product introduction - britec...heat pipe cold plate technology uses heat pipes embedded in an...

Product Introduction

XunChuan讯传为客户提供最优的散热解决方案Confidential

Extrusion heat sinks are the mainstay for cooling medium power semi-conductors .many shapes available to fit diverse applications .thousands of shapes exist in the marketplace .

Low cost

Extruded Section


Short production cycle

Processing is simple

Heat sink skived fin technology provides the best thermal performance when not use heat pipe .the biggest advantage is thinner fin ,smaller gap than extruded section .no glue is used in the process

Skived Heat Sink


Flexible for fin thickness and pitch

Seamless contact between base and fin

Heat pipe cold plate technology uses heat pipes embedded in an aluminum plate to provide the necessary high-efficiency heat transfer in space and weight constrained applications .by using heat pipes ,the cold plate has the weight of aluminum with an effective thermal conductivity more than four times that of copper .it is capable of operating in harsh environments including high altitude ,extreme temperatures /humidity ,shock

Heat Pipe Cold Plate


altitude ,extreme temperatures /humidity ,shock and vibration .

Uses heat pipe technology to move the heat from an attachment plate at the heat source to a location within the package where enough fin volume exists for adequate heat removal .fins are stacked on the heat pipes to provide adequate surface area for heat dissipation to the air .designed for applications with limited space directly above the component .multiple heat pipes can be used to transfer heat to a common airflow .thermal resistance is minimized through the use of a thermally conductive epoxy or solder efficiently


the use of a thermally conductive epoxy or solder efficiently transport the heat from the component to the fin stack for dispersal .the sink can be located above ,below or on the same level as the heat source making possible a wide variety of design configurations .the sink attachment plate is typically made of aluminum or copper

Heat pipe core units can be flexible thermal management system used to assure efficient cabinet level thermal manager .fin stacks can be tailored to accommodate different power loads and different air velocities in the ambient and internal loops .can be design the appropriate heat pipe core for each customer’s application with a broad range of core sizes available .


core sizes available .

- IGBT cooling for power supply systems and industrial equipment

Embedding heat pipe into the heat sink is an effective cooling alternative to greatly enhance the performance of an existing heat sink with minimal design changes .embedded heat pipe extend overall heat sink operation with little to no system updates ,providing improvement in your existing heat sink .high heat flux in concentrated areas can be spread


Bonding heat sink

Skived heat sink

Flexible for fin thickness and pitch

Seamless contact between base and fin

heat flux in concentrated areas can be spread across a heat sink by placing the hot spot over one end of the heat pipe which becomes the evaporator and the heat is transferred to the cooler part of the heat sink where it condenses releasing the heat to the heat sink .heat pipes inserted into the grooves of a heat sink base may reduce a heat sink’s thermal resistance by up to 50% .this allows embedded heat pipes to provide necessary improvements to your existing heat sink where needed .

IGBT Type: FF650R17IE4IGBT Number: 2Power Dissipation : 1000W/perHS Size:380*260*90


IGBT Type: FF450R17ME4IGBT Number: 4Power Dissipation : 750W/perHS Size:500*260*90

IGBT Type: FF1400R17IP4IGBT Number: 2Power Dissipation : 2000W/perHS Size:520*340*90


HS Size:520*340*90





HS Size:490*260*80

IGBT Type: FZ2400R17HP4


IGBT Type: FF600R12MEIGBT Number: 2Power Dissipation : 750W/perHS Size:360*356*140

IGBT Type:IGBT Number: 2Power Dissipation : 750W/perHS Size:360*356*140

IGBT Type: FZ2400R17HP4IGBT Number: 2Power Dissipation : 1500W/perHS Size:340*250*75

IGBT Type: FF1400R12IP4IGBT Number: 4


IGBT Type: FS450R17KE4IGBT Number: 2Power Dissipation : 1350W/perHS Size:400*300*90

IGBT Type: cm400dy-66hIGBT Number: 2Power Dissipation : 1100W/perHS Size:350*350*90

IGBT Number: 4Power Dissipation : 900W/perHS Size:480*400*95

IGBT Type:IGBT Type: FF400R33KF2C


IGBT Type:IGBT Number: 5Power Dissipation : 450W/3&1100W/2HS Size:475*225*90

IGBT Type: IGBT Number: 1Power Dissipation : 1350W/perHS Size:340*140*75

IGBT Type: FF400R33KF2CIGBT Number: 4Power Dissipation : 350W/perHS Size:270*260*95

IGBT Type: FF1400R14IP4





IGBT Type: FF450R17ME4IGBT Number: 12



IGBT Type: FF450R17ME4IGBT Number: 2Power Dissipation : 500W/perHS Size:270*180*95


IGBT Type: FF1400R12IP4




Embedded tube in the surface of plate technology is engineered to match the thermal/mechanical performance ,pressure drop and dimensional requirements of the application .these embedded tube into plate cold plates consist of copper of stainless steel tubes pressed into a channeled aluminum or copper extrusion or machined plate .embedded in the surface of plate to provide the lowest

Liquid Cooled Plates


surface of plate to provide the lowest thermal resistance between the semiconductor mounting surface and the cooling liquid .tubes can be bent into complex arrays to ensure the copper surface is directly under the semiconductor chips .

Liquid Cooled solutions features much higher efficiency than other thermal options. It is mainly applied in UPS, industrial equipment ,power electronics ,inverter and convertors.

Pump circulation system keeps the liquid moving inside

Able to dissipate heat at both sides

Applied in extremely high power more than 1000W

IGBT Type: cm400dy-66hIGBT Number: 3

IGBT Type: FF600R12MEIGBT Number: 12Power Dissipation : 1000W/perHS Size:800*880*25



IGBT Type:DD1200S17H4IGBT Number: 3Power Dissipation : 2500W/perHS Size:800*30*20

product introduction - britec...heat pipe cold plate technology uses heat pipes embedded in an...

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