hfss 3d layout -...

32
ANSYS HFSS 3D Layout 侯明刚

Upload: phamcong

Post on 30-Jan-2018

435 views

Category:

Documents


2 download

TRANSCRIPT

ANSYS HFSS 3D Layout

侯明刚

Introducing the New Layout Flow with HFSS

Two Design Interfaces

Both Require the Accuracy of 3D

and HFSS

Mechanical CAD (MCAD)

Electrical Layout (ECAD)

HFSS: 3D Parametric Design Entry (MCAD)

Geometry 3rd Party 3D CAD

Bi-Directional

Toolkits Script Customization

3D Component Library

Design Flow Integration Customization

3D Editor Native

Arbitrary 3D HFSS Desktop

Parametric Variations

HFSS: Layout Parametric Design Entry (EDA)

Geometry Layout Editor

Native

Toolkits Script Customization

Scripted Footprints

3rd Party Layout Translation

‘3D’ Layout Designer Desktop

Parametric Variations

Design Flow Integration Customization

HFSS v2014: Arbitrary 3D or 3D Layout

• No change to 3D product, licenses added to enable layout – ensemble_gui – nexxim_gui

• Required Installs – HFSS v2014 – Designer v2014

3rd Party 3D CAD Bi-Directional

3D Component Library

3D Editor Native

Scripted Footprints

3rd Party Layout Translation

Arbitrary 3D

3D Layout

Layout Editor Native

Toolkits Script Customization

Toolkits Script Customization Parametric

Variations

Parametric Variations

Additional Capability for HFSS v2014

1. HFSS with Layout Editor (Included) • Automated Interface for Package, PCB, or IC passive design • Layout with Integrated 3D HFSS solve

» DC Solver » Passive/Causal Frequency Sweeps » Embedded S-Parameters » Native HFSS solves from Cadence Allegro, APD, SiP, and

Virtuoso • Schematic Capture (Circuit Analysis enabled with optional license) • Full-wave SPICE circuit generation

2. PlanarEM (2.5D Method of Moments, Included) • Enabled with the HFSS solve license

3. Phi Mesher

• Features for HFSS from Layout – Integrated HFSS for layout geometry – Parametric Layout Editor

• Stackup – Etch Factor/Layer Offset • Padstacks • Trace parameters • HFSS Extents • Finite Dielectrics • Sub-region • Hierarchy

– Solver • Integrated HFSS solver • DC Solver • Embedded RLC and/or S-Parameters for HFSS

– Post-Processing • Network Data Explorer • Full-Wave SPICE/HSPICE broadband ROM export

– Integration with industry: • Cadence, Zuken, Mentor and Altium

HFSS from Layout

• Now included with HFSS

• Fast solve – 2D conductors – Infinite GND – Early in the

design process

• Leverage HFSS and 3D FEM with adaptive meshing in the later stages

PlanarEM 2.5D Method of Moments

Ease of Use: Ports

1. Click on the “Select

Elements” button

2. While pressing the Ctrl

button, select both

lumped ports

3. Right click on Excitations, then

click on “Couple Edge Ports”

Convert to Differential Waveport in One Click

Newly created coupled Waveport

Easily Size Waveport in a Few Clicks

Port with a Horizontal Extent Factor = 3

Port with a Horizontal Extent Factor = 5

If the newly generated coupled waveport can be

changed by editing the Horizontal Extent Factor

HFSS Solve from SIwave

– Create and Solve HFSS models from within • Allegro® Package Designer

• Allegro® PCB Designer

• SiP Digital Layout

• Virtuoso® Analog Design Environment

HFSS within Cadence

Set-up and solve HFSS

simulations without

leaving the Cadence

environment

HFSS 3D Layout and the Phi Mesher

HFSS Meshing Techniques

• Classic – Approach: Starts with a 3D surface triangular mesh on all objects and generate a 3D

volume mesh throughout simulation domain

– Availability: HFSS (traditional 3D interface) and HFSS 3D Layout

– Pro: Works for any arbitrary 3D geometry

– Con: For complex, many layered geometries can require a long time to generate

• PhiNew

– Approach: From a layout, generate layer by layer 2D triangular mesh. Sweep mesh in stackup (+z) direction to generate tetrahedral mesh elements

– Advantage: Skips heavyweight ACIS and 3D surface mesh generation

– Availability: HFSS 3D Layout only

– Pro: Extremely fast relative to classic 3D mesh approach

– Con: Only works for stack-up or ‘swept in Z’ geometries. IC components and packages, PCBs. etc.

Why Phi?

• Phi vs Classic – Always wins initial mesh generation

• Including Lambda + Port Adapt

• Initial mesh size is comparable

– Can mesh bigger designs • When combined with distributed memory solver and hardware can

solve very large and complex designs

Summary: Initial Mesh is orders of magnitudes faster,

Solver is the same

R14.5: 5hrs - Initial Mesh

2014.0: 11min - Initial Mesh

• Accurate Solution – Industry leading meshing capacity – Causal/Passive s-parameters – True DC solution – Embedded RLC or s-parameter components

• Fast Simulations

– Reduces multi-day long simulations to a few hours or less

• Ease of use – 3D Layout

– Easy translation, import and setup – Maintains trace characteristics and nets from layout – Hierarchical design – Chip/Package/Board – Embedded dielectric layers – Parameterized model for Design Optimization

• Trace width, layer thickness, via dimensions etc. • Manufacturing tolerances (etching factor) • Materials

Benefits of HFSS for 3D Layout

HFSS 3D Classic – 5hrs 15min

HFSS 3D Layout w Classic v15 – 3hrs 41 min

•HFSS 3D Layout meshing advantages – Mesh and solve non-manifold geometry

– Mesh geometries with large aspect ratios

– Layer-based geometry is easier to edit, modify, clean up etc.

Enhanced Meshing in HFSS 3D Layout

¼ of multilayer flip-chip package 20 nets (40 ports)

HFSS 3D Layout w Phi – 11 min

Is there a difference between

HFSS 3D and HFSS 3D Layout ?

Solve a model in both HFSS 3D and HFSS 3D Layout and compare

Note easy export from HFSS 3D layout to HFSS 3D

Multilayer complex package layout

• HFSS 3D compared to HFSS 3D Layout

HFSS 3D CAD

HFSS 3D Layout

Initial Meshing Comparison • Extremely fast initial Phi meshing. Phi is 20X faster!

• 4min vs. 1hr 20min

HFSS 3D - Classic

HFSS 3D Layout - PHI

HFSS 3D – Run Time

• Total: 6hrs 33min

• Adaptive Part: 4hr 1min

• Interpolating Sweep: 2hrs 32 min

HFSS 3D Layout – Run Time

• Total: 3hrs 3min

• Adaptive Part: 1hr 05min

• Interpolating Sweep: 1hr 58 min

HFSS 3D vs. HFSS 3D Layout

Solid HFSS 3D

Dashed - - - - - - - HFSS 3D Layout

Virtually identical results from adaptive meshing

Summary

HFSS 3D CAD HFSS 3D Layout

Initial Mesher Classic Phi

Initial Mesh Size (tets) 763, 953 712, 536

Initial Mesh Time 1hr 20min 4min

Number of Adaptive Passes 6 7

Number of Tets - Final 1, 617, 954 1, 620, 969

Adaptive Passes Run Time 4hrs 1min 1hr 5min (3.7X faster)

RAM 47.6 GB 49.6 GB

Is there a difference between

HFSS 3D and HFSS 3D Layout ?

Example #2: Multi-layer PCB with end to end SMA connectors

3D components drawn as stacked up geometry can be modeled in HFSS 3D Layout

• HFSS 3D Geometry – Include SMA connector body with stands (serve as ground pins)

– Account for true 3D SMA transition to PCB

HFSS 3D Solid Model Design Creation

Lumped Port dimensions

equal to connector pin dimensions

• Added SMA body geometry to a layout stackup

• Port properties created automatically

HFSS 3D Layout Design Creation

Layout View

EM Design 3D View

Stackup Editor Port/pin settings

Results Comparison

• HFSS 3D compared to HFSS 3D Layout

Solid HFSS 3D

Dashed - - - - - - - HFSS 3D Layout

• Phi meshing是突破性的有限元网格生成技术。

• 为IC、IC封装和PCB设计者提供了电路工程师熟悉的操作界面和快速初始网格刨分和快速仿真技术。

• 结合ANSYS HPC技术增加求解规模的可扩展性,支持求解更大、更复杂的层叠结构。

• 分布式直接矩阵求解器(Distributed direct matrix solver)使用多机分布式内存方式求解及其消耗内存的超大型复杂设计。

• 频域分解算法(Spectral decomposition method) 进行多频点并行求解,加快扫频速度。

总结