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FEATURES:One touch auto package conversion自动转换封装类型

Strip mapping with defect codes具有缺陷代码芯片条映像跟踪功能

Graphic User Interface (GUI) with SPC report图像用户界面(GUI), 含SPC报表

Reject identification 不合格的标记:- Wire breaker 割线- Bottom scribing (Linear/Rotary) 底部划线（直线／圆）- Ink dispenser 点墨

OPTIONS:2D matrix code reader 2D矩阵代码阅读装置

Networking capability 电脑网络性能

SEMI/CE complianceSEMI/CE 规格

Angular tilting mechanism to view incline view of strip (to check Core & Neck Bond)具有角度倾斜，可观测芯片的倾斜面

（可以从侧面观察粘接点和引线状态）

www.cei.com.sg

APPLICATIONS:

3rd Optical Inspection MachineWith Auto Conversion

Sales Agent :

HEADQUARTER

CEI Contract Manufacturing Limited2 Ang Mo Kio Ave 12 Singapore 569707 Tel : (65) 6481 1882 Fax : (65) 6481 3293 Website : www.cei.com.sg

The information in this catalogue is correct at the time of printing. CEI reserves the rights to make design changes or improvements. Specifications are subjected to changes without prior notice.

封装规格引线框架／BGA衬底／盘宽度：20mm~90mm 长度：140mm~280mm

供料／出料机构单个料匣进／出料匣的尺寸: 长：145mm~285mm 宽：25mm~95mm 高：＜=150mm料匣的升降系统（可编程步距）马达带动并装有阻碍感应器检验的话引线框架推出装置自动转换封装感应器控制防止损坏工件

工作台精度高及可编程的X-Y工作平台引线框架阻塞感应器用气动夹头，将引线框架移到检查区编程时间少于5分钟（对预先编程的封装而言）X-Y方向精度+/- 50 μm手动和自动定位导引性能

检测系统芯片可分成16个检验分区用户可以选择抽查检验（芯片条／料匣）或100%的检验立体放大显微镜芯片条映像跟踪功能

软件特性• 100顶先设金定的不合格类型代码• GPPH, MTBA, MTTA 报表及SPC• 批次数据及芯片条映像跟踪报表• 对称芯片缺陷位置报表• 5层次密码用户• 险测前芯片条映像跟踪功能• 手动步进功能• 芯片缺陷可以不同颜色代表• 芯片可分成16个检测分区

控制系统带UPS的工控PC，视窗的操作系统

电源和气源电源 : 110VAC/8A, 230VAC/4A 气源 : 72.5 psi(5 bar), CDA

尺寸和重量 尺寸: 1150mm(长) x 830mm(宽) x 1500mm(高)重量: 350公斤(约)

PACKAGE SPECIFICATIONSLeadframes/BGA substrates/BoatsWidth: 20mm to 90mm, Length: 140mm to 280mm

LOADING/UNLOADING STATION Single magazine Input/OutputMagazine dimension: 145mm to 285mm (Length) 25mm to 95mm (Width) Up to 150mm (Height)Convertible magazine elevator system (Programmable Pitch) Motorised Frame pusher assembly with obstruction sensorsAuto Package conversion sensor controls to prevent damages to parts

WORK STATIONHigh accuracy programmable X-Y tableDevice obstruction detectorPneumatic device gripper to inspection areaLess than 5 minutes programming time (for pre-programmed package)X-Y index accuracy of +/- 50 µmManual and auto indexing capability

INSPECTION SYSTEMSegmented inspection (Up to 16 segment)Option of performing sampling (Strip base/Magazine base) or 100% inspectionStereo zoom microscopeStrip mapping features with defect codes

SOFTWARE FEATURES• 100 Predefine Reject Coding• GPPH, MTBA, MTTA report & SPC• Lot report with strip map• Reverse Strip Report useful for QA• 5-Stage password protection• Pre-mapping software features• Programmable strip movement during inspection• Strip map colour coding• Segmented inspection (Up to 16 segment)

CONTROLLERMicrosoft Windows PC based control with UPS

FACILITIESPower supply: 110VAC/8A, 230VAC/4AAir supply: 72.5psi (5 bar), CDA

DIMENSION & WEIGHT 1150mm (Length) x 830mm (Width) x 1500mm (Height)350kg approximately

SPECIFICATIONS

REJECT IDENTIFICATION :SCRIBBER MODULE

GRIPPER MECHANISM, MANUAL ADJUSTABLE XY & Z AXIS

MOTORISED XY TABLE

MOTORISED MAGAZINE HOLDER

MICROSCOPE WITH INTENSITYCONTROL RING LIGHT

OPT-653 3RD OPTICAL INSPECTION MACHINE自动转换第三步骤光学检验机

规 格

AWL6

81/A

WLM

681

AU

TO W

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R L

OA

DERFEATURES:

Automatic robotic wafer handling 6" and 8" wafer

Ready for 150mm and 200mm wafer (convertible)

Capability to handle thin wafer (≥6 mils)

Multi functions: Cassette To Cassette Sort , Cassette to XY Stagefor Micro Inspection

Inkless binning catered to handle all Semi Std Map format

Macro Tilting & Spin Module to inspect frontside, backside & edge

Capable to integrate with any OEM Optical Microscope

Optical Character Reader (OCR) capability

www.cei.com.sg

APPLICATIONS:

Macro and Micro Optical Wafer Inspection and Review System

Wafer Transfer/ Sort with OCR System

Sales Agent :

HEADQUARTER CEI Contract Manufacturing Limited2 Ang Mo Kio Ave 12 Singapore 569707

Tel : (65) 6481 1882 Fax : (65) 6481 3293

Website : www.cei.com.sg

The information in this catalogue is correct at the time of printing. CEI reserves the rights to make design changes or improvements. Specifications are subjected to changes without prior notice.

WAFER SIZE6" (150mm) and 8" (200mm) wafer

WAFER THICKNESS≥ 6mils

MACRO STATION170 Deg Back side tilt & inspection 45 Deg Front side tilt & inspectionSpin 360 Deg to check edge defect Programable by software recipe & joystickLumination - Halogen lamp (Standard) - Intensity programable by software

MICRO STATIONManual XYθ - 205 x 205 mm , θ=340°(Standard) Motorised XYθ - 205 x 250 mm, θ=+/-60° (Optional)- Accuracy +/- 10 micron- Repeatability 5 micron- Resolution 1 micronVibration Isolation System (Optional)

WPHCassette-Cassette 328 WPH *(exclude OCR, aligner processes)

Cassette-Macro 168 WPH *Cassette-Micro 176 WPH *Cassette-Macro-Micro 104 WPH ** Without operator inspection time

CONVERSION8" to 6" Wafer chuck at Macro & Micro Station

WAFER HANDLING ROBOT Class 1, 3 axis single arm atmospheric robot

ALIGNERClass 1, non-contact wafer alignment (Notch/Flat)

OCR (OPTIONAL) Cognex 1721 reader

DIMENSION & WEIGHT1000(L)mm x 1350(W)mm x 1380(H)mm ; 350 Kgs

OPTIONAL FEATURESRFID / Bar Code readerSemi S2/S8/CE CompliantClass 1000 with ulpha filter add-on

INPUT/OUTPUTConfigurable up to 2 H-Bar type open cassette

WAFER CASSETTEStandard open H-Bar cassette (25 wafers)

MICROSCOPE20X to 2000X magnification Bright field & Dark field capabilityUniveral Interface to all high end OEM microscope Digital Camera Intergration & Control - Online live image for review- Support image acquisition & storage

UPTIME≥ 98%

CASSETTE MAPPINGWafer Presence, Wafer Missing, Double Wafers and Cross Slot

WAFER PROTRUSION SENSORDetect wafer protrusion from Cassette

INKLESS BINNING (OPTIONAL)Import, edit, generate, export map based on Semi STD (EG,SINF,Text,FEDP8)Custom map formatVision alignment - Identification of first die

HOST COMMUNICATION (OPTIONAL)SECS/GEM - HSMS Compliant

CLEANLINESSClass 10K (US FED STD 209E)

USER INTERFACEGraphical base with English language 17" LCD monitor c/w keyboard and mouseError Reporting, Lot Management

SYSTEM CONTROLPC Based control with UPS back up (PC only)Window XP OS

SPC ANALYSISColour map, yield data, defect histrogram FACILITYSingle phase, 230VAC, 50/60Hz, 20A CDA compressed air, 5 bar (72 psi) Vacuum at 25 in Hg (customer facility)

SPECIFICATIONS

ALIGNER

MMI

MACRO STATION

CHUCK

XY STAGE (MICRO VISION)

AWL681/AWLM681 AUTO WAFER LOADER

AER8

121

UV

WA

FER

ER

AS

ER

FEATURES:300mm ready

Class 10 cleanliness

Modular design for future expansion

Capable of handling thin wafer of 12 mils

GEMS full compliance

www.cei.com.sg

APPLICATIONS:

Complete wafer erasing for EPROM & Flash Memory

UV curing and hardening

Removal of stress induced due to manufacturing processes

CEI_AER8121_BROCHURE_ENGLISH_PRINT.ai 6/7/2008 12:46:40 PM

Sales Agent :

HEADQUARTER CEI Contract Manufacturing Limited2 Ang Mo Kio Ave 12 Singapore 569707 Tel : (65) 6481 1882 Fax : (65) 6481 3293 Website : www.cei.com.sg

The information in this catalogue is correct at the time of printing. CEI reserves the rights to make design changes or improvements. Specifications are subjected to changes without prior notice.

WAFER SIZE8" (200mm) and 12" (300mm)

WAFER THICKNESS 200 micron (8" wafers) 500 micron (12" wafers)

(For thin wafers, please consult manufacturer.)

CONFIGURATIONModular and flexible dockingMaximum 4 UV Module ( 8 Chambers)

WAFER HANDLING ROBOTClass 1, 5 Axis Dual Arm Robot on track

WPH270 wafers per Hour (60 sec cure time)(Based on 3 UV Module configuration)

CONVERSIONNo conversion between 8" and 12" wafers

UPTIME 99%

CONTROLPC base control with UPS backup (PC only)

ALIGNER (OPTIONAL)Class 1, non-contact wafer alignment (Notch/Flat)

OCRCognex 1721 reader

OPTIONAL FEATURESRFID / Bar code ReaderSMIF CassetteSemi S2 / S8 / CE STD Compliant

DIMENSION & WEIGHTDimension : 2000mm(H) x 1930mm(L) x 2330mm(D)Weight : 1500 kg

INPUT/OUTPUTConfigurable up to 3 loadports(Asyst IsoPort™/Manual loadport)

UV MODULEEach UV module with Dual Vertical UV ChamberEach Chamber can be operated independentlyUV Lamp intensity 60 mw/cm2 (+/- 10%)

WAFER CASSETTEFOUP, FOSB for 12"Fluoroware H-Bar type housing 25 wafers

STATISTICAL PROCESS CONTROLChamber temperature monitoringUV Lamp life monitoringCooling & exhaust monitoring

MAN MACHINE INTERFACEGraphical base with English/Chinese language selectable17" LCD monitor c/w keyboard and mouseError reporting, Lot and Recipe management

CLEANLINESSClass 1000 ( US FED STD 209E)Class 10 (Optional)

HOST COMMUNICATION (OPTIONAL)SECS / GEMS - HSMS compliant

SAFETY/EMERGENCY FEATURESThermal protection on UV shielded power supplyAuto UV shut down (> 30 min non operation)Online lamp intensity monitor c/w alarm & display

FACILITY415VAC & 208VAc , 50/60 Hz 30A & 40ACDA , compressed air, 5 bar (72 psi)Vacuum at 25 in Hg (customer facility)

EXHAUST 200 Cfm per exhaust (per UV chamber)

SPECIFICATIONS

UV CHAMBER

CASSETTE MAPPING

WAFER DUAL ARM ROBOT HANDLING

ALIGNER

WINDOWS & MENU BASEENGLISH / CHINESE SELECTABLE

AER8121 UV WAFER ERASER

CEI_AER8121_BROCHURE_ENGLISH_PRINT.ai 6/7/2008 12:47:12 PM