETAILED DESCRIPTION OF THEPREFERRED EMBODIMENT

1 5

25

35

45

55

2b o n d i n g pad on t o p o f t h e s u b s t r a t e 1 2 . The a s e c o n d bottome l e c t r o d e E2 i s ? i p - c h i p bonded t o a n o t h e r c o n d u c t i n gbonding pad on t h e s u b s t r a t e 1 2 . The s i d e W a l l 1 5 a n d at r a n s p a r e n t c o v e r 28 e n c l o s e s t h e l a s e r d i o d e 10 o c o n s t i t u t ea s i n g l e l a s e r d i o d e u n i t .

F I G . 1 B shoWs t h e s u r f a c e o f t h e s u b s t r a t e 1 2 f o r t h es t r u c t u r e shoWn i n F I G . 1 A . The s u b s t r a t e 12 h a s a bondingp a d 1 6 p r i n t e d o n t o p o f t h e s u b s t r a t e 1 2 . T h e b o n d i n g p a d1 6 i s W i r e bonded t o t h e t o p e l e c t r o d e E1 and f e d t h r o u g h ap l a t e d - t h r o u g h c o n d u i t 16P o a c i r c u i t c o n t a c t a t t h e bottomo f t h e s u b s t r a t e 12 s e r v i n g a s a ? r s t o u t p u t t e r m i n a l . Theb o t t o m e l e c t r o d e E2 o f t h e l a s e r d i o d e i s ? i p - c h i p bonded oa n o t h e r b o n d i n g p a d 1 8 Which i s a l s o c o n n e c t e d t o t h eb o t t o m o f t h e s u b s t r a t e 1 2 t h r o u g h a n o t h e r p l a t e d - t h r o u g hh o l e 18P t o a n o t h e r c i r c u i t c o n t a c t a t t h e bottom o f t h es u b s t r a t e 1 2 , s e r v i n g a s t h e s e c o n d o u t p u t t e r m i n a l o f t h el a s e r d i o d e .

F I G . 2A hoWs a l a y o u t f o r mass p r o d u c t i o n o f t h e l a s e rd i o d e s o f t h e p r e s e n t i n v e n t i o n . A o m m o n s u b s t r a t e 22 i s? r s t e r e c t e d W i t h s i d e W a l l s 25 t o s e p a r a t e a m a t r i X o f l a s e rd i o d e s 2 0 . Each l a s e r d i o d e i s g l u e d t o t h e s u b s t r a t e W i t hc o n d u c t i v e epoXy f o r ? i p - c h i p bonding t o a c o m m o n s u bs t r a t e 2 2 . The ? r s t e l e c t r o d e E1 s W i r e bonded by W i r e 26Wf o r c o n n e c t i o n t o t h e bottom c o n t a c t o f t h e s u b s t r a t e 2 2 .F i n a l l y , a t r a n s p a r e n t cover i s used t o cover over t h e e n t i r es u b s t r a t e , by g l u i n g o v e r t h e s i d e W a l l s 2 5 t o p r o t e c t t h ed e v i c e from d u s t a s shoWn i n F I G . 2C. The s t r u c t u r e i s t h e nd i c e d a l o n g t h e b a n d s X 1 , X 2 , Y 1 , Y2 t o y i e l d a l a r g enumber o f l a s e r d i o d e s .

F I G . 28 shoWs t h e t o p vieW o f t h e s u b s t r a t e 22 i n massp r o d u c t i o n . The s u b s t r a t e 2 2 h a s a l a r g e number o f b o n d i n gp a d s 26 f o r t h e ? r s t e l e c t r o d e s E 1 , Which a r e c o n n e c t e d t ot h e b o t t o m c o n t a c t s t h r o u g h t h e p l a t e d - t h r o u g h c o n d u i t 26Ps e r v i n g a s t h e o u t p u t t e r m i n a l s f o r t h e ? r s t e l e c t r o d e s o f t h el a s e r d i o d e s . The t o p o f t h e s u b s t r a t e 2 2 a l s o h a s s e c o n db o n d i n g p a d s 2 8 , e a c h ? i p - c h i p b o n d e d t o t h e s e c o n de l e c t r o d e E2 o f t h e l a s e r d i o d e a n d f e d t h r o u g h t h e p l a t e dt h r o u g h c o n d u i t 28P o t h e b o t t o m o f t h e s u b s t r a t e 2 2 . Thep l a t e d - t h r o u g h c o n d u i t s W i t h i n e a c h package a s W e l l a s a l lt h e p a c k a g e s a l o n g a same column a r e a l i g n e d f o r t h ec o n v e n i e n c e o f s a W i n g .

FIG. 2C s h oW s a t r a n s p a r e n t cover 28 f o r t h e ma s sproduced l a s e r d i o d e p a c k a g e s . T h i s c o v e r r e s t s on t o p o f t h el a s e r d i o d e p a c k a g e s . A f t e r d i c i n g , t h e c o v e r i s s e p a r a t e di n t o i n d i v i d u a l c o v e r s f o r t h e l a s e r d i o d e p a c k a g e .

FIG. 2D shoWs a t r a n s p a r e n t c o v e r 28 With l e n s e s 2 8 2 .T h e s e l e n s e s s e r v e t o f o c u s t h e l i g h t r a d i a t i n g f r o m t h e l a s e rd i o d e . C o n v e r s e l y , t h e l e n s e s c a n b e d e f o c u s i n g l e n s e s t op r o d u c e d i v e r g e n t l i g h t r a y s .FIG. 3A h oW s a t o p vieW of a common u b s t r a t e Withm e t a l l i c c o a t i n g f o r h e a t s i n k i n g . The s u b s t r a t e 3 2 c o n t a i n sa l a r g e number o f b o n d i n g p a d s f o r a m a t r i X o f l a s e r d i o d e s .The t o p o f t h e s u b s t r a t e 3 2 h a s b o n d i n g p a d s 3 6 f o rc o n n e c t i o n t o t h e ? r s t e l e c t r o d e s o f t h e l a s e r d i o d e s E1Which a r e f e d t h r o u g h p l a t e d - t h r o u g h c o n d u i t s 36P t o b o ttom c o n t a c t s o f t h e s u b s t r a t e , s e r v i n g a s e X t e n d e d i n p u tt e r m i n a l s t o E 1 . The t o p o f t h e s u b s t r a t e 32 a l s o h a s b o n d i n gp a d s 38 f o r c o n n e c t i o n t o t h e s e c o n d e l e c t r o d e s o f t h e l a s e rd i o d e s E2 Which a r e f e d t h r o u g h p l a t e d - t h r o u g h c o n d u i t s38P o o t h e r bottom c o n t a c t s o f t h e s u b s t r a t e 3 2 , s e r v i n g a se X t e n d e d i n p u t t e r m i n a l s t o E 2 . T h i s embodiment s d i f f e r e n tf r o m F I G . 2B n t h a t t h e b o n d i n g p a d 3 8 h a s r e l a t i v e l y l a r g ea r e a f o r d i s s i p a t i n g h e a t .

FIG. 3 B shoWs a n e n l a r g e d vieW o f one u n i t l a s e r d i o d ep a c k a g e shoWn i n F I G . 3 B . The t o p o f t h e s u b s t r a t e 3 2 h a s



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6 , 0 0 8 , 5 2 93

s u b s t r a t e 3 2 a l s o h a s a b o n d i n g p a d 3 8 e a c h ? i p - c h i p b o n d e dt o t h e bottom E2 o f t h e l a s e r d i o d e and e x t e n d e d t o a n o t h e rb o t t o m c o n t a c t o f t h e s u b s t r a t e 3 2 t h r o u g h p l a t e d - t h r o u g hc o n d u i t 38P s e r v i n g a s a second e x t e n d e d i n p u t t e r m i n a l t oE 2 . The b o n d i n g p a d 3 8 h a s a r e l a t i v e l y l a r g e a r e a t o b e t t e rh e a t s i n k i n g .F I G . 3 C s a c r o s s - s e c t i o n a l vieW o f F I G . 3 B . T h i s ? g u r eshoWs h o W t h e ? r s t b o n d i n g p a d 3 6 i s e x t e n d e d t o t h eb o t t o m s i d e o f t h e s u b s t r a t e 3 2 t h r o u g h t h e p l a t e d - t h r o u g hc o n d u i t 36F t o become c i r c u i t c o n t a c t 3 6 B . S i m i l a r l y , t h es e c o n d b o n d i n g p a d 3 8 i s e x t e n d e d t o t h e b o t t o m o f t h es u b s t r a t e 3 2 t h r o u g h t h e p l a t e d t h r o u g h c o n d u i t 38P t obecome c i r c u i t c o n t a c t 38B.

F I G . 4A hoWs t h e h e a t d i s s i p a t i n g m e t a l on t h e s u b s t r a t es e r v i n g a s a n b o n d i n g p a d . The s u b s t r a t e 4 2 i s p l a t e d W i t h al a r g e number o f b o n d i n g p a d s f o r a m a t r i x o f l a s e r d i o d e s 4 0 .The b o n d i n g p a d s 4 6 a r e f o r t h e ? r s t e l e c t r o d e s E 1 , Whichi s c o n n e c t e d t o t h e o t h e r s i d e o f t h e s u b s t r a t e 4 2 t h r o u g h t h ep l a t e d - t h r o u g h c o n d u i t s 4 6 P , s e r v i n g a s t h e ? r s t e x t e n d e di n p u t t e r m i n a l . T h e s u b s t r a t e 4 2 a l s o h a s b o n d i n g p a d s 4 8 f o rt h e second e l e c t r o d e s E 2 , Which a r e c o n n e c t e d t o t h e o t h e rs i d e o f t h e s u b s t r a t e 4 2 t h r o u g h t h e p l a t e d - t h r o u g h h o l e s4 8 P , s e r v i n g a s t h e s e c o n d e x t e n d e d i n p u t t e r m i n a l s . Thed i f f e r e n c e o f t h i s embodiment a n d t h a t i n F I G . 3A s t h a te a c h p l a t e d - t h r o u g h h o l e 48P i e s u n d e r n e a t h t h e l a s e r d i o d e4 0 .

F I G . 4B shoWs a n e n l a r g e d vieW o f a u n i t l a s e r d i o d ep a c k a g e shoWn i n F I G . 4 A . The s u b s t r a t e 4 2 h a s a b o n d i n gpad 4 6 Which i s c o n n e c t e d t o t h e E1 e l e c t r o d e o f t h e l a s e rd i o d e 40 on t h e t o p s i d e o f t h e s u b s t r a t e 42 a n d e x t e n d e dt h r o u g h a p l a t e d - t h r o u g h c o n d u i t 46F o t h e b o t t o m s i d e o ft h e s u b s t r a t e s e r v i n g a s t h e ? r s t e x t e n d e d i n p u t t e r m i n a l . Thes u b s t r a t e 4 2 a l s o h a s b o n d i n g p a d 4 8 c o n n e c t e d t o t h e E2e l e c t r o d e o f t h e l a s e r d i o d e 40 on h e t o p s i d e o f t h e s u b s t r a t e4 2 a n d e x t e n d e d t h r o u g h a p l a t e d - t h r o u g h h o l e 48F t o t h ebottom s i d e o f t h e s u b s t r a t e s e r v i n g a s t h e s e c o n d e x t e n d e di n p u t t e r m i n a l . T h e b o n d i n g p a d 4 8 i s p l a c e d u n d e r n e a t h t h el a s e r d i o d e 4 0 .

F I G . 4 C shoWs t h e c r o s s - s e c t i o n a l vieW o f t h e s t r u c t u r eshoWn i n F I G . 4 B . The ? r s t b o n d i n g p a d 4 6 i s e x t e n d e dt h r o u g h a p l a t e d - t h r o u g h c o n d u i t 46F o t h e o t h e r s i d e o f t h es u b s t r a t e 42 t o form c i r c u i t c o n t a c t 46B. The second bondi n g p a d 4 8 i s f e d t h r o u g h a p l a t e d - t h r o u g h h o l e 48F t o t h eo t h e r s i d e o f t h e s u b s t r a t e 42 t o form a c i r c u i t c o n t a c t 48 B .

W h i l e t h e p r e f e r r e d embodiments o f t h e i n v e n t i o n h a v ebeen shoWn a r e d e s c r i b e d , i t W i l l b e a p p a r e n t t o t h o s e s k i l l e di n t h e a r t t h a t v a r i o u s modi?cation m a y b e made i n t h ee m b o d i m e n t s W i t h o u t d e p a r t i n g f r o m t h e s p i r i t o f t h e p r e s e n ti n v e n t i o n . Such modi?cations a r e a l l W i t h i n t h e s c o p e o f t h i si n v e n t i o n .What i s c l a i m e d i s :

1 . A u r f a c e mount package f o r a s e m i c o n d u c t o r l a s e rd i o d e h a v i n g a ? r s t e l e c t r o d e on h e t o p s u r f a c e o f s a i d d i o d eand a second e l e c t r o d e a t t h e bottom s u r f a c e o f s a i d d i o d e ,c o m p r i s i n g

a s u b s t r a t e on Which s a i d l a s e r diode s mounted o n a t o ps u r f a c e o f s a i d s u b s t r a t e ;

a ? r s t p l a t e d - t h r o u g h c o n d u i t h a v i n g a ? r s t end c o n n e c t e dt o a ? r s t b o n d i n g p a d f o r b o n d i n g t o s a i d ? r s t e l e c t r o d e ,and a second end connected t o a ? r s t c i r c u i t c o n t a c t a tt h e b o t t o m s u r f a c e o f s a i d s u b s t r a t e ; a n d

a second p l a t e d - t h r o u g h c o n d u i t having one end conn e c t e d t o a s e c o n d b o n d i n g p a d f o r b o n d i n g t o s a i dsecond e l e c t r o d e , and a second end connected t o asecond c i r c u i t c o n t a c t a t t h e bottom s u r f a c e o f s a i ds u b s t r a t e .

10

1 5

25

45

55

43 . A u r f a c e mount p a c k a g e a s d e s c r i b e d i n c l a i m 1 ,

W h e r e i n s a i d s e c o n d b o n d i n g p a d i s ? i p - c h i p b o n d e d t o s a i ds e c o n d e l e c t r o d e .

4 . A u r f a c e mount p a c k a g e a s d e s c r i b e d i n c l a i m 1 ,W h e r e i n s a i d ? r s t b o n d i n g p a d a n d s a i d s e c o n d b o n d i n g p a da r e p l a t e d ? a t a t t h e t o p s u r f a c e o f s a i d s u b s t r a t e .5 . A u r f a c e mount package a s d e s c r i b e d i n c l a i m 1 ,W h e r e i n s a i d s e c o n d b o n d i n g p a d h a s a l a r g e enough a r e a t oserve as a heat s i n k .

6 . A u r f a c e mount p a c k a g e f o r l a s e r d i o d e h a v i n g a ? r s te l e c t r o d e o n t h p t o p s u r f a c e o f s a i d d i o d e and a seconde l e c t r o d e a t t h e b o t t o m s u r f a c e o f s a i d d i o d e , c o m p r i s i n g ,

a s u b s t r a t e o n Which s a i d l a s e r diode i s mounted o n t h et o p s u r f a c e o f s a i d s u b s t r a t e ;

a ? r s t p l a t e d - t h r o u g h c o n d u i t h a v i n g a ? r s t end c o n n e c t e dt o a ? r s t b o n d i n g p a d f o r b o n d i n g t o s a i d ? r s t e l e c t r o d e ,and a second end connected t o a ? r s t c i r c u i t c o n t a c t a tt h e b o t t o m o f s a i d s u b s t r a t e ;

s e c o n d p l a t e d - t h r o u g h c o n d u i t h a v i n g o n e e n d c o n n e c t e dt o a second c i r c u i t c o n t a c t a t t h e b ot t om s u r f a c e o f s a i ds u b s t r a t e ;

f o u r W a l l s e r e c t e d t o e n c l o s e s a i d l a s e r d i o d e ; a n da t r a n s p a r e n t cover r e s t i n g o n s a i d W a l l s .7 . A u r f a c e mount package a s d e s c r i b e d i n c l a i m 6 ,

Wherein s a i d cover i s mounted With a l e n s .8 . A u r f a c e mount package a s d e s c r i b e d i n c l a i m 7 ,

W h e r e i n s a i d l e n s i s a f o c u s i n g l e n s .9 . A u r f a c e mount package a s d e s c r i b e d i n c l a i m 7 ,

W h e r e i n s a i d l e n s i s a d i v e r g e n t l e n s .1 0 . Asurface mount p a c k a g e f o r l a s e r d i o d e h a v i n g a ? r s t

e l e c t r o d e o n t h e t o p s u r f a c e o f s a i d d i o d e and a seconde l e c t r o d e a t t h e b o t t o m s u r f a c e o f s a i d d i o d e , c o m p r i s i n g :a s u b s t r a t e o n Which s a i d l a s e r diode i s mounted o n t h e

t o p o f s a i d s u b s t r a t e ;? r s t p l a t e d - t h r o u g h c o n d u i t h a v i n g a ? r s t e n d c o n n e c t e d

t o a ? r s t b o n d i n g p a d f o r b o n d i n g t o s a i d ? r s t e l e c t r o d e ,and a second end connected t o a ? r s t c i r c u i t c o n t a c t a tt h e b o t t o m o f s a i d s u b s t r a t e ;

a second p l a t e d - t h r o u g h c o n d u i t having one end conn e c t e d t o a s e c o n d b o n d i n g p a d f o r b o n d i n g t o s a i dsecond e l e c t r o d e , and a second end connected t o asecond c i r c u i t c o n t a c t a t t h e bottom s u r f a c e o f s a i ds u b s t r a t e ;

Wherein a t l e a s t one o f s a i d ? r s t c o n d u i t and s a i d secondc o n d u i t a r e s e m i c i r c u l a r g r o o v e s a l o n g t h e s i d e o f s a i ds u b s t r a t e .

1 1 . A u r f a c e mount p a c k a g e a s d e s c r i b e d i n c l a i m 1 0 ,W h e r e i n s a i d ? r s t c o n d u i t i s a g r o o v e a l o n g t h e s i d e o f s a i ds u b s t r a t e , a n d s a i d s e c o n d c o n d u i t i s a v i a h o l e b e n e a t h s a i dl a s e r d i o d e .

1 2 . A u r f a c e mount p a c k a g e a s d e s c r i b e d i n c l a i m 1 0 ,W h e r e i n s a i d ? r s t b o n d i n g p a d i s W i r e - b o n d e d t o s a i d ? r s te l e c t r o d e .

1 3 . A u r f a c e mount p a c k a g e a s d e s c r i b e d i n c l a i m 1 0 ,W h e r e i n s a i d s e c o n d b o n d i n g p a d i s ? i p - c h i p b o n d e d t o s a i ds e c o n d e l e c t r o d e .

1 4 . A u r f a c e mount p a c k a g e a s d e s c r i b e d i n c l a i m 1 0 ,W h e r e i n s a i d ? r s t b o n d i n g p a d a n d s a i d s e c o n d b o n d i n g p a da r e p l a t e d ? a t a t t h e t o p s u r f a c e o f s a i d s u b s t r a t e .

1 5 . A u r f a c e mount p a c k a g e a s d e s c r i b e d i n c l a i m 1 0 ,W h e r e i n s a i d s e c o n d b o n d i n g p a d h a s a l a r g e enough a r e a t o



22/51

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( 5 4 ) FLAT PACKAGE FOR SEMICONDUCTOR FOREIGN PATENT DOCUMENTSDIODES 59208756-A * 1 1 / 1 9 8 4 ( J P )

( 7 5 ) I n v e n t o r : B i l y Wang; H s i n - C h u 2000349222A * 1 2 / 2 0 0 0 ( J P )* c i t e d by examiner( 7 3 ) A s s i g n e e : H a r v a t e k C 0 r p . ; H s i n - C h u ( T W ) P r i m a r y E x a m i n e r N a t h a n F l y n n

( * ) N o t i c e : S u b j e c t t o a n y d i s c l a i m e r , t h e t e r m o f t h i s A s s i s t a n t EX?minrR6InIn0n R . F O r d p a t e n t i s e x t e n d e d o r a d j u s t e d u n d e r 3 5 ( 7 4 ) A t t o r n e y , A g e n t , o r FirmH. C . L i n , P a t e n t A g e n tU . S . C . 1 5 4 ( b ) b y 0 d a y s . ( 5 7 ) ABSTRACT

( 2 1 ) A p p l . N o . : 0 9 / 5 9 6 , 9 0 7 TWo ? a t c o n t a c t p a d s f o r m a p o r t i o n o f t h e b o t t o m s u r f a c eo f a ? a t package and c o n s t i t u t e t h e tWo e x t e r n a l c o n n e c t i o n s

( 2 2 ) F i l e d : Jun 1 9 2000 f o r t h e d i o d e . The d i o d e r e s t s on a t l e a s t one t h e c o n t a c t( 5 1 ) I n t . C l . 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . H01L 3/495 P a d S - The d i o d e and t h e C o n t a c t Pads a r e Covered W i t h( 5 2 ) US . C l . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 7 / 6 6 6 ; 2 5 7 / 9 9 ; 2 5 7 / 4 3 3 ; P r e t e e t i v e glue I f t h e d i o d e h a s one e l e e t r e d e a t t h e bottom2 5 7 / 7 3 5 ; 4 3 8 / 1 2 4 s u r f a c e ; t h e c o n t a c t pad n o t i n c o n t a c t W i t h d i o d e i s W i r e( 5 8 ) F i e l d O f Search . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 7 / 9 9 , 1 0 0 , 4 3 3 , hehded t h t h e t o p e t e e t t e d e I t t h e e h e d e h a s b o t h e t e e t t e d e e

257/676 73 5 774 773 779 782 783 a t t h e bottom s u r f a c e ; t h e tW o e l e c t r o d e s can r e s t on tWo 6 6 , 6 7 8 ; , 4 5 8 / 12 4 ; s e p a r a t e c o n t a c t p a d s . I f t h e d i o d e h a s b o t h e l e c t r o d e s o n t h e

t o p s u r f a c e ; t h e e l e c t r o d e s can be Wire-bonded t o t h e tW o( 5 6 ) R e f e r e n c e s C i t e d s e p a r a t e c o n t a c t p a d s . T h e t o p s u r f a c e o f t h e c o n t a c t p a d s

c a n be roughened o r p r o t r u d e d t o i n c r e a s e a d h e s i o n betweenUS ATENT DOCUMENTS t h e p r o t e c t i v e g l u e a n d t h e c o n t a c t p a d s . The c o n t a c t p a d s

5 444 301 * 8/1995 Song e t a l . . . . . . . . . . . . . . . . . . . . . . . . . . . . 257/737 can a l s o h a v e tunnels a t the b o t t o m Surface t o increase the5 : 9 6 9 : 4 1 6 * 1 0 / 1 9 9 9 Kim . . . . . . . . . . . . . . . . . . 2 5 7 / 6 9 2 ghhhg t h t e r t a e e hetWeeh t h e C o n t a c t Pads ahd t h e g l u e6,114,750 * 9/2000 U d a g a w a e t a l . 257/6666 , 1 3 0 , 1 1 5 * 10/2000 O k um ur a e t a l . . . . . . . . . . . . . . . . . . . . . 438/124 9 Claims, 6 Drawing Sheets

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FLAT PACKAGE FOR SEMICONDUCTORDIODES

BACKGROUND OF THE INVENTION( 1 ) F i e l d o f t h e I n v e n t i o nT h i s i n v e n t i o n r e l a t e s t o s e m i c o n d u c t o r d i o d e p a c k a g e , i np a r t i c u l a r t o o p t i c a l d i o d e s .( 2 ) B r i e f D e s c r i p t i o n o f t h e R e l a t e d A r tF I G . 1 shoWs a c o n v e n t i o n a l d u a l - i n l i n e package f o r

s e m i c o n d u c t o r d i o d e s s u c h a s t h a t u s e d f o r l i g h t e m i t t i n gd i o d e s ( L E D ) , l a s e r d i o d e s ( L D ) , p h o t o - d i o d e s ( P D ) e t c .Such p a c k a g e s a r e a l s o a p p l i c a b l e t o image s e n s o r s . Thed i o d e c h i p 10 h a s a bottom e l e c t r o d e 12 and a t o p e l e c t r o d e1 4 . These e l e c t r o d e s a r e c o u p l e d t o t h e e x t e n s i o n s o f tWop i n s 1 3 a n d 1 5 f o r e x t e r n a l c o n n e c t i o n s . The b o t t o m e l e ct r o d e 1 2 i s c o u p l e d t o p i n 1 3 a n d t h e t o p e l e c t r o d e 1 5 i sc o u p l e d t h r o u g h a b o n d i n g W i r e t o p i n 1 5 . T

h e t r e n d t o d a y i s t o m i n i a t u r i Z e t h e p a c k a g e s i Z e o f as e m i c o n d u c t o r d e v i c e . The e x t e n s i o n s o f p i n s 1 3 a n d 1 5o c c u p y s p a c e o f t h e p a c k a g e .

SUMMARY OF THE INVENTIONAn b j e c t o f t h i s p a c k a g e i s t o m i n i a t u r i Z e t h e d i m e n s i o n s

o f a d i o d e p a c k a g e . A n o t h e r o b j e c t o f t h i s i n v e n t i o n i s t of a c i l i t a t e s u r f a c e m o u n t i n g t h e p a c k a g e . T h e s e o b j e c t s a r eo b t a i n e d by s u r f a c e mounting a d i o d e package a s a ? a tp a c k a g e . The b o t t o m o f t h e ? a t p a c k a g e h a s t W o p a d s , W h i c hform t h e e x t e r n a l c o n n e c t i o n s f o r t h e d i o d e . The bottome l e c t r o d e i s mounted on one o f t h e pads and h e t o p e l e c t r o d eo f t h e d i o d e i s W i r e bonded t o t h e o t h e r p a d . Thus noe x t e n s i o n s o f t h e c o n n e c t i o n p i n s a r e u s e d a n d s p a c e i ss a v e d . T h e p a c k a g e i s s e a l e d i n a t r a n s p a r e n t p r o t e c t i v e g l u ef o r a n o p t i c a l d e v i c e .

BRIEF DESCRIPTION OF SEVERAL VIEWS OFTHE DRAWINGS

F I G . 1 shoWs t h e s i d e vieW o f a p r i o r a r t d u e l i n l i n epackage f o r a s e m i c o n d u c t o r d i o d e .

F I G . 2 shoWs h e s i d e vieW f t h e b a s i c s t r u c t u r e o f t h e ? a tp a c k a g e o f t h e p r e s e n t i n v e n t i o n .

F I G . 3 shoWs t h e b o t t o m vieW o f t h e r o u g h e n e d s u r f a c eo f t h e c o n t a c t p a d s .

F I G . 4 shoWs t h e bottom vieW o f t h e package W i t h a h o l eand a s l o t t o i n c r e a s e a d h e s i o n .

F I G . 5 shoWs a second embodiment o f t h e p r e s e n t i n v e nt i o n .F I G . 6 shoWs a t h i r d emb odiment o f t h e p r e s e n t i n v e n t i o n .F I G . 7 shoWs a package f o r mounting a d i o d e W i t h tWo

bottom e l e c t r o d e s .F I G . 8 shoWs a package f o r mounting a d i o d e W i t h tWo t o p

e l e c t r o d e s .F I G . 9 shoWs t h e over?oW p a t t e r n o f g l u e a t t h e b o t t o m

o f t h e p a c k a g e .F I G . 10 shoWs a t u n n e l a t t h e bottom o f t h e p a c k a g e .F I G . 1 1 shoWs a t h r e e - d i m e n s i o n a l vieW o f t h e t u n n e l

shoWn i n F I G . 1 0 .DETAILED DESCRIPTION OF THEINVENTION

F I G . 2 shoWs t h e s i d e vieW o f t h e b a s i c p a c k a g e o f t h e

10

1 5

25

35

45

55

2a bottom e l e c t r o d e 22 and t o p e l e c t r o d e 2 4 . The bottome l e c t r o d e i s d i r e c t l y mounted on t o p o f t h e c o n t a c t p a d 2 3a n d t h e t o p e l e c t r o d e o f t h e d i o d e 20 i s W i r e bonded t o t h ec o n t a c t p a d 2 5 . A f t e r W i r e b o n d i n g , t h e a s s e m b l y i s s e a l e di n p r o t e c t i v e g l u e 2 7 . F o r a n o p t i c a l d e v i c e , t h e p r o t e c t i v eg l u e i s t r a n s p a r e n t . The t o p v i e W o f t h e c o n t a c t p a d s o f t h ep a c k a g e i s shoWn n F I G . 3 . The t o p s u r f a c e s o f t h e c o n t a c tp a d s 23 a n d 2 5 a r e r o u g h e n e d t o i n c r e a s e t h e a d h e s i o nb e t W e e n t h e p r o t e c t i v e g l u e 2 7 a n d t h e c o n t a c t p a d s 2 3 a n d25 s o t h a t t h e p r o t e c t i v e g l u e 27 d o e s n o t p e e l o f f f r o m t h ec o n t a c t p a d s 23 a n d 2 5 .

The a d h e s i o n c a n f u r t h e r b e enhanced by c u t t i n g a h o l ea n d / o r a s l o t i n t h e c o n t a c t pads a s shoWn i n F I G . 4 . AsshoWn, a h o l e 254 s c u t i n t h e c o n t a c t pad 25 and a s l o t 234i s c u t i n t h e c o n t a c t p a d 2 3 . W h en p r o t e c t i v e g l u e i s p o u r e di n t o t h e h o l e 254 a n d t h e s l o t 2 3 4 , t h e s u r f a c e betWeen t h ep r o t e c t i v e g l u e 2 7 a n d t h e c o n t a c t p a d s 2 3 a n d 2 5 i si n c r e a s e d s o t h a t t h e p r o t e c t i v e g l u e 27 d o e s n o t p e e l o f ffrom t h e c o n t a c t p a d s 23 a n d 2 5 .

F I G . 5 shoWs a n o t h e r embodiment o f t h i s i n v e n t i o n . Thec o n t a c t pad 23 and 25 a r e stamped from t h e bottom t op r o d u c e tWo t u n n e l s 236 and 256 u n d e r n e a t h t h e c o n t a c tpads a s shoWn i n t h e bottom vieW F I G . 10 and t h e3 - d i m e n s i o n a l v i e W i n F I G . 1 1 . D u r i n g t h e s e a l i n g p r o c e s s ,t h e g l u e ? o W s i n t o t h e t u n n e l s 236 a n d 256 f r o m t h e e n d s .T h e s e t u n n e l s i n c r e a s e t h e g l u i n g i n t e r f a c e b e t W e e n t h e g l u e27 a n d t h e c o n t a c t p a d s 2 3 a n d 2 5 , s o t h a t t h e c o n t a c t p a d s2 3 a n d 2 5 d o n o t p e e l o f f e a s i l y f r o m t h e p r o t e c t i v e g l u e 2 7 .The t u n n e l s 236 a n d 256 c a n b e f o r m e d by s t a m p i n g f r o mt h e b o t t o m s u r f a c e s o f t h e r e s p e c t i v e p a d s . T h e p r o t r u s i o n sc r e a t e d b y t h e s t a m p i n g p r o c e s s a l s o i n c r e a s e t h e g l u i n gi n t e r f a c e t o h o l d t h e c o n t a c t p a d s i n p l a c e . F I G . 9 shoWs t h eb o t t o m v i e W o f t h e c o n t a c t p a d s a f t e r g l u i n g . T h e d o t t e do u t l i n e 5 5 shoWs t h e c o n t a c t p a d s a n d t h e s o l i d o u t l i n eshoWs t h e over?oW p a t t e r n o f t h e g l u e 2 7 . The over?oW 5 555 on t h e pad 25 c a n t h e n removed f o r b e t t e r s o l d e r i n gf u n c t i o n a t t h e p a d .

F I G . 6 shoWs t i l l a n o t h e r embodiment o f t h i s i n v e n t i o n .The c o n t a c t pads a r e eroded o r c u t f r om t h e b ot t om t o c r e a t etWo t u n n e l s 238 and 285 i n t h e c o n t a c t p a d s 23 a n d 25r e s p e c t i v e l y . As i n F I G . 5 , t h e s e t u n n e l s i n c r e a s e t h e a d h es i o n b e t W e e n t h e p r o t e c t i v e g l u e 2 7 a n d t h e c o n t a c t p a d s 2 3 ,2 5 . These t u n n e l s can be formed by means o f mechanicalg r i n d i n g , s c r i b i n g o r c h e m i c a l e t c h i n g , e t c .

F I G . 7 shoWs a ? a t package f o r mounting a d i o d e 30 W i t htWo bottom e l e c t r o d e s 302 and 3 0 4 . These e l e c t r o d e s r e s t ontWo c o n t a c t p a d s 33 a n d 3 5 r e s p e c t i v e l y a t t h e b o t t o m o f t h e? a t p a c k a g e W i t h o u t a n y b o n d i n g W i r e s . The d i o d e 30 a n dt h e c o n t a c t p a d s 33 a n d 35 a r e c o v e r e d W i t h p r o t e c t i v e g l u e3 7 . The bottoms o f t h e c o n t a c t p a d s 33 a n d 35 c a n b ecoupled t o a motherboard.

F I G . 8 shoWs a ? a t package f o r mounting a d i o d e 40 W i t htWo t o p e l e c t r o d e s 42 a n d 4 4 . These tWo e l e c t r o d e s 42 a n d44 a r e W i r e bonded t o tWo c o n t a c t pads 43 and 45 r e s p e ct i v e l y . The d i o d e 40 i s mounted on t h e c o n t a c t pad 4 3 . Thes t r u c t u r e i s t h e n s e a l e d i n p r o t e c t i v e g l u e 4 7 . The b o t t o m s o ft h e c o n t a c t pads 43 and 45 c a n be c o u p l e d t o a m o t h e r b o a r d .

While t h e p r e f e r r e d embodiments o f t h e i n v e n t i o n h a v ebeen d e s c r i b e d , i t W i l l b e a p p a r e n t t o t h o s e s k i l l e d i n t h e a r tt h a t v a r i o u s m o d i ? c a t i o n s ma y b e ma de i n t h e embodimentsW i t h o u t d e p a r t i n g f r o m t h e s p i r i t o f t h e p r e s e n t i n v e n t i o n .Such modi?cations a r e a l l W i t h i n t h e s c o p e o f t h i s i n v e n t i o n .

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tWo c o n t a c t p a d s f o r making e x t e r n a l e l e c t r i c a l connect i o n s W i t h b o t t o m s u r f a c e s p l a n a r W i t h t h e b o t t o m o fs a i d p a c k a g e , a n d h a v i n g s a i d d i o d e mounted on t l e a s tone o f s a i d tWo c o n t a c t p a d s ; and

a p r o t e c t i v e g l u e t o c o v e r s a i d d i o d e and s a i d c o n t a c tp a d s .2 . A? a t p a c k a g e a s d e s c r i b e d i n c l a i m 1 , W h e r e i n t h e ? r s t

e l e c t r o d e o f s a i d tWo e l e c t r o d e s i s l o c a t e d a t t h e bottoms u r f a c e o f s a i d d i o d e and mounted on ? r s t c o n t a c t pad o fs a i d tWo c o n t a c t p a d s , and t h e s e c o n d e l e c t r o d e o f s a i d tWoe l e c t r o d e s i s l o c a t e d a t t h e t o p s u r f a c e o f s a i d d i o d e andWire-bonded t o t h e second c o n t a c t pad o f s a i d tWo c o n t a c tp a d s .

3 3 . A a t p a c k a g e a s d e s c r i b e d i n c l a i m 1 , W h e r e i n t h e t o ps u r f a c e s o f s a i d c o n t a c t p a d s a r e roughened t o i n c r e a s ea d h e s i o n b e t W e e n s a i d p r o t e c t i v e g l u e a n d s a i d c o n t a c t p a d s .

4 . A a t p a c k a g e a s d e s c r i b e d i n c l a i m 1 , W h e r e i n s a i dc o n t a c t p a d s h a v e h o l e s f o r s a i d p r o t e c t i v e g l u e t o a d h e r e .

1 5

45 . A a t p a c k a g e a s d e s c r i b e d i n c l a i m 1 , W h e r e i n t h e

c o n t a c t p a d s h a v e p r o t r u s i o n s a t t h e u p p e r s u r f a c e o f s a i dc o n t a c t p a d s t o i n c r e a s e a d h e s i o n b e t W e e n s a i d p r o t e c t i v eg l u e a n d s a i d c o n t a c t p a d s .6 . A a t p a c k a g e a s d e s c r i b e d i n c l a i m 1 , W h e r e i n s a i dc o n t a c t p a d s h a v e d e p r e s s i o n s i n t h e b o t t o m s u r f a c e o f s a i dc o n t a c t p a d s t o i n c r e a s e g l u i n g i n t e r f a c e betWeen c o n t a c tp a d s a n d s a i d g l u e a n d t o h o l d s a i d c o n t a c t p a d s i n p l a c e .7 . A ?at p a c k a g e a s d e s c r i b e d i n c l a i m 1 , W h e r e i n t h e tWos a i d e l e c t r o d e s o f t h e d i o d e a r e l o c a t e d a t t h e bottom s u r f a c eo f s a i d d i o d e a n d make d i r e c t c o n t a c t W i t h tWo r e s p e c t i v ec o n t a c t p a d s W i t h o u t W i r e - b on d i n g .8 . A ?at p a c k a g e a s d e s c r i b e d i n c l a i m 1 , W h e r e i n t h e tWos a i d e l e c t r o d e s o f t h e d i o d e a r e l o c a t e d a t t h e t o p s u r f a c e o fs a i d d i o d e and Wire-bonded t o s a i d tWo c o n t a c t p a d s .9 . A a t p a c k a g e a s d e s c r i b e d i n c l a i m 1 , W h e r e i n s a i dp r o t e c t i v e g l u e i s t r a n s p a r e n t .

* * * * *



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( 5 4 ) WHITE LIGHT SOURCE FROM LIGHT ( 5 6 ) R e f e r e n c e s C i t e dEMITTING DIODE

_ _ _ U.S. PATENTDOCUMENTS( 7 5 ) I n v e n t o r s : B l l y W a n g , H s i n - C h u ( T W ) ; JonmeC h u an g , Taipei Yann Lee, 6 , 2 9 9 , 4 9 8 B1 * 1 0 / 2 0 0 1 Liu e t a l . . . . . . . . . . . . . . . . . . . . . . . 445/24Hsinchu * c i t e d by examiner( 7 3 ) A s s i g n e e : H a r v a t e k C o r p o r a t i o n , H s i n - C h u( T W ) P r i m a r y E x a m i n e r V i p P a t e l

( * ) N o t i c e : S u b j e c t t o a n y d i s c l a i m e r , t h e t e r m o f t h i s ( 7 4 ) A t t o r n e y ) A e m , 0 r Firm_Rosenberg, K l e i n e ep a t e n t i s e x t e n d e d o r a d j u s t e d u n d e r 3 5U . S . C . 1 5 4 ( b ) b y 8 0 d a y s . ( 5 7 ) ABSTRACT

A h i t e l i g h t s o u r c e i s o b t a i n e d by c o n v e r t i n g s h o r t Wave( 2 1 ) A p p l N05 1 0 / 3 7 2 , 8 4 8 l e n g t h c o l o r l i g h t e m i t t e d f r o m a l i g h t e m i t t i n g d i o d e ( L E D ) .( 2 2 ) F i l e d : Feb 2 6 2 0 0 3 T h e c o n v e r s i o n i s a c h i e v e d b y c o v e r i n g t h e LED c h i p W i t h

a ? u o r e s c e n t g l u e . The LED h i p i s mounted on a s p l i t( 6 5 ) P r i o r P u b l i c a t i o n Data s u b s t r a t e , and t h e o u t e r e n d s o f t h e s u b s t r a t e s e r v e a s

t e r m i n a l s f o r t h e LED. A a l l ma y b e e r e c t e d a r o u n d t h eUS 2004 0164675 A1A 26 2004/ u g LED c h i p t o c o n t a i n t h e ? u o r e s c e n t g l u e , and a n o t h e r( 5 1 ) I n t . C l . 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . H 0 1 J 1 / 6 2 t r a n s p a r e n t g l u e m a y b e used t o c o v e r t h e ? u o r e s c e n t g l u e( 5 2 ) u s . C l . . . . . . . . . . . . . . . . . . . . . . . . . 3 1 3 / 5 1 2 ; 3 1 3 / 5 0 1 ; 313/506 f o r p r o t e c t i o n( 5 8 ) Field o f Search . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 313/498, 501,

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WHITE LIGHT SOURCE FROM LIGHTEMITTING DIODE

BACKGROUND OF THE INVENTION( 1 ) F i e l d o f t h e I n v e n t i o nT h i s i n v e n t i o n i s r e l a t e d t o a l i g h t e m i t t i n g d i o d e ( L E D ) ,p a r t i c u l a r l y t o a L E D p a c k a g e f o r e m i t t i n g W h i t e l i g h t .( 2 ) B r i e f D e s c r i p t i o n o f R e l a t e d A r tF I G . 1 shoWs a p r i o r a r t LED a c k a g e . An LED h i p 1 0

i s mounted o n t h e l e f t s i d e o f a s u b s t r a t e . The s u b s t r a t e i ss p l i t i n t h e middle W i t h a gap i n t o a l e f t hand s e c t i o n 1 1 anda r i g h t hand s e c t i o n 1 2 . The bottom e l e c t r o d e o f t h e LEDc h i p 1 0 i s mounted on t h e l e f t h a n d s e c t i o n 1 1 , a n d t h e t o pe l e c t r o d e o f t h e LED h i p 1 0 i s W i r e bonded by W i r e 1 3 t ot h e r i g h t h a n d s e c t i o n 1 2 . The e x t e n s i o n s o f s e c t i o n s 1 1 a n d12 s e r v e a s t e r m i n a l s f o r s u r f a c e mounting o f t h e LEDp a c k a g e . The s u b s t r a t e a n d t h e c h i p 1 0 a r e e n c a p s u l a t e d i na s e a l i n g g l u e 1 6 a s shoWn n t h e s i d e vieW F I G . 2 . Athroughh o l e 1 5 and a c u t 1 4 a r e i n s e r t e d i n t h e s u b s t r a t e f o r t h e g l u et o ? l l f o r s t r o n g e r a d h e s i o n . S i n c e a n LED normally cane m i t o n l y c o l o r l i g h t , t h e l i g h t e m i t t e d f r o m t h e p a c k a g ec a n n o t e m i t W h i t e l i g h t .

SUMMARY OF THE INVENTIONAn b j e c t o f t h i s i n v e n t i o n i s t o u s e an LED o g e n e r a t e

W h i t e l i g h t . A n o t h e r o b j e c t o f t h i s i n v e n t i o n i s t o r e d u c e t h eh e i g h t o f a n L E D p a c k a g e . S t i l l a n o t h e r o b j e c t o f t h i si n v e n t i o n i s t o p r o t e c t t h e LED rom c o n t a m i n a t i o n .

T h e s e o b j e c t s a r e o b t a i n e d b y u s i n g a s h o r t W a v e l e n g t hl i g h t e m i t t i n g d i o d e . A h i n l a y e r o f ? u o r e s c e n t g l u e c o v e r st h e t o p a n d p e r i p h e r a l o f t h e l i g h t e m i t t i n g d i o d e . T h e LE Dn o r m a l l y e m i t s s h o r t W a v e l e n g t h c o l o r l i g h t , s u c h a s b l u e ,p u r p l e , b l u e - p u r p l e o r UV o l o r l i g h t , o t h e r t h a n W h i t e l i g h t .The ? u o r e s c e n t g l u e c o n v e r t s t h e s h o r t W a v e l e n g t h c o l o rl i g h t i n t o W h i t e l i g h t . T h e ? u o r e s c e n t g l u e a l s o s e a l s t h ep a c k a g e a g a i n s t c o n t a m i n a t i o n a n d s t r e n g t h e n s t h e p a c k a g es t r u c t u r a l l y .

BRIEF DESCRIPTION OF THE DRAWGINGSF I G . 1 shoWs t h e t o p vieW o f a p r i o r a r t LED a c k a g e .F I G . 2 shoWs t h e s i d e vieW o f a p r i o r a r t LED a c k a g e .F I G . 3 shoWs t h e b a s i c s t r u c t u r e o f t h e LED a c k a g e o f

t h e p r e s e n t i n v e n t i o n .F I G . 4 shoWs a W a l l f o r t h e LED a c k a g e .F I G . 5 shoWs t h e W a l l shoWn i n F I G . 4 s u r r o u n d i n g t h eLE D c h i p .F I G . 6 shoWs a t r a n s p a r e n t g l u e c o v e r i n g t h e ? u o r e s c e n tg l u e .F I G . 7 s h o W s t h e t r a n s p a r e n t g l u e c o v e r i n g t h e s i d e a n dt o p o f t h e LE D p a c k a g e .F I G . 8 shoWs a p a c k a g e f o r ? i p - c h i p LED.

DETAILED DESCRIPTION OF THEINVENTION

FIGS. 37 sh oW t h e c o n s t r u c t i o n o f t h e LED ackage a sa White l i g h t s o u r c e .

F I G . 3 shoWs t h e s i d e vieW o f t h e b a s i c s t r u c t u r e o f t h ep r e s e n t i n v e n t i o n . A h o r t W a v e l e n g t h c o l o r LED 1 0 i smounted on t h e l e f t s e c t i o n 1 1 o f a m e t a l s u b s t r a t e , Which ss p l i t W i t h a r i g h t hand s e c t i o n 1 2 . The t o p e l e c t r o d e o f t h eLED 0 i s W i r e bonded by W i r e 1 3 t o t h e r i g h t s e c t i o n 1 2 .The LED h i p 10 a n d t h e m e t a l s e c t i o n s 1 1 a n d 1 2 a r e s e a l e d

1 5

25

35

40

55

6 5

2W i t h a ? u o r e s c e n t g l u e 1 6 . The ? u o r e s c e n t g l u e c o v e r t s t h ec o l o r l i g h t e m i t t e d f r o m t h e L E D 1 0 i n t o W h i t e l i g h t . Them e t a l s e c t i o n s e c t i o n s 1 1 a n d 1 2 h a v e t h r o u g h h o l e s 1 4 f o rt h e ? u o r e s c e n t g l u e t o ? oW t h r o u g h d u r i n g s e a l i n g , t h u ss t r e n g t h e n i n g t h e s t r u c t u r e . The e x t e n s i o n s o f s e c t i o n s 1 1and 12 a r e n o t covered by t h e ? u o r e s c e n t g l u e 16 t o s e r v e a st e r m i n a l s o f t h e LED o r s u r f a c e m o u n t i n g .

F I G . 4 shoWs a W a l l 2 5 f o r s u r r o u n d i n g t h e LED h i pshoWn i n F I G . 3. The W a l l 25 can b e o f e q u a l h e i g h t a s o ru n e q u a l h e i g h t a s t h e ? u o r e s c e n t g l u e 1 6 . W a l l 2 5 i s o f e q u a lh e i g h t . W a l l 2 5 1 i s o f t a l l e r h e i g h t . W a l l 252 i s o f s h o r t e rh e i g h t .

F I G . 5 shoWs t h e W a l l 25 e r e c t e d o u t s i d e t h e ? u o r e s c e n tg l u e 1 6 shoWn n F I G . 3 . I n t h i s ? g u r e , t h e W a l l i s t a l l e r t h a nt h e ? u o r e s c e n t g l u e 1 6 .

F I G . 6 shoWs a W a l l 25 a l l e r t h a n t h e ? u o r e s c e n t g l u e 1 6t o p r o v i d e s p a c e f o r a t r a n s p a r e n t g l u e 26 t o ? l l o v e r t h e? u o r e s c e n t g l u e 1 6 f o r p r o t e c t i o n o f t h e ? u o r e s c e n t g l u e 1 6 .

F I G . 7 shoWs a n o t h e r embodiment Where t h e t r a n s p a r e n tg l u e a l s o c o v e r s t h e o u t s i d e s u r f a c e o f t h e W a l l t o s t r e n g t h e nt h e s t r u c t u r e a s a l a y e r 261.

F I G . 8 shoWs package f o r a ? i p - c h i p LED 0 1 . The LEDc h i p 1 0 1 h a s t W o b o t t o m e l e c t r o d e s , i n c o n t a c t W i t h s a i d ? r s tm e t a l s e c t i o n 1 1 a n d s a i d s e c o n d m e t a l s e c t i o n 1 2 , r e s p e ct i v e l y . O t h e r p a r t s o f t h e package a r e t h e same a s t h a t shoWni n F I G . 7 .

The LE D s d e s c r i b e d i n FIGS. 37 a r e s h o r t W a v e l e n g t hLE D s s e l e c t e d f r o m t h e g r o u p , c o n s i s t i n g o f b l u e l i g h tL E D s , p u r p l e l i g h t L E D s , b l u e - p u r p l e l i g h t L E D s , a n du l t r a - v i o l e t l i g h t LEDsWhile t h e p r e f e r r e d embodiment o f t h e i n v e n t i o n h a v e

been d e s c r i b e d , i t W i l l b e a p p a r e n t t o t h o s e s k i l l e d i n t h e a r tt h a t v a r i o u s modi?cations can b e i n t h e embodiments W i t ho u t d e p a r t i n g f r o m t h e s p i r i t o f t h e r e s e n t i n v e n t i o n . Suchm o d i ? c a t i o n s a r e a l l W i t h i n t h e s c o p e o f t h e p r e s e n t i n v e nt i o n .

Wh a t i s c l a i m e d i s :1 . A i g h t e m i t t i n g d i o d e ( L E D ) W h i t e l i g h t s o u r c e ,c o m p r i s i n g :a l i g h t e m i t t i n g d i o d e c h i p h a v i n g a b o t t o m e l e c t r o d e a n da s e c o n d e l e c t r o d e , a n d e m i t t i n g s h o r t W a v e l e n g t h c o l o rl i g h t ;a s p l i t m e t a l s u b s t r a t e having a ? r s t m e t a l s e c t i o n and a

s e c o n d m e t a l s e c t i o n , s e p a r a t e f r o m e a c h o t h e r ,W h e r e i n s a i d ? r s t m e t a l s e c t i o n i s mounted W i t h s a i dbottom e l e c t r o d e a n d s a i d s e c o n d s e c t i o n i s c o n n e c t e dt o s a i d s e c o n d e l e c t r o d e ;

a ? u o r e s c e n t g l u e , c o v e r i n g s a i d L E D c h i p a n d i n n e r e n d so f s a i d ? r s t s e c t i o n a n d s a i d second s e c t i o n , a n d conv e r t i n g s a i d s h o r t W a v e l e n g t h c o l o r l i g h t i n t o W h i t el i g h t , a n d

t e r m i n a l s f o r s a i d LED ormed by t h e o u t e r e n d s o f s a i d? r s t m e t a l s e c t i o n a n d s a i d s e c o n d m e t a l s e c t i o n , n o tc o v e r e d b y s a i d ? u o r e s c e n t g l u e .

2 . The LED h i t e l i g h t s o u r c e a s d e s c r i b e d i n c l a i m 1 ,f u r t h e r c o m p r i s i n g a t l e a s t o n e t h r o u g h h o l e s i n s a i d ? r s tm e t a l s e c t i o n and s a i d s e c o n d m e t a l s e c t i o n f o r s a i d ?uor e s c e n t g l u e t o ? l l a n d t o s t r e n g t h e n t h e a d h e s i o n betWeent h e ? u o r e s c e n t g l u e a n d s a i d s u b s t r a t e .

3. The LED W h i t e l i g h t s o u r c e a s d e s c r i b e d i n c l a i m1 , f u r t h e r c o m p r i s i n g a W a l l e r e c t e d a r o u n d s a i d ? u o r e s c e n tg l u e t o c o n t a i n s a i d ? u o r e s c e n t g l u e .

4 . The LED h i t e l i g h t s o u r c e a s d e s c r i b e d i n c l a i m 3 ,W h e r e i n s a i d W h e r e i n s a i d W a l l i s o f u n e q u a l h e i g h t a s s a i d? u o r e s c e n t g l u e .



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US 6 , 8 4 1 , 9 3 4 B23

5 . The LED h i t e l i g h t s o u r c e a s d e s c r i b e d i n c l a i m 4 ,f u r t h e r c o m p r i s i n g a t r a n s p a r e n t g l u e c o v e r i n g s a i d ? u o r e sc e n t g l u e t o p r o t e c t s a i d ? u o r e s c e n t g l u e .

6 . The LED h i t e l i g h t s o u r c e a s d e s c r i b e d i n c l a i m 5 ,W h e r e i n t h e t r a n s p a r e n t g l u e a l s o c o v e r s t h e o u t s i d e o f s a i dW a l l .

7 . The LED h i t e l i g h t s o u r c e a s d e s c r i b e d i n c l a i m 1 ,W h e r e i n s a i d LED s s e l e c t e d f r o m t h e g r o u p c o n s i s t i n g o fs h o r t W a v e l e n g t h b l u e l i g h t , p u r p l e l i g h t , b l u e - p u r p l e l i g h t ,a n d u l t r a v i o l e t l i g h t .

48 . The LED h i t e l i g h t s o u r c e a s d e s c r i b e d i n c l a i m 1 ,

Wherein s a i d second e l e c t r o d e i s a t o p e l e c t r o d e W i r e bondedt o s a i d second m e t a l s e c t i o n .

9 . The LED h i t e l i g h t s o u r c e a s d e s c r i b e d i n c l a i m 1 ,Wherein s a i d second e l e c t r o d e i s a second bo ttom e l e c t r o d ei n c o n t a c t W i t h s a i d second m e t a l s e c t i o n .



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Exhibit D



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1 2 ) United States D e s i gn Patent 1 0 ) P a t e n t N o . :Wang

USO0D659655S

US D 6 5 9 , 6 5 5 S( 4 5 ) Date o f P a t e n t : * 9 : May 5 , 2012

( 5 4 ) LED PACKAGE BASE( 7 5 ) I n v e n t o r : B i l y W a n g , H s i n c h u ( T W )( 7 3 ) A s s i g n e e : H a r v a t e k C o r p o r a t i o n , H s i n c h u ( T W )( * * ) T e r m : 1 4 Years( 2 1 ) A p p l . N o . : 2 9 / 3 9 6 , 1 2 3( 2 2 ) F i l e d : J u n . 2 6 , 2 0 1 1( 3 0 ) F o r e i g n A p p l i c a t i o n P r i o r i t y D a t a

J a n . 5 , 201 1 (TW) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 3 000 49(51) LOC 9 ) Cl. . . . . . . 13-03( 5 2 ) US. l . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D13/180(58) Field of Classi?cation S e a r c h . . . . . . . . . . . . . . . . . D l 3 / l80;

D 2 6 / l , 2 ; 2 5 7 / 7 9 , 8 0 , 8 1 , 8 8 , 8 9 , 9 5 , 9 8 ,2 5 7 / 9 9 , 1 0 0 , E 3 3 . 0 5 8 ; 3 1 3 / 4 8 3 , 4 9 8 , 5 0 0 ;3 6 2 / 5 5 5 , 8 0 0S e e a p p l i c a t i o n ? l e f o r c o m p l e t e s e a r c h h i s t o r y .

( 5 6 ) R e f e r e n c e s C i t e dU . S . PATENT DOCUMENTS

D534,l32 S * 12/2006 Yoon . . . . . . . . . . . . . . . . . . . . . . . . . . . Dl3/l807 , 242, 03 5 B2 7 / 2 0 0 7 Kim t a 1 . . . . . . . . . 257 /99D 5 5 8 , 6 9 3 S * l/2008 Shin e t a 1 . . . . . . . . . . . . . . . . . . . . . Dl3 l80

D599,305 S * 9/ 2009 Kimet 1. . . . . . . . . . . . . . . . . . . . . Dl3/l80D633,053 S * 2/20ll Lin . . . . . . . . . . . . . . . Dl3/l807 , 9 1 0 , 9 4 8 B2* 3 / 2 0 l l Kim t a 1 . 2 5 7 / 9 9D 6 3 7 , 9 8 l S * 5/20ll K0 t a l . . . D l 3 / l 8 07,935,982 B2 5/20ll Kim t a 1 . . . . . . . . . . .. 257/997,968,900 B2* 6/20ll Hussellet a 1 . . . . . . . . . . . . . . . . . . . 257 /99

* c i t e d by examinerPrim ar y Examiner elina Sikder( 7 4 ) A t t o r n e y , A g e n t , or Firm * i Cai I n t e l l e c t u a lP r o p e r t y ( U S A ) O f ? c e( 5 7 ) CLAIMThe o r n a m e n t a l d e s i g n f o r a LED p a c k a g e b a s e , a s shoWnand d e s c r i b e d .

DESCRIPTIONF I G . 1 i s a p e r s p e c t i v e vieW o f a LED package b a s e shoWi n g m y neW d e s i g n ;F I G . 2 i s a f r o n t vieW t h e r e o f ;FIG. 3 i s a r e a r vieW t h e r e o f ;F I G . 4 i s a l e f t s i d e vieW t h e r e o f ;F I G . 5 i s a r i g h t s i d e vieW t h e r e o f ;F I G . 6 i s a t o p vieW t h e r e o f ;F I G . 7 i s a bottom vieW t h e r e o f ; a n d ,F I G . 8 i s a p e r s p e c t i v e v i e W s h o w i n g t h e p r a c t i c a l u s a g e .

1 C l a i m , 5 Drawing S h e e t s



46/51

US. Pa t en t May 5 , 2 0 1 2 S h e e t 1 o f 5 US D659,655 S

. . .ww w..



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US. Pa t en t May 5 , 2 0 1 2 S h e e t 2 o f 5 US D659,655 S

z. v



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US. Pa t en t May 5 , 2 0 1 2 S h e e t 3 o f 5 US D659,655 SCase 6:13-cv-00901 Document 1-4 Filed 11/22/13 Page 5 of 7 PageID #: 48


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US. Pa t en t May 5 , 2 0 1 2 S h e e t 4 o f 5 US D659,655 SCase 6:13-cv-00901 Document 1-4 Filed 11/22/13 Page 6 of 7 PageID #: 49


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US. Pat ent May 1 5 , 2 0 1 2 S h e e t 5 o f 5 US D659,655 SCase 6:13-cv-00901 Document 1-4 Filed 11/22/13 Page 7 of 7 PageID #: 50


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S 44 (Rev. ) CIVIL COVER SHEETThe JS 44 civil cover sheet and the information contained herein neither replace nor supplement the filing and service of pleadings or other papers as required by law, except as pr

y local rules of court. This form, approved by the Judicial Conference of the United States in September 1974, is required for the use of the Clerk of Court for the purpose of inhe civil docket sheet. (SEE INSTRUCTIONS ON NEXT PAGE OF THIS FORM.)

. (a) PLAINTIFFS DEFENDANTS

(b) County of Residence of First Listed Plaintiff County of Residence of First Listed Defendant(EXCEPT IN U.S. PLAINTIFF CASES) (IN U.S. PLAINTIFF CASES ONLY)

NOTE: IN LAND CONDEMNATION CASES, USE THE LOCATIONTHE TRACT OF LAND INVOLVED.

(c) Attorneys (Firm Name, Address, and Telephone Number) Attorneys (If Known)

I. BASIS OF JURISDICTION (Place an X in One Box Only) III. CITIZENSHIP OF PRINCIPAL PARTIES(Place an X in One Box for (For Diversity Cases Only) and One Box for Defendant

1 U.S. Government 3 Federal Question PTF DEF PTF D

Plaintiff (U.S. Government Not a Party) Citizen of This State 1 1 Incorporated orPrincipal Place 4

of Business In This State

2 U.S. Government 4 Diversity Citizen of Another State 2 2 Incorporated andPrincipal Place 5

Defendant (Indicate Citizenship of Parties in Item III) of Business In Another State

Citizen or Subject of a 3 3 Foreign Nation 6

Foreign Country

V. NATURE OF SUIT (Place an X in One Box Only)CONTRACT TORTS FORFEITURE/PENALTY BANKRUPTCY OTHER STATUTE

110 Insurance PERSONAL INJURY PERSONAL INJURY 625 Drug Related Seizure 422 Appeal 28 USC 158 375 False Claims Act

120 Marine 310 Airplane 365 Personal Injury - of Property 21 USC 881 423 Withdrawal 400 State Reapportionm

130 Miller Act 315 Airplane Product Product Liability 690 Other 28 USC 157 410 Antitrust

140 Negotiable Instrument Liability 367 Health Care/ 430 Banks and Banking

150 Recovery of Overpayment 320 Assault, Libel & Pharmaceutical PROPERTY RIGHTS 450 Commerce

& Enforcement of Judgment Slander Personal Injury 820 Copyrights 460 Deportation

151 Medicare Act 330 Federal Employers Product Liability 830 Patent 470 Racketeer Influence

152 Recovery of Defaulted Liability 368 Asbestos Personal 840 Trademark Corrupt Organizatio

Student Loans 340 Marine Injury Product 480 Consumer Credit

(Excl. Veterans) 345 Marine Product Liability LABOR SOCIAL SECURITY 490 Cable/Sat TV

153 Recovery of Overpayment Liabili ty PERSONAL PROPERTY 710 Fair Labor Standards 861 HIA (1395ff) 850 Securities/Commod

of Veterans Benefits 350 Motor Vehicle 370 Other Fraud Act 862 Black Lung (923) Exchange

160 Stockholders Suits 355 Motor Vehicle 371 Truth in Lending 720 Labor/Mgmt. Relations 863 DIWC/DIWW (405(g)) 890 Other StatutoryActi

190 Other Contract Product Liability 380 Other Personal 740 Railway Labor Act 864 SSID Title XVI 891 Agricultural Acts

195 Contract Product Liability 360 Other Personal Property Damage 751 Family and Medical 865 RSI (405(g)) 893 Environmental Matt

196 Franchise Injury 385 Property Damage Leave Act 895 Freedom of Informa

362 Personal Injury - Product Liability 790 Other Labor Litigation ActMed. Malpractice 791 Empl. Ret. Inc. 896 Arbitration

REAL PROPERTY CIVIL RIGHTS PRISONER PETITIONS Security Act FEDERAL TAX SUITS 899 Administrative Proc

210 Land Condemnation 440 Other Civil Rights 510 Motions to Vacate 870 Taxes (U.S. Plaintiff Act/Review or Appe

220 Foreclosure 441 Voting Sentence or Defendant) Agency Decision

230 Rent Lease & Ejectment 442 Employment Habeas Corpus: 871 IRSThird Party 950 Constitutionality of

240 Torts to Land 443 Housing/ 530 General 26 USC 7609 State Statutes

245 Tort Product Liability Accommodations 535 Death Penalty IMMIGRATION

290 All Other Real Property 445 Amer. w/Disabilities - 540 Mandamus & Other 462 Naturalization Application

Employment 550 Civil Rights 463 Habeas Corpus -

446 Amer. w/Disabilities - 555 Prison Condition Alien Detainee

Other 560 Civil Detainee - (Prisoner Petition)

448 Education Conditions of 465 Other Immigration

Confinement Actions

V. ORIGINTransferred fromanother district(specify)

(Place an X in One Box Only)

1 OriginalProceeding

2 Removed fromState Court

3 Remanded fromAppellate Court

4 Reinstated orReopened

5 6 MultidistrictLitigation

VI. CAUSE OF ACTION

Cite the U.S. Civil Statute under which you are filing (Do not cite jurisdictional statutes unless diversity):

Brief description of cause:

VII. REQUESTED IN

COMPLAINT:

CHECK IF THIS IS A CLASS ACTION

UNDER F.R.C.P. 23

DEMAND $ CHECK YES only if demanded in complaint

JURY DEMAND: Yes NoMonetary

HARVATEK CORPORATION

Ni, Wang, & Associates, PLLC8140 Walnut Hill Lane, Ste. 310, Dallas, TX 75231Tel: 972-331-4600

Nichia Corporation

Title 35 of United States Code

Patent Infringement


harvatek corp. v. nichia corp. - complaint

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