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ASMD1812 Series Surface Mount PTC Devices

PRODUCT DATASHEET

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Description

The ASMD1812 series provides surface mount resettable overcurrent protection with holding current from 0.1A to 3.5A. This series offers complete portfolio in terms of holding current and working voltage, and is suitable for wide range of applications.

Features

● ● ●●●●

RoHS compliant and lead-freeLow profileHalogen-freeFast response to fault currentCompact design saves board spaceCompatible with high temperature solders

USB hubs, ports and peripheralsMotherboard USB & IEEE 1394 protectionSet-top-box and HDMIOptical disk drivesGame console port protectionGeneral electronics

Applications

● ● ● ●●

Agency Approvals

Agency File Number

pending

pending

Regulation Standard

2002/95/EC

EN14582

JDT FUSE Industrial Corp.

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Environmental Specifications

Page 2/7

I hold = Hold Current. Maximum current device will not trip in 25°C still air.I trip = Trip Current. Minimum current at which the device will always trip in 25°C still air.V max = Maximum operating voltage device can withstand without damage at rated current (Imax).I max = Maximum fault current device can withstand without damage at rated voltage (V max).Pd = Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.Ri min/max = Minimum/Maximum device resistance prior to tripping at 25°C.R1max = Maximum device resistance is measured one hour post reflow.CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame.

Test

Conditions Resistance change


Passive agingHumidity agingThermal shockResistance to solvent Vibration 　Ambient operating conditions : - 40 °C to +85 °CMaximum surface temperature of the device in the tripped state is 125 °C

+85°C, 1000 hrs.+85°C, 85% R.H. , 168 hours+85°C to -40°C, 20 timesMIL-STD-202,Method 215MIL-STD-202,Method 201

±5% typical±5% typical±33% typicalNo changeNo change

Performance Specification

Model V max(V dc)

I max(A)

I hold@25°C

(A)

I trip@25°C

(A)

P dTyp.(W)

MaximumTime To Trip Resistance

Current(A)

Time(Sec)

R i min(Ω)

R1max(Ω)

ASMD1812-010ASMD1812-014ASMD1812-020ASMD1812-030ASMD1812-050

ASMD1812-050-30ASMD1812-050-60

ASMD1812-075ASMD1812-110

ASMD1812-110-16ASMD1812-125ASMD1812-150

ASMD1812-150-16ASMD1812-160ASMD1812-200ASMD1812-260ASMD1812-300ASMD1812-350

30.060.030.030.015.030.060.013.28.016.016.08.016.08.08.08.08.06.0

100100100100100100100100100100100100100100100100100100

0.100.140.200.300.500.500.500.751.101.101.251.501.501.602.002.603.003.50

0.300.340.400.601.001.001.001.502.202.202.503.003.002.804.005.005.006.00

0.80.80.80.80.80.80.80.80.80.80.80.80.80.80.80.80.82.0

0.51.58.08.08.08.08.08.08.08.08.08.08.08.08.08.08.010.0

1.500.150.020.100.150.150.150.200.300.300.400.500.501.002.002.504.004.00

0.7500.6500.3500.2500.1500.1500.1500.0900.0500.0500.0500.0400.0400.0300.0200.0150.0120.008

15.0006.0005.0003.0001.0001.0001.4000.4500.2500.2500.1400.1600.1600.1300.1000.0500.0400.030


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Thermal Derating Curve

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Average Time-Current Curve

CURRENT IN AMPERES

TIM

E IN

SE

CO

ND

Derating Curves for ASMD1812 Series

Temperature (°C )

Per

cent

age

of D

erat

ed C

urre

nt

020406080

100120140160

-40 -20 0 20 40 60 80

0.01

0.1

1

10

100

0.1 1 10 100

0.30A

0.50A

0.75A

1.00A

1.25A

1.50A

1.85A

2.0A

2.50A

2.60A

3.00A

3.50A


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Soldering Parameters

Profile Feature Pb-Free Assembly

Average Ramp-Up Rate(Ts max to T p)Preheat -Temperature Min(Ts min) -Temperature Max(Ts max) -Time(Ts min to Ts max)Time maintained above: -Temperature(TL) -Time(tL)Peak Temperature(Tp)Ramp-Down RateTime 25℃ to Peak TemperatureStorage Condition

3℃/second mac.

150℃200℃60~180 seconds

217℃60~150 seconds260℃6℃/second max.8 minutes max0℃~35℃,≤70%RH

Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-freeRecommended maximum paste thickness is 0.25mmDevices can be cleaned using standard industry methods and solvents.Note 1:All temperature refer to topside of the package, measured on the package body surface.Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.

t L 60~150 s

tsPreheat 60~180 s

t 25°C to peak

Time

TL 217

TP 260

25

TP 20~40 S

Ramp-up Critical Zone TL to TP

Ramp-down

Tsmax

Tsmin

150

200

Tem

pera

ture

(°C

)

Thermal Derading Chart

Model- 40°C - 20°C 0°C 25°C 40°C 50°C

Maximum ambient operating temperature (Tmao) vs. hold current (Ihold)

60°C 70°C 85°C

0.160.230.290.440.591.101.601.592.002.302.282.102.883.904.154.84

ASMD1812-010ASMD1812-014ASMD1812-020ASMD1812-030ASMD1812-050ASMD1812-075ASMD1812-110

ASMD1812-110-16VASMD1812-125ASMD1812-150

ASMD1812-150-16VASMD1812-160ASMD1812-200ASMD1812-260ASMD1812-300ASMD1812-350

0.140.190.260.390.570.991.451.441.752.052.031.962.613.423.764.39

0.120.170.230.350.550.871.281.271.521.771.751.882.252.963.464.04

0.100.140.200.300.500.751.101.101.251.501.501.602.002.603.003.50

0.080.120.170.260.450.630.920.921.001.231.211.261.802.332.552.98

0.050.080.120.180.300.450.660.640.750.820.790.841.091.351.611.88

0.070.100.150.230.430.570.830.820.951.091.071.121.662.072.282.66

0.060.090.140.210.350.490.710.700.900.950.930.981.451.942.012.35

0.030.060.100.150.230.350.520.500.530.610.580.630.801.001.331.55


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Physical Dimensions(mm.)

Termination Pad CharacteristicsTerminal pad materials：Tin-plated Nickel-CopperTerminal pad solder ability：Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3.

ModelMin. Max. Min. Max. Min.

A B C D E

Max. Min. Min.


ASMD1812-050-30VASMD1812-050-60V

ASMD1812-075ASMD1812-110

ASMD1812-110-16VASMD1812-125ASMD1812-150


4.374.374.374.374.374.374.374.374.374.374.374.374.374.374.374.374.374.37

4.734.734.734.734.734.734.734.734.734.734.734.734.734.734.734.734.734.73

3.073.073.073.073.073.073.073.073.073.073.073.073.073.073.073.073.073.07

3.413.413.413.413.413.413.413.413.413.413.413.413.413.413.413.413.413.41

0.300.300.300.300.300.300.300.300.300.300.300.300.300.300.300.300.300.30

0.500.500.500.500.400.701.100.400.400.600.600.400.400.400.500.500.500.50

1.001.001.301.000.901.301.800.900.901.301.301.201.201.201.301.501.501.50

0.250.250.250.250.250.250.250.250.250.250.250.250.250.250.250.250.250.25

Packaging Quantity and Marking

Part Number Quantity

SMD812 SeriesTape & reel packaging per EIA481-1

1,500 pcs/reel3.2±0.1

3.2±0.1

1.78±0.11.78±0.1


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Governing Specifications EIA 481-1

WP0P1P2A0B0B1max.D0FE1E2min.TT1max.K0Leader min.Trailer min.Reel DimensionsA max.N min.W1W2

12 ± 0.34.0 ± 0.108.0 ± 0.102.0 ± 0.053.5 ± 0.105.1 ± 0.105.91.50 + 0.1, -05.5 ± 0.051.75 ± 0.1010.250.60.10.9 ± 0.1390160　

1786012.4 ± 0.518.4

Tape And Reel Specifications (mm)

Storage And Handling ● Storage conditions：40°C max, 70% R.H.● Devices may not meet specified performance if storage conditions are exceeded.Technology Corp.

D2

K0 B0A0

T

F

W

E1

P2D0P0

P1

W4

W2

W3

W1

F

H1

W

CD

H


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Special Voltage Rating(Optional)

Holding Current Rating

Device Dimensions: Length/width(Unit:1/100 inch) Size 4532 mm / 1812 inch

Surface Mount Device

Part Number System

Cross Reference

ASMD 1812 - -

“PolySwitch” is a registered trademark of Tyco Electronics.“POLY-FUSE” is a registered trademark of Littelfuse,Inc.“EVERFUSE” is a registered trademark of Polytronics Technology Corp.

ModelTyco / PolySwitch® Littelfuse / POLY-FUSE® Polytronics / EVERFUSE®

Cross Reference


ASMD1812-050-30VASMD1812-050-60V

ASMD1812-075ASMD1812-110

ASMD1812-110-16VASMD1812-125ASMD1812-150


miniSMDC010F-miniSMDC014FminiSMDC020F

-miniSMDC050FminiSMDC050F

-miniSMDC750FminiSMDC110F

miniSMDC110F/16miniSMDC125FminiSMDC150F

miniSMDC150F/12miniSMDC160FminiSMDC200FminiSMDC260FminiSMDC300F

-

1812L0101812L0141812L0201812L0351812L050

1812L050/30-

1812L0751812L110

1812L110/161812L1251812L150

1812L150/121812L1601812L2001812L2601812L300

-

SMD1812P010TFSMD1812P014TFSMD1812P020TFSMD1812P030TFSMD1812P050TF

SMD1812P050TF/30-

SMD1812P075TFSMD1812P110TF

SMD1812P110TF/16SMD1812P125TFSMD1812P150TF

SMD1812P150TF/12SMD1812P160TFSMD1812P200TFSMD1812P260TFSMD1812P300TF

-


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