ic testing and development in semiconductor areamultiple test methods on single tester simple...

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IC Testing and Development in

Semiconductor Area

Prepare by Lee Zhang, 2004


Outline1. Electronic Industry Development2. Semiconductor Industry Development


4Electronic Industry DevelopmentElectronic Industry in Worldwide and in China WideElectronic product revenue in worldwide is $1.5 trillion (US dollar) at year of 2003.Electronic product revenue in China wide is $160 billion (US dollar) at year of 2003, which is about 11% of world revenue.Electronic product revenue in China wide is $180 billion (US dollar) at year of 2004, and it will be reached $270 billion by 2007.


4Electronic Industry Development

Electronic Industry in Worldwide and in China WideElectronic industry revenue in China wide is $227 billion (US dollar) at year of 2003.2003 China electronics export is $124 billion, 1/3 of China total export.


4Electronic Industry DevelopmentElectronic Products Produced on 2003PC revenue was 48 million units.TV revenue was 58 million units.Mobile phone was 211 million units.Communication bandwidth exchange equipments were increased by over 40%.Auto mobile industries were increased by over 40% and will be reached $5.5 billion revenue on 2007.


4Electronic Industry DevelopmentElectronic Products vs. SemiconductorSemiconductor revenue in worldwide is $163 billion (US dollar) at year of 2003.Semiconductor revenue in China wide is $25.2 billion at year of 2003, which is about 16% of worldwide revenue.1) CPU design and development2) DSP design and development3) LCD design and development4) Mobile phone related chip design and development


4Semiconductor DevelopmentHow to look into semiconductor industry development?People give a prediction for 10 years or 50 years or forever in changing or keeping semiconductor materials or factor.Companies change the strategy to challenge the semiconductor industry.More business specialists believe the market is the key to look into.Someone only look for the business cycles to believe the development no ending.


4Semiconductor DevelopmentHow to look into China’s semiconductor industry development?China’s semiconductor industry has a very young age.China’s semiconductor is learning the business strategies from USA, Japan, and Europe.China is not concerning the problem with the world but we need more intellectual properties.China would look into high-end products in semiconductor development.


4Semiconductor DevelopmentThe Strong Point and The Weak Point From China Semiconductor DevelopmentDeveloping traditional and continuous able products (like analog circuit design).Developing new mini product design and simple circuit design (like digital circuit design on mobile phone chip, smart card chip).Semiconductor manufacturing cost reduction and competition (low-end process like 6” wafer manufacture).


4Semiconductor DevelopmentThe Strong Point and The Weak Point From China Semiconductor DevelopmentBuild low cost bases for manufacturing of assembly and testing (like real-state cost, facility cost, material cost and engineer cost).Lack of intellectual property of design and technology. Lack of good base of technology research and professional experience on high-end design. Lack of long-term strategies to invest a research and development center.


1. Overview IC Testing Establishment2. The Types of Tests in IC Manufacture3. The Types of IC Product Tests4. Test Classification 5. Basic Manufacture Test Flow6. Basic Production Test Flow 7. Impact Test Cost in IC Manufacture

Outline


Outline8. Impact Test Cycle in IC Manufacture9. Objectives of Product and Production Testing10. Test vs. Quality and Reliability11. Tester Divided by Test Capabilities12. Tester Divided by Test Functions 13. Other Important Facilities


4Overview IC Test EstablishmentHow is IC test established?From design point of viewFrom manufacture point of viewFrom system design point of viewFrom failure analysis point of viewFrom customer requirement point of view

How important is the testing in IC industry?Measuring new products realisticMonitoring manufacture processEvidence for consumer acceptance


4Overview IC Test Establishment

What is the future development for IC test?Design for self-testSeparate IP core testMultiple test methods on single testerSimple product test with complicated testerReduce software development time


4Types of Testing in IC Mfg.How many are the major types of testing?Design type of test.Manufacture or product type of test.Production type of test.Reliability type of test.Physical failure analysis type of test.

Detail Included Each Test TypeDesign types: design simulation test, design debug test, design characterization test and design qualification test.


4Types of Testing in IC Mfg.Detail Included Each Test TypeMfg and product types: process step test, E (electron) test, engineering test and yield enhancement test.Production types: wafer probing test, assembly package test, final test and QA test.Reliability types: characterization test and qualification test.Physical FA types:


4Types of Product TestingSix Types of Product Testing in IC FieldMemory types – ROM and RAM devices.Logic types – programmable logic devices.System types – embedded, microcontroller, Soc devices.Mixed-signal types – analog and digital devices.RF types – optical and communication devices.LCD types – display driver devices.


4Testing Classification

Memory Testing (SRAM, DRAM, EEPROM, Flash Memory, Embedded Memory)Logic Testing (ASIC, FPGA, PLD, CPU)Mixed Signal Testing (ADC, DAC)SoC Testing (System on Chip Device)LCD Testing (Liquid Crystal Driver)IP Testing (PLL, ADC, DAC, USB, Bandgap, Vregulator, High-Speed I/O and so on)


4Impact of Testing Cost

Requiring huge amounts of investmentsLargely varying with volumesProduct and process maturityProduct and process complexityProduct lead time (testing on wafer, packaging cycle time and package testing)


4Impact of Testing Cycle

Design for Testability (DFT in design side)Characterization (design development)Reliability Assessment (process manufacturing)Pre-production Testing (product engineering)Production Testing (production manufacturing)Yield Enhancement (product engineering)


4Impact of Testing Cycle

Performance Improvement (process engineering)Test cost Reduction (manufacturing side)Product Cost Reduction (production side)


4Objective of Production Testing

Screening sequencePerformance of specificationCollecting data for better controlManufacturing process fine-tuningProgress in yield enhancement process Same product by different classes of performance (speed, vcc range, temperature range, W/R & R/W performance)


4Testing vs. Quality and Reliability

Design of the cell, process and productDebug and characterization of process and productManufacturing machine: equipment, resources,materials and so onThe overall process controlThe reliability assessment of process and productThe overall know-how of the manufacture


4Tester Divided by Test CapabilitiesBench-top Tester (PC based, Power Meter, Power Supply, Oscilloscopes and so on)


4Tester Divided by Test CapabilitiesAutomatic Tester (Advantest, HP93000 Tester, Mosaid Tester and Teradyne Tester and so on)


4Tester Divided by Test Functions

Logic Device (Credence Tester, HP93000 Tester, Teradyne Tester and so on )Memory Device (Advantest, Mosaid Tester)Mixed-Signal Device (Teradyne Tester and HP93000, Yokogawa Tester and so on)SoC/LCD Device (Teradyne Tester and Yokogawa Tester and so on)IP Testchip (Bench-Top and ATE)


4Other Important Facilities

Probe StationHandlerLaser Repair/Laser MarkProbe CardDUT Board

4x1


Outline

1. Purpose of Testing2. Basic Test Flow and DUT Flow3. Basic Test Items4. Test Methodology and Test Flow


1) Purposes of Testing

For Design Houses or for Foundry- Guarantee the products meet design targets.- Pre-screen for reliability test.- Quality assurance to the production process.- Meet customer spec. and requirement.For Customers- Verification of the product’s functions- Monitor the quality of incoming products


2) Basic Testing Flow

ICFabrication Testing Shipped

PartsYield:

Fraction of good parts

Quality:

Defective parts per million (DPM)

Rejects


2) Basic DUT Flow

TestStimulus

DUTResponse

DUT

Pass

Fail

GoodOr

Bad ?


3) Basic Test Items

4DC Parameter Test (Static Test)

4Functional Test

4AC Parameter Test (Dynamic Test)

4Reliability Related Test


4DC Parameter Test

When a voltage or current is measured during the test and the pass/fail results are based upon the measured value

Continuity Test (Open & Short)Leakage Test. (Iil / lih)Output Driving Test (Vol / Voh, Iol / IoH)Dynamic Current Test (Power Consumption)Quiescent Current Test (Standby and Power Down)


4DC Parameter Test (Datasheet)


4Function TestWhen the device is actively performing logical functions. Input data is supplied to DUT and output data is read from the DUT to determine the pass/fail results of the test.

Configuration Test (registers, state-machine and output configuring and logic functionality)Pattern Test (program/verify or write/read and different patterns test and memory functionality)Sense Amplifier Functionality TestBuild-in-Self-Test (BIST and DFT)


4AC Parameter TestAC testing is performed by setting up the appropriate timing values (edge placements) and signal formats as defined in the device AC specification and then executing a functional test sequence.Setup TimeHold TimeOutput Propagation DelayPulse WidthRising TimeFalling Time


4AC Parameter Test (Datasheet)


4AC Parameter Test (Timing Diagram)


- Setup Time

Data Input Setup Time Relative to /WE Low to High TransitionWE

Data In

Setup Time


- Hold Time

Data Input Hold Time Relative to /WE Low to High TransitionWE

Data In

Hold Time


- Propagation Delay

Data In

Propagation Delay

AddressValid Address

Valid Data

Output Propagation Delay Relative to Address Valid Time


- Pulse Width/Rise Time/Fall Time

WE

Data In

Rise Time Fall Time

Pulse Width


- AC Signal Waveform


4Reliability Related TestProgram Cycling TestProgram High Temperature TestBake Between Test from Step to Step Burn-in Between Test from Step to Step


4) Test Methodology & Test Flow

4Test Aspects

4Test Methods

4Block Test Flow

4Test Program Flow

4Software Accomplishment


4Test AspectsDC Test & ParametricAC Test & ParametricFunctional Programming Test Retention / Endurance Reliability TestWrite / Read / Verify Functional TestMixed Signal Converting TestHigh Speed I/O Driver TestCheck Build-In-Self-TestFrequency / Timing Input and Output Test


4Test Methods

Understand Device Technology (Memory, SoCor Mixed-Signal, or Logic CPU)Understand Test Specification and Criteria (Datasheet, Design Architecture)Create a Block Test Flow (Test steps of overall)Create a Detail Spec. Test Flow (Program test flow)Program Development -> Program Debugging -> Program VerificationProgram Delivery to Engineering Test or Production Test


4Manufactury Test Flow

Wafer Acceptance

Testing

DesignDebugTesting

Wafer Sort

Testing

Final (Package)

Testing

QualityControlTesting

ReliabilityTesting

Characterization(Engineering)

Testing

Incoming(Inspection)

Testing


4Production Test FlowWafer

AcceptanceTesting

WaferSort

Testing

Repair IfFailedTesting

Final (Package)

Testing

QualityControlTesting

PackagingIf PassedTesting

MarkingAnd

Testing

FG or Shipping


4Block Test FlowWafer Sort 1

Bake atHigh Temp.

WaferSort 2

Assembly(Package)

Final Test 1

Burn-inFor Monitor

Final Test 2

QA/QCTest


4Test Program Flow

Continuity Test

ICC and Standby Test

ConfigurationOr Logic Test

Program PtnAnd Verify

Bist andScan Test

AC ParameterTest

ProgramPattern & ID

VerifyPattern & ID

AD/DAConvert Test


4Software AccomplishmentWafersort 1(Chip Probing -1) Test ProgramWafersort 2 (Chip Probing -2) Test ProgramFinal Test Program 1Final Test Program 2QA/QC Test Program (Qualification check for delivery test)


4SummaryTesting of complex ICs is responsible for the second highest contribution (after wafer fab.) to the total manufacturing cost of the product.Testing is expensive and will be even more expensive if changes are made.a) Higher integration of circuit (mixed digital and analog signal, Embedded memory)b) High speed signaling (over 500MHz)

ic testing and development in semiconductor areamultiple test methods on single tester simple...

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