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P A R TO N E
CHAPTER 2Atomic Bonding
The scanning tunneling microscope (Section4.7) allows the imaging of individual atomsbonded to a material surface. In this case, themicroscope was also used to manipulate theatoms into a simple pattern. Four lead atomsare shown forming a rectangle on the surfaceof a copper crystal. (From G. Meyer and K. H.Rieder, MRS Bulletin 23 28 [1998].)
Outer orbital(with four sp3 hybridbonding electrons)
Nucleus (withsix protons andsix neutrons)
Inner orbital(with two 1s electrons)
Figure 2-1 Schematic of the planetary model of a12C atom.
1H
1.008
3Li
6.941
4Be
9.012
I A
II A III A IV A V A VI A VII A
VIII
III B IV B V B VI B VII B I B
11Na
22.99
12Mg
24.31
13Al
26.98
14Si
28.09
15P
30.97
16S
32.06
17Cl
35.45
18Ar
39.95
5B
10.81
6C
12.01
7N
14.01
8O
16.00
9F
19.00
10Ne
20.18
2He
4.003
0
19K
39.10
20Ca
40.08
21Sc
44.96
22Ti
47.90
23V
50.94
24Cr
52.00
25Mn
54.94
26Fe
55.85
27Co
58.93
28Ni
58.71
29Cu
63.55
30Zn
65.38
31Ga
69.72
32Ge
72.59
33As
74.92
34Se
78.96
35Br
79.90
36Kr
83.8037Rb
85.47
38Sr
87.62
39Y
88.91
40Zr
91.22
41Nb
92.91
42Mo
95.94
43Tc
98.91
44Ru
101.07
45Rh
102.91
46Pd
106.4
47Ag
107.87
48Cd
112.4
49In
114.82
50Sn
118.69
51Sb
121.75
52Te
127.60
53I
126.90
54Xe
131.3055Cs
132.91
56Ba
137.33
57La
138.9187Fr
(223)
88Ra
226.03
89Ac
(227)
72Hf
178.49
73Ta
180.95
74W
183.85
75Re
186.2
76Os
190.2
77Ir
192.22
78Pt
195.09
79Au
196.97
80Hg
200.59
81Tl
204.37
82Pb
207.2
83Bi
208.98
84Po
(210)
58Ce
140.12
59Pr
140.91
60Nd
144.24
61Pm
(145)
62Sm
150.4
63Eu
151.96
64Gd
157.25
65Tb
158.93
66Dy
162.50
67Ho
164.93
68Er
167.26
69Tm
168.93
70Yb
173.04
71Lu
174.9790Th
232.04
91Pa
231.04
92U
238.03
93Np
237.05
94Pu
(244)
95Am
(243)
96Cm
(247)
97Bk
(247)
98Cf
(251)
99Es
(254)
100Fm
(257)
101Md
(258)
102No
(259)
103Lw
(260)
85At
(210)
86Rn
(222)
II B
Figure 2-2 Periodic table of the elements indicating atomic number and atomic mass (in amu).
Energy (eV)
–283.9
–6.52 (sp3)
1s
0
Figure 2-3 Energy-level diagram for the orbital electrons in a 12C atom.Notice the sign convention. An attractive energy is negative. The 1s elec-trons are closer to the nucleus (see Figure 2–1) and more strongly bound(binding energy = −283.9 eV). The outer orbital electrons have a bind-ing energy of only −6.5 eV. The zero level of binding energy correspondsto an electron completely removed from the attractive potential of thenucleus.
Electron transfer
Ionic bond
Na Cl
Na+ Cl–
Figure 2-4 Ionic bonding between sodiumand chlorine atoms. Electron transfer fromNa to Cl creates a cation (Na+) and ananion (Cl−). The ionic bond is due to thecoulombic attraction between the ions ofopposite charge.
Cl–
Na+
Figure 2-5 Regular stacking of Na+and Cl− ions in solid NaCl. Thisis indicative of the nondirectionalnature of ionic bonding.
0.70.60.50.40.3a (nm)
Na+ Cl–
0.20.1
a
4
3
2
1
00
Fc
× 10
9 (N)
Figure 2-6 Plot of the coulombic force (Equation 2.1) for a Na+—Cl− pair.
0.7a (nm)
0.60.50.40.3
Na+
Fc (coulombic force of attraction)
FR (repulsive force)
F (net bonding force)
Cl–
0.20.1
a0
4
3
2
1
–1
–2
–3
–4
0
Fc
× 10
9 (N)
Figure 2-7 Net bonding force curve for a Na+−Cl− pair showing an equi-librium bond length of a0 = 0.28 nm.
+
0
–Bon
ding
forc
eNa+ Cl–
a
+
0
a0
–
Bon
ding
ene
rgy
a
Figure 2-8 Comparison of the bonding force curveand the bonding energy curve for a Na+−Cl−pair. Since F = dE/da , the equilibrium bondlength (a0) occurs where F = 0 and E is a mini-mum (see Equation 2.5).
(a)
(b)
(c)
a0
rCl–rNa+
Figure 2-9 Comparison of (a) a plane-tary model of a Na+−Cl− pair with(b) a hard-sphere model and (c) asoft-sphere model.
Na
Na+
Cl
Cl–
Figure 2-10 Formation of an ionic bond between sodium and chlorine inwhich the effect of ionization on atomic radius is illustrated. The cation(Na+) becomes smaller than the neutral atom (Na), while the anion(Cl−) becomes larger than the neutral atom (Cl).
R = 1.0
r = 0.2
CN = 1 possible CN = 2 possible CN = 3 maximum CN = 4 unstable
Figure 2-11 The largest number of ions of radius R that can coordinate an atom of radius r is 3 when the ra-dius ratio, r/R = 0.2. (Note: The instability for CN = 4 can be reduced but not eliminated by allowing athree-dimensional, rather than a coplanar, stacking of the larger ions.)
30˚
cos 30˚ = 0.866 = = 0.155R
r + R
r
R→
Figure 2-12 The minimum radius ratio, r/R ,that can produce threefold coordinationis 0.155.
(a)
(b)
(d)
(c)
Cl Cl
Cl Cl
Figure 2-13 The covalent bond ina molecule of chlorine gas, Cl2,is illustrated with (a) a plane-tary model compared with (b)the actual electron density and(c) an “electron-dot” schematicand (d) a “bond-line” schematic.
C C
HH
C C C C C
HH
H H
H H
H
H
H
H
H
H
C C C
H
H
H
H
H
H
(a)
(b)
Ethylenemolecule
Ethylenemer
Polyethylenemolecule
. . . .. . . .
. . . .. . . .
Figure 2-14 (a) An ethylene molecule (C2H4) is comparedwith (b) a polyethylene molecule ( C2H4 ) n that re-sults from the conversion of the C=C double bond intotwo C—C single bonds.
C
H
H
C
H
H
CH
H
CH H
CH
HC
H
H
C
H
H
C
H
H
C
H
HC
H
HC HH
C HH
C
H
H
C
H
H
CH
H C
H
H
C
H
H
C
H
HC
H
HC
H
H
C
H
H
C
H
H
CH
H
CHH
CH H
CH H
CHH
CH H
CH H
CH H
CH H
CHH
CH
HC
H
H
C
H
H
C
H
H
C
H
H
C
H
HC
H
H
C
H
HC
H
HC
H
H
C
H
H
C
H
H
C
H
H
C
H
H
C
H
H
C
H
H
C
H
H
CH H
CHH
CH
H
CHH
CH
H
C
H
H
C
H
H
CH
H
CH
H
C
H
H
C
H
H
CH
H
CH
H
CH
H
... .
....
. . . .
.. . .
. . . .
. . . .
. . ..
. . . .
Figure 2-15 Two-dimensional schematic representation of the “spaghettilike” structure ofsolid polyethylene.
C
C C
C C
CC
C
C
CC
C
C
C
C
C
Figure 2-16 Three-dimensional structure of bond-ing in the covalent solid, carbon (diamond).Each carbon atom (C) has four covalent bondsto four other carbon atoms. (This geometry canbe compared with the “diamond cubic” struc-ture of Figure 3–23.) In this illustration, the “bond-line” schematic of covalent bonding is givena perspective view to emphasize the spatial ar-rangement of bonded carbon atoms.
O2–
Si4+
Figure 2-17 The SiO4−4 tetrahedron
represented as a cluster of ions. Infact, the Si—O bond exhibits bothionic and covalent character.
Bond energy
0
+
–
E a
Bond length
Figure 2-18 The general shape of the bond energy curve as well asassociated terminology applies to covalent as well as ionic bond-ing. (The same is true of metallic and secondary bonding.)
109.5˚
C
Figure 2-19 Tetrahedral configuration of covalentbonds with carbon. The bond angle is 109.5◦.
Cu2+ ion core(cutaway view)
Electron cloud from valence electrons
Figure 2-20 Metallic bond consisting of an electron cloud, or gas. An imaginaryslice is shown through the front face of the crystal structure of copper, reveal-ing Cu2+ ion cores bonded by the delocalized valence electrons.
1H2.1
3Li1.0
4Be1.5
I A
II A III A IV A V A VI A VII A
VIII
III B IV B V B VI B VII B I B
11Na0.9
12Mg1.2
13Al1.5
14Si1.8
15P
2.1
16S
2.5
17Cl3.0
18Ar–
5B
2.0
6C
2.5
7N3.0
8O3.5
9F
4.0
10Ne–
2He–
0
19K0.8
20Ca1.0
21Sc1.3
22Ti1.5
23V1.6
24Cr1.6
25Mn1.5
26Fe1.8
27Co1.8
28Ni1.8
29Cu1.9
30Zn1.6
31Ga1.6
32Ge1.8
33As2.0
34Se2.4
35Br2.8
36Kr–
37Rb0.8
38Sr1.0
39Y1.2
40Zr1.4
41Nb1.6
42Mo1.8
43Tc1.9
44Ru2.2
45Rh2.2
46Pd2.2
47Ag1.9
48Cd1.7
49In1.7
50Sn1.8
51Sb1.9
52Te2.1
53I
2.5
54Xe–
55Cs0.7
56Ba0.9
57-71La-Lu1.1-1.2
87Fr0.7
88Ra0.9
89-102Ac-No1.1-1.7
72Hf1.3
73Ta1.5
74W1.7
75Re1.9
76Os2.2
77Ir2.2
78Pt2.2
79Au2.4
80Hg1.9
81Tl1.8
82Pb1.8
83Bi1.9
84Po2.0
85At2.2
86Rn–
II B
Figure 2-21 The electronegativities of the elements. (After Linus Pauling, The Nature of the Chemical Bondand the Structure of Molecules and Crystals; An Introduction to Modern Structural Chemistry, 3rd ed.,Cornell University Press, Ithaca, New York, 1960)
+–
Magnitude ofdipole moment
Secondarybond
Isolated Ar atom
+–
Isolated Ar atom
Center of negative(electron) charge
Center of positivecharge (nucleus)
Figure 2-22 Development of induced dipoles in adjacent argon atoms leading to a weak, secondary bond. The de-gree of charge distortion shown here is greatly exaggerated.
Dipole
HH
O
+
=
+
Figure 2-23 “Hydrogen bridge.” This secondary bond is formedbetween two permanent dipoles in adjacent water molecules.(From W. G. Moffatt, G. W. Pearsall, and J. Wulff, TheStructure and Properties of Materials, Vol. 1: Structures,John Wiley & Sons, Inc., New York, 1964.)
covalent
Semiconductors
Polymers
metallic secondary
Ceramics and glassMetals
ionic
Figure 2-24 Tetrahedron representing the relative contri-bution of different bond types to the four fundamentalcategories of engineering materials (the three structuraltypes plus semiconductors).