performance analysis of electronics cooling using nanofluids in microchannel … · 2016. 12....

Performance Analysis of Electronics Cooling using Nanofluids in Microchannel

Heat Sink Siti Natasha Malik Fesal1, SitiSyazwaniIlmin2, ZurainiGani3

1Mechanical Engineering Department, 2Mathemathics Science and Computer Department, Polytechnic Ungku Omar, Ipoh, 31400, Perak, Malaysia

3Mechanical Engineering Department,UniversitiKebangsaan Malaysia, 43600Bangi.Malaysia. [email protected]

[email protected] [email protected]

Abstract—Performance analysis of thermal enhancement for cooled microchannel heat sink (MCHS) using nanofluidsmathematical formulation was investigated and presented in this paper. Heat transfer capability in terms of thermal conductivity, heat transfer coefficient, thermal resistance, heat flux and required pumping power were evaluated on the effectiveness of copper oxide (CuO), silicon dioxide (SiO2) and titanium dioxide (TiO2) with water as a base fluid. The results showed that thermal performance augmented by 12.2% in thermal conductivity at particle volume fraction of 4% to CuO-water nanofluid, 11.8% for SiO2-water and 10.0% for TiO2-water. The maximum heat transfer coefficient enhances of 12.4% for CuO, SiO2 is 8.22% and 7.4% for TiO2 with the same inlet velocity of 3 m/s. The addition of nanoparticle concentration significantly enhances the heat transfer, but elevates the expenses of higher required pumping power to increase the pressure drop. The maximum enhancement of heat flux in CuO-water was found to be 2575 kW/m2, 2501 kW/m2 for SiO2-water and 2485 kW/m2 for TiO2-water nanofluid at 4% of volume fraction. The pressure drop is increased with the mass flow rate of 1021 kg/m3 for CuO-water at 0.5% of volume fraction and 47925 Pa to 54314 Pa pressure drop at 4% of volume fraction. The CuO-water pumping power was found to be the highest at 4% of volume fraction with 102.3 W at 3 m/s inlet velocity compared to SiO2 and TiO2 also increased the pumping power of 75.0 W to 90.6 W with increasing volume fraction and pressure drop. The positive thermal results implied that CuOnanofluid is a potential candidate for future applications in MCHS.Further analysis is recommended to be done with various Reynolds number, pumping power and flow rate of nanoparticles to obtain better heat transfer performance of cooling fluids. Keywords: Electronics cooling, nanofluids, microchannel heatsink

I. INTRODUCTION In the last three decades, the emergence of nanotechnologyis rapidly approaching, were utilized to improve the heat transfer rate to apply on the electronicdevices in order to reach a satisfactory level of thermal efficiency. The heat transfer rate can passively be improved by changing the geometry’s flow, boundary conditions or by improving thermo physical properties such as increasing the thermal conductivity of fluid [1]. To meet the high dissipation rate requirements and maintain a low junction temperature in electronic devices, many cooling technologies have been pursued. Among of these, the microchannel heat sink (MCHS) was introduced because of its ability to produce high heat transfer coefficient, small size and volume per heat load and small coolant requirements [2].

Working fluids was applied to enhance the heat transfer by changing the fluid transport properties and flow features in MCHS. Recently, this concept has focused on heat transfer enhancement by using a nanofluid that has a nanoscale metallic or non-metallic particles in the base fluids.Besides, nanofluids has become a concern because they display higher potential as heat transfer fluid than normally utilized base fluids and micron sized particle-fluids. This is due to clogging in pumping and flow apparatus which is caused by rapid settling of the micron sized particle. Nanofluids do not indicate this behavior. This makes nanofluids a better choice as heat transfer fluid [3]. Nanofluids (1-100nm-size particles), often called as ultra-fine solid particles, engineered colloidal suspension, are stable and prepared by dispersing a certain percentage of nanoparticles in base fluids[4-6]. The factors that causes heat transfer enhancement are solid particles and host fluids chemical composition, size, shape and concentration of nanoscale particles, thermal condition and surfactants. Some of these factors also affect the stability of the nanofluids. There are three strategies to attain good stability, namely addition of surfactants, pH control and ultrasonification [7]. From the literature, heat transfer coefficient depends on Reynolds number, volume fraction of the nanofluids (concentration), temperature, base-fluid

ISSN (Print) : 2319-8613 ISSN (Online) : 0975-4024 Siti Natasha Malik Fesal et al. / International Journal of Engineering and Technology (IJET)

DOI: 10.21817/ijet/2016/v8i6/160806219 Vol 8 No 6 Dec 2016-Jan 2017 2626

thermal properties and nanofluids purity. Generally, nanofluids are highly potential to be used as coolant in electronic packaging since their heat transfer coefficient exceeded the predicted value in laminar flow region in many analyses and from the famous Dittus-Boelter correlation in turbulent correlations [8].

Zakaria et al.[9] has studied on numerical analysis of thermal enhancement for a single Proton Exchange Membrane Fuel Cell (PEMFC) cooling plate by using a low concentration of Al2O3 in Water-Ethylene Glycol mixtures as a coolant. It shown that the higher volume percent concentration of Al2O3 the better the heat transfer enhancement but at the higher expense of pumping power. Moraveji et al. [10] used a model of MCHS with 20 x 20 mm bottom with five nanoparticle volume fractions in five inlet velocities for two types of nanoparticle containing TiO2 and SiC.By using different value of Reynolds Numbers, the effect of a nanoparticle volume fraction on the convective heat transfer coefficient was investigated. The modelling results was compared to analytical calculations and it showed that, it was accurate for the correlated equations that were obtained for Nusselt number and friction factor were acceptable.

The numerical simulations is studied on the laminar and turbulent forced convection heat transfer in a MCHS with a mixture of nanofluid consisting of CuO-water [11]. The method used to solve the continuity, momentum and energy equations was the finite volume method with the parameters of the particle volume faction ( 0.204%, 0.256%, 0.294% and 0.4%), and the volumetric flow rate ( 10 mL/min, 15mL/min and 20mL/min). From the comparisons of thermal resistance predicted by the single-phase and two-phase models with the experimental results, it revealed that, two-phase model was more accurate than the single-phase model. Other than that, the thermal resistance of nanofluids is smaller than that of water, which decreases as the particle volume fraction and the volumetric flow rate increase in laminar flow. In addition, the pressure drop increases slightly for nanofluid-cooled MCHS in the laminar flow case.

This study deals with three types of nanoparticles which are copper oxide(CuO), silica(SiO2) and titanium oxide (TiO2) suspended in a water as a base fluid. The microchannel heat sink (MCHS) operation was analyzed with the nanofluids serve as a working fluid.Performance of nanofluids as coolant is predicted in terms of thermal conductivity, heat transfer coefficient, thermal resistance, heat flux and required pumping power.

II. METHODOLOGY The performance of CuO-water, SiO2-water and TiO2-water nanofluids has been analyzed by using

mathematical formulation to compare the performance of cooling of electronics. Thermophysical properties of the water and nanoparticles (CuO, SiO2, TiO2) at 30oC areas shownin Table I.

TABLE I. Thermophysical properties of the base fluid and nanoparticles [10, 12]

A. Nanofluid Properties The thermophysical properties of the nanofluidswiththe volume fractions, , of nanoparticles and base fluid were used; 0.5%, 1.0%, 1.5%, 2.0%, 2.5%, 3.0%, 3.5% and 4.0% are determined by utilizing the following equations: Density of nanofluid is calculated by the use of Pak and Cho [13]correlation:

∅ 1 ∅ (1) Effective thermal conductivity is given by Hamilton and Crosser [13] equation, can be expressed as follow:

∅∅ (2)

Nanofluid specific heat equation is evaluated from Xuan andRoetzelcorrelation [14] which shown below: 1 ∅ ∅ (3)

Effective viscosity of nanofluid is given by Einstein equation as suggested for particle in volume fractions less than 5.0 vol.% and is defined [15]:

Fluid/Nanoparticles Properties ρ(kg/m3) µ(N.s/m3) Cp(J/kg.K) k(W/m.K)

Base Water, H2O 994.2 724.6 x 10-6 4178 0.6248 Copper Oxide, CuO 6320 - 385 76.5 Silica Dioxide, SiO2 3970 - 765 36 Titanium Dioxide, TiO2 4157 - 710 8.4



1 2.5∅ (4) Where subscript f, p, nf are correspond to fluid, particle and nanofluids respectively. Nanoparticle shape factor, n, was assumed to be 3 for spherical particles as tabulated in Table II.

TABLE II. Calculated thermophysical properties for nanofluids

CuO/Water Properties Particle Volume Fraction(∅ %) ρCuO kCuO ρCpCuO µCuO

0.5% 1020.83 0.63399 4145165 0.00073 1.0% 1047.46 0.64327 4136562 0.00074 1.5% 1074.09 0.65265 4127959 0.00075 2.0% 1100.72 0.66211 4119356 0.00076 2.5% 1127.35 0.67167 4110753 0.00077 3.0% 1153.97 0.68133 4102151 0.00078 3.5% 1180.60 0.69109 4093548 0.00079 4.0% 1207.23 0.70094 4084945 0.00080

SiO2/WaterProperties Particle Volume Fraction(∅ %) ρ SiO2 k SiO2 ρCpSiO2 µ SiO2

0.5% 1009.08 0.63374 4148184 0.00073 1.0% 1023.96 0.64277 4142600 0.00074 1.5% 1038.84 0.65189 4137017 0.00075 2.0% 1053.72 0.66109 4131433 0.00076 2.5% 1068.60 0.67038 4125850 0.00077 3.0% 1083.47 0.67977 4120266 0.00078 3.5% 1098.35 0.68924 4114682 0.00079 4.0% 1113.23 0.69881 4109099 0.00080

TiO2/WaterProperties Particle Volume Fraction(∅ %) ρ TiO2 k TiO2 ρCpTiO2 µTiO2

0.5% 1010.01 0.63238 4147756 0.00073 1.0% 1025.83 0.64003 4141745 0.00074 1.5% 1041.64 0.64773 4135733 0.00075 2.0% 1057.46 0.65550 4129722 0.00076 2.5% 1073.27 0.66333 4123710 0.00077 3.0% 1089.08 0.67123 4117699 0.00078 3.5% 1104.90 0.67919 4111687 0.00079 4.0% 1120.71 0.68722 4105676 0.00080



B. Microchannel Heat Sink (MCHS) The MCHS which typically contains lot of parallel microchannel has the capability of producing high heat transfer coefficient, less dimension-volume per heat load and lesser requirement of coolant [2]. There were few assumptions have been made in order to simplify this analysis whereby[9]:

The flow is incompressible, laminar and in steady state. The effect of body force is neglected. The fluid properties are constant and viscous dissipation is neglected. The fluid phaseand nanoparticles are in thermal equilibrium with zero relative velocity and the resultant

mixture can be considered as a conventional single phase. The geometric configuration of this microchannel is considered based on research of Tsai and Chein[2]

shown in Fig.1 whereby the nanofluids is forced to flow through the fin slot in x-direction with mean velocities of 3 m/s. Table III below shows the details of MCHS dimensions.

Fig. 1. MCHS schematic diagram [2]

TABLE III. Dimensions of MCHS [2]

Symbol Size Size Lhs x Whs 1 cm x 1cm Channel height, H 365 µm Channel width, Wch 57 µm Porosity, 0.5 Fin thickness, Wfin 57 µm Number of channels,n 25 Aspect ratio, 6.4



Parameters like hydraulic diameter and other dimensionless correlations for Reynolds number, Prandtl number and Nusselt number are consideredunder the assumption of single phase, constant thermal properties applicablefor laminar and turbulent flows in order to analyze the efficiency of MCHS by applying nanofluids to achieve the heat dissipation capability [16, 17]. The heat transfer coefficient is calculated by using:

(5)

Where;

Hydraulic diameter : (6)

Reynolds number : (7)

Prandtl number : (8)

Nusselt number : 0.023 . . (9) The calculation for Reynolds, Prandtl and Nusselt number are based on the assumption that the fluid flow with the inlet speed of 3m/s for various volume fraction of nanoparticle. The efficiency of the microchannel is computed using:

(10)

Where;

(11)

is the MCHS thermal conductivity which is 400W/mK. Furthermore, total thermal resistance is computed using the summation of all the three resistances:

(12)

where is the area of MCHS bottom part and is the total nanofluid mass flowrate [12]. The surface area is calculated by the formula of: (13) where is the channel area.

2 (14) Number of cooling channels, n = 25 [18]. Thus, the total heat transfer (Q) and the bottom heat flux is computed using:

(15)

and

(16)

Where, is the fluid temperature at the inlet and Tmax is the largest of bottom temperature of microchannels. From Xie et.al [19] the maximumdifferenceof is taken to be 50oC. C. Effectiveness Evaluation of Nanofluid for Electronics Cooling The effectiveness of nanofluid as coolant is evaluated in term of performance of microchannel heat sink. This analysis is crucial in order to see the impact of the viscous pressure drop on the performance of MCHS. Coefficient of performance, COP for MCHS is defined as the ratio of the dissipated heat to the invested pumping power [20].

(17)

Where; ∆ (18)

(19) (Ppow: Idealized pumping power and: Volumetric flowrate of nanofluid, n: Number of channels). The pressure drop is calculated using [21],

∆ (20)



with Darcy friction factor : 1.82 1.64 (21) III. RESULT AND DISCUSSION

Nanoparticle addition in fluid base will result higher thermal conductivity compared to a conventional liquid and conventional two-phase mixture coolant. Solid particle are added as they conduct heat much better than a liquid on its own. In this study, three types of nanofluids were used as coolant in microchannel heat sink. Performance of nanofluids as coolant were predicted in terms of thermal conductivity, heat transfer coefficient, thermal resistance, heat flux and required pumping power. The result was compared with conventional liquid which is water. Table IV shows the properties of water as coolant in MCHS with inlet velocity of 3 m/s.

TABLE IV. Properties of water in MCHS with inlet velocity of 3 m/s.

Properties Values Thermal conductivity, k (W/m.K) 0.6248 Heat transfer coefficient, h (W/m2.K) 30111.41 Reynolds No, Re 405.87 Prandtl No, Pr 4.85 Nusselt No, Nu 4.75

The prediction of performance of CuO-water, SiO2-water and TiO2-water nanofluids were calculated using Eq. (1)-Eq (21). The calculated data is shown in Table V, Table VI and Table VII.

TABLE V. Thermal conductivity, heat transfer coefficient and mass flow rate of CuO-water nanofluid.

CuO/Water

Particle Volume Fraction(∅ %) k(W/m.K) h(W/m2.K) ṁ (kg/s) 0.5% 0.63399 30584 0.01455 1.0% 0.64327 31055 0.01493 1.5% 0.65265 31525 0.01531 2.0% 0.66211 31993 0.01569 2.5% 0.67167 32460 0.01606 3.0% 0.68133 32926 0.01644 3.5% 0.69109 33392 0.01682 4.0% 0.70094 33856 0.01720

TABLE VI. Thermal conductivity, heat transfer coefficient and mass flow rate of SiO2-water nanofluid.

SiO2/Water Particle Volume Fraction(∅ %) k(W/m.K) h(W/m2.K) ṁ (kg/s)

0.50% 0.63374 30419 0.01438 1.00% 0.64277 30727 0.01459 1.50% 0.65189 31037 0.01480 2.00% 0.66109 31347 0.01502 2.50% 0.67038 31658 0.01523 3.00% 0.67977 31970 0.01544 3.50% 0.68924 32283 0.01565 4.00% 0.69881 32597 0.01586



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neering, vol. 30(16. Tokit, H. A. Mnanofluids,” InteHaghihi, M. Sal

ak, M. Muhammence, vol. 49, pp. 1. Sohel, S. S. Khatransfer enhancemp. 164-172, 2014hadimi, R. Saiditions,” Internatioaidur, K. Y. Leongy Reviews, vol.

efficiency of ance of the Mhysical prope

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15(3), pp. 1646-

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ACKedge PolytechnUniversitiTun this research s

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07. nvective performa4, 2010.

M. Z. Yusoff, “Thmunications in Heam, Z. Anwar, I. LCooling performan

Saidur, A. Hepbaannel heat sink u

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th nanoparticle vo

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KNOWLEDGEM

nic Ungku OmHussein Onn

study. REFERENCES-water Nanofluid

ofluid-cooled mic

ance of nanofluid

hermal performanat and Mass TranLumbreras, M. Bnce of nanofluid

asli, M. F. M. SabusingAl2O3 –H2O

A review of nanonsfer, vol. 54, pp

view on applicatio

olume fractions.

electronic dethe impact of

d with additionles for all typeON r MCHS usinofluids at diffee their heat trheat flux and-water nanofluSiO2-water ancoolants in laonsiderable incFor heat transfumber. The pf pumping poof nanofluids

HS and show

MENT mar, Universitn,BtPahat,Mala

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[9] I. Zakaria, W. A. N. W. Mohamed, A. M. I Mamat, R. Saidur, W. H. Azmi, R. Mamat, K. I. Sainan, and H. Ismail, “Thermal analysis of heat transfer enhancement and fluid flow for low concentration of AL2O3 water-ethylene glycol mixture nanofluid in a single PEMFC cooling plate,” Energy Procedia, vol. 79, pp. 259-264, 2015.

[10] M. K. Moraveji, R. M. Ardehali, and A. Ijam, “CFD investigation of nanofluid effects (cooling performance and pressure drop) in mini-channel heat sink,” International Communications in Heat and Mass Transfer, vol. 40, pp. 58-66, 2013.

[11] Y.T. Yang, K.T Tsai, Y. H. Wang, and S. H. Lin, “Numerical study of microchannel heat sinperformance using nanofluids,” International Communications in Heat and Mass Transfer, vol. 57, pp. 27-35, 2014.

[12] T. L. Bergman, A. S. Lavine, F.P. Incropera, and D. P. Dewitt, “Fundamentals of heat and mass transfer (7th Edition),” John Wiley & Sons, USA, pp. 995-1010, 2011.

[13] S. S. Khaleduzzaman, R. Saidur, J. Selvaraj, I. M. Mahbubul, M. R. Sohel, and I. M. Shahrul, “Nanofluids for thermal performance improvement in cooling of electronic device,” In Advanced Materials Research, Vol. 832, pp. 218-223, 2014.

[14] A. K. O Albdoor, “Numerical Investigation of Laminar Nanofluid Flow in Micro Channel Heat Sinks,” Southern Technical University, Al-Nassiriah Technical Institute, Department of Mechanical Techniques, ThiQar, Iraq. International Journal of Mechanical Engineering and Technology (IJMET), vol. 5, Issue 12, pp. 86-96, December 2014.

[15] E. Farsad, S. P. Abbasi, M. S. Zabihi, and J. Sabbaghzadeh, “Numerical simulation of heat transfer in a micro channel heat sinks using nanofluids,” Heat and Mass Transfer, vol. 47(4), pp. 479-490, 2011.

[16] Y.Xuan and W. Roetzel, “Conceptions for heat transfer correlation of nanofluids.” International Journal of heat and Mass transfer, vol.43 (19), pp.3701-3707, 2000.

[17] A. Ijam,and R. Saidur, “Nanofluid as a coolant for electronic devices (cooling of electronic devices),” Applied Thermal Engineering, vol. 32(2012), pp. 76–82, 2012.

[18] T. Bello-Ochende, L. Liebenberg, and J. P. Meyer, “Constructal cooling channels for micro-channel heat sinks,”International Journal of Heat and Mass Transfer, vol. 50(21-22), pp. 4141–4150,2007.

[19] X. L. Xie, Z. J. Liu, Y. L. He, and W. Q. Tao, “Numerical study of laminar heat transfer and pressure drop characteristics in a water-cooled minichannel heat sink,” Applied Thermal Engineering, vol. 29(1), 64–74, 2009.

[20] W. Escher, T. Brunschwiler, N. Shalkevich, A. Shalkevich, T. Burgi, B. Michel, and D. Poulikakos, “On the Cooling of Electronics With Nanofluids,”Journal of Heat Transfer, 133(5), 2011.

[21] W. Q. Tao, Y. P. Cheng, and T. S. Lee,”The Influence of Strip Location on the Pressure Drop and Heat Transfer Performance of a Slotted Fin,” Numerical Heat Transfer, Part a: Applications, vol. 52(5), pp. 463–480, 2007.

AUTHOR PROFILE

Siti Natasha Malik Fesalreceived the Bachelor degree and Masterin Mechanical Engineering from UniversitiTun Hussein Onn, Bt.Pahat,Johor in 2004 and 2015, respectively. Currently she is working as lecturer at Mechanical Department, Polytechnic UngkuOmar, Ipoh, Perak.

SitiSyazwaniIlminreceived the Bachelor degree in Applied Science of Maritime Technology from Universiti Malaysia Terengganu, Kuala Terenganu, Terenganu in 2010 and Masterin Mechanical Engineering from University Tun Hussein Onn,Bt.Pahat,Johor in 2015. Currently she is working as lecturer at Mathematics Science and Computer Department, Polytechnic UngkuOmar, Ipoh, Perak

ZurainiGanireceived the Bachelor degree in Mechatronic from KolejUniversitiTun Hussein Onn (KuiTTHO), Bt.Pahat, Johor in 2002 and Master in Mechanical Engineering from Universiti Kebangsaan Malaysia, Bangi, Selangor in 2010. Currently she is pursuing post-graduate studiesat Mechanical Engineering Department, University Kebangsaan Malaysia,Bangi,Selangor.



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