quality reliability technology - qrtkr.com · engine control system transmission fuel injection...
TRANSCRIPT
-
Quality Reliability Technology
QRT
-
www.qrtkr.com 3
VISION
QRT
QRT()()SKHynix
QRT()
QRT()QRT() QRT()
Operating Life & Environmental Reliability Test
Physical & Mechanical Test
Electrical Stress Test
Failure Analysis
FIB(Focused Ion Beam)Solution
Material Analysis
Training & Consulting
/
/
/ ESD EMI EOS
- /
FIB
/
&
(HTOL)(THB)(T/C)/(HTSL/LTSL)/
EMC
CEO Message Business Part
QRT()
-
Quality Reliability Technology www.qrtkr.com4 5
FIB
&
X(X-Ray)
(SAT/SAM)
(Curve Tracing)
Decapsulation(Decap)
Chip Delayering
Cross Section
Crack
PCB
-
-
-
-
-
TEM
//
(SEM)
(EDS)
EMMl(PHEMOS/THEMOS)
Dye & Pry
(Optical Scope)
(FE-SEM)(Dual FIB)(TEM)(EDS)
(EELS)
(AFM)(TOF-SIMS)
(AES)X(XPS)X(XRD)
(GC)(GC-MS)
(FT-IR) /(UV/VIS)
(ICP-OES)(ICP-MS)
X(XRF) (IC)
Metal Cut/Deposition
Insulation Cut/Deposition
(Training)
(Consulting)
(Factory Audit)
Remarks
Service Items JEDEC/MIL/AEC/ES(QR)
/
(ELFR)
/(HTOL/LTOL)
/ (HTGB/HTRB)
(Flash)
(VIB)
(CERT)
(HALT)
(MS)
/(Drop)
- IEC, ISO
- JEDEC, AEC, MIL-STD
- ES, GMOEM
()
()
- IEC, ISO
- JEDEC, AEC, MIL-STD
- ES, GMOEM
UTM///
- Die, Wire Bonding
- PKG Body, Lead, Solder Ball
- PCB, Module
- IEC, ISO
- JEDEC, AEC, MIL-STD
- ES, GMOEM
(Solder Joint)
- IPC, JEDEC
(MSL)
(Preconditioning)
/(HTSL/LTSL)
/(THB/THS)
(TC)
(PTC)
(Liquid TS)
(HAST/uHAST)
(PCT)
///
(Board Level Drop/Bending/TC/VIS)
/(Shear/Tensile)
/(Torque/Twist/Bending)
/(SD/RSH)
/
/
Remarks
ESD/EOS/IC-EMI
ESD(HBM/MM/CDM)
(Latch-up)
ESD(Gun-ESD)
(EOS)
(IC-EMI)
-
Quality Reliability Technology www.qrtkr.com6 7
AEC Standards & OEM Specification
AEC-Q100Integrated Circuits
AEC-Q101Discrete Semiconductors
AEC-Q200Passive Components
JEDEC, AEC-Q100,101,200, OEM in-house spec.
AEC-Q101Discrete Semiconductors
AEC-Q200Passive Components
AEC-Q100Integrated Circuits
Component LevelQualification
Automotive LevelMechanical Durability
Sub. System LevelQualification
Driver informationDashboard displayCar navigation
ChassisPower steeringBrakingVDM
Body electricalsIBCMCAN gatewayLight controls
SecurityImmobilizerCar alarm
PowertrainEngine control systemTransmissionFuel injectionFuel pump
SafetyAirbagsSeat occupation detectionPedestrian protectionNight visionTire air pressure detection
Ultracapacitors
Hydtogen tanks
Electric motor
Power Control Unit
Fuel cell system box
Fuel cell stack
Powertrain radiator
Fuel cell systemradiator
Automotive Electronics Quali cation
OEM Components Qualification SpecificationES95400 / ES95910 / ES90000 Series and etc
-
Quality Reliability Technology www.qrtkr.com8 9
AEC-Q100 (IC) , 4
. , Target
.
AEC-Q101 FET, Diode, IGBT, Transistor
(Discrete Components) .
.
AEC Q100 AEC Q101
Qualification Test Definitions for Discrete Semiconductors
Qualification Test Flow for Integrated Circuits
-40 to +125 discrete semiconductors except for LEDs
-40 to +85 all LEDs
Grade 0 -40 to +150
Grade 1 -40 to +125
Grade 2 -40 to +105
Grade 3 -40 to +85
Stress Abrv Datatype NoteSample
Sizeper lot
# oflots
Accepton #
failed
Reference(currentrevision)
1
Pre- and Post-Stress Electrical
Test
TEST 1 NGparts tested per therequirements of the
appropriate part0
User
suppliersstandard
Test is performed as specifi ed in the applicable stress reference at room temperature.
2 Pre- PC 1 GS parts before Test # 7,8, 9, & 10.
0 JESD22A-113
Performed on surface mount parts (SMDs) prior to Test #
Any replacement of parts must be reported.
3 External Visual EV 1 NG parts 0JESD22B-101 marking and workmanship.
4 Parametric PV 1 N 25 3Note A 0Individual AEC over the part temperature range to insure
5High
TemperatureReverse Bias
HTRB 1 CDGKUVPX 773
Note B 0MIL-STD-750-1
M1038 Method A
1000 hours at the maximum DC Reverse Voltage rated
The ambient temperature TA is to be adjusted
HTRB as a minimum. (See note X HTRB.)To be implemented on, or before, April 1, 2014.
27 Dielectric Integrity DI 3 DM 5 1 0AEC-Q101-004
Pre- & Post-process change comparison to evaluate process change robustness.All parts must exceed gate breakdown voltage minimum (Power MOS & IGBT only).
28
Short CircuitReliability
Characteriza- SCR 3 DP 103
Note B 0 AEC-Q101-006 For smart power parts only.
29 Lead Free LF 3 - - - AEC-Q005For all related solderability, solder heat resistance and whisker requirements.To be implemented on, or before, April 1, 2014.
Transistor
LED
Automotive Electronics Quali cation
Grade Level Ambient Operating Temp. Range Minimum Temp. Range
QUALIFICATION TEST DEFINITIONS
Discrete Semiconductor Type
AEC-Q100(IC)4
AEC-Q101FET, Diode, IGBT, Transistor(Discrete Components)
FAB
-
Quality Reliability Technology www.qrtkr.com10 11
AEC .
. () AEC
, Full Coverage Qualification Service .
() , AEC-Q Standard
, , .
, Lab, .
AEC Qualification Test , 1:1
One Stop Service .
0 -50 to +150 Flat chip ceramic Resistors, X8R ceramic capacitors
1 -40 to +125Capacitor Networks, Resistors, Inductors, Transformers, Thermistors, Resonators, Crystals and Varistors, all other ceramic and tantalum capacitors
2 -40 to +105
3 -40 to +85Film capacitors, Ferrites, R/R-C Networks and Trimmer capacitors
Stress NO. Note Sample Size Per LotNumberof lots
Accept onNumber
failedPre-and Post-StressElectrical Test 1 G 0
High TemperatureExposure 3 DG
77Note B 1 0
Temperature Cycling 4 DG 77Note B 1 0
Analysis 5 DG77
Note B 1 0
Shear Strength 31 DG 30 1 0
Short Circuit FaultCurrent Durability 32 DG 30 1 0
Fault Current Durability 33 DG 30 1 0
End-of-Life Mode 34 DG 30 1 0
Jump Start Endurance 35 DG 30 1 0
Load Dump Endurance 36 DG 30 1 0
Inductor
Resistor
Capacitor
() AEC Standard Full Coverage ServiceAEC-Q200 Capacitor, Inductor, Resistor . , Flammability, Lead
Integrity .
Qualification Test Definitions for Passive Components
AEC Q200
Automotive Electronics Quali cation
Grade Temp. Range Passive Component Type
QUALIFICATION SAMPLE SIZE REQUIREMENTS
AEC-Q200Capacitor. Inductor. ResistorFlammability, Lead Integrity
AECQRTAECFull Coverage Qualification Service
QRTAEC-Q Standard Lab1:1 One Stop ServiceAEC Qualification Test
QRTAEC Standard Full Coverage Service
-
Quality Reliability Technology www.qrtkr.com12 13
Semiconductor & Electronic Component
Smart Appliance
Smartphone
Internet of Things (IOT)
Smart Medical System
Wearable Device
Aerospace/Defense
ICT
ISO26262OEM
ES(Sequencial Test)36524Functional Test
ES90000-01 Inspection of Solder Joint
ES90000-04 Reliability Tests for Pb-free Soldering
ES90000-02 Delamination Inspection for Mounted Part
ES90000-03 Reliability Test for bare PCB
ES90000-05 Highly Accelerated Life Test
ES95400-10 Environmental Tests for Electronic EquipmentES95910-93 Environmental Tests for Air Bag System
/
ES
-
Quality Reliability Technology www.qrtkr.com14 15
One-Stop
Failure Analysis Service
(Material Analysis)
LED Quantum Well Stucture_TEM Nano Cellulose_FE-SEM Bump Grain Orientation_Dual FIB
Micro Structure Analysis
Organic Analysis
FE-SEM Analysis Dual FIB Analysis TEM Analysis EDS Analysis EELS Analysis
GC Analysis GC-MS Analysis FT-IR Analysis UV/VIS Analysis
AFM Analysis TOF-SIMS Analysis AES Analysis XPS Analysis XRD Analysis
ICP-OES Analysis ICP-MS Analysis XRF Analysis IC Analysis
Surface Analysis
Inorganic Analysis
SMT / PCB Analysis
PCB
Material Analysis
FIB Circuit Edit
Electronic Components / Parts Analysis
Reverse Engineering
Solderability Test
FAILURE ANALYSISSERVICE
-
Quality Reliability Technology www.qrtkr.com16 17
/ Training(on-site)()
S
/
(6 sigma/TPM/SPC etc.)
(ISO 9000/9001, KOLAS, ISO 26262 etc.)
/ /
(etc.)
()
12()
- (ww.smtech.go.kr)
- www.smtech.go.kr
- (12)
: +82-31-8094-8253 [email protected]
: +82-31-8094-8251 [email protected]
/ Consulting
/ Factory Audit
Training and Consulting National Support Project
(7)
70% (7,000)
30%()
100%
(7)
60%(7,000)
40%()
100%
(on-site)
Money
Time
Quality
www.smtech.go.kr()
(16)
(http://sminfo.smba.go.kr/)
()
* NET()NEP()
*
()
National Support ProjectNational Support ProjectNational Support ProjectNational Support Project
1,000 600(60%/) + 400(40%/)
-
Quality Reliability Technology www.qrtkr.com18 19
(AEC/JEDEC/OEM Specification)
Service Procedure / Accreditation Location & Contact Point
QRT20042009KOLASQRT
QRT
60~70%(www.smtech.ga.kr)
QRTIPC(Institute for Printed Circuits : )IPC-A-610 (Acceptability of Electronics
Assemblies)IPC-A-600 (Acceptability of Printed Boards)Certified IP: Specialist(IPC)ICT
Global Network
Jeong, Hanchul +82-31-8094-8212 [email protected]
Lee, Jinsu +82-31-8094-8214 [email protected]
Kang, Jeonghoon +82-31-8094-8213 [email protected]
Lee, Hyunbae +82-31-8094-8256 [email protected]
/ Mechanical Jung, Sukhwan +82-31-8094-8228 [email protected]
/ Kim, Namho +82-31-8094-8221 [email protected]
(Open Lab) Kim, Hyunsoo +82-31-546-7546 [email protected]
FIB ( Open Lab) Kim, Chulsoo +82-31-546-7544 [email protected]
(Open Lab)
ESD/EOS/EMI(Open Lab) Kim, Dongseong +82-31-546-7549 [email protected]
To cover the whole spectrum of the electronics industry from IC to end Products.
KOREA
CHINA-WUXI
JAPAN-TOKYO
USA-SAN JOSE
()
Sales Net-work
(PO)
Board3~4
Board
Board
Board/
Package
Board
Datasheet / Pin
HTOLLTOL THB ESD
Test VectorOperation TimingOperating Voltage
Bias Con gurationBiasing Voltage
Zapping VoltageZapping ModeZapping Pin/Group
HTOL:
T H B :
E S D :
Pin count / Dimension
QRT()
QRT()
-
031.8094.8211
A Global Leading-edge Company
for Reliability Engineering and Failure Analysis