innovations in eda: multi-technology rf design using the ...bbs.hwrf.com.cn/downrf/ads2011.pdf ·...

Joe CivelloADS Product Manager

Agilent Technologies

Welcome

© Agilent Technologies 2011

Agenda

• RF & microwave market trends & how Agilent EEsof is investing its R&D• Multi-technology design with ADS 2011 - demo• New capabilities for all RF & microwave engineers

– Circuit design & simulation - demo– EM modeling (Momentum and FEM) - demo– Load Pull for improved PA matching network design - demo– Layout - demo– And more …

Complete MMIC/Module ADS Desktop Design

RF & Microwave Market Trends

Increasing Complexity & Integration• Commercial wireless and Aerospace/Defense Industries are rapidly moving

from single packaged MMICs, to larger, more complex ICs in multi-chip RF modules

• Today’s flows combine multiple, poorly integrated tools, which are not able to address multiple technology design and verification

• The IC, laminate, package, and PCB system need to be designed together, interactively

• Electro-magnetic interactions between substrates need to be modeled

ADS 2011: The IC/Module/Package/PCB Design SolutionRealizing the Multi-Technology Vision

Multi-Technology Circuit Design• Multiple die (IC and IPD)• Multiple substrates (die, laminate, LTCC,

package, PCB)• Multiple process design kits (PDKs)

– GaAs (HBT, pHEMT), GaN, SiGe, Si …

Integrated Electro-Magnetic Solvers• Multi-Technology EM simulation

– Full 3D EM Simulation• Finite Element Simulator• Parameterized Solid Models of Components

• Multi-layer 3D Planar EM simulation• Easy EM simulation for the every engineer

Mounted on Board

Multiple ICs Multiple Technologies

On Laminate &Packaged

Designing Across Multiple Technologies

The Multi-Technology Challenge

LNAGaAs Mixer

SiGe

RF Module Laminate

Layer Defs

AEL Cust

Single Technology Space

Traditional Design Tools• Designed to handle one

type of design– IC, Module, or PCB

• Have a single technology definition space

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True Multi-Technology Management

LNAGaAs

MixerSiGe

RF Module Laminate

Lam:Components

Lam:Material Prop

Lam:Layer Defs

Lam:AEL Cust

SiGe:Components

SiGe:Material PropSiGe:Layer Defs

SiGe:AEL Cust

GaAs:Components

GaAs:Material PropGaAs:Layer Defs

GaAs:AEL Cust

ADS 2011 Multi-technology Environment

New Library construct maintains separate technology definition areas• No namespace collisions• No layer mapping needed• No PDK conflicts

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Multi-Technology Design & Library Management

Multi-Technology Circuit Simulation

• Simulate critical circuits across multiple technologies• Design closer to the margins• Detect and solve issues before manufacturing

Module Laminate

MixerSiGe

LNA GaAs

Native Physical Multi-Substrate Support

• Easily add one or more pre-defined substrates– IC in a package, IC in a module,

module on a board, etc.• Unlimited levels of technology stacking

– i.e. IC on a module on a PCB• Supports flip chips, wire bonding, and

backside mounting• No modification of layers required• Directly modify any of the designs

– No flattening required• Works with all the ADS tools

– Layout, 3D Visualization, Momentum and FEM, etc.

Easy to combine multiple substrates

New graphical substrate editor

ADS Integrated 3D EM FlowMomentum & FEM in ADS, 3D EM Components & EMPro/FDTD link

EMPro PlatformADS Platform

FDTD SimulatorFEM SimulatorMomentum Simulator

Parameterized3D EM

Components

LayoutCAD Data

Multi-Technology EM SimulationCapabilities & Vision

• Discover coupling effects prior to fabrication

• More effectively optimize design elements for final packaging

• More easily make design trade-offs

• Help diagnose and solve performance problems

+ =

3D view FEMMomentum

+

Package IC IC

Multi-technologyEM Simulation

Improved RF Circuit Design and Simulation

ViewsEasily Manage Models & Design Representations• Cells represent a single design

object• Cell Views provide multiple

representations of that design object– Different schematic variants,

behavioral, measured, layout, EM data views, etc.

– User defined• Simplifies schematics• Easily select simulation model• Explore design variants

Cell name

Views

Dynamic Simulation Model Selection

Design, by its nature, is evolutionary. Selecting model type and accuracy is key to this. This makes it simple and virtually instantaneous.

• Easily select the model to use for simulation– Tradeoff speed vs. accuracy

• Works on one or more selected components

• Current active model is shown on the schematic

• Easily create a model priority list to work on entire design hierarchy

Major Improvements to Load PullFrom load pull to design in a few clicks

• New load pull data controller– Handles Maury load pull data

• Direct, instant loading of load pull data– Handles multiple files– Easier review of data

• Immediately simulate matching network– Easier design optimization, including

improved discrete optimization– Automatic interpolation of scattered

measurement data• Automatically display performance

parameters

Fast, Easy, Intuitive

Making EM Simulation Part of Everyone’s Design Flow

New Graphical Layer Definition

• Graphical, unified entry of layer and stackup data– Defines layers and properties for Layout, Momentum, and FEM

• Easy drag and drop operations– Easily select and modify properties

• Simpler, faster, and less error prone

New Streamlined EM SetupMaking EM Work for Everyone

• Single dialog replaces 8 – Easily navigate & review the setup options• Same setup for Momentum, Momentum RF, & FEM

– Easy to try different solvers on the same design• Setup is automatically saved and can be reused for other EM simulations

Previous EM Setup ADS 2011

Reusing Saved EM Setup ConfigurationsMaking EM Work for Everyone

• Makes it possible for non-experts to create accurate EM models

• Big productivity improvement for all users• Easier to experiment with different setup

options

FoundryPDK

EMExpert

PackagedWithADS

DesignEngineer

Designer’sown setups

Saves Mouse Clicks (30 down to 3)

Use saved setups on new work

New Integrated EM Port Viewer/Editor

Features of new Port Editor• Copy a value and paste to

multiple ports• New filtering

– Quickly find ports by attributes

– Filter on one or multiple attributes

• Automatic port generation• Automatic port re-

sequencing

Auto

Multi-port Editor

CombinedMulti-port

Viewer & Editor

Single port Editor

Preprocessor Mesher (2nd generation ) Solver

New Momentum 2nd Generation Mesher

• Increased accuracy, robustness and performance– Fast floating-point interval arithmetic

• Improved mesh quality– Avoids slivers– Improved handling of small and wide

shapes– New algorithm for edge mesh and

overlap extraction• Reduced mesh complexity

– New quadranglesrectangle

NEWquadrilateral

triangle

OLD

NEW

Example: PDN impedanceFreq sweep 0-3 GHzMatrix size: 17.501

2005 2008 2010

solve time

load time

solve time

load time

load time

2003

Release Load Solve Storage

2005A

2008U12011

dense (N2) direct (N3) dense (N2)

dense (N2) iterative (NpN2) dense (N2)

dense (N2) direct (NlogN)1.5 sparse (NlogN)

sparse (NlogN) direct (NlogN)1.5 sparse(NlogN)

2003A

Momentum Solver – 5 years of (R)evolution

* Performance will vary dependent on complexity, frequency and other factors

Expanded Bondwire Support• New, fast analysis of bondwires in Momentum

– Automatically modeled as part of Momentum simulation

– Calculates self and mutual inductance– FEM provides the most accurate analysis

• Bondwires work for both Momentum and FEM– Easily create the bondwire in Layout– Full parametric control of bondwire profile

• Jedec Bondwire – Follows the JEDEC standard parameters

• Shape Bondwire – More flexible control of the bondwire profile

• Bondwires now have edit handles

Set parameters

Create and edit in 2D

Render in 3D

Layout

Layout Usability: Object Handles

• Directly work on objects – quick & efficient• Objects with handles

– Arcs, Circles, Polylines, Polygons, Rectangles, Text

– Transmission Lines, Paths, Wires, Traces, Annotations, Wire Labels, Rulers, Dimension Lines

• Infrastructure available for end user customization– Add handles to pdk components and

design kits– Customizable behavior

Layout Command Line & Toolbar

• Command line provides efficient keyboard entry for common functions • User can add their own functions to the command line• The toolbar provides single click operations for frequently used features

– Set vertex selection on/off, control pin-number display and align shapes

Layout Command Line - Current Functions

Performance w/ & w/o package

Accurately predict real performance

QFN DesignerPredict Packaged Performance in Minutes

Quickly synthesize complex package, combine with IC & PCB data

Configure QFN package

And much more …

Data Display Improvements• Improved Smith Chart graphics

– Better display of chart values– Better overall look and data granularity

• Set color for a group of traces – Easier interpretation of sweeps

• Improved Data Display Template Browser – Real time quick search – Direct editing of template properties– Save As and Delete from the Browser

Other 2011 Improvements – Circuit Simulation• Linear Simulation Speedup - up to 10X

– For fully-linear circuits with swept, tuned, or optimized simulations• Improved Transmission line models (including multi-layer library)

– More accurate broad-band skin effect calculation– New, advanced method of calculating surface roughness loss– More accurate calculation of Power/Ground Plane loss

• Output simulator results in Matlab format– New controller makes it possible to filter the output

• New models supported– NXP SiMKit 3.4, PSP 102.3.4 and 103.1.1, Mextram 504.8, BSIMSOI 4.3.0, BSIM 4.6.5,

HiSIM_HV 1.2.0, MOSVAR 1.1, R3, PSPICE diode

• Support for Verilog A now included as part of ADS Core for use with all simulators

Other 2011 Improvements

• Desktop LVS Viewer can now display Calibre errors• Backside component support• Allegro/ADS link (IFF for Allegro) now included in shipping product • New entry mode for circles and rectangles

– Use CTRL key and first point will be the center of the shape• New Array Reference (AREFs) objects to Layout

– Much more memory efficient way to create large arrays of objects• Advanced Model Composer (AMC) models can now be created with FEM • Layout connectivity engine is up to 40X faster than previous releases• Layout layers can now have sub-layers (purposes)

– Can visually distinguish different objects drawn on a layer

Signal Integrity/Power Integrity

• Power Integrity with Momentum– Unique capability for PI analysis on split

power/ground plane PCBs– Accurate modeling of multi-GHz effects– Easy setup with SI/PI Analysis tool

• IBIS AMI simulation support– Fast, accurate SERDES models for ‘what if…?’

channel simulation

• More accurate modeling of high frequency effects in PCB transmission lines (multi layer models library and Momentum)– Surface roughness of copper traces– MLM causal dielectric loss algorithm now added to

Momentum also

Improved Accuracy for Conductor ModelsNew Multi-level Hemispherical ModelAvailable in Momentum and Circuit Simulation

Closer correlation to measured data Hammerstad

Hemispherical

NEW Multi-level

2 4 6 8 10 12 14 160

-5

-4

-3

-2

-1

-6

0

freq, GHz

Measured Data

Agilent 5500Atomic Force Microscope

• More accurately reflects conductor surface• Can use AFM measurements to set params

Support for International Character Set

• Can create annotations / documentation with international characters• Provided in schematic and data display

ADS 2011 Summary

• ADS 2011 new capabilities for multi-technology RF design• ADS 2011 makes electromagnetic simulation easier for all designers• New circuit and electromagnetic simulation technologies increase

performance and usability• New physical design capabilities to make ADS Layout more powerful• IBIS-AMI simulation support & new Signal Integrity/Power Integrity wizard

for split Power/Ground planes

Agilent EEsof EDA“Innovative Solutions,Breakthrough Results”

Questions?

For More Information

Agilent ADS 2011 Web page (new feature details)

www.agilent.com/find/eesof-ads2011

ADS 2011 on YouTube

www.youtube.com/user/AgilentEEsof

ADS 2011 Overview (Quick Start Video, Multi-technology Tutorials, …)

www.agilent.com/find/eesof-ads2011-overview

http://www.agilent.com/find/eesof-ads2011�

http://www.youtube.com/user/AgilentEEsof�

http://www.agilent.com/find/eesof-ads2011-overview�

You can find more webcastswww.agilent.com/find/eesof-innovations-in-edawww.agilent.com/find/eesof-webcasts-recorded

You are invited

Amolak BadeshaSenior Application Expert Agilent Technologies

http://www.agilent.com/find/eesof-innovations-in-eda�







http://www.agilent.com/find/eesof-webcasts-recorded�





Innovations in EDA Webcast Series: Multi-Technology RF Design Using the New Advances in ADS 2011

ADS 2011:The IC/Module/Package/Board Design Solution

Joe CivelloADS Product ManagerAgilent EEsof EDA

July 2009

Agilent EEsof EDA Overview

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