industry terminology 工业术语

IPC Market Research

Industry Terminology

工业术语

IPC Market Research

EMS

(Electronics Manufacturing Services)

EMS-- 电子制造服务

Provides assembly services for which you do not own the intellectual property

提供组装服务，但不拥有自主知识产权的公司、企业

IPC Market Research

Original Design Manufacturer(ODM)

ODM-- 原始设计制造商

Provides assembly and system builds services for which the company owns

the intellectual property.提供组装和系统构建服务，

且拥有自主知识产权的公司、企业

IPC Market Research

Vertical EMS CompanyAn EMS company which owns their supply

chain – PCB manufacturing. Sanmina-SCI

纵向 EMS 公司 -- 拥有自己供应链的 EMS 公司如 PCB 制造。 Sanmina-

SCI

Virtual EMS Company

An EMS company which outsources material. Jabil

EMS 公司 -- 其材料均外购的 EMS 公司。 Jabil

IPC Market Research

EMS Size Based on Sales Dollar按销售额 EMS 公司分为：

• Large (Tier I) ---- 大型（ 1 级）Greater than $3 billion---- 大于 30 亿美元• Mid (Tier II) ---- 中型（ 2 级）$400 million to $3 billion ---- 4 亿 --30 亿美元• Small (Tier III) ---- 小型（ 3 级）$100 million to $400 million---- 1 亿 --4 亿美元• Micro (Tier IV) ---- 微型（ 4 级）Below $100 million ---- 小于 1 亿美元

EMS Stock Highlights Q3 2006 2006 年第 3 季度 EMS 股市指数

Large Index has increased +6.7% from last quarter

大型公司指数比上一季度升高了 +6.7% Mid Index has decreased (19.4%) from last quarter

中型公司指数比上一季度降低了 (19.4%) Small Index has decreased (4.2%) from last quarter

小型公司指数比上一季度降低了 (4.2%)• Micro Index has increased +33.7% from last

quarter

微型公司指数比上一季度升高了 +33.7%

IPC Market Research

Global EMS Market Status

全球 EMS 市场状况

IPC Market Research

Regional Shares of EMS/ODM Market 2005 and Forecast 2010

26%23%

45%

6%

20% 18%

5%

57%

0%

10%

20%

30%

40%

50%

60%

North America Europe Asia ROW

2005 2010

2005 年全球各区域 EMS/ODM 市场份额及 2010 年预测

IPC Market Research

Forecasts of North American and Worldwide EMS/ODM Market Growth

(in billions $US)

$189.5$213.4

$240.9$271.8

$290.9

$49.6 $52.6 $55.8 $59.2 $62.8

$-

$50.0

$100.0

$150.0

$200.0

$250.0

$300.0

$350.0

2005 2006 2007 2008 2009

North America Worldwide

北美及全球 EMS/ODM 市场增长预测

IPC Market Research

2005 2010EMS/ODM ($M) EMS/ODM ($M)

North America 49.6 66.3 6.0% Mexico 13.4 27.2 15.2%

EMEA 43.1 59.1 6.5%

Eastern Europe 4.1 7.3 12.1%

Asia 85.4 186.7 16.9%

China 45.1 105.2 18.5%

Rest of the World 11.4 16.4 7.4%

Total 189.5 328.4 11.6%

Revenue by Country CAGR

＊ Revenue by Country—- 国家税收＊ CAGR---- 年均复合增长率

IPC Market Research

* EMS – Served available market

EMS— 部分现有市场* OEM – Available total market

OEM— 全部现有市场

2005 2006 2007 2008 2009 CAGR

EMS 189,512$ 213,642$ 240,956$ 271,888$ 290,945$ 11.6%

OEM 810,372$ 880,672$ 975,366$ 1,060,787$ 1,061,182$ 6.9%

Total 810,372$ 880,672$ 1,060,787$ 1,061,182$ 1,061,182$ 6.9%

Forecast of Global EMS/ODM Market (in $ millions)

全球 EMS/ODM 市场预测

IPC Market Research

Status

of

EMS Market in North America

北美 EMS 市场状况

IPC Market Research

North American EMS/ODM Total Available Market Potential

49.3

175.1

0

50

100

150

200

250

EMS/ODM Market

In B

illio

ns

of

US

Do

llars

Served Available Market Unpenetrated Portion of Market

224.4

22%

北美 EMS/ODM 全部现有市场潜力

IPC Market Research

History, Forecast and Trends in the North American Assembly Market

(in billions of $US)

$-

$10.0

$20.0

$30.0

$40.0

$50.0

北美组装市场历史、预测及发展走势

IPC Market Research

2004 2005 Number Gained

Small (< $20M) 1,015 1,119 104

Medium ($20 - $100M) 252 263 11

Large (>$100M) 220 215 -5

Total 1,487 1,597 110

Estimated Number of EMS Facilities in North America

北美 EMS 企业数量（估计）

IPC Market Research

Historical Trends in Sales Per Employee (Source: IPC Statistical Program)

$0

$20,000

$40,000

$60,000

$80,000

$100,000

$120,000

$140,000

$160,000

$180,000

1997 1998 1999 2000 2001 2002 2003 2004 2005

In M

illi

ons o

f U

.S.

Doll

ars

人均销售额历史数据（来源： IPC 统计项目部）

IPC Market Research

Trends in Source of Revenue All Participating Companies in North America

27%

68%

2% 0% 2% 1% 0%2% 0% 2% 1% 0%

27%

68%

0%10%20%30%40%50%60%70%80%

Value of PCBs and Components

Assembly services (both systems and boards)

TestBoard Assembly Design Services

Product Design Services

Prototypes

Repair Services

2004 2005

北美所有参与公司收入来源走势

IPC Market Research

Percent of 2005 Revenue(All Participating Companies in North America)

System Build32.4%

Assembly 67.6%

2005 收入百分比（北美所有参与公司）

IPC Market Research

Trends in Industry Markets Served by Participating Companies in North America

2004-2006

0%5%

10%15%20%25%30%35%

2004 2005 2006E

北美所有参与公司所服务工业市场走势（ 2004-2006 ）

IPC Market Research

Percent of Company Sales to Major Industry Markets in 2005

(All Participating Companies in North America)

Instrumentation/Medical

22.9%

Industrial Electronics

29.2%

Government/Military 11.1%

Consumer Electronics

1.8%

Computer3.1%

Communication30.8%

Business Retail0.1%

Automotive1.0%

2005 面向主要工业市场的公司销售百分比

IPC Market Research

Customer Longevity in 2005 - All Companies in North America

16.4%14.7%

18.4%

22.5%

28.0%

0%

5%

10%

15%

20%

25%

30%

< 1 year 1 - 2 years 2 - 4 years 4 - 6 years 6 years ormore

2005 客户合作期 ---- 北美所有参与公司

IPC Market Research

Order Sizes as a Percent of Total Dollar Value of All Orders in 2005 & 2006E

19

.0%

32

.5%

1.3

%

23

.0%

5.8

%

36

.5%

14

.5%

37

.5%

1.8

%6.0

%

15

.0%

7.3

%

0%

5%

10%

15%

20%

25%

30%

35%

40%

Fewer Than100 Parts

100-500 Parts 501-1,000Parts

1,001-10,000Parts

10,001-50,000Parts

More than50,000 Parts

2005 2006E

2005 及 2006 年订单规模占所有定单总值百分比

IPC Market Research

Order Sizes as a Percent of Total Dollar Value of All Orders in 2004 and 2005

28.9

%

9.9%

0.9%

39.0

%

20.3

%

2.7%

1.4%

38.4

%

19.4

%

2.5%

28.6

%

8.0%

0%

5%

10%

15%

20%

25%

30%

35%

40%

45%

Fewer Than 100Parts

100-500 Parts 501-1,000 Parts 1,001-10,000Parts

10,001-50,000Parts

More than50,000 Parts

2004 2005

2004 及 2005 年订单规模占所有定单总值百分比

IPC Market Research

Capital Equipment as Percent of Total SalesAll Participating Companies in North America

2.8

%

4.3

% 5.2

%

3.3

%

3.7

%

3.2

%

2.5

%

2.7

%

3.1

%

2.0

%

3.2

%

1.7

%

1.2

%

1.1

% 1.7

% 2.4

%

2.3

%

0.0%

1.0%

2.0%

3.0%

4.0%

5.0%

6.0%

19

90

19

91

19

92

19

93

19

94

19

95

19

96

19

97

19

98

19

99

20

00

20

01

20

02

20

03

20

04

20

05

20

06

E

北美所有参与公司资产设备占总销售额的百分比

IPC Market Research

2004 2005

Through-Hole Components 8.26% 7.90%

Standard Surface Mount 86.36% 84.72%

Fine Pitch Surface Mount (18-25 mils) 3.82% 4.16%

Ultra Fine Pitch Surface Mount (<18 mils) 0.31% 0.96%

Chip Scale Packages 0.08% 0.74%

Ball Grid Arrays and Array Components 1.10% 1.47%

0.00% 0.00%

Direct Chip Attach (wirebond) 0.01% 0.01%

0.06% 0.04%

100.00% 100.00%

All Participating Companies is North America

Percentage and Type of Components Placed on Boards in 2004 and 2005

Flip Chip

Other

TOTAL

2004-2005 北美所有参与公司安装在电路板上的元件类型及百分比

IPC Market Research

Status

of

EMS Market in China

中国 EMS 市场状况

IPC Market Research

Percent of 2005 Revenue (All Participating Companies in Asia)

System Build 55.0%

Assembly 45.0%

2005 亚洲所有参与公司收入百分比

IPC Market Research

Trends in Industry Markets Served by Participating Companies in Asia

2004-2006

0%

10%

20%

30%

40%

50%

2004 2005 2006

亚洲所有参与公司所服务工业市场走势（ 2004-2006 ）

IPC Market Research

Percent of Company Sales to Major Industry Markets in 2005

(All Participating Companies in Asia)

Communication 22.8%

Business Retail 3.0%

Automotive 1.7%

Instrumentation/Medical

9.2%

Industrial Electronics

43.6% Government/Military 0.3%

Consumer Electronics

16.6%

Computer 2.7%

2005 公司销售占主要工业市场的百分比（亚洲所有参与公司）

IPC Market Research

Customer Longevity in 2005 - All Companies in Asia

8.1%

27.0%

40.5%

19.8%

4.5%

0%

5%

10%

15%

20%

25%

30%

35%

40%

45%

< 1 year 1-2 years 2-4 years 4-6 years 6 years ormore

2005 客户合作期 -- 亚洲所有参与公司

IPC Market Research

2004 2005

Through-Hole Components 5.52% 4.36%

Standard Surface Mount 89.68% 87.93%

Fine Pitch Surface Mount (18-25 mils) 2.29% 2.96%

Ultra Fine Pitch Surface Mount (<18 mils) 0.04% 0.80%

Chip Scale Packages 0.02% 0.65%

Ball Grid Arrays and Array Components 1.74% 2.62%

0.00% 0.00%

Direct Chip Attach (wirebond) 0.72% 0.67%

0.00% 0.00%

100.00% 100.00%

Percentage and Type of Components Placed on Boards in 2004 and 2005

Other

TOTAL

All Participating Companies in Asia

Flip Chip

2004-2005 亚洲所有参与公司安装在电路板上的元件类型及百分比

IPC Market Research

GlobalLead Free

Implementation

无铅在全球的实施

IPC Market Research

OEMs - Preparedness for Lead Free Implementation

26%

14%

51%

10%

17%

34%

18%

5%11%

14%17%

9%

48%

9%

18%

0%

10%

20%

30%

40%

50%

60%

Not preparedat all

Selectedsolder but notin production

Selectedsolder and

finishes

Engaged inlead free

prototyping

Fully engagedin lead freeassembly

Ave

rag

e

North America Asia Europe

OEM— 无铅实施准备状况

尚未准备

选择了焊料，但未用于生产

选择了焊料和涂层

完成了无铅样品生产

全部实现无铅组装

IPC Market Research

EMS - Preparedness for Lead Free Implementation

8% 7%6%

78%

15%

5%

65%

10%

4%2%

18%

6%10%

3%

64%

0%

10%

20%

30%

40%

50%

60%

70%

80%

Not prepared atall

Selected solderbut not in

production

Selected solderand finishes

Engaged in leadfree prototyping

Fully engaged inlead freeassembly

Ave

rag

e

North America Asia Europe

EMS-- 无铅实施准备状况

尚未准备

选择了焊料，但未用于生产

选择了焊料和涂层

完成了无铅样品生产

全部实现无铅组装

IPC Market Research

OEMs - Greatest Cost in Lead Free Implementation

Materials 27.1%

PCBs 12.3%

Assembly equipment

12.3%

Components 14.9%

Systems/inventory

management 33.3%

OEM— 无铅实施中的最大成本

IPC Market Research

EMS - Greatest Cost in Lead Free Implementation

Systems/inventory

management 36.2%

Components 15.9%

Assembly equipment

22.3%

PCBs 1.1%

Materials 24.4%

EMS— 无铅实施中的最大成本

IPC Market Research

OEMs - Major Barriers to Lead Free Implementation - Average Rating on a Scale of 1 (least impact) to 5

(greatest impact)

2.7 2.9 2.9 3.6 3.3 3.5 3.8 2.7

2.8 2.9 2.93.6 3.4 3.5 3.8

3.8

2.5 2.7 2.4

3.22.9 3.2

3.5

2.0

0

2

4

6

8

10

12

Solder selection

PCB design & manufacture

Assembly equipment/processes

Component acquisition & labeling

Manufacturing process

Inventory management

Reliability concerns

Others

Av

era

ge

ra

tin

g

Europe

Asia

North America

OEM — 无铅实施中的主要障碍

IPC Market Research

EMS - Major Barriers to Lead Free Implementation - Average Rating on a Scale of 1 (least impact) to 5

(greatest impact)

2.7 3.1 3.4 4.0 3.4 3.8 3.6 3.2

2.6 3.1 3.13.7 3.4 3.7 3.7 2.9

2.63.2 3.0

3.83.1

3.4 3.62.6

02468

1012

Av

era

ge

ra

tin

g

Europe

Asia

North America

EMS — 无铅实施中的主要障碍

IPC Market Research

34%

23%

9%

20%

8%7%

13%

14%

16%

5%7%5%8%12%

20%

5%

25%

9%

13%

49%

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

Today End of 2007 By 2010Year

OEMs - Ratio of Lead Free Versus Tin Lead

100% lead free

90% lead free/10% tin lead








OEM— 无铅与锡铅之比

IPC Market Research

18%

40%

25%

13%

2%

6%

5%

18%

21%

17%

7%

10%

11%

4%

3%

14%

11%

20%

23%

28%

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

Today End of 2007 By 2010Year

EMS - Ratio of Lead Free Versus Tin Lead

100% lead free









EMS— 无铅与锡铅之比

IPC Market Research

Threats to EMS companiesEMS 企业面临的挑战

Lead Free

无铅

IPC Market Research

It is estimated that lead free will increase assembly cost by at least

10%

据估计无铅将使组装成本至少增加 10%

IPC Market Research

Lead Free Technology

无铅技术

Threats to EMS companiesEMS 企业面临的挑战

IPC Market Research

• Solder paste – Sn3Ag0.5Cu焊膏

• Wave solder – Sn3Ag0.5Cu波峰焊用焊料

• Hand solder – 96.5Sn3.5Ag 手工焊用焊料 rework wire• BGA rework – 95.5Sn3Ag0.5Cu BGA 返工 solder paste or paste flux. 焊膏或膏状助焊剂

Solectron Recommendation for Lead Free

Solectron 公司关于无铅的建议

IPC Market Research


Solectron 公司关于无铅的建议Today’s situation 目前状况 1. Tin-lead solder paste with tin-lead components:

Generally O.K.

锡铅焊膏与锡铅元件：通常不会发生问题2. Tin-lead solder paste with lead-free components:

锡铅焊膏与无铅元件： Danger with assembly of lead-free CSP/ BGAs:

Insufficient collapse/realignment/ opens due to low temperature tin-lead assembly profile

组装无铅 CSP/BGA 时会有危险 ---- 由于锡铅组装曲线温度较低，会导致坍塌不充分 / 自对准 / 开路

IPC Market Research

Tomorrow’s situation 未来状况3. Lead-free solder paste with tin-lead components: 无铅焊膏与锡铅元件：

Danger with tin-lead CSP/BGAs: Voiding/ bridging (CSP/BGA sphere reflows before solder paste)

对锡铅元件比较危险：空洞 / 桥接 Are tin-lead and lead-free components and boards rated

to higher lead-free soldering temperatures 锡铅元件同无铅元件及板子一样要经受较高的无铅焊接温度

4. Lead-free solder paste with lead-free components. 无铅焊膏与无铅元件：

Are lead-free components and boards rated to higher lead-free soldering temperatures

无铅元件及板子要经受较高的无铅焊接温度



IPC Market Research

Designated production areas for lead-free wave and rework指定无铅波峰焊和返工生产区域

• Dedicated lead-free wave solder machine指定无铅波峰焊设备 Logistics to separate lead-free SnAgCu and SnPb solder bar

(including triangular shaped bar for lead-free) 在物流方面要分开放置无铅 SAC 和锡铅焊料棒

• Rework solders must be compatible with the manufactured solder – need separate designated lead-free rework area in production and methods to deal with field returns.

返工焊料必须与制造所用焊料兼容 — 必须区分生产中所指定的无铅返工区域和处理现场返回的方法



IPC Market Research

Designated production areas for lead-free wave and rework指定无铅波峰焊和返工生产区域

• Lead-free component and board labeling will be needed to differentiate between SnPb and lead-free assemblies for assembly, repair and rework (Refer to JEDEC standard, JESD97: Marking, Symbols and Labeling for lead-free assemblies, components and devices and IPC 1066 standard for lead-free labeling)

为了便于组装、返修和返工，在锡铅与无铅组件之间必须区分无铅元件

和板子标签（可参考 JEDEC 标准 -JESD97 和 IPC 标准 IPC-1066 ）• Planning of production line is essential for lead-free assembly.

规划无铅组装生产线是无铅组装必需的。



IPC Market Research

1. Site must run qualification test vehicle 现场必须进行资格测试 1. a. SMT a. SMT2. Process (Training/ Support) 工艺（培训 / 支持）3. Equipment 设备4. b. Wave b. 波峰焊5. Process (Training/ Support) 工艺（培训 / 支持）6. Equipment 设备

2. Product Review 产品审核1. Complexity of Product and End-Of-Life of Product (2006) 产品复杂性和产品的（ 2006 ）2. SMT (Quantity and Type) SMT （数量和类型）3. Wave (Quantity and Type) 波峰焊（数量和类型）4. PCB (Material and Surface Finish) PCB （材料和表面涂层）5. Components (Material and Surface Finish) 元件（材料和表面涂层）

Solectron Recommendation for Lead Free-- Site Transition

Solectron 公司关于无铅的建议—现场转换

IPC Market Research

3. BOM Component Scrubbing (Temperature rating, lead-free specifications) BOM 元件整理（温度等级、无铅技术规范）

1. Global Materials Component Engineering Support (Supplier Development Engineering),

全球材料元件工程支持（供应商开发工程）2. Consigned/ Turnkey 委托 / 总承包

4. Prototype Builds (Manufacturing and reliability trials) 原型构建（制造和可靠性试验）5. Pilot Builds (Manufacturing and reliability trials) 试生产（制造和可靠性试验）6. Production 批量生产

Solectron Recommendation for Lead Free-- Site Transition

Solectron 公司关于无铅的建议—现场转换

IPC Market Research

• All Builds on Production Lines using Standard Assembly and Inspection Equipment

采用标准组装和检测设备构建生产线• Approximately 2000 SnAgCu and 200 SnPb boards built

evaluating PCB supplier, solder paste lot and production line 生产约 2000 块 SAC 板和 200 块 Sn/Pb 板，评价 PCB 供应商、焊

膏批次、和生产线• Printing: No issues (Solder Paste Height within specification for

tin-lead and lead-free solder paste) 印刷：无问题（焊膏高度在锡铅及无铅焊膏技术规范范围内）• Placement: No issues 贴装：无问题

Solectron Recommendation for Lead Free-- Production Settings Solectron 公司关于无铅的建议—生产设置

IPC Market Research

• Reflow: No issues (higher temperature profile needed for lead-free SnAgCu paste). Used nitrogen reflow atmosphere (< 100ppm O2) in 10 zone convection oven

再流焊：无问题（无铅 SAC 焊膏需要较高温度的曲线）。在 10温区的再流焊炉中使用氮气再流气氛（ O2< 100ppm ）

• Rework: No issues (higher temperature profile needed for lead-free SnAgCu BGA rework)

返工：无问题（无铅 SAC BGA 返工需要较高温度的曲线）• Visual Inspection: Joint Appearance Related to IPC-610 and

Customer Workmanship Standard Acceptance Criteria

目检：焊点外观应符合 IPC-610 和客户质量标准验收准则

Solectron Recommendation for Lead Free-- Production Settings Solectron 公司关于无铅的建议—生产设置

IPC Market Research

Solectron Recommendation for Lead Free - Summary of Assembly and Summary of Assembly and

Reliability ResultsReliability Results Solectron 公司关于无铅的建议—组装概况及可靠性结果• The solder joint quality is within acceptable limits based on

IPC610 and customer product visual inspection standard 焊点在 IPC-610 和客户产品目检标准的可接收范围之内

• Reliability testing (Temperature and Humidity, Temperature and Voltage, ATC, Unpackaged shock, Unpackaged vibration) indicated the lead-free SnAgCu assembled and reworked boards were as reliable as tin-lead

可靠性测试（温度及湿度、温度及电压、 ATC 、无包装冲击、无包装振动）显示用无铅 SAC 组装和返工的板子与用锡铅组装及返工的板子一样可靠

IPC Market Research

Lead Free Technology - Voiding无铅技术—空洞

IPC Market Research

Number Voids >25 Percent

Cycl

es

to F

ailu

re

20151050

6000

5000

4000

3000

2000

1000

AlloySAC 386SAC 405SAC305SN/Pb

Scatterplot of Cycles to Failure vs Number Voids >25 Percent


IPC Market Research

Reliability Research from the IPC Solder Products Value Council

IPC 焊料产品评估委员会的可靠性研究结果 Based on the number and comparison of solder

joint voids to thermal cycle interconnection failure data, there is no evidence that soldering joint voiding has any significant impact on solder joint reliability

根据热周期互连失效数据中的焊点空洞数量及其对比，没有证据表明焊接点空洞对焊点可靠性有显著影响


IPC Market Research

Lead Free Technology –Tin Whiskers无铅技术— 锡晶须

• Many component manufacturers are changing from tin-lead (90Sn10Pb) to pure tin (100%Sn) and high-tin (>95%Sn) lead-free alloy solderable leadframe/ termination coatings

很多元件制造商将锡铅（ 90Sn/10Pb ）引线框架 /端子可焊涂层改为了纯锡（ 100%Sn ）涂层和高含量锡（ Sn含量 >95% ）涂层

• Pure tin and high-tin lead-free coated components raise concerns about tin whiskers

纯锡涂层和高含量锡无铅涂层元件会产生锡晶须问题• Standardized accelerated tin whisker test method and

whisker length acceptance criteria is needed

急需标准化的加速锡晶须测试方法和晶须长验收准则

IPC Market Research

Lead Free – Inspection无铅 – 检验

SnPb joint: 锡铅焊点semi –smooth and shiny 光滑发亮

SAC joint: SAC 焊点Grainy and shiny 灰暗

IPC Market Research

Addressing

Lead Free Component Issues

by

Solectron

Solectron 正在解决无铅元件问题

IPC Market Research

Solectron Recommendation for Lead Free - Components

Solectron 公司关于无铅的建议—元件• Tier 1 manufacturers have the infrastructure (resources,

capital, etc..) to support RoHS transition1 级制造商具备了支持 RoHS转换的基础结构（资源、资金等）

• Part numbers are changing for RoHS compliance depending on commodity and manufacturer为符合 RoHS,正在改变部件号 , 但取决于具体部件和制造商

• No standard method of identification (marking/labeling) of RoHS compliant components尚无识别符合 RoHS 元件的标准方法（标识 / 标签）

• No standard method of reporting RoHS environmental data (IPC-1752 materials declaration standard now released)

尚无报告 RoHS环境数据的标准方法 (IPC已发布 IPC-1752 材料声明标准 )

IPC Market Research

Logistics Part Marking Package Marking Strategy Timing

Part Number Change

(Could MFG both Pb and Pb Free)

Marked with standardized symbology

Outer Package may be marked with a standard or non-standard

symbol

Change all Part Numbers

In Accordance With European Requirements

Part Number Remains the Same/ Date Code Cut-Over

Marked with their own

symbology

Inner Package may be marked with a standard or non-standard

symbol

Change Only Part Numbers in Parallel to Supplier Part

Number Changes

Before European

Requirements

Transition Date Only

No MarkingsNo Package

Marking

Don't Change Any Part Numbers

After European Requirements

or Never Change

Manufacturer Customer


Solectron 公司关于无铅的建议—元件

IPC Market Research

Solectron has created new site part numbers for all RoHS compliant assemblies and all

of their BOM components, regardless of the actions of component manufacturers or

customers.

Solectron已经对所有符合 RoHS 的组件及所有其 BOM 上的元件建立了新的现场部件号，无论元件制造商或客户是否针对 RoHS采取了行动。


Solectron 公司关于无铅的建议—元件

IPC Market Research

• Clear physical and financial separation of the supply chain (i.e. Inventory, Demand, Supply)

从物流上和财政上明确区分供应链 (如库存、要求、供应 )• Fully utilize MRP (Material Requirement Planning) System 全面采用 MRP （材料需求计划）系统• Will be able to use effective dates to phase in/ phase out part

numbers 能够利用有效日期使用或淘汰部件号• Clean BOMs (Bill of Materials), AMLs (Approved Materials Lists)

and Orders 整理 BOM （材料清单）、 AML （经认可的材料表）及定单• Lowest risk of mixing inventory in warehouses 使仓库中物料混存风险最低化• Easier to capture and recover E & O (Excess and Obsolete)

created by the switchover 简化由于转换而产生的 E&O(过剩和废弃 ) 元件的收集和回收



IPC Market Research

• Do you have a clear RoHS roadmap?你是否有清晰的 RoHS 路径图

• What are your plans to migrate to ROHS 6/6 compliance?你计划如何转向符合 ROHS 6/6？

• The Original Equipment Manufacturer (OEM) is responsible for Certificate of Compliance and process data to manufacture product and for liability coverage.

原始设备制造商要对制造产品所需的符合和工艺数据的证明及可靠性负责

• Approved components (MPNs) on Approved Manufacturers List (AML).

经认可的材料表（ AML ）内的认可元件• Existing inventory. 现有的库存• Existing inventory at EMS manufacturers. EMS 制造商的现有库存

Solectron Recommendation for Lead Free - Customers Requirements

Solectron 公司关于无铅的建议— 客户要求

IPC Market Research

• Clear separation of compliant and non-compliant inventory符合及不符合的库存分离

• Preferred method: change part numbers to distinguish RoHS-compliant components, assemblies and product最好的方法：为了区别符合 RoHS 的元件、组件和产品，改变部件号

• Need formal manufacturing communication process (such as an ECO/MCO) to request process and part changes rather than sending alert notices

需要正式的制造传达过程（如 ECO/MCO ）去申请工艺和部件改变，而不是只送警示通知而已。



IPC Market Research

Overall RoHS Compliance is the Responsibility of the OEM

整个产品符合 RoHS 是 OEM 的责任• Product compliance: OEM 产品符合： OEM

• Process materials: EMS Provider (e.g. Solectron) 工艺材料： EMS 企业（如 Solectron ）• Component compliance: Component Manufacturers

元件符合：元件制造商



IPC Market Research

Plan to Minimize Excess and Obsolete Component Issue

过剩和废弃元件问题最小化计划• Change part numbers for RoHS compliant components

改变符合 RoHS 元件的部件号• Change part numbers for RoHS compliant product 改变符合 RoHS 产品的部件号• Change part numbers to distinguish between non-compliant

and compliant components and product 改变部件号以区别不符合与符合元件及产品



IPC Market Research

Lead Free Component Issues无铅元件问题

Another/Similar

Approach by a Major EMS Company

in Asia

亚洲一家著名 EMS 公司采用了另一种 / 类似方法

IPC Market Research

Lead Free Component Issue无铅元件问题

First Choice for Component Manufacturers首先选择元件制造商

Component Suppliers will include a suffix that denotes it is a lead free part and

conforms to ROHS元件供应商应在部件号后加后缀

表明该部件是无铅部件，符合 ROHS

IPC Market Research

Second Choice for Component Manufacturers其次选择元件制造商

If the EMS company receives a component without a lead free suffix the component

manufacturer needs to provide a certificate of compliancy

如果 EMS 公司收到了没有无铅后缀的元件，元件制造商必须提供符合证明

Lead Free Component Issue无铅元件问题

IPC Market Research

Threats to China EMS Companies中国 EMS 企业所面临的威胁

Geographic Regions地理区域

IPC Market Research

Geographic Regions - India地理区域– 印度

• Strategically located as hub for services throughout Asia 从战略上讲，其位于整个亚洲的服务中心• Currently - best positioned as source for India-destined product 目前，是销往印度产品的最佳地点• Growing economic and consumer base 正成长为经济和消费基地• Limited infrastructure capabilities 有限的基础设施能力• Lack of centralized government combined with high amount of

red tape 缺乏有力的政府及相应的政策支持• Some major EMS companies currently in India 一些著名的 EMS 公司均在印度设有工厂• Technology OEMs polled rank India highest among locations

best suited for outsourcing electronics design* 技术型 OEM 公司对最适合于外购电子设计的地点进行投票，印度得分最高

IPC Market Research

Geographic Regions – Mexico地理区域– 墨西哥

• Close to the United States, same time zone 接近美国，时区相同• Shift from low-mix, high-volume to high-mix low volume

capabilities 正从少品种、大批量转向多品种、小批量• Companies are realizing the importance of applying lean

principles 公司正认识到政策倾斜的重要性• Good location for companies with high transportation costs or

quick turnaround requirements 对于运输成本较高或要求快速响应的公司是不错的地点• Shortages of skilled management and specialized, technical

employees exist 缺乏有经验的管理人员和专门的技术人员• Technology OEMs polled recognize Mexico as a better

destination source for outsourcing electronics manufacturing than design*

技术型 OEM 公司投票认为墨西哥更适于作为外购电子制造的地点

IPC Market Research

Geographic Regions – Russia地理区域– 俄罗斯

• Driven by market liberalization & European integration 市场自由化及欧洲一体化• Low trade barrier & low wages 较小的贸易障碍且工资较低• Infrastructure requires upgrades 基础设施需要升级• Supply chain not as developed as in China 供应链的开发不如中国• Technology OEMs polled rank Russia relatively low among

countries best suited for outsourcing electronics design and manufacturing*

技术型 OEM 公司对最适合于外购电子设计和制造的地点进行投票，俄罗斯得分较低

• Corruption 贪污腐败

IPC Market Research

Geographic Regions – Thailand地理区域 – 泰国

• Quality workforce, low attrition 劳动力素质高、低耗损• Country recognizes the importance of electronics manufacturing

as a doorway to prosperity 国家认识到电子制造是走向繁荣重要性路径之一• Active government involvement to protect the EMS industry 政府积极干预保护 EMS 行业• EMS providers polled rank Thailand as the second best location

for cost-effective outsourcing manufacturing* EMS 供应商投票认为泰国是外购制造的第二最佳地点• Extra incentives in place to promote R&D projects 额外的激励以推进 R&D 项目• Difficult for foreigners to own local firms 外国人难以拥有当地公司• Seems to be a lack of cooperation among the various state

agencies 各种国家机构似乎缺乏合作

IPC Market Research

Geographic Regions – Vietnam地理区域 – 越南

• Late-comer to the global EMS stage 全球 EMS舞台的后来者• National IT strategy different from that of Singapore and South

Korea in the 60s and 70s 国家 IT策略与 60 、 70 年代新加坡和韩国有所不同• Vietnam’s industry set up its industry through different sourcing

arrangements based on varying stages of production 根据生产的各个阶段，通过不同的资源配置安排建立自己的工业体系• Good location for systems integrators and computer re-sellers 系统集成商和计算机销售的良好地点• Lack of same-level assembly technology for SMT, circuit assembly

vs. other low-cost regions. 与其他低成本区域相比，缺乏相同水平的 SMT 、电路组装用组装技术

IPC Market Research

Threats to China EMS Companies中国 EMS 企业所面临的威胁

Cost of Raw materials原材料成本

IPC Market Research

Cost of Raw Materials原材料成本

IPC Market Research

Cost of Raw Materials - Solder原材料成本 – 焊料

263% costof metals increase

IPC Market Research

Cost of Raw Materials – PCBs原材料成本 – PCB

• Due to yield improvements, material costs and productivity, ½ oz foil is now lower cost than 1 oz. (Heavy copper detrimental to productivity)

由于产量提高、材料成本及生产效率， 1/2 盎司铜箔的成本低于 1 盎司

• Japanese laminate producers raised Fr4 pricing on average 30% in June

日本层压板生产商在今年 6 月将 FR4 的价格平均提高了 30%

• Glass Suppliers forecasting ~ 3% - 10% additional price increases for Q306

玻璃供应商预测 06 年第三季度玻璃的价格会增加 3%-10%

• Resin Suppliers forecasting ~ 3% - 5% additional price increases for Q306

树脂供应商预测 06 年第三季度树脂的价格会增加 3%-5%

IPC Market Research

1

1.1

1.2

1.3

1.4

1.5

1.6

1.7

US$ index/sq. ft.

Laminate Price Trend

Cost of Raw Materials – PCBs原材料成本 – PCB

IPC Market Research

Financial View of EMS IndustryEMS 行业的金融纵览

IPC Market Research

Cyclicality: High 周期性：长Visibility: Low 透明度：低Competition: High 竞争性：激烈Outlook: Uncertain 前景：不确定

Financial View of EMS IndustryEMS 行业的金融纵览

IPC Market Research

Financial View of EMS Industry - Cyclical EMS 行业的金融纵览 — 周期

Need to Control Cash Flow

需要控制现金流转 Critical to Manage Balance Sheet

严格管理资产负债表 Maintain Breakeven as Low as Possible

尽可能维持低亏损 Investors Try to Time the Market

IPC Market Research

Financial View of EMS Industry – Low Visibility

EMS 行业的金融纵览 — 低透明度Conservative Financials保守金融

Secure Cash Flow 可靠的现金流转 Right-Size Balance Sheet 适当的资产负债表

Potential Improvements潜在的改善

Customer Relationships 客户关系

Long-Term Contracts Upselling

Better Forecasting 更好的预测

IPC Market Research

Financial View of EMS Industry – Highly Competitive

EMS 行业的金融观点 — 高竞争性• Overcapacity 产能过剩• Power could reside with ODMs • OEMs may bring work back in-house OEM 可能会自己完成制造• Bubble Infrastructure 泡沫基础结构

• Easy Money and Credit Delayed Natural Cleansing Process

• Not getting paid for services – lead free

IPC Market Research

Opportunities for

EMS Companies

EMS 企业的机遇

IPC Market Research

Opportunities for EMS Companies EMS 企业的机遇

Lead Free无铅

IPC Market Research

Opportunities for EMS Companies – Lead Free

EMS 企业的机遇 — 无铅 Market differentiator for your company

无铅是划分市场标杆Validate your companies ability to meet lead

free requirements:证明你的公司能够满足无铅要求

Certification?认证？

Materials Declaration?材料声明？

IPC Market Research

IPC Market Research

Opportunities for EMS Companies- Materials Declaration

EMS 企业的机遇 — 材料声明 • Part of a family of supplier declaration standards 供应商声明标准系列部分• Exchange of detailed materials composition throughout the supply chain 交换贯穿供应链的详细材料成份• Establish electronic data formats

建立电子数据格式• Provide a PDF-based form

提供 PDF 格式• IPC MOU with Adobe IPC 已同 Adobe 签订了协议 • Users can edit the PDF form using the free Acrobat Reader 用户可使用免费下载的 Acrobat Reader 编辑 PDF 格式• Automated data extraction

自动数据提取

IPC Market Research

Opportunities for EMS Companies

Market ForcesEMS 企业的机遇 — 市场推动力

IPC Market Research


EMS companies have 20% - 30% of total available market for electronics assembly.

EMS 企业占有电子组装整个现有市场的 20%-30%

Companies can grow market share企业可增加市场份额

in good times and 迅速

bad

more room to grow.更多的成长空间

IPC Market Research

Opportunities for EMS Companies – Market Forces

EMS 企业的机遇 – 市场推动力Market/Customers will reward:

市场 / 客户回报：• Virtual versus Vertical EMS companies

纵向 EMS 企业• ODMs may alienate some OEMs which could be positive for

smaller EMS companies

ODM 可能会疏远积极寻找小型 EMS 企业的 OEM

• Large EMS companies/ODMs have a hard time working with industrial and medical markets

大型 EMS/ODM 企业在工业 / 医疗市场会有一段艰难时期

IPC Market Research


Design is Critical

To

Success and Market Differentiation设计对于成功及市场划分非常关键

IPC Market Research

Opportunities for EMS Companies – Design

EMS 企业的机遇 – 设计 According to Dr. Dongkai Shangguan, Senior Director, Flextronics International:伟创力国际的高级主管上官东恺博士说：

• Approximately 80% of the product’s cost is determined in the design stage.

约 80% 的产品成本决定于设计阶段• Up to 80% of the total cost of a product is determined in the New

Product Introduction process 在新产品导入过程中可确定达 80% 的产品总成本• Leveraging EMS involvement early on in the design stage can result in a

25% reduction in product cost and 25% reduction in time to market. EMS尽早渗入设计阶段会使成本降低 25% ，上市时间缩短 25%

IPC Market Research


EMS 企业的机遇 – 设计Dr. Shangguan: What happens when design is ignored.上官东恺博士说：忽视设计会导致• Resolving issues can require substantial changes to the

design. 需要改变设计来解决问题

- Cost 成本- Cost of product development 产品开发成本 - Cost of quality 质量成本

- Time to Market 上市时间- Lost Opportunities 贻误商机

The more competitive the market the higher the risk 竞争越激烈，风险越高

IPC Market Research


EMS 企业的机遇 – 设计Dr. Shangguan: What happens when design is ignored.

上官东恺博士说：忽视设计会导致• As technologies continue to increase in complexity, the grater

the changes for divergence between whit is designed and what get manufacturered.

技术复杂程度的提高，导致设计者和制造商的摩擦不断增加 - Unless companies make specific efforts to reduce this effect

through design/manufacturing collaboration.

除非企业做出针对性的努力来减少这种设计 / 制造摩擦

IPC Market Research


EMS 企业的机遇 – 设计

Product development requires much more manufacturing involvement than in

the past.

与过去相比，产品开发要求更多地涉及制造

IPC Market Research


North America and Europe

IPC Market Research

Opportunities for EMS Companies – Partnerships

EMS 企业的机遇 – 合作China EMS can be low cost/volume

provider中国 EMS 企业是成本低 / 产量高的供应商

However: 但是• Strong communication necessary 必须加强沟通• Reluctance because of quality issues 质量问题导致不愿和中国的 EMS 企业合作 • Reluctance because China EMS can take away customer 不愿和中国的 EMS 企业合作 – 可能带走客户• Can establish their own plant in China 会建立自己在中国的工厂

IPC Market Research

Opportunities for EMS Companies – Other Considerations

EMS 企业的机遇 –其他需要考虑的事项

Productivity生产力

Quality质量

Intellectual Property知识产权

Workforce Training 人力培训

IPC Market Research

Understand

IPC Standards

and Certification Programs

了解 IPC 标准及认证课程


IPC Market Research

Questions提问

industry terminology 工 业 术 语

Documents

industry terminology 工业术语