lcd implementation using arm 7

Shanghai Mairong Electronic Technology Co., Ltd.

Contact Information Shanghai Mairong Electronic Technology Co., Ltd. Email:[email protected] Http://www.mairongtech.com

SPECIFICATION FOR

LCD MODULE

MODULE NO.: MR024-9325-51P-B DOC.REVISION :V00

Customer Approval:

SIGNATURE DATE

PREPARED BY

CHECKED BY

APPROVED BY


DOCUMENT REVISION HISTORY Version DATE DESCRIPTION CHANGED BY


1. Features & Mechanical Specifications

Item Contents

Unit LCD

LCD Type TFT Transmissive Normal White --

Viewing direction 12:00 --

Backlight White LED x4 in Parallel --

Interface 8/9/16/18bit parallel bus interface 6/16/18bit SPI+RGB interface --

Driver IC ILI9325 --

Outline Dimension 42.7259.46 2.6 mm

Glass area (WHT) 41.1 57.1 1.44 mm

Active area (WH) 36.7248.96 mm

Number of Dots 240(RGB) 320 --

Pixel pitch (WH) 0.143 0.143 mm

Operating Temperature -20 +70

Storage temperature -30 +80


2. Dimensional Outline Fi

rst i

ssue

A00

double side tape

tesa#4972(t=0.042mm

12o'

cloc

k

YD

XR

YU

XL

Figure 1. Dimensional outline


3. Block Diagram

Figure 2. Block diagram


4. Pin Description Pin No. Pin Symbol I/O Function

1 ENABLE I Data ENEABLE signal for RGB interface operation. Low:Select

2 DOTCLK I Dot clock signal for RGB interface operation.

3 HSYNC I Line synchronizing signal for RGB interface operation.

4 VSYNC I Frame synchronizing signal for RGB interface operation.

5 /CS I Chip select input.Active low. 6 SCL I Synchronizing clock signal in SPI mode.

7 SDI I SPI interface input pin. The data is latched on the rising edge of the SCL signal.

8 RS I A register select signal. 9 WR I Write enable signal.Active high.

10 RD I Read enable signal.Active low 11 RESET I Reset input pin.Active low.

12-29 PD0---PD17 I/O Date Bus.

30 VDD I

A supply voltage to the interface pins: IM[3:0], nRESET, nCS, nWR, nRD, RS, DB[17:0], VSYNC, HSYNC,DOTCLK, ENABLE, SCL, SDI, SDO. Connect to an external power supply of 1.65 ~ 3.3V(IOVcc)

31,32 VCI I A supply voltage to the analog circuit. Connect to an external power supply of 2.5 ~ 3.3V.(Vci)

33-34 GND I GND 35 NC - Dummy 36 IM3 I Select the MCU system interface mode.

*Please see note below or see the description of ILI9325 Spec P10.

37 IM2 I 38 IM1 I 39 IM0 I 40 GND I Ground.

41-44 NC - Dummy

45 GND I Ground.

46 SDO O SPI interface output pin. The data is outputted on the falling edge of the SCL signal.

47 A - LED backlight cathode.

48,49,50,51 K I LED backlight anode.


5. Absolute Maximum Ratings

Item Symbol Rating Unit MIN. TYP. MAX

Supply Voltage range VDD -0.3 - VDD+0.3 V

Power supply for gate drive VGH 15.0 V

VGL -8.0 V

TFT Common Voltage VcomH 2.5 - 4.0 V

VcomL -2.0 - 0 V

Operating Temperature range TOP -20 - +70

Storage Temperature range TST -30 - +80

6. Electrical Characteristics DC Characteristics

Item Symbol Min. Type. Max. Unit

Logic Supply Voltage VDDIOVcc 1.65 - 3.3 V

I/O Supply Voltage VCI(Vci) 2.5 - 3.3 V

7. Backlight Characteristics White LED 4 in parallel (Ta = 25C)

Item Symbol Condition Min Typ Max Unit

Forward Voltage VF IF=80mA 2.8 - 3.3 V

Power consumption P IF=80mA - - 256 mW

Luminance for LCD Lv IF=80mA 3000 - cd/m2


8. Electro-Optical Characteristics Using WK LCD+ Normal Polarizer+Corresponding Backlight, reference only (Note 1,Note 2)


9. Instruction Description Please refer to ILI9325 datasheet 10. AC Characteristics 8080-series MCU interface Timing Characteristics


11. Interface Connector OMRONXF2B-5145-31A *Note(in ILI9325 spec)

I80system interface


12.Quality Specifications All The raw material are Rohs complicant.

12.1 Standard of the product appearance test Manner of appearance test: The inspection should be performed in using 20W x 2 fluorescent lamps.

Distance between LCM and fluorescent lamps should be 100 cm or more. Distance between LCM

and inspector eyes should be 30 cm or more.

Viewing direction for inspection is 45 from vertical against LCM.

45o 45o

FluorescentLamps

LCD

100cm min30cm min

Definition of zone:

A Zone: viewing area B Zone: outside viewing area

LCM

A Zone

B Zone


12.2 Specification of quality assurance

AQL inspection standard

Sampling method: MIL-STD-105E, Level II, single sampling

Defect classification (Note: * is not including)

Classify Item Note AQL

Major Display state Short or open circuit

1

0.65

LC leakage

Flickering

No display

Wrong viewing direction

Contrast defect (dim, ghost) 2

Back-light 1,8

Non-display Flat cable or pin reverse 10

Wrong or missing component 11

Minor Display state Background color deviation 2 1.0

Black spot and dust 3

Line defect, Scratch 4

Rainbow 5

Chip 6

Pin hole 7

Polarizer Protruded 12

Bubble and foreign material 3

Soldering Poor connection 9

Wire Poor connection 10

TAB Position, Bonding strength 13


Note on defect classification

No. Item Criterion

1 Short or open circuit Not allow

LC leakage

Flickering

No display

Wrong viewing direction

Wrong Back-light

2 Contrast defect Refer to approval sample

Background color deviation

3 Point defect, Black spot, dust (including Polarizer) = (X+Y)/2

Unitmm

4 Line defect,

Scratch

Unit: mm

5 Rainbow Not more than two color changes across the viewing area.

X

Y

W

L

Point Acceptable Qty. Size


No Item Criterion

6 Chip

Remark: X: Length

direction

Y: Short direction

Z: Thickness direction

t: Glass thickness

W: Terminal Width

Acceptable criterion X Y Z 2 0.5mm t

Z

Y X

Y

X

Acceptable criterion X Y Z 3 2 t

shall not reach to ITO

X

Z

Y

t

Acceptable criterion X Y Z

2 0.5mm t/2

Acceptable criterion X Y Z

Disregard 0.2 t

Acceptable criterion X Y Z 5 2 t/3

Y

X Z

W Y

ZX


No. Item Criterion

7 Segment pattern W = Segment width = (X+Y)/2

(1) Pin hole

< 0.10mm is acceptable.

8 Back-light (1) The color of backlight should correspond its specification.

(2) Not allow flickering 9 Soldering (1) Not allow heavy dirty and solder ball on PCB.

(The size of dirty refer to point and dust defect)

(2) Over 50% of lead should be soldered on Land.

10 Wire (1) Copper wire should not be rusted

(2) Not allow crack on copper wire connection.

(3) Not allow reversing the position of the flat cable.

(4) Not allow exposed copper wire inside the flat cable. 11* PCB (1) Not allow screw rust or damage.

(2) Not allow missing or wrong putting of component.

X X

Y Y

W

Point Size Acceptable Qty 1/4W Disregard

1/4W< 1/2W 1 1/2W 0 Unit: mm

Lead

Land

50% lead


No Item Criterion

12

Protruded

W: Terminal Width

13 TAB 1. Position

2 FPC bonding strength test

14 Total no. of acceptable

Defect A. Zone

Maximum 2 minor non-conformities per one unit.

Defect distance: each point to be separated over 10mm

B. Zone

It is acceptable when it is no trouble for quality and assembly

in customers end product.

W Y

X

Acceptable criteria: Y 0.4

ITO

TAB

W1 W

H1 H

W11/3W H11/3H

F

FPC

P (=F/FPC bonding width) 650gf/cm ,(speed rate: 1mm/min) 5pcs per SOA (shipment)


12.3 Reliability of LCM Reliability test condition:

Item Condition Time (hrs) Assessment

High temp. Storage 80C 48

No abnormalities

in functions

and appearance

High temp. Operating 70C 48

Low temp. Storage -30C 48

Low temp. Operating -20C 48

Humidity 60C/ 90%RH 48

Temp. Cycle -30C 25C 80C

(60 min 5 min 60min) 10cycles

Recovery time should be 24 hours minimum. Moreover, functions, performance and appearance shall

be free from remarkable deterioration within 50,000 hours under ordinary operating and storage

conditions room temperature (20+8C), normal humidity (below 65% RH), and in the area not

exposed to direct sun light.

lcd implementation using arm 7

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