semileds m-90 20w rev.1.052ebad10ee97eea25d5e-d7d40819259e7d3022d9ad53e3694148.r84… · 2. flux is...

PRODUCT DATASHEET

M90 20W High Power LED

Table of Contents

Features………………………………………………………………………………………………………………………………………………. 1

Applications…………………………………………………………………………………………………………………………………………. 1

Absolute Maximum Ratings..……………………………………………………………………………………………………………….. 1

Flux Characteristics………………………………………………………………………………………………………………………………. 2

Typical Electro‐Optical Characteristics Curves..……………………………………………………………………………………

Thermal Design Curve…………………………………………………………………………………………………………………………..

Chromaticity Coordinate Groups…………………………………………………………………………………………………………..

3

4

5

Mechanical Dimensions………….…………………………………………………………………………………………………………… 7

Shipping Package Information.……………………………………………………………………………………………………………. 8

Reflow Soldering Conditions…….…………………………………………………………..…………………………………………….. 10

LED Handling Information…………..…………………………………………………………………………………………………………

Lens Handling………………………………………………………………………………………………………………………………………..

Lens Cleaning………………………………………………………………………………………………………………………………………..

11

11

11

Carrier Tape Handling…....…………………………………………………………………………………………………………………….. 12

RoHS Compliant

M90‐20W PRODUCT DATASHEET

© 2005‐2013 SemiLEDs. All Rights Reserved RoHS Compliant www.semileds.com Data Sheet Rev. 1.0 Subject to change without notice

Page 1

Features General purpose white

Very low thermal resistance: < 1.0 K/W

High luminous flux in a compact footprint: 9.00mm x 9.00mm package size

8KV (HBM) ESD protection

Reflow solder able JEDEC J‐STD‐020D

Applications General lighting

Retail lighting

Architectural lighting

Directional replacement lamps

Industrial and commercial lighting

Absolute Maximum Ratings (Tj = 25 )

Parameters Symbol Rating Unit

DC Forward current (7S7P) IF 840 mA

Operating temperature Topr ‐40 ~ 85 ℃

LED Storage temperature Tstg1 ‐40 ~ 110 ℃

LED Junction temperature Tj 125 ℃

Soldering temperature at tp

(JEDEC‐020‐D) Tsol 20 ~ 40 Second

ESD

classification

MIL‐STD‐883G HBM 8000 (Class 3B) V

JESD22‐A115‐B MM 400 (Class C) V

Notes:

1. Proper current derating must be observed to maintain junction temperature below the maximum.



Page 2

Flux Characteristics (Tj = 25 )

Part number Color

CCT Range Base Order

Codes Minimum

Luminous Flux@840mA (Im)

Forward Voltage @840mA (V)

Min. Max. Min. Max.

M9090‐020‐0707‐EA

Cool

White

70‐CRI

6020 7040

1700

19.6 21.7

21.7 23.8

23.8 25.9

1800

19.6 21.7

21.7 23.8

23.8 25.9

1900

19.6 21.7

21.7 23.8

23.8 25.9

M9090‐020‐0707‐CA 5310 6020

1700

19.6 21.7

21.7 23.8

23.8 25.9

1800

19.6 21.7

21.7 23.8

23.8 25.9

1900

19.6 21.7

21.7 23.8

23.8 25.9

M9090‐020‐0707‐WC

Warm

White

80‐CRI

2870 3220

1200

19.6 21.7

21.7 23.8

23.8 25.9

1300

19.6 21.7

21.7 23.8

23.8 25.9

1400

19.6 21.7

21.7 23.8

23.8 25.9

Notes:

1. Forward voltage is measured with an accuracy of ±0.1V (tester tolerance)

2. Flux is measured with an accuracy of ±10% and ±2 on CRI measurements.

3. The typical CRI (Cool Rendering Index) for Cool White 70‐CRI is 70, and for Warm White 80‐CRI is 80.

4. SemiLEDs M90 20W product is tested and binned at 840mA.



Page 3

Typical Electro‐Optical Characteristics Curves (Tj=25℃)

Forward Current vs. Forward Voltage Relative Luminous Flux vs. Forward Current

Relative Radiant Power vs. Wavelength Typical Spatial Distribution

Typical Polar Radiation Pattern



Page 4

Thermal Design Curve

The junction temperature can be correlated to the thermal resistance between the junction and ambient (Rja)

by the following equation.

Tj=Ta + Rja*W

Tj: LED junction temperature

Ta: Ambient temperature

Rja: Thermal resistance between the junction and ambient

W: Input power (IF*VF)



Page 5

Chromaticity Coordinate Groups

Product Binning (Cool White)

ES6500 6020～7040K

Rank CIE‐X CIE‐Y Rank CIE‐X CIE‐Y Rank CIE‐X CIE‐Y Rank CIE‐X CIE‐Y

1A

0.3048 0.3207

1B

0.3028 0.3304

1C

0.3115 0.3391

1D

0.3130 0.3290

0.3130 0.3290 0.3115 0.3391 0.3205 0.3481 0.3213 0.3373

0.3144 0.3186 0.3130 0.3290 0.3213 0.3373 0.3221 0.3261

0.3068 0.3113 0.3048 0.3207 0.3130 0.3290 0.3144 0.3186

ES5700 5310～6020K


2A

0.3215 0.3350

2B

0.3207 0.3462

2C

0.3290 0.3538

2D

0.3290 0.3417

0.3290 0.3417 0.3290 0.3538 0.3376 0.3616 0.3371 0.3490

0.3290 0.3300 0.3290 0.3417 0.3371 0.3490 0.3366 0.3369

0.3222 0.3243 0.3215 0.3350 0.3290 0.3417 0.3290 0.3300



Page 6

Product Binning (Warm White)

ES3000 2870～3220K


7A1

0.4147 0.3814

7B1

0.4221 0.3984

7C1

0.4342 0.4028

7D1

0.4259 0.3853

0.4183 0.3898 0.4259 0.4073 0.4385 0.4119 0.4300 0.3939

0.4300 0.3939 0.4385 0.4119 0.4513 0.4164 0.4418 0.3981

0.4259 0.3853 0.4342 0.4028 0.4465 0.4071 0.4373 0.3893

7A2

0.4183 0.3898

7B2

0.4259 0.4073

7C2

0.4385 0.4119

7D2

0.4300 0.3939

0.4221 0.3984 0.4299 0.4165 0.4430 0.4212 0.4342 0.4028

0.4342 0.4028 0.4430 0.4212 0.4562 0.4260 0.4465 0.4071

0.4300 0.3939 0.4385 0.4119 0.4513 0.4164 0.4418 0.3981



Page 7

Mechanical Dimensions

Notes: 1. All dimensions are in millimeters. 2. Drawings not to scale. 3. General tolerances are ±0.13 mm unless otherwise indicated.

Pad configuration

Pad Function

1 Cathode

2 Anode

3 Thermal



Page 8

Shipping Package Information

Tape Dimensions (Unit: mm) Item Specification Tol.(+/‐)

W 16.00 ±0.30E 1.75 ±0.10F 7.50 ±0.10

D0 1.50 +0.10,‐0D1 1.50 +0.25,‐0P0 4.00 ±0.10

P1 12.00 ±0.10P2 2.00 ±0.10

P0X10 40.00 ±0.20

t 0.35 ±0.05A0 9.40 ±0.10

B0 9.40 ±0.10K0 4.95 ±0.10

Reel

Trailer 35 pockets (min)

of empty pockets

Leader 35 pockets

(min) of empty pockets

Loaded Pockets



Page 9

Packaging

Desiccants

Humidity indicator card

Static Shielding bag

Desiccants

Humidity indicator card

Static Shielding bag

1 reel in a bag = 200pcs

1 bag in an inner box= 200pcs

Small size: 5 inner box in an outer box= 1000pcsLarge size: 10 inner box in an outer box= 2000pcs

Humidity Indicator Card

Static Shielding Bag

Label

Packing after MFG Packing for shipping



Page 10

Reflow soldering conditions The LEDs can be soldered using the parameters listed below. As a general guideline, the users are suggested to

follow the recommended soldering profile provided by the manufacturer of the solder paste. Although the

recommended soldering conditions are specified in the list, reflow soldering at the lowest possible temperature

is advised for the LEDs.

Profile Feature Sn‐Pb Eutectic Assembly Pb‐Free Assembly

Average Ramp‐up Rate (Tsmax to Tp)

3℃/second max. 3℃/second max.

Preheat - Temperature Min(Tsmin) - Temperature Max(Tsmax) - Time(tsmin to tsmax)

100℃

150℃

60‐120 seconds

150℃

200℃

60‐180 seconds

Time maintained above: - Temperature(TL) - Time(tL)

183℃

60‐150 seconds

217℃

60‐150 seconds

Peak/classification Temperature(Tp)

215℃ 260℃

Time within 5℃ of actual Peak

Temperature(tp) 10‐30 seconds 20‐40 seconds

Ramp‐Down Rate 6℃/second max. 6℃/second max.

Time 25℃ to Peak Temperature 6 minutes max. 8 minutes max.

Note: 1. The housing side wall is composed by silicon which is a kind of semiconductor. 2. Please avoid solder ball or excessive solder around side wall during SMT process.



Page 11

LED Handling Information

The following items are recommended when handling the LEDs:

1. The lens of the LEDs should not be exposed to dust and debris. Excessive dust and debris may cause a

drastic decrease in light output.

2. Avoid mechanical stress on the LED lens.

3. Do not touch the LED lens surface. It would affect the optical performance of the LED due to the LED lens’

damage.

4. Pick and place tool is recommended when removing the LEDs from the factory tape and reel packaging.

Lens Handling

Please follow the following guidelines when handling the LEDs:

1. Use tweezers to hold the LEDs.

2. Do not touch the lens with the tweezers or fingers.

3. Do not apply more than 4N (400g) of force directly onto the lens.

Correct ( ) Wrong (X)

Lens Cleaning

A suitable cleaning solution can be applied to the lens surface to remove dirt and dust particles:

1. Try gentle swabbing using a lint‐free swab.

2. If needed, isopropyl alcohol can be used with a lint‐free swab to gently remove dirt from the lens surface.

3. Do not use other solvents as they may directly react with the LED assembly.

4. Do not use ultrasonic cleaning which may damage the LED.



Page 12

Carrier Tape Handling

The following items are recommended when handling the carrier tape of the LEDs:

1. Do not twist the carrier tape

2. The inward bending diameter should not be smaller than 6cm for carrier tape

3. Do not bend the tape outward

4. Storage temperature should not exceed 60℃

5. Ten reels per box

6. Box dimensions: 49cm x 22cm x 21 cm

7. Full box weight: 3±0.5 Kg.

<<66ccmm



Page 13

About Us

SemiLEDs Corporation is a US based manufacturer of ultra‐high brightness LED chips with state of

the art fabrication facilities in Hsinchu Science Park, Taiwan. SemiLEDs specializes in the development

and manufacturing of vertical LED chips in blue (white), green, and UV using a patented copper alloy

base. This unique design allows for higher performance and longer lumen maintenance. The World

Economic Forum recognized SemiLEDs innovations with the 2009 Technology Pioneer Award.

SemiLEDs is fully ISO 9001:2008 Certified

SemiLEDs is a publicly traded company on NASDAQ Global Select Market (stock symbol “LEDS”). For

investor information, please contact us at [email protected].

For further company or product information, please visit us at www.semileds.com or please contact

sales@ semileds.com.

www.semileds.com

ASIA PACIFIC

3F, No. 11, KeJung Rd.

Chu‐Nan Site

Hsinchu Science Park

Chu‐Nan 350, Miao‐Li County

Taiwan, ROC

Tel: +886‐37‐586788

Fax: +886‐37‐582688

[email protected]

semileds m-90 20w rev.1.052ebad10ee97eea25d5e-d7d40819259e7d3022d9ad53e3694148.r84… · 2. flux is...

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