rg12864b-biw-v

: 406 456 6F No.456-6, Dunhua RD., Beitun District,Taichung, Taiwan, R.O.C WEB: http://www.Raystar-Optronics.com E-mail: [email protected] Tel:886-4-22911297 Fax886-4-22911296

RG12864B-BIW-V

SPECIFICATION CUSTOMER :

APPROVED BY:( FOR CUSTOMER USE ONLY )

PCB VERSION:

DATA:

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ISSUED DATE:Page 1 , Total 23 Pages

RG12864B-BIW-V

Contents1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. Specification Revision History General Specification Module Classification Information Interface Pin Function Outline dimension & Block Diagram Display Control Instruction Detailed Explanation Timing Characteristics Optical Characteristics Absolute Maximum Ratings Electrical Characteristics Backlight Information Reliability Inspection specification Precautions in use of LCD Modules Material List of Components for RoHs Page 3 Page 4 Page 5 Page 6 Page 7 Page 8 Page 9 Page 11 Page 12 Page 13 Page 13 Page 14 Page 15 Page 16 Page 20 Page 21

Page 2 , Total 23 Pages

1. Specification Revision HistoryRECORDS OF REVISIONVERSION 1 DATE 2008.1.23 REVISED PAGE NO. Note First issue


2. General SpecificationThe Features of the Module is description as follow: Module dimension: 75.0 x 52.7 x 8.9 (max.) mm3 View area: 60.0 x 32.6 mm2 Active area: 55.0 x 27.48 mm2 Number of Dots: 128 x 64 Dot size: 0.39 x 0.39 mm2 Dot pitch: 0.43 x 0.43 mm2 LCD type: STN Negative, Transmissive , blue Duty: 1/64 View direction: 6 oclock Backlight Type: LED, White


3. Module Classification InformationRGItem 1 2 3 4

12864

BB I W VDescription

BrandRaystar Optronics Inc. CCharacter Type, Display Type GGraphic Type Display Font128 x64 Dots Serials Code. PTN Positive, Gray NTN Negative, GSTN Positive, Gray YSTN Positive, Yellow Green BSTN Negative, Blue FFSTN Positive TFSTN Negative AReflective, N.T, 6:00 KTransflective, W.T,12:00 DReflective, N.T, 12:00 1Transflective, U.T,6:00 GReflective, W. T, 6:00 4Transflective, U.T.12:00 JReflective, W. T, 12:00 0Reflective, U. T, 6:00 3Reflective, U. T, 12:00 BTransflective, N.T,6:00 ETransflective, N.T.12:00 HTransflective, W.T,6:00 NWithout backlight PEL, Blue green TEL, Green DEL, White CTransmissive, N.T,6:00 FTransmissive, N.T,12:00 ITransmissive, W. T, 6:00 LTransmissive, W.T,12:00 2Transmissive, U. T, 6:00 5Transmissive, U.T,12:00 YLED, Yellow Green ALED, Amber WLED, White OLED, Orange

5

LCD Mode

6

LCD Polarizer Type/ Temperature range/ View direction

7

Backlight Type

8

FCCFL, White GLED, Green Special Code V: Build in Negative voltage output


4. Interface Pin FunctionPin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Symbol VDD VSS Vo DB0 DB1 DB2 DB3 DB4 DB5 DB6 DB7 CS1 CS2 RST R/W D/I E Vee A K Level 5.0V 0V H/L H/L H/L H/L H/L H/L H/L H/L L L L H/L H/L H Power supply (+5V) Power supply (GND) Data bus line Data bus line Data bus line Data bus line Data bus line Data bus line Data bus line Data bus line Select Column 1~ Column 64 Select Column 65~ Column 128 Reset signal H: Read (MPUModule) , L: Write (MPUModule) H: Data , L : Instruction Description

(Variable) Contrast Adjustment

Enable signal Negative Voltage output Power Supply for LED (+) Power Supply for LED (- )


5. Outline Dimension &Block Diagram

2.5 2.20.5 2.9 9.05 11.59

7.5 10.0

75.0 0.5 70.0 70.6 60.0(VA) 55.0(AA)

1.5 2-R1.25 PTH 2-R2.0 PAD20.12

8.9Max 5.4

52.7 0.5 49.7 44.6 32.6(VA) 27.48(AA)

A

128*64 DotsK

1

20

13.37 37.5

P2.54*19=48.26 LED B/L

2.5

20- 1.0PTH 20- 1.8PAD

2- 2.5 PTH 2- 4.0 PAD

1.0

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

Vdd Vss Vo DB0 DB1 DB2 DB3 DB4 DB5 DB6 DB7 CS1 CS2 RST R/W D/I E Vee A K

0.43 0.39

10.16

25.35

The non-specified tolerance of dimension is0.43 0.39

0.3mm.

DOT SIZE

128X64 DOT

Seg1~64

Seg65~128

Bias and Power Circuit

Seg Driver

Seg Driver

FR,M,CL,CLK1,CLK2

Com Driver

Com1~64

MPU80 series or 68 series

CS1 CS2 RST

N.V. Generator

E D/I R/W DB0~DB7

Vdd Vo

VR 10K~20K

VEE

External contrast adjustment.


6. Display Control InstructionThe display control instructions control the internal state of the NT7108. Instruction is received from MPU to NT7108 for the display control. The following table shows various instructions.


7. Detailed Explanation

The display data appears when D is 1 and disappears when D is 0. Though the data is not on the screen with D=0, it remains in the display data RAM. Therefore, you can make it appear by changing D=0 into D=1. SET ADDRESS (Y ADDRESS)

Y address (AC0-AC5) of the display data RAM is set in the Y address counter. An address is set by instruction and increased by 1 automatically by read or write operations of display data. SET PAGE (X ADDRESS)

X address (AC0-AC2) of the display data RAM is set in the X address register. Writing or reading to or from MPU is executed in this specified page until the next page is set. DISPLAY START LINE (Z ADDRESS)

Z address (AC0-AC5) of the display data RAM is set in the display start line register and displayed at the top of the screen. When the display duty cycle is 1/64 or others (1/32-1/64), the data of total line number of LCD screen, from the line specified by display start line instruction, is displayed.


STATUS READ

BUSY When BUSY is 1, the Chip is executing internal operation and no instructions are accepted. When BUSY is 0, the Chip is ready to accept any instructions. ON/OFF When ON/OFF is 1, the display is OFF. When ON/OFF is 0, the display is ON. RESET When RESET is 1, the system is being initialized. In this condition, no instructions except status read can be accepted. When RESET is 0, initializing has finished and the system is in usual operation condition. WRITE DISPLAY DATA

Writes data (D0-D7) into the display data RAM. After writing instruction, Y address is increased by 1 automatically. READ DISPLAY DATA

Reads data (D0-D7) from the display data RAM. After reading instruction, Y address is increased by 1 automatically.


8. Timing CharacteristicsMPU Interface Characteristic E cycle E high level width E low level width E rise time E tall time Address set-up time Address hold time Data set-up time Data delay time Data hold time (write) Data hold time (read) Symbol tcyc twhE twlE tr tf tas tah tdsw tddr tdhw tdhr Min 1000 450 450 140 10 200 10 20 Typ (T=25, VDD=+5.0V0.5) Max 25 25 320 Unit ns ns ns ns ns ns ns ns ns ns ns

tCtW L

E

0 .7 V D D 0 .3 V D D

t WtR

HtF

R /W

0 .7 V D D 0 .3 V D D

tA S UtA S U

t A H

C S 1 B ,C S 2 B , C S 3 ,R S

0 .7 V D D 0 .3 V D D

t D S U0 .7 V D D

t D H W

D B 0 - D B 70 .3 V D D

MPU Read TimingtC

tW

L

E

0 .7 V D D 0 .3 V D D

t W

H

tR0 .7 V D D

tFt A Ht A H

R /W

tA S U0 .3 V D D

tA S U

C S 1 B ,C S 2 B , C S 3 ,R S

0 .7 V D D 0 .3 V D D

tD0 .7 V D D

tD H R

D B 0 - D B 70 .3 V D D

MPU Write TimingPage 11 , Total 23 Pages

9. Optical CharacteristicsItem View Angle Contrast Ratio Response Time Symbol (V) (H) CR T rise T fall Condition CR2 CR2 Min 20 -30 Typ 3 150 150 Max 40 30 200 200 Unit deg deg ms ms

Definition of Operation Voltage (Vop)

Definition of Response Time ( Tr , Tf )

Intensity 100

Selected Wave

Non-selected Conition Intensity

Selected Conition

Non-selected Conition

Non-selected Wave

10

Cr Max

Cr = Lon / Loff

100

90

Vop

Driving Voltage(V)

Tr

Tf

[positive type]

[positive type]

Conditions : Operating Voltage : Vop Frame Frequency : 64 HZ Viewing Angle() : 0 0 Driving Waveform : 1/N duty , 1/a bias

Definition of viewing angle(CR2)b f = 180

l

r

= 270

= 90

= 0Page 12 , Total 23 Pages

10. Absolute Maximum RatingsItem Operating Temperature Storage Temperature Input Voltage Supply Voltage For Logic Supply Voltage For LCD Symbol TOP TST VI VDD VDD-VLCD Min -20 -30 0 0 0 Typ Max +70 +80 VDD 6.7 16.7 Unit V V V

11. Electrical CharacteristicsItem Supply Voltage For Logic Symbol VDD-VSS Condition Ta=-20 Supply Voltage For LCD VDD-V0 Ta=25 Ta=+70 Input High Volt. Input Low Volt. Output High Volt. Output Low Volt. Supply Current VIH VIL VOH VOL IDD Min 4.5 7.6 2.0 0 2.4 0 3.0 Typ 5.0 8.0 4.0 Max 5.5 9.6 VDD 0.8 VDD 0.4 5.0 Unit V V V V V V V V mA


12. Backlight InformationSpecificationPARAMETER Supply Current Supply Voltage Reverse Voltage Luminous Intensity Wave Length Life Time Color SYMBOL ILED V VR IV p White MIN 48 3.4 150 50K TYP 60 3.5 200 MAX 90 3.6 5 UNIT mA V V TEST V=3.5V CONDITION

cd/m2 ILED=60mA nm Hr. ILED=60mA ILED=60mA

Note: The LED of B/L is drive by current only, drive voltage is for reference only. drive voltage can make driving current under safety area (current between minimum and maximum).

.Drive from pin19,pin20

R

A K

B/L

LCM


13. ReliabilityContent of Reliability Test (wide temperature, -20~70) Environmental TestTest ItemHigh Temperature storage Low Temperature storage High Temperature Operation Low Temperature Operation High Temperature/ Humidity Operation time. time. and the thermal stress to the element for a long time. for a long time. The module should be allowed to stand at 60,90%RH max For 96hrs under no-load condition excluding the polarizer, Then taking it out and drying it at normal temperature. The sample should be allowed stand the following 10 cycles of operation -20 Thermal shock resistance 30min 5min 1 cycle Total fixed amplitude : 15mm Vibration test Endurance test applying the vibration during transportation and using. Vibration 10~55Hz One cycle 60 seconds to 3 directions of X,Y,Z for Each 15 minutes VS=800V,RS=1.5k Static electricity test Endurance test applying the electric stress to the terminal. CS=100pF 1 time Frequency : 3 30min 25 70 -20/70 10 cycles

Content of Test

Test Condition200hrs 200hrs 200hrs 200hrs 60,90%RH 96hrs

Note2 1,2 1

Endurance test applying the high storage temperature for a long 80 Endurance test applying the high storage temperature for a long -30 Endurance test applying the electric stress (Voltage & Current) 70 Endurance test applying the electric stress under low temperature -20

1,2

Note1: No dew condensation to be observed. Note2: The function test shall be conducted after 4 hours storage at the normal Temperature and humidity after remove from the test chamber. Note3: Vibration test will be conducted to the product itself without putting it in a container.


14. Inspection specificationNO Item Criterion 1.1 Missing vertical, horizontal segment, segment contrast defect. 1.2 Missing character , dot or icon. 1.3 Display malfunction. 1.4 No function or no display. 1.5 Current consumption exceeds product specifications. 1.6 LCD viewing angle defect. 1.7 Mixed product types. 1.8 Contrast defect. AQL

01

Electrical Testing

0.65

02

Black or white 2.1 White and black spots on display 0.25mm, no more than spots on LCD three white or black spots present. (display only) 2.2 Densely spaced: No more than two spots or lines within 3mm 3.1 Round type : As following drawing =( x + y ) / 2 LCD black spots, white spots, contamination (non-display)

2.5

SIZE 0.10 0.100.20 0.200.25 0.25

03

Acceptable Q TY Accept no dense 2 1 0 Acceptable Q TY Accept no dense 2 As round type

2.5

3.2 Line type : (As following drawing) Length Width --W0.02 L3.0 0.02W0.03 L2.5 0.03W0.05 --0.05W

2.5

04

Polarizer bubbles

If bubbles are visible, judge using black spot specifications, not easy to find, must check in specify direction.

Size 0.20 0.200.50 0.501.00 1.00 Total Q TY

Acceptable Q TY Accept no dense 3 2 0 3

2.5


NO 05

Item Scratches

Criterion Follow NO.3 LCD black spots, white spots, contamination

AQL

Symbols Define: x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length L: Electrode pad length: 6.1 General glass chip : 6.1.1 Chip on panel surface and crack between panels:

06

Chipped glass

y: Chip width x: Chip length Not over viewing x1/8a area Not exceed 1/3k 1/2tz2t x1/8a If there are 2 or more chips, x is total length of each chip. 6.1.2 Corner crack:

z: Chip thickness Z1/2t

2.5

y: Chip width x: Chip length Not over viewing x1/8a area Not exceed 1/3k 1/2tz2t x1/8a If there are 2 or more chips, x is the total length of each chip.

z: Chip thickness Z1/2t


NO

Item

Criterion

AQL

Symbols : x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length L: Electrode pad length 6.2 Protrusion over terminal : 6.2.1 Chip on electrode pad :

y: Chip width x: Chip length y0.5mm x1/8a 6.2.2 Non-conductive portion:

z: Chip thickness 0 zt

06

Glass crack

2.5

y: Chip width x: Chip length z: Chip thickness y L x1/8a 0 zt If the chipped area touches the ITO terminal, over 2/3 of the ITO must remain and be inspected according to electrode terminal specifications. If the product will be heat sealed by the customer, the alignment mark not be damaged. 6.2.3 Substrate protuberance and internal crack. y: width y1/3L x: length xa


NO 07

Item Cracked glass

Criterion The LCD with extensive crack is not acceptable. 8.1 Illumination source flickers when lit. 8.2 Spots or scratched that appear when lit must be judged. Using LCD spot, lines and contamination standards. 8.3 Backlight doesnt light or color wrong. 9.1 Bezel may not have rust, be deformed or have fingerprints, stains or other contamination. 9.2 Bezel must comply with job specifications. 10.1 COB seal may not have pinholes larger than 0.2mm or contamination. 10.2 COB seal surface may not have pinholes through to the IC. 10.3 The height of the COB should not exceed the height indicated in the assembly diagram. 10.4 There may not be more than 2mm of sealant outside the seal area on the PCB. And there should be no more than three places. 10.5 No oxidation or contamination PCB terminals. 10.6 Parts on PCB must be the same as on the production characteristic chart. There should be no wrong parts, missing parts or excess parts. 10.7 The jumper on the PCB should conform to the product characteristic chart. 10.8 If solder gets on bezel tab pads, LED pad, zebra pad or screw hold pad, make sure it is smoothed down. 10.9 The Scraping testing standard for Copper Coating of PCBX Y

AQL 2.5 0.65 2.5 0.65 2.5 0.65 2.5 2.5 0.65 2.5 2.5 0.65 0.65 2.5 2.5

08

Backlight elements

09

Bezel

10

PCBCOB

X * Y

rg12864b-biw-v

Documents

high storage temperature

viewing x1 8a area

display data ram

lcd side length

chip thickness z1 2t

selected conition

glass thickness

normal temperature