專案管理 - 新產品創育Project Management - New Product Generating

朱明茂 (James Chu)

July. 2003

July.2003

Outlines

Brief of Project Management

Product Generating– Marketing Survey & Product Definition

– Product Development Management

– Product Marketing / Customer Support/ Continue improvement loop

Case study - Semiconductor Equipment

Case practice - free imagination talk

Brief of Project Management

What a Project Manager have to do

6 Tasks for a project management

6 Steps for a project layout

July.2003

Project Manager’s Job

Prepare Project Plan

Get the resource from stake holder

Form a strong project team, define role, target for team member

and motivate them

Follow the and control the progress, set control point and benchmark

Progress report to the project sponsor, ensure the information flow through

all project level

Periodical Review and learning

July.2003

6 Tasks for project management

Task No.1 •Identify Projects

•Setting Priorities

•Understanding roles

•Self Assessment

Task No.2 •Analyze cost and benefit

•Define Objectives

•Initiate Action

•Identify Stake holder’s view

Task No.3 •Identify Tasks

•Estimate Timescales

•Allocate Responsibility

•Assess Risks

Task No.4 •Manage your team

•Delegate wherever possible

•Review progress frequently

•Make it happen

Task No.5 •Engage Stakeholder early

•Clarify expectation

•Brief end users

•Celebrate success

Task No.6 •Set up Learning System

•Praise Good Work

•Learn from Mistake

•Publicize findings

July.2003

Or, try to answer these ……..

• How can I make things go according to plan?

• How much time can I spend on this?

• Who has a stake in my project?

• How can I make this idea happen?

• Who needs to be involved

• What will the benefit be?

• What is the project suppose to deliver?

• What is the logical sequence of tasks?

• Who will do what and when?• Who is the handover for?

• When does handover take place?

• How do I plan for it?

• What happen and why?

• How can I learn from this?

• What recommendation can I make ?

• How can I keep everybody happy?

• Can somebody else do this?

• Who needs to know about changes?

Planning Phase

Execution Phase

Handover / review Phase

July.2003

Balancing the control factors

QualityCost

Time

Product Generating

Phases

Activities

•Time to market

•Performance Spec.•Resources

July.2003

Creating a planning in 6 steps

2. Define Milestones in time

3. List activities and relations

4. Determine Critical Path

5. Define buffers

6. Allocate resources

inte

rac

tio

n

After the project goal / objectives / scope defined

1. Work Break Down Structure leads planning

Example refer to case study 1

Product Generating

–Marketing Survey & Product Definition

–Product Development Management

–Product Marketing / Customer Support / Continue improvement loop

July.2003

Market Survey – Business stake

Where can I set my foot print ?

date from VLSI research, Inc.

Overall Equipment Market(22918.2M U.S)

Test27%

Wafer Processing

65%

Package Assembly

8%

TestWafer ProcessingPackage Assembly

Wafer Processing Market(14961.5M U.S)

Dry Etch14%

Other Wafer Process

Equipment7%

Wet Processing

9%

Ion Implanters5%

Deposition34%

CMP Equipment

5%

Mask Exposure

Equipment2%

Wafer Exposure

Equipment24%

July.2003

Market Survey – Product Economic Cycle

A: Product inspired by market demand and/or new technologyB: Pilot product roll out to market ramp upC: Product mature / stable and widely demanded-suppliedD: Successor emerging E: Market peak volume

Product emerging

Plateau FadingStarting

Time

Market Volume

July.2003

Market Survey – Product Economic Cycle

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yprobabilitptimetptf :,:,,2

productainitiatetoCostptft

tA:,

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1 volumeessbuTotalptf

tD

tosin:,2

maturedemandproducttotime

tBt slope

/

0

harvesttotime

tCtB slope byegoodsaytotime

tDtC slope

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toptfptfMaxoductGood

July.2003

Product Market Survey – examples

Healthy

MarketBad

Market

Fragile

Market

investment

Business

July.2003

Product Definition – identify the AOI

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Product

Customer

Market

those valued and can be sold

those who pay for service

=

=

= area has business opportunity

Competitiveness = Right product in right time to Mr.Right

Profitability

Essential

= Margin*sale - (OP cost) Winning factor

Business window

Sliding Shrinking

Cost to generate product

July.2003

Product Development - Generating Phases

Research

Technology

Generate Product Operational Phase Product life extension

Pilot

Plateau

Fading

July.2003

Product Development – Organization

Research

Technology

Generate Product Operational Phase Product service life extension

1. Marketing & Technology Development

2. Sales and Business Operation

3. Production & Goods Flow

4. Customer Support & Product Sustaining

1. Survey market / define product specification / design it2. Promote the product and deal business process3. Produce and deliver the product4. Sustain the product operation & quality feedback

July.2003

Product Development – Sectors Deliverable

Research

Technology

Generate Product Operational Phase Product service life extension

Marketing & Technology Development

Sales and Business Operation

Production & Goods Flow

Customer Support & Product Sustaining

Market strategy

Product Spec.

Product Roadmap

CQM

Market promotion

Business OP Plan

Market feedback

CQM

Production Plan

Logistic MRP

CQM

Support plan

CS Feedback

Field Upgrade

CQM

July.2003

Marketing / Customer Support / CIP

Pilot

Plateau

Fading

Decision Phase 1

Decision Phase2

Decision Phase 3

Technology Roadmap

Marketing / Customer Support / CIP

July.2003

Tasks \ Functions

Product Meeting

PD

M

PR

M – M

anufacturing

Integral Proto &

Pilot

Planner

PL C

ustomer S

upport

Product M

anager

PD

M S

ustaining

Sales R

epresentativeB: Start phase 1 activities A C C C CInputsPlan Phase 1 R R R R RC: Start phase 2 activities A C C C CInputsResults of Review phase 1 R R R R RPlan phase 2 R R R R RD: Start phase 3 activities A C C C CInputsResults of Review phase 2 R R R R RPlan phase 3 R R R R RD1: Release Sales plan & start protoactivities

A C C C C C

InputsRelease proposals (*) R R RE: Start phase 4 activities A C C C C CInputsResults of Review phase 3 R R R R R RPlan phase 4 R R R R R RE1: Start pilot production activities A C C C C CInputsPilot release proposal R R

Participants in meeting: cross sector

Meeting type

Authorities Responsibilities Contributing tasks of participants

Tasks to be done

Project Control Meeting-TRAC example

July.2003

The Project Management Plan

• Each sub project should have a similar plan

PMP

3.WBS

2. Deliverables

4. Planning

5. Organization

6.

Resources7.

Means8.

Budget

9.Risks

1. Description

Case study - Semiconductor Equipment

ex.Metrology tool to control CD by SEMModel: X-SEM-65

July.2003

Market Survey – Technology roadmap

Year of Production 2001 2002 2003 2004 2005 2006 2007 2010 2013 2016DRAM 1/2 Pitch (nm) 130 115 100 90 80 70 65 45 32 22MPU /ASIC 1/2 Pitch (nm) 150 130 107 90 80 70 65 45 32 22MPU Printed Gate Length (nm) 90 75 65 53 45 40 35 25 18 13MPU Physical Gate Length (nm) 65 53 45 37 32 28 25 18 13 9

Inline, nondistructive microscopy resolution (nm)for P/T=0.1 0.5 0.4 0.4 0.3 0.3 0.2 0.2 0.15 0.11 0.07

MPUGate

Microscopy capable of measurement of patternedwafershaving Maximum aspect ratio / diameter (nm)(DRAM contacts) [A]

11.4150

11.9130

12.4110

1390

13.680

14.370

15.265

16.145

19.332

23.222

DI/2

Real particle detection limit (nm) [B] 65 53 45 37 32 30 25 18 13 9 DI/2Minimum particle size for compositional analysis(dense lines on patterned wafers) (nm) 43 35 30 24 21 20 17 12 9 6 DI/2

Specification limit of total surface contaminationfor critical COI surface materials (atoms/cm2) [C] 5.00E+09 5.00E+09 5.00E+09 5.00E+09 5.00E+09 5.00E+09 5.00E+09 5.00E+09 5.00E+09 5.00E+09

MPUGate

Surface detection limits for individual element forcritical GOI elements (atom/cm2) with signal tonoise ratio of 3:1 for each element

5.00E+08 5.00E+08 5.00E+08 5.00E+08 5.00E+08 5.00E+08 5.00E+08 5.00E+08 5.00E+08 5.00E+08MPUGate

Microscopy

Materials and Contamination Characterization

Driver

July.2003

Market Survey – Market SizeOverall Equipment Market

(22918.2M U.S)

Test27%

Wafer Processing

65%

Package Assembly

8%

TestWafer ProcessingPackage Assembly

Test Eq. Market(6171 M U.S)

ProcessDiagnosticsEquipment

45%

Mfrg Connectivity &Design and Test

IntegrationSystems

5%

System-on-a-chipTest System

15%

Material HandlingSystems

15%

MXSL, Linear andDiscrete Test

System6%

Memory IC TestSystems

11%

Logic IC TestSystems

3%

July.2003

Market Survey – Competition ground

Process Diagnostic Equipment Market - 2002(289.2 M U.S)

KLA-Tencor40%

AppliedMaterials

10%

Hitachi HighTechnologies

Corp.5%

others45%

•Can we get something from this piece ?

•How much and by what ?

July.2003

Right Time to Market

First arrive usually takes the most !!

t0 tB tC tDtA

Business Window

July.2003

Market Survey – Product Cycle

Year of Production 2001 2002 2003 2004 2005 2006 2007DRAM 1/2 Pitch (nm) 130 115 100 90 80 70 65MPU /ASIC 1/2 Pitch (nm) 150 130 107 90 80 70 65MPU Printed Gate Length (nm) 90 75 65 53 45 40 35MPU Physical Gate Length (nm) 65 53 45 37 32 28 25

Research

Technology

Generate Product Operational Phase

Product life extension

t0 tB tC tDtA

Project Plan Layout – 6 steps

July.2003

Step 1. WBS leads planning

SPS /65SDS /65

Resolution

SDS /65Throughput

SDS /65Reliability

EDS e-beam source

EDS Leveling

EDS Optics

EDS Alignment

Scan Control

EDSElec. Layout

EDS Mech. Layout

PlatformEDS

C&T Control

Material HandlingEDS

Wafer Handler

EDS Wafer Stage

EDS HW Drivers

Software Control

EDS Pattern Library

EDS Algorithm

EDS User Interface

July.2003

Step 2. Define Milestones in time

Define critical milestones – where several activities come together– are important for client delivery I.e. start integration,

shipping, first run

Perform backward planning of activities from milestones

July.2003

Step 3. List activities and relations

List activities (including the required documents)

Determine time required to finish activities (hours or days of work)

Sequential relationships between activities/ other projects

Claim resources

ID Task Name Exp Dur1 Write functional spec 4

2 Prepare Projectplan 4

3 Plan 2

4 Get Resources 2

5 Hold Kick-off 1

6 Design Hardware 10

7 Design Software 7

8 Integrate 5

9 Produce 10

10 Purchase 5

11 Assemble 2

12 Install 2

13 Service 1 day

Gantt Chart

July.2003

Step 4. Determine Critical Path

The critical path is the longest chain or path of activities from start up to finish

It is critical because the completion of activities on this path determine whether or not due dates are met

ID Task Name Exp Dur1 Write functional spec 4

2 Prepare Projectplan 4

3 Plan 2

4 Get Resources 2

5 Hold Kick-off 1

6 Design Hardware 10

7 Design Software 7

8 Integrate 5

9 Produce 10

10 Purchase 5

11 Assemble 2

12 Install 2

13 Service 1

Red pathis critical

July.2003

Step 5. Determine buffers

Determine of all activities an optimistic, pessimistic and expected time to finish that specific activity

Calculate the variance of:– The critical path between starts and

finishes– The string of activities feeding the

critical path Calculate the buffers

– Feeding buffer just before feeding lineenters critical path (Feeding Buffer is in time)

Fine-tuning of the critical path with resources from non-critical activities or from outside the project (Capacity Buffer)

FB

Time

Finish

Red = critical path

Mean time

Earliest start next critical path activity

CB

July.2003

Step 6. Allocate Resources

July.2003

Step 6. Allocate ResourcesTasks \ Functions

Product Meeting

PD

M

PR

M – M

anufacturing

Integral Proto &

Pilot

Planner

PL C

ustomer S

upport

Product M

anager

PD

M S

ustaining

Sales R

epresentative

B: Start phase 1 activities A C C C CInputsPlan Phase 1 R R R R RC: Start phase 2 activities A C C C CInputsResults of Review phase 1 R R R R RPlan phase 2 R R R R RD: Start phase 3 activities A C C C CInputsResults of Review phase 2 R R R R RPlan phase 3 R R R R RD1: Release Sales plan & start protoactivities

A C C C C C

InputsRelease proposals (*) R R RE: Start phase 4 activities A C C C C CInputsResults of Review phase 3 R R R R R RPlan phase 4 R R R R R RE1: Start pilot production activities A C C C C CInputsPilot release proposal R R

RequiredTasks

ResourcesOwner

Responsibility

July.2003

Project Action Control

Deming CyclePlanObjectivesMethod

DoTrain

Execute

ActRemedies

Future action

CheckAgainst Objectives/method