Automotive MCU in a Fast-Changing Environment快速变化市场中的汽车微控制器

Jason Yang – Automotive MCU Marketing Manager杨金晶 – 汽车微控制器市场经理M a r c h . 2 0 1 5

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>50 Year Legacy

>5,500 Engineers

>6,000 Patent Families

A Global Leader in Automotive MCU

汽车微控制器供应商的领导者

Microcontrollers

Digital Networking

Automotive MCU

Analog & Sensors

RF

Five Core Product

Groups

Four Primary

Markets

Automotive

Networking

Industrial

Consumer

Freescale shipped over 370M automotive MCUs (>4 per car) in 2012

Freescale is in approximately 50 million new vehicles / year

飞思卡尔为市场提供超过3.7亿片汽车微控制器（平均每辆车超过4片），

每年超过五千万辆新车使用了飞思卡尔的汽车微控制器

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Agenda

• Automotive Market Trends

车身电子市场趋势

• Automotive MCU Trends and Challenges

汽车微控制器的趋势和挑战

• FSL Automotive MCU Accelerate Your Business

飞思卡尔汽车MCU产品和方案助力您的事业

• Conclusion

总结

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Automotive market trends

车身电子市场趋势

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Body Market Trends and Challenges 车身电子市场趋势

Connected

Cost Efficient

Green

Safe and

Secure

• More complex Gateways with higher performance and

multi-core usage (Expanding memory )

• Ethernet and wireless communication

• Personalization options driving LIN nodes

• Functional Safety - ISO26262

Several body-apps need ASIL A/B (some C/D)

• Reduced ASIL-assessment effort

• Security/Cryptography for Gateway and BCM modules

• Power management in stop and run modes

• Autosar SW management of partial/pretended networking

• EC-motors, LED-lighting

• Cost reduction via ECU integration

• Electrification of the car replacing mech. components

• Scalability of hardware and software

• Auto generated code to decrease dev costs

Software

Integration:

• Autosar:

• Multicore-support

• OS

• MCAL

• Safety:

• SW-routines

supporting self-test

(Core/Memory)

• Security:

• Cryptography

algorithmic support

• Application-support

• Motor Control-library

• Reference designs

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0

20

40

60

80

100

120

2000

2002

2004

2006

2008

2010

2012

2014

2016

2018

2020

2022

2024

2026

Light Vehicle Production (Million)

World Total

N. Amer, Japan,

Europe, S. Korea

BRIC, ROW

Vehicle Production’s Shifting Global Footprint

全球机动车产量预测

• World Light Vehicle production is

forecasted to double in the 25-

year period (2000-2025)

• All of the Growth is in Emerging

Markets

Source: IHS Automotive (Feb‘14)

Region 2000-2025 CAGR

N. Amer., Japan,

Europe, S. Korea 0%

BRIC, ROW 8%

Worldwide 3%

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Automotive Processors Per Vehicle Trends

每一辆汽车上的汽车微控制器增长趋势

$0

$20

$40

$60

$80

$100

$120

2007 2013 2020

Auto Processor Content per Vehicle ($)

N. America

Japan

Europe

S. Korea

China

India

World

Avg.

0

5

10

15

20

25

30

35

40

45

2007 2013 2020

Auto Processors per Vehicle

N. America

Japan

Europe

S. Korea

China

India

World

Avg.

Source: Strategy Analytics (Jan ‘14)

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Market Trends and Challenges for

Automotive MCUs

汽车微控制器的趋势和挑战

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Automotive Electronics Architectural Trends

汽车电子网络结构的进化

Today/Near Future

Gateway

ECU

Infotainment

Gateway/

Centerstack

Ethernet

Cameras

Diagnostics/

Programming

Distributed Electronic Control Units

One ECU per mechanical function - connected by

multiple CAN and LIN interfaces

Distributed Computing

Major computing nodes on a high-performance network

organized by “domains” that control distributed nodes.

Future (2018+)

Torque

Management

Driver Interface

(HMI)

Vehicle

Dynamics &

Safety

Body, Security

Lighting

Engine

Transmission

Electric

Motor

Generator

Seats Mirrors Doors Lighting

Navigation Instruments

Multimedia/

Telematics

Entertainment

Driver

Controls

Steering

Dampers ADAS

(Radar,Camera)

Airbags Tensioners

Ped. Protection

Brakes Dynamics

Sensors

Auto MCU: More performance, more embedded memory, more safety for

less cost, less power and less development effort

市场对汽车微控制器的要求：更高性能，更大内存，更多安全，

更低价格，更低功耗，更低开发成本。

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Challenges for Body Electronics 车身电子面临的挑战

• Central Gateway need high performance and high scalability.

中央网关需要高性能和高扩展性.

• Limited R&D Cost - different applications need share

common platform to reuse software/hardware/toolchain.

控制开发成本 - 不同应用需要共享软硬件平台以使得软件/硬件/

工具链能够最大程度的重复使用。

• Smart distributed CAN/LIN nodes require smaller size and

lower cost.

智能分布式CAN/LIN节点需要更小体积更低成本

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Freescale Automotive MCU Overview

飞思卡尔汽车微控制器

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Challenges for Body Electronics 车身电子面临的挑战

• Central Gateway need high performance and high scalability.

中央网关需要高性能和高扩展性.

• Limited R&D Cost - different applications need share

common platform to reuse software/hardware/toolchain.

控制开发成本 - 不同应用需要共享软硬件平台以使得软件/硬件/

工具链能够最大程度的重复使用。

• Smart distributed CAN/LIN nodes require smaller size and

lower cost.

智能分布式CAN/LIN节点需要更小体积更低成本

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256k

SRAM

(with ECC)

256k

SRAM

(with ECC)

MPC5748C/G - High End Gateway/BCM Solution 高端网关/BCM 解决方案

Communications I/O System

48ch*

ATD

10bit

eMIOS

96ch

4

I2C,

3 SAI

4

DSPI

6

SPIs

8

CAN

18

LIN

Flex

32ch*

ATD

12bit

CTU

3

Analog

Comp-

arators

CROSSBAR SWITCH

Memory Protection Unit (MPU)

Crossbar Masters

3x Nexus

Class 3+

JTAG

Debug System

Peripheral

Bridge

HSM

256k

SRAM

(with ECC)

Flash controller

SIUL

16xPIT+RTI

3xSWT

3xSTM

SSCM

STCU (MBIST/LBIST)

FCCU

BAF/BAR

16xSemaphore

DMA MUX

6M

Flash

incl EE emulation

(with ECC)

Applications:

•High end Gateway and Body Modules

Key Characteristics:

•2x e200z4 + 1x z2 cores, FPU on z4 cores

•160 MHz max for z4s and 80 MHz on z2

•HSM Security Module option supports both SHE

and EVITA low/medium standard

•Media Local Bus supports MOST communication

•2 x USB 2.0 (1 OTG and 1 Host module) support

interfacing to 3G modem and infotainment domain

•2x Ethernet 10/100 Mbps RMII, MII, +1588, AVB

• Ethernet switch

•CAN module optionally supports CAN FD

•SDHC provides standard SDIO interface

•Low Power Unit provides reduced CAN, LIN, SPI,

ADC functionality in low power mode

•Designed to ISO26262 process for use in ASIL B

•-40 to +125C (ambient)

•3.0V to 5.5V

Packages:

•176 LQFP, 256 BGA, 324 BGA

VReg

RTC/API

8-40MHz Osc

FMPLL

32KHz Osc

16MHz IRC

128KHz IRC

ML

B

SD

HC

Fle

xR

ay

2x U

SB

2.0

Eth

ern

et

e200z2

Core

e200z4

Core

e200z4

Core

*Mixture of internal and external channels

Features available depend on package and device version

1

CRC

5747C 5748C 5747G 5748G

Cores 2 2 3 3

Flash 4M 6M 4M 6M

RAM 512k 768k 768k 768k

MLB N N Y Y

USB N N Y Y

Low

Power

Unit

Interface

32

ch

eD

MA

Eth

ern

et

X

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Challenges for Body Electronics 车身电子面临的挑战

• Central Gateway need high performance and high scalability.

中央网关需要高性能和高扩展性.

• Limited R&D Cost - different applications need share

common platform to reuse software/hardware/toolchain.

控制开发成本 - 不同应用需要共享软硬件平台以使得软件/硬件/

工具链能够最大程度的重复使用。

• Smart distributed CAN/LIN nodes require smaller size and

lower cost.

智能分布式CAN/LIN节点需要更小体积更低成本

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KEA products comparison table

Device

Features

Flash RAM EE

PROM Freq

MS

CAN SCI SPI ATD PWT

Flex-

Tim ACMP IIC GPIO

Packag

es

KEAZN8 8K 1K emulate 48MHz 0 1 1 12c12b 1 6c+2c

16b 2 1

Up to

22

16

TSSOP/

24 QFN

KEAZN16 16K 2K 256B 40MHz 0 3 2 16c12b NA 6c+2c+

2c 16b 2 2

Up to

57

32/64

LQFP

KEAZN32 32K 4K 256B 40MHz 0 3 2 16c12b NA 6c+2c+

2c 16b 2 2

Up to

57

32/64

LQFP

KEAZN64 64K 4K 256B 40MHz 0 3 2 16c12b NA 6c+2c+

2c 16b 2 2

Up to

57

32/64

LQFP

KEAZ64 64K 8K emulate 48MHz 1 3 2 16c12b 1 6c+2c+

2c 16b 2 2

Up to

71

64/80

LQFP

KEAZ128 128K 16K emulate 48MHz 1 3 2 16c12b 1 6c+2c+

2c 16b 2 2

Up to

71

64/80

LQFP

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KEA128 Block Diagram

Communications I/O System

6+2+2ch

16bit Flex

Timer(2)

2

I2C

2

SPI

3

SCI

(LIN)

2

KBI

16ch,

12bit ADC

w/8 FIFO

1

PWT

2

Analog

Comp-

arators

Peripheral Bus

SWD

Debugger

Debug

RAM

Up to

16KB

System

Peripheral

Bridge

Flash

UP To

128KB

1xWDT

1-Cycle GPIO

BME(1)

Applications:

• Automotive general purpose

Operating Characteristics:

• Voltage range: 2.7 to 5.5 V

• Temperature range: -40 to 125°C

Key Features:

• ARM Cortex M0+ core 48MHz

• Up to 128K embedded flash

• Up to 16K RAM

• External OSC and internal ICS for clock

• System functions: LVD, WDG, CRC, LP

modes

• Communication: SPI, SCI, IIC, CAN

• Timers: FTM, PWM, PIT, PWT, RTC

• 12bit ADC and ACMP

Packages:

•16TSSOP, 24QFN, 32/ 64 and 80LQFP

• Pin compatible within KEA family

PMC

2.7-5.5V

POR

Ext Osc

(1-20M, 32K)

FLL Clk Mult

Int R/C OSC

(~32KHz 2%)

Int LP Osc

(1KHz)

LVD

NV

IC

1-C

Y M

UL

ARM Cortex M0+

48MHz Core Freq

(1) Support bit operation in RAM

(2) Faster timer running 2 x core clock

1

MSCAN RTC

Open-

Drain IO,

KBI,

GPIO

1

PIT

EEPROM

256B

Option

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42.14

18.60

10.09

5.29 6.04

0.00

5.00

10.00

15.00

20.00

25.00

30.00

35.00

40.00

45.00

Cortex-M0+ A (16bit) B (16bit) C (8bit) D (16/8bit)

Processor Energy Efficiency in CoreMark/mA

New pipeline for best energy efficiency

高性能低功耗内核

• Cortex-M0+ is twice more efficient than closest architecture

Assuming only 1/3 of reported MCU consumption is related to the processor

x2.25 x8

Cortex-M0+: 1.8V, 25C, std configuration, TSMC180ULL, running CoreMark

A, B, C & D: current generation of low-power Flash MCUs, running from Flash in most favourable conditions, ~1.8-2.2V, values from Datasheet/public numbers

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Applications: • Seats/Sun Roof

• Windows/Doors

• Mirror/Wiper

• Fuel/Water Pump controller

• Body Control

• Park Assist

• DC/BLDC Motor control

• Ambient lighting

• Infotainment connection module

• GPS/Radio companion MCU

Reference Solutions: • BLDC motor control

• Vehicle Interior / Exterior LED Lighting

• Low Power LIN/CAN Node Networking

• Motorcycle Engine Control

Kinetis Auto: General Purpose 32 Bit ARM MCU

Kinetis汽车微控制器目标应用

Kinetis Auto MCU SummaryKi ti 汽车微控制器总结Kinetis汽车微控制器总结

Automotive grade qualified 汽车级产品认证First 32-bit ARM-based MCU ready to use in general automotive applications

Scalable 扩展性8KB to 2MB embedded flash, pin to pin compatible

Save development cost & speed time to market 节省开发成本和时间market 节省开发成本和时间Massive options of development tools, SW and HW references

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Challenges for Body Electronics 车身电子面临的挑战

• Central Gateway need high performance and high scalability.

中央网关需要高性能和高扩展性.

• Limited R&D Cost - different applications need share

common platform to reuse software/hardware/toolchain.

控制开发成本 - 不同应用需要共享软硬件平台以使得软件/硬件/

工具链能够最大程度的重复使用。

• Smart distributed CAN/LIN nodes require smaller size and

lower cost.

智能分布式CAN/LIN节点需要更小体积更低成本

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VREG (8pin)

LIN phy (8pin)

MCU

or

DSC (48pin)

Gate

Driver (48pin)

Op-amps

Discrete Solution

20+

3+

2+

S12ZVM Solution:

• ~ 50 fewer solder joints

• - 4 to 6 cm2 PCB space

S12ZVM for BLDC Motor Control

用于直流无刷电机控制的高集成度混合信号微控制器

4cm

~1 ½ in.

64pin

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S12 MagniV: Integration Beyond the MCU

MagniV: 高集成度混合信号微控制器家族

Our S12 MagniV portfolio simplifies system design with the integration on High-

Voltage (HV) analog features onto MCUs for automotive applications

S12ZVM

BLDC Motor Control

S12ZVC

Small CAN nodes

MM912/S12VR

Window Lift

S12ZVL

LIN Nodes

S12VR

MM912_S812 S12ZVL

Reduced PCB Space

Improved manufacturing efficiency

Reduced Bill of Material

Simplified development

MM912_S812

S12ZVC

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AUTOSAR – Global Automotive Software Standard

AUTOSAR – 汽车软件标准

• Benefits for car manufacturer

− Establish development distribution among suppliers

− Compete on innovative functions with increased design flexibility

− Simplify software and system integration

− Reduce cost of overall software development

• Benefits for supplier

− Reduce version proliferation

− Reuse software modules across car manufacturers

− Increase efficiency of application development

Volume of ECUs with AUTOSAR

Source: AUTOSAR Development Partnership

• Members represent about 80% of worldwide car production.

• In 2016 approx 25% of ECUs will be based on AUTOSAR.

Source: AUTOSAR

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Freescale Automotive Software

飞思卡尔提供汽车软件产品

• Freescale provides software products where in-depth hardware

knowledge is crucial – including AUTOSAR MCAL and OS, Core Self

Test, and application-specific libraries to address unique hardware

features.

Part of the Solution Separate Products

AUTOSAR MCAL

low-level drivers

AUTOSAR

Operating System

Self Test

Libraries

Application-oriented

Libraries

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Simplifies the process of system compliance, with

solutions designed to address the requirements of

automotive and industrial functional safety standards

Reduces the time and complexity required to

develop safety systems that comply with ISO 26262

and IEC 61508 standards

Functional Safety. Simplified.

Supports the most stringent Safety Integrity

Levels (SILs),enabling designers to build with

confidence

Zero defect methodology from design to

manufacturing to ensure our products meet the

stringent demands of safety applications

ISO 26262 : Automotive Norm on Functional Safety

ISO26262: 越来越多汽车应用要求功能安全

Session Summary总结

• Vehicle networking is ever growing complicated, which includes more and more CAN/LIN nodes, and Ethernet enters vehicle.enters vehicle.车身网络复杂度不断增加，CAN/LIN节点数量快速增长，以太网进入车身网络。

• MPC5748G family address high end BCM/Gateway with Ethernet.MPC5748G提供理想的高端BCM/网关解决方案。

• Kinetis Auto MCU with ARM core offering the scalability to cover various body applicationsto cover various body applications.Kinetis汽车MCU覆盖车身电子大部分应用，整个系列具有高兼容性，便于客户建立通用软硬件平台。

• MagniV family offering high-integration solutions forMagniV family offering high integration solutions for smart distributed nodes in vehicle network.MagniV混合信号MCU为车身网络上的智能节点提供高集成度解决方案。

• Freescale provide AutoSAR and Functional Safety support on most MCU products.飞思卡尔汽车微控制器具备完善的AutoSAR和功能安全支持。

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Making the World a Smarter Place.